US4936785A
(en)
*
|
1988-12-19 |
1990-06-26 |
Krug Eric M |
Interchangeable adapter module for electronic devices
|
US5224023A
(en)
*
|
1992-02-10 |
1993-06-29 |
Smith Gary W |
Foldable electronic assembly module
|
US6036098A
(en)
*
|
1992-05-15 |
2000-03-14 |
Symbol Technologies, Inc. |
Miniature scan element operably connected to a personal computer interface card
|
US5347428A
(en)
*
|
1992-12-03 |
1994-09-13 |
Irvine Sensors Corporation |
Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
|
US5303121A
(en)
*
|
1992-12-28 |
1994-04-12 |
Ncr Corporation |
Multi-chip module board
|
USD370464S
(en)
*
|
1994-11-30 |
1996-06-04 |
Metropage, Inc. |
Heat seal connector for a pager
|
US5933623A
(en)
*
|
1995-10-26 |
1999-08-03 |
Hitachi, Ltd. |
Synchronous data transfer system
|
US6021048A
(en)
*
|
1998-02-17 |
2000-02-01 |
Smith; Gary W. |
High speed memory module
|
US6008994A
(en)
*
|
1998-08-04 |
1999-12-28 |
Itt Manufacturing Enterprises, Inc. |
PC card grounding clip
|
US6025992A
(en)
*
|
1999-02-11 |
2000-02-15 |
International Business Machines Corp. |
Integrated heat exchanger for memory module
|
US6381140B1
(en)
*
|
1999-08-30 |
2002-04-30 |
Witek Enterprise Co., Ltd. |
Memory module
|
USD432096S
(en)
*
|
1999-11-24 |
2000-10-17 |
Samsung Electronics Co., Ltd. |
Semiconductor module
|
JP4569913B2
(en)
*
|
2000-03-10 |
2010-10-27 |
エルピーダメモリ株式会社 |
Memory module
|
US6757751B1
(en)
*
|
2000-08-11 |
2004-06-29 |
Harrison Gene |
High-speed, multiple-bank, stacked, and PCB-mounted memory module
|
US6576972B1
(en)
*
|
2000-08-24 |
2003-06-10 |
Heetronix |
High temperature circuit structures with expansion matched SiC, AlN and/or AlxGa1-xN(x>0.69) circuit device
|
US7103694B2
(en)
*
|
2000-09-08 |
2006-09-05 |
Hewlett-Packard Development Company, L.P. |
Method and apparatus implementing a tuned stub SCSI topology
|
KR100340285B1
(en)
*
|
2000-10-24 |
2002-06-15 |
윤종용 |
Memory module having series-connected printed circuit boards
|
US6535387B2
(en)
*
|
2001-06-28 |
2003-03-18 |
Intel Corporation |
Heat transfer apparatus
|
US6956284B2
(en)
*
|
2001-10-26 |
2005-10-18 |
Staktek Group L.P. |
Integrated circuit stacking system and method
|
US20030097506A1
(en)
*
|
2001-11-20 |
2003-05-22 |
Aaeon Technology Inc. |
Structure of the bus card of the mini image port
|
JP4217157B2
(en)
*
|
2001-12-04 |
2009-01-28 |
株式会社東京アールアンドデー |
Power supply device
|
DE10160041A1
(en)
*
|
2001-12-06 |
2003-09-25 |
Marconi Comm Gmbh |
Electronic circuit module and method for its assembly
|
US6590282B1
(en)
*
|
2002-04-12 |
2003-07-08 |
Industrial Technology Research Institute |
Stacked semiconductor package formed on a substrate and method for fabrication
|
US6762942B1
(en)
*
|
2002-09-05 |
2004-07-13 |
Gary W. Smith |
Break away, high speed, folded, jumperless electronic assembly
|
JP4221238B2
(en)
*
|
2002-09-26 |
2009-02-12 |
エルピーダメモリ株式会社 |
Memory module
|
US6812555B2
(en)
*
|
2003-03-10 |
2004-11-02 |
Everstone Industry Corp. |
Memory card substrate with alternating contacts
|
JP2005123503A
(en)
*
|
2003-10-20 |
2005-05-12 |
Renesas Technology Corp |
Semiconductor device and semiconductor module
|
TW200515843A
(en)
*
|
2003-10-27 |
2005-05-01 |
Benq Corp |
Electronic apparatus with module-locking device
|
JP2005191148A
(en)
*
|
2003-12-24 |
2005-07-14 |
Sanyo Electric Co Ltd |
Hybrid integrated circuit device and manufacturing method thereof
