USD660810S1 - Heat spreader with fins for a computer memory module - Google Patents

Heat spreader with fins for a computer memory module Download PDF

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Publication number
USD660810S1
USD660810S1 US29/404,201 US201129404201F USD660810S US D660810 S1 USD660810 S1 US D660810S1 US 201129404201 F US201129404201 F US 201129404201F US D660810 S USD660810 S US D660810S
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United States
Prior art keywords
fins
memory module
computer memory
heat spreader
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/404,201
Inventor
Martin Mueller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corsair Memory Inc
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Corsair Memory Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to US29/404,201 priority Critical patent/USD660810S1/en
Assigned to CORSAIR MEMORY, INC. reassignment CORSAIR MEMORY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MUELLER, MARTIN
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Publication of USD660810S1 publication Critical patent/USD660810S1/en
Assigned to BANK OF AMERICA, N.A., AS AGENT reassignment BANK OF AMERICA, N.A., AS AGENT NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Assignors: CORSAIR COMPONENTS, INC., CORSAIR MEMORY, INC.
Assigned to MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT reassignment MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT SECOND LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Assignors: CORSAIR MEMORY, INC.
Assigned to MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT reassignment MACQUARIE CAPITAL FUNDING LLC, AS COLLATERAL AGENT FIRST LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Assignors: CORSAIR MEMORY, INC.
Assigned to CORSAIR MEMORY, INC., CORSAIR COMPONENTS, INC. reassignment CORSAIR MEMORY, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: BANK OF AMERICA, N.A.
Assigned to Corsair Memory Inc., ORIGIN PC, LLC reassignment Corsair Memory Inc. TERMINATION AND RELEASE OF SECOND LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY RECORDED AT REEL 043714, FRAME 0171 Assignors: MACQUARIE CAPITAL FUNDING LLC
Assigned to BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT reassignment BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Assignors: CORSAIR MEMORY, INC.
Assigned to CORSAIR MEMORY, INC., ORIGIN PC, LLC reassignment CORSAIR MEMORY, INC. TERMINATION AND RELEASE OF FIRST LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY Assignors: MACQUARIE CAPITAL FUNDING LLC
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Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front right side perspective view of a first embodiment of a heat spreader with fins for a computer memory module showing our design;
FIG. 2 is a front view of the first embodiment of the heat spreader with fins for a computer memory module;
FIG. 3 is a rear view of the first embodiment of the heat spreader with fins for a computer memory module;
FIG. 4 is a top side view of the first embodiment of the heat spreader with fins for a computer memory module;
FIG. 5 is a bottom side view of the first embodiment of the heat spreader with fins for a computer memory module;
FIG. 6 is a right side view of the first embodiment of the heat spreader with fins for a computer memory module;
FIG. 7 is a left side view of the first embodiment of the heat spreader with fins for a computer memory module;
FIG. 8 is a front right side perspective view of a second embodiment of the heat spreader with fins for a computer memory module;
FIG. 9 is a front view of the second embodiment of the heat spreader with fins for a computer memory module;
FIG. 10 is a rear view of the second embodiment of the heat spreader with fins for a computer memory module;
FIG. 11 is a top side view of the second embodiment of the heat spreader with fins for a computer memory module;
FIG. 12 is a bottom side view of the second embodiment of the heat spreader with fins for a computer memory module;
FIG. 13 is a right side view of the second embodiment of the heat spreader with fins for a computer memory module; and,
FIG. 14 is a left side view of the second embodiment of the heat spreader with fins for a computer memory module.
The shade lines in the figures show contour and not surface ornamentation.

Claims (1)

  1. The ornamental design for a heat spreader with fins for a computer memory module, as shown and described.
US29/404,201 2011-10-17 2011-10-17 Heat spreader with fins for a computer memory module Active USD660810S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/404,201 USD660810S1 (en) 2011-10-17 2011-10-17 Heat spreader with fins for a computer memory module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/404,201 USD660810S1 (en) 2011-10-17 2011-10-17 Heat spreader with fins for a computer memory module

Publications (1)

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USD660810S1 true USD660810S1 (en) 2012-05-29

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US29/404,201 Active USD660810S1 (en) 2011-10-17 2011-10-17 Heat spreader with fins for a computer memory module

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD761744S1 (en) 2012-07-18 2016-07-19 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
USD862402S1 (en) * 2017-12-18 2019-10-08 Kingston Digital, Inc. Memory heat dissipation sink
TWD208052S (en) 2019-10-09 2020-11-01 搏盟科技股份有限公司 The veneer part of the memory
USD951937S1 (en) * 2018-12-06 2022-05-17 Samsung Electronics Co., Ltd. Solid state drive storage device
USD964947S1 (en) * 2021-06-03 2022-09-27 Kingston Digital, Inc. Heat sink for memory module
USD1005296S1 (en) * 2021-11-30 2023-11-21 G.Skill International Enterprise Co., Ltd. Computer memory module
USD1005295S1 (en) * 2021-11-30 2023-11-21 G.Skill International Enterprise Co., Ltd. Computer memory module
USD1035597S1 (en) * 2022-12-15 2024-07-16 Kingston Digital, Inc. Heat sink for memory module

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD761744S1 (en) 2012-07-18 2016-07-19 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
USD862402S1 (en) * 2017-12-18 2019-10-08 Kingston Digital, Inc. Memory heat dissipation sink
USD951937S1 (en) * 2018-12-06 2022-05-17 Samsung Electronics Co., Ltd. Solid state drive storage device
TWD208052S (en) 2019-10-09 2020-11-01 搏盟科技股份有限公司 The veneer part of the memory
USD964947S1 (en) * 2021-06-03 2022-09-27 Kingston Digital, Inc. Heat sink for memory module
USD1005296S1 (en) * 2021-11-30 2023-11-21 G.Skill International Enterprise Co., Ltd. Computer memory module
USD1005295S1 (en) * 2021-11-30 2023-11-21 G.Skill International Enterprise Co., Ltd. Computer memory module
USD1035597S1 (en) * 2022-12-15 2024-07-16 Kingston Digital, Inc. Heat sink for memory module

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