TWD189068S - Ssd storage device - Google Patents

Ssd storage device

Info

Publication number
TWD189068S
TWD189068S TW106304666F TW106304666F TWD189068S TW D189068 S TWD189068 S TW D189068S TW 106304666 F TW106304666 F TW 106304666F TW 106304666 F TW106304666 F TW 106304666F TW D189068 S TWD189068 S TW D189068S
Authority
TW
Taiwan
Prior art keywords
storage device
design
ssd storage
item
ssd
Prior art date
Application number
TW106304666F
Other languages
Chinese (zh)
Inventor
任洸萬
尹恩振
Original Assignee
三星電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星電子股份有限公司 filed Critical 三星電子股份有限公司
Publication of TWD189068S publication Critical patent/TWD189068S/en

Links

Abstract

【物品用途】;本設計物品是一種固態硬碟(Solid State Drive,簡稱SSD)儲存裝置,其經由使用半導體來儲存資料於其內。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。[Use of item]; This design item is a solid state drive (SSD) storage device that uses semiconductors to store data in it. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design.

Description

固態硬碟儲存裝置Solid state hard disk storage device

本設計物品是一種固態硬碟(Solid State Drive,簡稱SSD)儲存裝置,其經由使用半導體來儲存資料於其內。The design item is a solid state drive (SSD) storage device that stores data therein by using a semiconductor.

圖式所揭露之虛線部分,為本案不主張設計之部分。The dotted line section disclosed in the figure is not part of the design of this case.

TW106304666F 2017-02-17 2017-08-16 Ssd storage device TWD189068S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20170007653 2017-02-17
??30-2017-0007653 2017-02-17

Publications (1)

Publication Number Publication Date
TWD189068S true TWD189068S (en) 2018-03-11

Family

ID=62706219

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106304666F TWD189068S (en) 2017-02-17 2017-08-16 Ssd storage device

Country Status (3)

Country Link
US (1) USD826945S1 (en)
JP (1) JP1608116S (en)
TW (1) TWD189068S (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD190983S (en) * 2017-02-17 2018-06-11 三星電子股份有限公司 Ssd storage device
TWD189064S (en) * 2017-02-17 2018-03-11 三星電子股份有限公司 Ssd storage device
USD869469S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
AU201815958S (en) * 2018-04-09 2018-11-06 Samsung Electronics Co Ltd SSD Storage Device
EP3923687B1 (en) * 2020-06-09 2024-04-03 Samsung Electronics Co., Ltd. Memory device and electronic device including the same
USD997161S1 (en) * 2020-09-10 2023-08-29 Samsung Electronics Co., Ltd. Solid state drive memory device
USD986249S1 (en) * 2021-08-30 2023-05-16 Samsung Electronics Co., Ltd. Solid state drive memory device
USD986900S1 (en) * 2021-08-30 2023-05-23 Samsung Electronics Co., Ltd. Solid state drive memory device
USD986899S1 (en) * 2021-08-30 2023-05-23 Samsung Electronics Co., Ltd. Solid state drive memory device
TWD220529S (en) * 2021-11-30 2022-08-11 芝奇國際實業股份有限公司 Memory Module (2)
TWD220530S (en) * 2021-11-30 2022-08-11 芝奇國際實業股份有限公司 Memory Module (1)