|
JP2005191147A
(en)
*
|
2003-12-24 |
2005-07-14 |
Sanyo Electric Co Ltd |
Method for manufacturing hybrid integrated circuit device
|
DE102004009055B4
(en)
*
|
2004-02-23 |
2006-01-26 |
Infineon Technologies Ag |
Cooling arrangement for devices with power semiconductors and method for cooling such devices
|
US7532537B2
(en)
*
|
2004-03-05 |
2009-05-12 |
Netlist, Inc. |
Memory module with a circuit providing load isolation and memory domain translation
|
US7516281B2
(en)
*
|
2004-05-25 |
2009-04-07 |
Micron Technology, Inc. |
On-die termination snooping for 2T applications in a memory system implementing non-self-terminating ODT schemes
|
US20060261449A1
(en)
*
|
2005-05-18 |
2006-11-23 |
Staktek Group L.P. |
Memory module system and method
|
US7579687B2
(en)
*
|
2004-09-03 |
2009-08-25 |
Entorian Technologies, Lp |
Circuit module turbulence enhancement systems and methods
|
US7606050B2
(en)
*
|
2004-09-03 |
2009-10-20 |
Entorian Technologies, Lp |
Compact module system and method
|
US7468893B2
(en)
*
|
2004-09-03 |
2008-12-23 |
Entorian Technologies, Lp |
Thin module system and method
|
US7423885B2
(en)
*
|
2004-09-03 |
2008-09-09 |
Entorian Technologies, Lp |
Die module system
|
US20060049513A1
(en)
*
|
2004-09-03 |
2006-03-09 |
Staktek Group L.P. |
Thin module system and method with thermal management
|
US20060050492A1
(en)
*
|
2004-09-03 |
2006-03-09 |
Staktek Group, L.P. |
Thin module system and method
|
US7324352B2
(en)
*
|
2004-09-03 |
2008-01-29 |
Staktek Group L.P. |
High capacity thin module system and method
|
US7606049B2
(en)
*
|
2004-09-03 |
2009-10-20 |
Entorian Technologies, Lp |
Module thermal management system and method
|
US7542297B2
(en)
*
|
2004-09-03 |
2009-06-02 |
Entorian Technologies, Lp |
Optimized mounting area circuit module system and method
|
US7215551B2
(en)
*
|
2004-09-29 |
2007-05-08 |
Super Talent Electronics, Inc. |
Memory module assembly including heat sink attached to integrated circuits by adhesive
|
US7299313B2
(en)
*
|
2004-10-29 |
2007-11-20 |
International Business Machines Corporation |
System, method and storage medium for a memory subsystem command interface
|
US7869218B2
(en)
*
|
2004-11-16 |
2011-01-11 |
Super Talent Electronics, Inc. |
Light-weight solid state drive with rivet sets
|
US7269025B2
(en)
*
|
2004-12-30 |
2007-09-11 |
Intel Corporation |
Ballout for buffer
|
DE102005005064B4
(en)
*
|
2005-02-03 |
2006-12-21 |
Infineon Technologies Ag |
Semiconductor memory module with bus architecture
|
US7519894B2
(en)
*
|
2005-06-14 |
2009-04-14 |
Infineon Technologies Ag |
Memory device with error correction code module
|
US8081474B1
(en)
*
|
2007-12-18 |
2011-12-20 |
Google Inc. |
Embossed heat spreader
|
US8796830B1
(en)
*
|
2006-09-01 |
2014-08-05 |
Google Inc. |
Stackable low-profile lead frame package
|
DE102005033710B3
(en)
*
|
2005-07-19 |
2007-01-25 |
Infineon Technologies Ag |
Semiconductor memory module, has control bus connected with control chip at end and with contact holes of module plate at another end, and memory chip connected to control bus by conductor of upper surface of plate and by contact holes
|
US7442050B1
(en)
*
|
2005-08-29 |
2008-10-28 |
Netlist, Inc. |
Circuit card with flexible connection for memory module with heat spreader
|
US7365990B2
(en)
*
|
2005-12-19 |
2008-04-29 |
Infineon Technologies Ag |
Circuit board arrangement including heat dissipater
