WO2003049518A1 - Alimentation de courant - Google Patents
Alimentation de courant Download PDFInfo
- Publication number
- WO2003049518A1 WO2003049518A1 PCT/JP2002/012471 JP0212471W WO03049518A1 WO 2003049518 A1 WO2003049518 A1 WO 2003049518A1 JP 0212471 W JP0212471 W JP 0212471W WO 03049518 A1 WO03049518 A1 WO 03049518A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat sink
- power supply
- supply device
- switching element
- heat
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
Definitions
- the present invention relates to a power supply device using a switching element, which reduces the thermal resistance associated with heat dissipation of the switching element, satisfactorily ensures the performance of the device, and streamlines the connection structure with external terminals. It was done.
- a power supply device for supplying power to a predetermined device is configured using a switching element.
- a switching element is an element that provides a switching function to a circuit network without providing a switching contact, and a typical example thereof is a silicon transistor.
- switching elements for power supply require a relatively large output, and are mounted on heat sinks as a measure against heat generation.
- the above-mentioned power supply device has higher performance and is inexpensive.
- the rated temperature of the switching element is high, connection with external terminals is easy, and the structure is simple. Therefore, it is important that they are excellent in manufacturability and cost, and that they are lightweight and compact.
- the present invention has been made in consideration of these conditions, and an object of the present invention is to provide a power supply device that reduces the thermal resistance associated with heat dissipation of a switching element and that rationalizes a connection structure with external terminals. It is to be. Disclosure of the invention
- the invention described in claim 1 of the present application is directed to a power supply device using a switching element, wherein the power supply device includes a conductive first heat sink to which the switching element is attached; A second heat sink provided with a heat sink electrically insulated, wherein the first heat sink is used as one terminal of the switching element, and the first heat sink contacts an external terminal.
- This is a power supply device having a configuration with a protrusion. According to such a configuration, it is possible to reduce the thermal resistance associated with the heat radiation of the switching element and to rationalize the connection structure with the external terminals.
- heat generated in the switching element is transmitted from the switching element to the first heat sink, and further transmitted from the first heat sink to the second heat sink. As a result, the heat dissipation of the switching element is improved.
- the first heat sink has conductivity, and can be used as one terminal of the switching element. Further, the first heat sink has a protrusion that contacts the external terminal, and the first heat sink and the external terminal are accurately and efficiently connected by using the protrusion.
- the invention described in claim 2 of the present application is the invention according to claim 1, wherein the opposing area between the first heat sink and the second heat sink is wider than the opposing area between the switching element and the first heat sink. Power supply device.
- the opposing area between the first heat sink and the second heat sink is set larger than the opposing area between the switching element and the first heat sink, so that the first heat sink and the first heat sink are separated from each other. The balance between the amount of heat transferred to the heat sink and the amount of heat transferred from the first heat sink to the second heat sink is ensured.
- the invention described in claim 3 of the present application is the power supply device according to claim 1 or 2, wherein the first heat sink is a metal plate formed into an L shape.
- an L-shaped metal plate as the first heat sink.
- such a metal plate is mounted on the second heat sink, and a portion rising from the second heat sink is defined as a projection that contacts an external terminal.
- any one of claims 1 to 3 a connector is provided on each of the protrusion of the first heat sink and the external terminal, and the connectors are joined to each other.
- the power supply device has a configuration in which the protrusion and the external terminal are in contact with each other.
- the invention described in claim 5 of the present application is the invention according to any one of claims 1 to 4, wherein the power supply device includes a plurality of the switching elements and the first heat sink, and at least one of the first heat sinks.
- This is a power supply device having a configuration in which two or more switching elements, each of which has the same potential as an electrode, are attached to a heat sink.
- FIG. 4 is a front view showing a power supply device according to a specific example of the present invention.
- Figure 2 is a front view showing a power supply device according to a specific example of the present invention.
- FIG. 3 is a top view illustrating a power supply device according to a specific example of the present invention.
- Fig. 4 is a top view illustrating a power supply device according to a specific example of the present invention.
- FIG. 4 is a front view showing the inside of a power supply device according to a specific example of the present invention.
- FIG. 4 is a right side view showing the inside of the power supply device according to a specific example of the present invention.
- FIG. 4 is a front view showing a switching element, a first heat sink, and a second heat sink according to a specific example of the present invention.
- FIG. 4 is a left side view showing a switching element, a first heat sink, and a second heat sink according to a specific example of the present invention.
- FIG. 4 is a bottom view showing a switching element, a first heat sink, and a second heat sink according to a specific example of the present invention.
- FIG. 4 is an explanatory view showing connection between a protrusion of a first heat sink and an external terminal according to a specific example of the present invention.
