USD503691S1 - Conductive clip for a semiconductor package - Google Patents

Conductive clip for a semiconductor package Download PDF

Info

Publication number
USD503691S1
USD503691S1 US29/188,754 US18875403F USD503691S US D503691 S1 USD503691 S1 US D503691S1 US 18875403 F US18875403 F US 18875403F US D503691 S USD503691 S US D503691S
Authority
US
United States
Prior art keywords
semiconductor package
conductive clip
clip
conductive
ornamental
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/188,754
Inventor
Martin Standing
Hazel Deborah Schofield
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
Infineon Technologies Americas Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US81977401 priority Critical
Application filed by Infineon Technologies Americas Corp filed Critical Infineon Technologies Americas Corp
Priority to US29/188,754 priority patent/USD503691S1/en
Assigned to INTERNATIONAL RECTIFIER CORPORATION reassignment INTERNATIONAL RECTIFIER CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCHOFIELD, HAZEL DEBORAH, STANDING, MARTIN
Application granted granted Critical
Publication of USD503691S1 publication Critical patent/USD503691S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/63—Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—BASIC ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Description

FIG. 1 is a perspective view of a conductive clip according to our design;
FIG. 2 is another perspective view of a conductive clip according to our design, the broken lines being included for illustrative purposes and forming no part of the claimed design;
FIG. 3 is a top plan view of a conductive clip according to our design;
FIG. 4 is a bottom plan view of a conductive clip according to our design, the broken lines being included for illustration purposes and forming no part of the claimed design;
FIG. 5 is a side elevational view of a conductive clip according to our design; and,
FIG. 6 is a side elevational view of a conductive clip according to our design.

Claims (1)

  1. The ornamental design for a conductive clip for a semiconductor package, as shown and described.
US29/188,754 2001-03-28 2003-08-22 Conductive clip for a semiconductor package Expired - Lifetime USD503691S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US81977401 2001-03-28
US29/188,754 USD503691S1 (en) 2001-03-28 2003-08-22 Conductive clip for a semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/188,754 USD503691S1 (en) 2001-03-28 2003-08-22 Conductive clip for a semiconductor package

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US09/819,774 Division US6624522B2 (en) 2000-04-04 2001-03-28 Chip scale surface mounted device and process of manufacture

Publications (1)

Publication Number Publication Date
USD503691S1 true USD503691S1 (en) 2005-04-05

Family

ID=34377804

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/188,754 Expired - Lifetime USD503691S1 (en) 2001-03-28 2003-08-22 Conductive clip for a semiconductor package

Country Status (1)

Country Link
US (1) USD503691S1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070090523A1 (en) * 2005-10-20 2007-04-26 Ralf Otremba Semiconductor component and methods to produce a semiconductor component
US20070215997A1 (en) * 2006-03-17 2007-09-20 Martin Standing Chip-scale package
US20070259514A1 (en) * 2006-05-04 2007-11-08 Ralf Otremba Interconnection Structure, Electronic Component and Method of Manufacturing the Same
US20070267729A1 (en) * 2006-05-17 2007-11-22 Ralf Otremba Electronic Component Having a Semiconductor Power Device
US7663212B2 (en) 2006-03-21 2010-02-16 Infineon Technologies Ag Electronic component having exposed surfaces
US7757392B2 (en) 2006-05-17 2010-07-20 Infineon Technologies Ag Method of producing an electronic component
US20100308454A1 (en) * 2009-06-08 2010-12-09 Jun Lu Power semiconductor device package and fabrication method
US20110101511A1 (en) * 2009-10-29 2011-05-05 Jun Lu Power semiconductor package
USD642578S1 (en) * 2009-09-30 2011-08-02 Sony Corporation Memory card adapter
USD807824S1 (en) * 2016-07-18 2018-01-16 General Electric Company Heat spreader
USD808350S1 (en) * 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate
USD844577S1 (en) * 2014-03-28 2019-04-02 Osram Sylvania Inc. Conductor pad
USD874413S1 (en) * 2018-11-02 2020-02-04 Topline Corporation Fixture for delivering 1752 solder columns onto a substrate
USD908648S1 (en) 2019-12-12 2021-01-26 Topline Corporation Adjustable fixture for aligning column grid array substrates