|
US7511969B2
(en)
*
|
2006-02-02 |
2009-03-31 |
Entorian Technologies, Lp |
Composite core circuit module system and method
|
US7619893B1
(en)
*
|
2006-02-17 |
2009-11-17 |
Netlist, Inc. |
Heat spreader for electronic modules
|
US7394149B2
(en)
*
|
2006-03-08 |
2008-07-01 |
Microelectronics Assembly Technologies, Inc. |
Thin multichip flex-module
|
US7393226B2
(en)
*
|
2006-03-08 |
2008-07-01 |
Microelectronics Assembly Technologies, Inc. |
Thin multichip flex-module
|
US7429788B2
(en)
*
|
2006-03-08 |
2008-09-30 |
Microelectronics Assembly Technologies, Inc. |
Thin multichip flex-module
|
US7520781B2
(en)
*
|
2006-03-08 |
2009-04-21 |
Microelectronics Assembly Technologies |
Thin multichip flex-module
|
CN101043789B
(en)
*
|
2006-03-25 |
2010-05-12 |
富准精密工业(深圳)有限公司 |
Heat radiating device
|
CN101083362A
(en)
*
|
2006-05-31 |
2007-12-05 |
富士康(昆山)电脑接插件有限公司 |
Clamp device and flange connector having the same
|
KR100818621B1
(en)
*
|
2006-08-11 |
2008-04-01 |
삼성전자주식회사 |
Memory Module, Socket for Memory Module and Main Board Having The Same
|
US7590899B2
(en)
*
|
2006-09-15 |
2009-09-15 |
International Business Machines Corporation |
Processor memory array having memory macros for relocatable store protect keys
|
US7477522B2
(en)
*
|
2006-10-23 |
2009-01-13 |
International Business Machines Corporation |
High density high reliability memory module with a fault tolerant address and command bus
|
US7612446B2
(en)
*
|
2006-11-22 |
2009-11-03 |
International Business Machines Corporation |
Structures to enhance cooling of computer memory modules
|
JP4389228B2
(en)
*
|
2006-11-29 |
2009-12-24 |
エルピーダメモリ株式会社 |
Memory module
|
US7474529B2
(en)
*
|
2006-11-29 |
2009-01-06 |
International Business Machines Corporation |
Folded-sheet-metal heatsinks for closely packaged heat-producing devices
|
TW200825931A
(en)
*
|
2006-12-11 |
2008-06-16 |
Kreton Corp |
Memory packaging element and insert card module using the memory packaging element
|
CN101206603A
(en)
*
|
2006-12-22 |
2008-06-25 |
鸿富锦精密工业(深圳)有限公司 |
AD signal interface card based on PCI
|
DE102007019117B4
(en)
*
|
2007-04-23 |
2009-01-22 |
Qimonda Ag |
memory module
|
US7839712B2
(en)
*
|
2007-08-03 |
2010-11-23 |
Qimonda Ag |
Semiconductor memory arrangement
|
US20090086448A1
(en)
*
|
2007-09-27 |
2009-04-02 |
Hiew Siew S |
Solid state drive with coverless casing
|
KR20090051640A
(en)
*
|
2007-11-19 |
2009-05-22 |
삼성전자주식회사 |
A heat sink for semiconductor device and semiconductor module including the same
|
US7872483B2
(en)
*
|
2007-12-12 |
2011-01-18 |
Samsung Electronics Co., Ltd. |
Circuit board having bypass pad
|
TWI439843B
(en)
*
|
2008-04-23 |
2014-06-01 |
Ibm |
Printed circuit assembly with automatic selection of storage configuration based on installed paddle board
|
US8018723B1
(en)
*
|
2008-04-30 |
2011-09-13 |
Netlist, Inc. |
Heat dissipation for electronic modules
|
US20100049914A1
(en)
*
|
2008-08-20 |
2010-02-25 |
Goodwin Paul M |
RAID Enhanced solid state drive
|
US7682179B1
(en)
*
|
2008-09-09 |
2010-03-23 |
Chou Hsien Tsai |
Electrical connector having elastic card-ejecting member
|
JP2010079445A
(en)
*
|
2008-09-24 |
2010-04-08 |
Toshiba Corp |
Ssd device
|
JP2010282511A
(en)
*
|
2009-06-05 |
2010-12-16 |
Elpida Memory Inc |
Memory module and memory system including the same
|
WO2010144097A1
(en)
*
|
2009-06-12 |
2010-12-16 |