- FIG. 3 is a front view (a), a right side view (b), and a bottom view (c) showing a first heat sink according to a specific example of the present invention.
- FIG. 3 is a front view (a), a right side view (b), and a bottom view (c) showing a first heat sink according to a specific example of the present invention.
- FIG. 2 is a front view (a), a right side view (b), and a bottom view (c) showing a terminal member according to a specific example of the present invention.
- the power supply device 1 of the present example shown in FIGS. 1 to 12 supplies power to a DC motor coil.
- a DC motor is mounted on an electric vehicle together with a battery as a power source, and is a driving motor for driving the vehicle based on a driver's driving operation, as shown in these figures (typically, FIG. 4).
- the power supply device 1 includes a plurality of switching elements 20, a plurality of conductive first heat sinks 30 each having one or more switching elements 20 mounted thereon, and a plurality of first heat sinks 30.
- the first heat sink 30 shown in FIG. 10 is for mounting one switching element 20, and the first heat sink 30 shown in FIG. 11 is composed of a plurality of switching elements. 20 is to be attached.
- the switching element 20 of this example is a voltage-controlled F-type in which the flow of electrons in the semiconductor is controlled by another electrode.
- the current flowing from the power supply to the motor coil is switched by the circuit board 60 controlling the voltages of the plurality of switching elements 20 respectively.
- the control signal is input from the controller connector 62.
- Each first heat sink 30 is used as one terminal of the switching element 20, and a portion facing the second heat sink 40. And a projection 31 protruding from the opposite portion and abutting on the external terminal.
- the first heat sink 30 is a metal plate formed in an L-shape, and has one portion fixed to the second heat sink 40 and the other rising from the second heat sink 40. Are formed as projections 31 that contact the external terminals.
- the second heat sink 40 is a metal plate having a required area.
- the heat generated in the switching element 20 is transmitted to the first heat sink 30 and the second heat sink 40 and dissipated.
- the facing area between the first heat sink 30 and the second heat sink 40 is determined by taking into account the thermal resistance of the insulating sheet 50 and the distance between the switching element 20 and the first heat sink 30. It is set wider than the facing area.
- the second heat sink 40 may be provided with a radiator such as a fin. According to such heat radiation means, the heat radiation of the switching element 20 can be further improved.
- the external terminals in this example are the power supply terminal 81 and the mobile terminal 82 (see FIG. 9), and the power supply device 1 is composed of a plurality of adjacent first heat sinks 30. 1 is connected to the terminal 81 on the power supply side, and the projection 31 of the other first heat sink 30 and the terminal member 61 of the circuit board 60 are connected to the terminal 82 on the motor side. ing.
- a plurality of switching elements 20 having the same potential as the electrodes are mounted on the other first heat sink 30. That is, the structure is simplified by using one first heat sink 30 as an electrode of a plurality of switching elements 20.
- the contact between the protrusion 31 of the first heat sink 30 and the external terminal, and the contact between the terminal member 61 of the circuit board 60 and the external terminal is made by joining the connector provided on the projection 31 and the terminal member 61 with the connector provided on the external terminal.
- a connector J is attached to the projection 31 and the terminal member 61, and a plug P is attached to the terminal 81 on the power supply side and the terminal 82 on the module side. Each of them is attached, and a predetermined contact is made by inserting each plug P into the jack J.
- the jack J and the plug P of this example are resin members having excellent heat resistance.
- the cover 70 has a first opening 71 that exposes the projection 31 of each first heat sink 30 and the terminal member 61 of the circuit board 60, and a component of the circuit board 60.
- a second opening 72 that exposes the mouthpiece connector 62 is provided.
- the protrusion 31 and the terminal member 61 protrude from the first opening 71 to the outside of the cover 70, and the jack J is fitted into the edge of the first opening 71.
- the protrusions 31 and the terminal members 61 may be provided with holes or cutouts at appropriate positions in order to avoid a rise in temperature at the contact points with the external terminals.
- the heat transmitted from the switching element 20 to the contact point between the protrusion 31 and the external terminal can be prevented to some extent by providing the hole and the cutout. Further, when the strength of the projection 31 or the terminal member 61 is slightly deteriorated due to the influence of the hole / notch, it is preferable to suppress the periphery of the hole / notch with the jack J and to reinforce.
- the switching element 20, the first heat sink 30, the second heat sink 40, and the insulating sheet 50 are positioned by using a jig or the like, and these are placed in a plurality. Screw in with bolts B (see Figures 4 to 8). A through hole for passing the bolt B and a female screw portion for screwing the bolt B are provided at key points of each member.