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070090523A1 (en) * 2005-10-20 2007-04-26 Ralf Otremba Semiconductor component and methods to produce a semiconductor component
US7786558B2 (en) 2005-10-20 2010-08-31 Infineon Technologies Ag Semiconductor component and methods to produce a semiconductor component
US20070215997A1 (en) * 2006-03-17 2007-09-20 Martin Standing Chip-scale package
US7663212B2 (en) 2006-03-21 2010-02-16 Infineon Technologies Ag Electronic component having exposed surfaces
US7541681B2 (en) 2006-05-04 2009-06-02 Infineon Technologies Ag Interconnection structure, electronic component and method of manufacturing the same
US20070259514A1 (en) * 2006-05-04 2007-11-08 Ralf Otremba Interconnection Structure, Electronic Component and Method of Manufacturing the Same
US20070267729A1 (en) * 2006-05-17 2007-11-22 Ralf Otremba Electronic Component Having a Semiconductor Power Device
US7476978B2 (en) 2006-05-17 2009-01-13 Infineon Technologies, Ag Electronic component having a semiconductor power device
US7757392B2 (en) 2006-05-17 2010-07-20 Infineon Technologies Ag Method of producing an electronic component
US8563360B2 (en) 2009-06-08 2013-10-22 Alpha And Omega Semiconductor, Inc. Power semiconductor device package and fabrication method
US20100308454A1 (en) * 2009-06-08 2010-12-09 Jun Lu Power semiconductor device package and fabrication method
USD642578S1 (en) * 2009-09-30 2011-08-02 Sony Corporation Memory card adapter
USD658185S1 (en) 2009-09-30 2012-04-24 Sony Corporation Memory card adapter
US20110101511A1 (en) * 2009-10-29 2011-05-05 Jun Lu Power semiconductor package
US7939370B1 (en) 2009-10-29 2011-05-10 Alpha And Omega Semiconductor Incorporated Power semiconductor package
USD844577S1 (en) * 2014-03-28 2019-04-02 Osram Sylvania Inc. Conductor pad
USD877103S1 (en) * 2014-03-28 2020-03-03 Osram Sylvania Inc. Conductor pad
USD807824S1 (en) * 2016-07-18 2018-01-16 General Electric Company Heat spreader
USD825463S1 (en) * 2016-07-18 2018-08-14 General Electric Company Heat spreader
USD808350S1 (en) * 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate
USD874413S1 (en) * 2018-11-02 2020-02-04 Topline Corporation Fixture for delivering 1752 solder columns onto a substrate
USD908648S1 (en) 2019-12-12 2021-01-26 Topline Corporation Adjustable fixture for aligning column grid array substrates

Similar Documents

Publication Publication Date Title
USD442833S1 (en) Insulated beverage holder
USD482284S1 (en) Frusto-conical container
USD540710S1 (en) Flower arrangement holder
USD487700S1 (en) Cap
USD489983S1 (en) Plastic bottle
USD489984S1 (en) Plastic bottle
USD500447S1 (en) Oval bottle
USD474651S1 (en) Container
USD520363S1 (en) Bottle
USD419058S (en) Upper portion of a plastic bottle
USD498145S1 (en) Bottle
USD427514S (en) Upper portion of a plastic bottle
USD482624S1 (en) Bottle
USD505590S1 (en) Susceptor tray
USD474110S1 (en) Cup shaped container
USD474111S1 (en) Cup shaped container
USD476854S1 (en) Bowl
USD461995S1 (en) Tray
USD507083S1 (en) Litter scoop
USD496544S1 (en) Dual shelving unit
USD515701S1 (en) Adhesive patch
USD454669S1 (en) Hummingbird feeder
USD468714S1 (en) Housing for a communication device or similar articles
USD528422S1 (en) Container base
USD483616S1 (en) Oblong dish