TWD220530S - Memory Module (1) - Google Patents
Memory Module (1) Download PDFInfo
- Publication number
- TWD220530S TWD220530S TW110306520F TW110306520F TWD220530S TW D220530 S TWD220530 S TW D220530S TW 110306520 F TW110306520 F TW 110306520F TW 110306520 F TW110306520 F TW 110306520F TW D220530 S TWD220530 S TW D220530S
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- Prior art keywords
- design
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- memory module
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- taken along
- Prior art date
Links
- 238000010586 diagram Methods 0.000 abstract description 4
- 230000000007 visual effect Effects 0.000 abstract description 2
- 230000003796 beauty Effects 0.000 abstract 1
- 238000000354 decomposition reaction Methods 0.000 abstract 1
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Abstract
【物品用途】;本設計物品是記憶體模組。;【設計說明】;本設計的特點在於：記憶體模組整體外觀展現出流動、波浪意象且富於獨特視覺美感之意象。;圖式中以虛線所揭露之區域為本案不主張設計之部分。;8-8平面剖視圖係表示前視圖中沿著8-8剖線所截取之剖視圖。;9-9平面剖視圖係表示前視圖中沿著9-9剖線所截取之剖視圖。;參考圖為示例性地表示本設計分解狀態之參考示意圖。【Item Usage】;This design item is a memory module. ;[Design Description];The characteristic of this design is that the overall appearance of the memory module shows a flowing, wavy image and is full of unique visual beauty. ;The area revealed by the dotted line in the diagram is the part of this case that is not recommended for design. ;8-8 Plane sectional view system represents the sectional view taken along the 8-8 section line in the front view. ;9-9 plane section diagram system represents the section view taken along the 9-9 section line in the front view. ;The reference figure is a reference schematic diagram illustrating the decomposition state of this design.
Description
本設計物品是記憶體模組。This design item is a memory module.
本設計的特點在於：記憶體模組整體外觀展現出流動、波浪意象且富於獨特視覺美感之意象。The feature of this design is that the overall appearance of the memory module shows a flowing, wavy image and an image full of unique visual aesthetics.
圖式中以虛線所揭露之區域為本案不主張設計之部分。The area exposed by the dotted line in the drawing is the part of which the design is not claimed in this case.
8-8平面剖視圖係表示前視圖中沿著8-8剖線所截取之剖視圖。The 8-8 plan sectional view represents the sectional view taken along the 8-8 line in the front view.
9-9平面剖視圖係表示前視圖中沿著9-9剖線所截取之剖視圖。The 9-9 plan sectional view represents the sectional view taken along the 9-9 section line in the front view.
參考圖為示例性地表示本設計分解狀態之參考示意圖。The reference drawing is a reference schematic diagram exemplarily showing the disassembled state of the present design.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110306520F TWD220530S (en) | 2021-11-30 | 2021-11-30 | Memory Module (1) |
| US29/791,101 USD1005295S1 (en) | 2021-11-30 | 2021-12-29 | Computer memory module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110306520F TWD220530S (en) | 2021-11-30 | 2021-11-30 | Memory Module (1) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD220530S true TWD220530S (en) | 2022-08-11 |
Family
ID=88758098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110306520F TWD220530S (en) | 2021-11-30 | 2021-11-30 | Memory Module (1) |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD1005295S1 (en) |
| TW (1) | TWD220530S (en) |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU112763S (en) * | 1991-02-14 | 1991-11-06 | Portacom Pty Ltd | Touch sensor plug-in module |
| USD348469S (en) * | 1992-01-27 | 1994-07-05 | At&T Bell Laboratories | Electronics cabinet door |
| USD394845S (en) * | 1996-09-24 | 1998-06-02 | Motorola, Inc. | Front panel with perforations for infrastructure equipment |
| USD482691S1 (en) * | 2002-07-26 | 2003-11-25 | Hewlett-Packard Development Company, L.P. | Server blade |
| USD637157S1 (en) * | 2010-10-18 | 2011-05-03 | Apple Inc. | Electronic device |
| USD657756S1 (en) * | 2011-10-17 | 2012-04-17 | Corsair Memory, Inc. | Low profile heat spreader for a computer memory module |
| USD660810S1 (en) * | 2011-10-17 | 2012-05-29 | Corsair Memory, Inc. | Heat spreader with fins for a computer memory module |
| USD680119S1 (en) * | 2011-11-15 | 2013-04-16 | Connectblue Ab | Module |
| USD733145S1 (en) * | 2014-03-14 | 2015-06-30 | Kingston Digital, Inc. | Memory module |
| USD771043S1 (en) * | 2015-05-12 | 2016-11-08 | Hypr Corp | Biometric payment gateway device |
| USD782417S1 (en) * | 2016-04-20 | 2017-03-28 | Chyng Hong Electronic Co., Ltd. | Back panel for power supply |
| USD807824S1 (en) * | 2016-07-18 | 2018-01-16 | General Electric Company | Heat spreader |
| TWM544753U (en) * | 2016-10-07 | 2017-07-01 | 芝奇國際實業股份有限公司 | A memory device |
| TWD189071S (en) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | Ssd storage device |
| TWD189067S (en) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | Ssd storage device |
| TWD189068S (en) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | Ssd storage device |
| USD842304S1 (en) * | 2017-12-21 | 2019-03-05 | Corsair Memory, Inc. | Memory module |
| USD988318S1 (en) * | 2020-09-10 | 2023-06-06 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
| USD964947S1 (en) * | 2021-06-03 | 2022-09-27 | Kingston Digital, Inc. | Heat sink for memory module |
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2021
- 2021-11-30 TW TW110306520F patent/TWD220530S/en unknown
- 2021-12-29 US US29/791,101 patent/USD1005295S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD1005295S1 (en) | 2023-11-21 |
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