- the bolts B are made of an insulator. Alternatively, a metal bolt B and a boss made of an insulator may be used in combination.
- a method of fixing the switching element 20, the first heat sink 30, and the second heat sink 40 in addition to screwing, it is also possible to use a screw, a grommet, a rivet, or the like. is there.
- a circuit board in which the terminal member 61, the controller connector 62, the capacitor 63, the coil 64, the relay 65, etc. are fixed.
- the second heat sink 40 and the circuit board 60 are provided with a through hole for inserting the bolt B and a female screw portion for screwing the bolt B, respectively, at key points.
- the jack J is mounted on the projection 31 of the first heat sink 30 and the terminal member 61 of the circuit board 60, and the cover 70 is mounted so as to cover the circuit board 60.
- the cover 70 of this example is supported on the edge of the second heat sink 40, and includes a switching element 20, a first heat sink 30, an insulating sheet 50, and a circuit board 60.
- the power supply device 1 housed in a housing composed of a cover 70 and a second heat sink 40 is made into a unit using such a cover 70.
- the power supply device of the present invention reduces the thermal resistance associated with the heat radiation of the switching element and rationalizes the connection structure with the external terminals, and includes a power supply device for supplying power to a DC module. It is suitable for a power supply device in general.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Dc-Dc Converters (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2004-7007545A KR20040069319A (ko) | 2001-12-04 | 2002-11-28 | 급전장치 |
EP02783680A EP1463396A1 (en) | 2001-12-04 | 2002-11-28 | Power supply |
US10/497,688 US7151671B2 (en) | 2001-12-04 | 2002-11-28 | Power supply |
JP2003550573A JP4217157B2 (ja) | 2001-12-04 | 2002-11-28 | 給電装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001369743 | 2001-12-04 | ||
JP2001-369743 | 2001-12-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003049518A1 true WO2003049518A1 (fr) | 2003-06-12 |
Family
ID=19179084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/012471 WO2003049518A1 (fr) | 2001-12-04 | 2002-11-28 | Alimentation de courant |
Country Status (7)
Country | Link |
---|---|
US (1) | US7151671B2 (ja) |
EP (1) | EP1463396A1 (ja) |
JP (1) | JP4217157B2 (ja) |
KR (1) | KR20040069319A (ja) |
CN (1) | CN1255012C (ja) |
TW (1) | TW586343B (ja) |
WO (1) | WO2003049518A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007329230A (ja) * | 2006-06-07 | 2007-12-20 | Anden | 電子回路装置 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006303106A (ja) * | 2005-04-19 | 2006-11-02 | Denso Corp | 電子回路装置 |
JP2006332247A (ja) * | 2005-05-25 | 2006-12-07 | Sansha Electric Mfg Co Ltd | 電源装置および電気装置の放熱構造 |
US7952856B2 (en) * | 2008-06-02 | 2011-05-31 | Honda Motor Co., Ltd. | Power control unit and hybrid vehicle comprising same |
ES2635358T3 (es) * | 2009-04-23 | 2017-10-03 | Theravance Respiratory Company, Llc | Compuestos de diamina que tienen actividad antagonista del receptor muscarínico y agonista del receptor beta2 adrenérgico |
JP5576675B2 (ja) * | 2010-02-23 | 2014-08-20 | パナソニック株式会社 | 給電制御装置 |
USD637192S1 (en) * | 2010-10-18 | 2011-05-03 | Apple Inc. | Electronic device |
CN102646648B (zh) * | 2012-03-30 | 2014-12-03 | 台达电子企业管理(上海)有限公司 | 半导体开关绝缘保护装置以及电源组件 |
JP6698852B2 (ja) * | 2016-09-12 | 2020-05-27 | 三菱電機株式会社 | 半導体素子の保持装置およびこの保持装置を用いた電力変換装置 |
TWD190983S (zh) * | 2017-02-17 | 2018-06-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
US10368431B2 (en) * | 2017-07-20 | 2019-07-30 | Astec International Limited | Cooling assemblies for electronic devices |
AU201815958S (en) * | 2018-04-09 | 2018-11-06 | Samsung Electronics Co Ltd | SSD Storage Device |
USD869469S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