Hewlett-Packard Development Company, L.P. |
Hierarchical on-chip memory
|
US20110019370A1
(en)
*
|
2009-07-27 |
2011-01-27 |
Gainteam Holdings Limited |
Flexible circuit module
|
US8014144B2
(en)
*
|
2009-08-18 |
2011-09-06 |
Inventec Corporation |
Server device with a storage array module
|
JP5649293B2
(en)
*
|
2009-08-27 |
2015-01-07 |
ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. |
Memory module
|
US8463979B2
(en)
*
|
2009-09-08 |
2013-06-11 |
Ocz Technology Group Inc. |
Non-volatile storage devices, methods of addressing, and control logic therefor
|
JP2011090441A
(en)
*
|
2009-10-21 |
2011-05-06 |
Elpida Memory Inc |
Memory module
|
CN102934040B
(en)
*
|
2010-06-16 |
2015-11-25 |
惠普发展公司,有限责任合伙企业 |
Computer rack
|
USD637192S1
(en)
*
|
2010-10-18 |
2011-05-03 |
Apple Inc. |
Electronic device
|
USD637193S1
(en)
*
|
2010-11-19 |
2011-05-03 |
Apple Inc. |
Electronic device
|
US8675355B2
(en)
*
|
2011-03-16 |
2014-03-18 |
Lenovo (Singapore) Pte. Ltd. |
Release mechanism with pre-travel
|
USD673921S1
(en)
*
|
2011-04-21 |
2013-01-08 |
Kabushiki Kaisha Toshiba |
Portion of a substrate for an electronic circuit
|
USD673922S1
(en)
*
|
2011-04-21 |
2013-01-08 |
Kabushiki Kaisha Toshiba |
Portion of a substrate for an electronic circuit
|
JP2013171337A
(en)
*
|
2012-02-17 |
2013-09-02 |
Toshiba Corp |
Memory system and method for testing the same
|
USD716310S1
(en)
*
|
2012-06-09 |
2014-10-28 |
Apple, Inc. |
Electronic device
|
USD709894S1
(en)
*
|
2012-09-22 |
2014-07-29 |
Apple Inc. |
Electronic device
|
US9904333B2
(en)
*
|
2012-10-18 |
2018-02-27 |
Apple Inc. |
SSD (solid state drive) related features of a portable computer
|
US20140146462A1
(en)
*
|
2012-11-26 |
2014-05-29 |
Giovanni Coglitore |
High Density Storage Applicance
|
USD716743S1
(en)
*
|
2014-03-25 |
2014-11-04 |
Transcend Information, Inc. |
Printed circuit board of solid-state memory
|
USD769833S1
(en)
*
|
2014-08-29 |
2016-10-25 |
Apple Inc. |
Component for electronic device
|
US9934825B2
(en)
*
|
2014-12-12 |
2018-04-03 |
Toshiba Memory Corporation |
Semiconductor device and electronic device
|
USD753073S1
(en)
*
|
2014-12-30 |
2016-04-05 |
Altia Systems, Inc. |
Printed circuit board
|
JP1528936S
(en)
*
|
2015-01-14 |
2015-07-13 |
|
|
JP1528484S
(en)
*
|
2015-01-14 |
2015-07-13 |
|
|
JP1528485S
(en)
*
|
2015-01-14 |
2015-07-13 |
|
|
JP6381480B2
(en)
*
|
2015-05-12 |
2018-08-29 |
東芝メモリ株式会社 |
Semiconductor device
|
JP2017022241A
(en)
*
|
2015-07-09 |
2017-01-26 |
株式会社東芝 |
Semiconductor device and electronic equipment
|
TWD179882S
(en)
*
|
2016-06-20 |
2016-12-01 |
全何科技股份有限公司 |
solid state drive
|
USD798251S1
(en)
*
|
2016-11-07 |
2017-09-26 |
Transcend Information, Inc. |
Printed circuit board of solid-state memory
|
TWD189066S
(en)
*
|
2017-02-17 |
2018-03-11 |
三星電子股份有限公司 |
Ssd storage device
|
TWD189065S
(en)
*
|
2017-02-17 |
2018-03-11 |
三星電子股份有限公司 |
Ssd storage device
|
TWD189067S
(en)
*
|
2017-02-17 |
2018-03-11 |
三星電子股份有限公司 |
Ssd storage device
|
TWD189069S
(en)
*
|
2017-02-17 |
2018-03-11 |
三星電子股份有限公司 |
Ssd storage device
|
TWD189071S
(en)
*
|
2017-02-17 |
2018-03-11 |
三星電子股份有限公司 |
Ssd storage device
|
TWD190983S
(en)
*
|
2017-02-17 |
2018-06-11 |
三星電子股份有限公司 |
Ssd storage device
|
TWD189068S
(en)
*
|
2017-02-17 |
2018-03-11 |
三星電子股份有限公司 |
Ssd storage device
|
TWD189070S
(en)
*
|
2017-02-17 |
2018-03-11 |
三星電子股份有限公司 |
Ssd storage device
|