Family Cites Families (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4872505A (en) * 1988-08-16 1989-10-10 Ncr Corporation Heat sink for an electronic device
US5224023A (en) * 1992-02-10 1993-06-29 Smith Gary W Foldable electronic assembly module
US5347428A (en) * 1992-12-03 1994-09-13 Irvine Sensors Corporation Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
US5933623A (en) * 1995-10-26 1999-08-03 Hitachi, Ltd. Synchronous data transfer system
US5754409A (en) * 1996-11-06 1998-05-19 Dynamem, Inc. Foldable electronic assembly module
US6002589A (en) * 1997-07-21 1999-12-14 Rambus Inc. Integrated circuit package for coupling to a printed circuit board
JP3294785B2 (en) * 1997-09-01 2002-06-24 シャープ株式会社 Heat dissipation structure of circuit element
US6021048A (en) * 1998-02-17 2000-02-01 Smith; Gary W. High speed memory module
US6025992A (en) * 1999-02-11 2000-02-15 International Business Machines Corp. Integrated heat exchanger for memory module
US6381140B1 (en) * 1999-08-30 2002-04-30 Witek Enterprise Co., Ltd. Memory module
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
JP4569913B2 (en) * 2000-03-10 2010-10-27 エルピーダメモリ株式会社 Memory module
US6757751B1 (en) * 2000-08-11 2004-06-29 Harrison Gene High-speed, multiple-bank, stacked, and PCB-mounted memory module
KR100340285B1 (en) * 2000-10-24 2002-06-15 윤종용 Memory module having series-connected printed circuit boards
US6535387B2 (en) * 2001-06-28 2003-03-18 Intel Corporation Heat transfer apparatus
US6956284B2 (en) * 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
DE10160041A1 (en) * 2001-12-06 2003-09-25 Marconi Comm Gmbh Electronic circuit module and method for its assembly
US6590282B1 (en) * 2002-04-12 2003-07-08 Industrial Technology Research Institute Stacked semiconductor package formed on a substrate and method for fabrication
US6762942B1 (en) * 2002-09-05 2004-07-13 Gary W. Smith Break away, high speed, folded, jumperless electronic assembly
JP4221238B2 (en) * 2002-09-26 2009-02-12 エルピーダメモリ株式会社 Memory module
JP2005123503A (en) * 2003-10-20 2005-05-12 Renesas Technology Corp Semiconductor device and semiconductor module
DE102004009055B4 (en) * 2004-02-23 2006-01-26 Infineon Technologies Ag Cooling arrangement for devices with power semiconductors and method for cooling such devices
US7532537B2 (en) * 2004-03-05 2009-05-12 Netlist, Inc. Memory module with a circuit providing load isolation and memory domain translation
US7516281B2 (en) * 2004-05-25 2009-04-07 Micron Technology, Inc. On-die termination snooping for 2T applications in a memory system implementing non-self-terminating ODT schemes
US7468893B2 (en) * 2004-09-03 2008-12-23 Entorian Technologies, Lp Thin module system and method
US7542297B2 (en) * 2004-09-03 2009-06-02 Entorian Technologies, Lp Optimized mounting area circuit module system and method
US7606049B2 (en) * 2004-09-03 2009-10-20 Entorian Technologies, Lp Module thermal management system and method
US7423885B2 (en) * 2004-09-03 2008-09-09 Entorian Technologies, Lp Die module system
US7324352B2 (en) * 2004-09-03 2008-01-29 Staktek Group L.P. High capacity thin module system and method
US7579687B2 (en) * 2004-09-03 2009-08-25 Entorian Technologies, Lp Circuit module turbulence enhancement systems and methods
US20060049513A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method with thermal management
US20060050492A1 (en) * 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US7606050B2 (en) * 2004-09-03 2009-10-20 Entorian Technologies, Lp Compact module system and method
US20060261449A1 (en) * 2005-05-18 2006-11-23 Staktek Group L.P. Memory module system and method
US7299313B2 (en) * 2004-10-29 2007-11-20 International Business Machines Corporation System, method and storage medium for a memory subsystem command interface
US7269025B2 (en) * 2004-12-30 2007-09-11 Intel Corporation Ballout for buffer
DE102005005064B4 (en) * 2005-02-03 2006-12-21 Infineon Technologies Ag Semiconductor memory module with bus architecture
US7519894B2 (en) * 2005-06-14 2009-04-14 Infineon Technologies Ag Memory device with error correction code module
US8081474B1 (en) * 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
US8796830B1 (en) * 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
DE102005033710B3 (en) * 2005-07-19 2007-01-25 Infineon Technologies Ag Semiconductor memory module, has control bus connected with control chip at end and with contact holes of module plate at another end, and memory chip connected to control bus by conductor of upper surface of plate and by contact holes
US7442050B1 (en) * 2005-08-29 2008-10-28 Netlist, Inc. Circuit card with flexible connection for memory module with heat spreader
US7365990B2 (en) * 2005-12-19 2008-04-29 Infineon Technologies Ag Circuit board arrangement including heat dissipater
