CN101930957B - 功率半导体器件封装及制造方法 - Google Patents
功率半导体器件封装及制造方法 Download PDFInfo
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- CN101930957B CN101930957B CN2010102005603A CN201010200560A CN101930957B CN 101930957 B CN101930957 B CN 101930957B CN 2010102005603 A CN2010102005603 A CN 2010102005603A CN 201010200560 A CN201010200560 A CN 201010200560A CN 101930957 B CN101930957 B CN 101930957B
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- power semiconductor
- semiconductor encapsulation
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- electric installation
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
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Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US12/479,995 US8563360B2 (en) | 2009-06-08 | 2009-06-08 | Power semiconductor device package and fabrication method |
US12/479,995 | 2009-06-08 |
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CN2012101854448A Division CN102655134A (zh) | 2009-06-08 | 2010-06-02 | 功率半导体器件封装及制造方法 |
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CN101930957A CN101930957A (zh) | 2010-12-29 |
CN101930957B true CN101930957B (zh) | 2013-10-23 |
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CN2010102005603A Active CN101930957B (zh) | 2009-06-08 | 2010-06-02 | 功率半导体器件封装及制造方法 |
CN2012101854448A Pending CN102655134A (zh) | 2009-06-08 | 2010-06-02 | 功率半导体器件封装及制造方法 |
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CN2012101854448A Pending CN102655134A (zh) | 2009-06-08 | 2010-06-02 | 功率半导体器件封装及制造方法 |
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US (1) | US8563360B2 (zh) |
CN (2) | CN101930957B (zh) |
TW (1) | TWI469290B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US8637981B2 (en) * | 2011-03-30 | 2014-01-28 | International Rectifier Corporation | Dual compartment semiconductor package with temperature sensor |
US8951841B2 (en) | 2012-03-20 | 2015-02-10 | Infineon Technologies Ag | Clip frame semiconductor packages and methods of formation thereof |
US20150076676A1 (en) * | 2013-09-17 | 2015-03-19 | Jun Lu | Power semiconductor device package and fabrication method |
CN106463508A (zh) * | 2014-04-01 | 2017-02-22 | 英派尔科技开发有限公司 | 具有闪络保护的垂直晶体管 |
TWI579979B (zh) * | 2014-08-18 | 2017-04-21 | 萬國半導體股份有限公司 | 功率半導體裝置及其製造方法 |
EP3065172A1 (en) | 2015-03-06 | 2016-09-07 | Nxp B.V. | Semiconductor device |
US10256168B2 (en) | 2016-06-12 | 2019-04-09 | Nexperia B.V. | Semiconductor device and lead frame therefor |
US10991670B2 (en) * | 2018-09-28 | 2021-04-27 | Semiconductor Components Industries, Llc | Semiconductor device assemblies including spacer with embedded semiconductor die |
Citations (1)
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CN101145572A (zh) * | 2005-12-06 | 2008-03-19 | 三洋电机株式会社 | 半导体装置及其制造方法 |
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CN102655134A (zh) | 2012-09-05 |
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US20100308454A1 (en) | 2010-12-09 |
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