US11652091B2 (en) * | 2020-06-19 | 2023-05-16 | Abb Schweiz Ag | Solid state switching device including nested control electronics |
Citations (6)
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JPS5225299B2 (ja) * | 1973-10-19 | 1977-07-06 | ||
JPH08274482A (ja) * | 1995-03-29 | 1996-10-18 | Mitsubishi Electric Corp | 制御盤 |
JP2515683Y2 (ja) * | 1991-06-06 | 1996-10-30 | 本田技研工業株式会社 | スイッチング素子の取付構造体 |
JP2000252661A (ja) * | 1999-02-25 | 2000-09-14 | Omron Corp | ソリッドステートリレー及びそのソケット |
JP2001057406A (ja) * | 1999-06-11 | 2001-02-27 | Matsushita Electric Ind Co Ltd | 放熱基板及びその製造方法 |
JP2002124313A (ja) * | 2000-10-19 | 2002-04-26 | Sony Corp | バスバー及び電子又は電気部品の取付け構造 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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US3261396A (en) * | 1963-11-13 | 1966-07-19 | Staver Co | Heat dissipator for electronic circuitry |
US3766977A (en) * | 1972-09-15 | 1973-10-23 | M Pravda | Heat sinks |
US3893161A (en) * | 1974-02-04 | 1975-07-01 | Jr Albert Pesak | Frictionally engageable heat sink for solid state devices |
US4204248A (en) * | 1978-11-20 | 1980-05-20 | General Electric Company | Heat transfer mounting arrangement for a solid state device connected to a circuit board |
US4344106A (en) * | 1980-11-26 | 1982-08-10 | Rca Corporation | Transistor heat sink assembly |
US4387413A (en) * | 1980-12-24 | 1983-06-07 | Rca Corporation | Semiconductor apparatus with integral heat sink tab |
US4626982A (en) * | 1983-11-02 | 1986-12-02 | General Electric Company | Series connected switching power supply circuit |
US4707726A (en) * | 1985-04-29 | 1987-11-17 | United Technologies Automotive, Inc. | Heat sink mounting arrangement for a semiconductor |
US4669028A (en) * | 1986-02-18 | 1987-05-26 | Ncr Corporation | Heat sink for solid state devices connected to a circuit board |
JPH0750753B2 (ja) * | 1987-08-21 | 1995-05-31 | 株式会社東芝 | トランジスタ装置 |
US4766653A (en) * | 1987-10-16 | 1988-08-30 | Otis Elevator Company | Method and tool for assembling power semiconductor and heat sink |
US5450284A (en) * | 1994-02-17 | 1995-09-12 | Spacelabs Medical, Inc. | Heat sink and transistor retaining assembly |
US5917701A (en) * | 1997-11-05 | 1999-06-29 | Artesyn Technologies, Inc. | Heat sink hold-down clip |
-
2002
- 2002-11-28 KR KR10-2004-7007545A patent/KR20040069319A/ko not_active Application Discontinuation
- 2002-11-28 EP EP02783680A patent/EP1463396A1/en not_active Withdrawn
- 2002-11-28 CN CNB028241738A patent/CN1255012C/zh not_active Expired - Fee Related
- 2002-11-28 WO PCT/JP2002/012471 patent/WO2003049518A1/ja not_active Application Discontinuation
- 2002-11-28 JP JP2003550573A patent/JP4217157B2/ja not_active Expired - Fee Related
- 2002-11-28 US US10/497,688 patent/US7151671B2/en not_active Expired - Fee Related
- 2002-12-03 TW TW091134983A patent/TW586343B/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5225299B2 (ja) * | 1973-10-19 | 1977-07-06 | ||
JP2515683Y2 (ja) * | 1991-06-06 | 1996-10-30 | 本田技研工業株式会社 | スイッチング素子の取付構造体 |
JPH08274482A (ja) * | 1995-03-29 | 1996-10-18 | Mitsubishi Electric Corp | 制御盤 |
JP2000252661A (ja) * | 1999-02-25 | 2000-09-14 | Omron Corp | ソリッドステートリレー及びそのソケット |
JP2001057406A (ja) * | 1999-06-11 | 2001-02-27 | Matsushita Electric Ind Co Ltd | 放熱基板及びその製造方法 |
JP2002124313A (ja) * | 2000-10-19 | 2002-04-26 | Sony Corp | バスバー及び電子又は電気部品の取付け構造 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007329230A (ja) * | 2006-06-07 | 2007-12-20 | Anden | 電子回路装置 |
Also Published As
Publication number | Publication date |
---|---|
TW586343B (en) | 2004-05-01 |
KR20040069319A (ko) | 2004-08-05 |
US7151671B2 (en) | 2006-12-19 |
CN1600051A (zh) | 2005-03-23 |
EP1463396A1 (en) | 2004-09-29 |
JPWO2003049518A1 (ja) | 2005-04-21 |
TW200301069A (en) | 2003-06-16 |
JP4217157B2 (ja) | 2009-01-28 |
CN1255012C (zh) | 2006-05-03 |
US20050078454A1 (en) | 2005-04-14 |
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