US7511969B2 (en) * 2006-02-02 2009-03-31 Entorian Technologies, Lp Composite core circuit module system and method
US7619893B1 (en) * 2006-02-17 2009-11-17 Netlist, Inc. Heat spreader for electronic modules
US7520781B2 (en) * 2006-03-08 2009-04-21 Microelectronics Assembly Technologies Thin multichip flex-module
US7429788B2 (en) * 2006-03-08 2008-09-30 Microelectronics Assembly Technologies, Inc. Thin multichip flex-module
US7393226B2 (en) * 2006-03-08 2008-07-01 Microelectronics Assembly Technologies, Inc. Thin multichip flex-module
US7394149B2 (en) * 2006-03-08 2008-07-01 Microelectronics Assembly Technologies, Inc. Thin multichip flex-module
CN101043789B (en) * 2006-03-25 2010-05-12 富准精密工业(深圳)有限公司 Heat radiating device
US7590899B2 (en) * 2006-09-15 2009-09-15 International Business Machines Corporation Processor memory array having memory macros for relocatable store protect keys
US7477522B2 (en) * 2006-10-23 2009-01-13 International Business Machines Corporation High density high reliability memory module with a fault tolerant address and command bus
US7612446B2 (en) * 2006-11-22 2009-11-03 International Business Machines Corporation Structures to enhance cooling of computer memory modules
US7474529B2 (en) * 2006-11-29 2009-01-06 International Business Machines Corporation Folded-sheet-metal heatsinks for closely packaged heat-producing devices
JP4389228B2 (en) * 2006-11-29 2009-12-24 エルピーダメモリ株式会社 Memory module
TW200825931A (en) * 2006-12-11 2008-06-16 Kreton Corp Memory packaging element and insert card module using the memory packaging element
DE102007019117B4 (en) * 2007-04-23 2009-01-22 Qimonda Ag memory module
US7839712B2 (en) * 2007-08-03 2010-11-23 Qimonda Ag Semiconductor memory arrangement
KR20090051640A (en) * 2007-11-19 2009-05-22 삼성전자주식회사 A heat sink for semiconductor device and semiconductor module including the same
TWI439843B (en) * 2008-04-23 2014-06-01 Ibm Printed circuit assembly with automatic selection of storage configuration based on installed paddle board
US8018723B1 (en) * 2008-04-30 2011-09-13 Netlist, Inc. Heat dissipation for electronic modules
JP2010079445A (en) * 2008-09-24 2010-04-08 Toshiba Corp Ssd device
JP2010282511A (en) * 2009-06-05 2010-12-16 Elpida Memory Inc Memory module and memory system including the same
WO2010144097A1 (en) * 2009-06-12 2010-12-16 Hewlett-Packard Development Company, L.P. Hierarchical on-chip memory
JP5649293B2 (en) * 2009-08-27 2015-01-07 ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. Memory module
JP2011090441A (en) * 2009-10-21 2011-05-06 Elpida Memory Inc Memory module
USD637192S1 (en) * 2010-10-18 2011-05-03 Apple Inc. Electronic device
USD637193S1 (en) * 2010-11-19 2011-05-03 Apple Inc. Electronic device
USD673922S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
JP2013171337A (en) * 2012-02-17 2013-09-02 Toshiba Corp Memory system and method for testing the same
USD716310S1 (en) * 2012-06-09 2014-10-28 Apple, Inc. Electronic device
US9934825B2 (en) * 2014-12-12 2018-04-03 Toshiba Memory Corporation Semiconductor device and electronic device
USD753073S1 (en) 2014-12-30 2016-04-05 Altia Systems, Inc. Printed circuit board
JP1528485S (en) * 2015-01-14 2015-07-13
JP1528484S (en) * 2015-01-14 2015-07-13
JP1528936S (en) * 2015-01-14 2015-07-13
JP6381480B2 (en) * 2015-05-12 2018-08-29 東芝メモリ株式会社 Semiconductor device
JP2017022241A (en) * 2015-07-09 2017-01-26 株式会社東芝 Semiconductor device and electronic equipment
TWD179882S (en) * 2016-06-20 2016-12-01 全何科技股份有限公司 solid state drive
USD798251S1 (en) * 2016-11-07 2017-09-26 Transcend Information, Inc. Printed circuit board of solid-state memory
TWD189070S (en) 2017-02-17 2018-03-11 三星電子股份有限公司 Ssd storage device

Also Published As

Publication number Publication date
JP1608116S (en) 2018-07-02
USD826945S1 (en) 2018-08-28

Similar Documents

Publication Publication Date Title
TWD192429S (en) Ssd storage device
TWD192430S (en) Ssd storage device
TWD192432S (en) Ssd storage device
TWD193403S (en) Ssd storage device
TWD192431S (en) Ssd storage device
TWD190983S (en) Ssd storage device
TWD189068S (en) Ssd storage device
TWD199685S (en) Ssd storage device
TWD199686S (en) Ssd storage device
TWD189071S (en) Ssd storage device
TWD189069S (en) Ssd storage device
TWD189067S (en) Ssd storage device
TWD189070S (en) Ssd storage device
TWD189066S (en) Ssd storage device
TWD189064S (en) Ssd storage device
TWD202062S (en) Ssd storage device
TWD201584S (en) Ssd storage device
TWD193584S (en) Storage device
TWD202064S (en) Ssd storage device
TWD189065S (en) Ssd storage device
TWD208788S (en) Ssd storage device
TWD208787S (en) Ssd storage device
TWD193583S (en) Storage device
TWD193977S (en) Storage device
TWD208786S (en) Ssd storage device