WO2002100951A1 - Composition de resine thermodurcissable - Google Patents
Composition de resine thermodurcissable Download PDFInfo
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- WO2002100951A1 WO2002100951A1 PCT/JP2002/005115 JP0205115W WO02100951A1 WO 2002100951 A1 WO2002100951 A1 WO 2002100951A1 JP 0205115 W JP0205115 W JP 0205115W WO 02100951 A1 WO02100951 A1 WO 02100951A1
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- thermosetting resin
- phase
- resin composition
- epoxy
- polybutene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
- C08L23/30—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment by oxidation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to, for example, the improvement of impact resistance of a thermosetting resin composition using a reactive liquid polybutene, and particularly to the impact resistance, thermal crack test, and the like used as a sealing material for semiconductors and the like.
- the present invention provides an epoxy resin composition having improved crack resistance, oxidation resistance, and heat resistance.
- Thermosetting resins are used alone or in combination with other resins for many applications.Especially, they have good electrical insulation, sufficient mechanical strength, good heat resistance, and good thermal expansion. Because of its low coefficient and low cost, it is widely used for electrical and mechanical parts. On the other hand, the low toughness common to thermosetting resins is the biggest disadvantage, and various studies have been made.
- thermosetting resin due to the curing reaction may become a problem, and it is desired to reduce the volume shrinkage of the thermosetting resin.
- problems caused by large volume shrinkage include the surface smoothness of SMC (Sheet Molding Compound) molded products, coating and lining paint adhesion and adhesion strength, and the difference in shrinkage between parts of FRP. And the like.
- thermosetting resins To improve the impact resistance of an epoxy resin composition, one of the thermosetting resins, the introduction of flexible components into the epoxy resin and the use of core-shell rubber particles (Japanese Patent Publication No. Sho 61-2949-1) And Japanese Patent Application Laid-Open No. 2-117179, and reactive liquid rubber (Japanese Patent Publication No. 58-25391, Japanese Patent Application Laid-Open No. 10-182937, Patent No. 3036657), and reactive liquid polybutene. (European Patent Publication No. 045749) is widely recognized to be effective, but at the same time, its problems are also evident.
- the method of introducing a flexible component into an epoxy resin involves heat resistance, bending strength, etc.
- the core-shell structure rubber particles such as MBS powder (methyl methacrylate / styrene / butadiene core-shell resin particles) and rubber such as epoxy group-containing composite acryl rubber particles and cross-linked acryl rubber particles
- the method of adding fine particles has a large increase in viscosity and has a problem in storage stability.
- a reactive liquid rubber for example, a terminal carboxyl-modified atalylonitrile butadiene rubber (CTBN)
- CTBN terminal carboxyl-modified atalylonitrile butadiene rubber
- CTBN in the case of CTBN, the control of the reactivity and compatibility depending on its structure is not sufficient, and the size and distribution of the CTBN dispersed phase changes depending on the type of curing agent and curing conditions, and the epoxy resin composition It was pointed out that the characteristics changed significantly.
- CTBN has an inherent problem with respect to long-term reliability, for example, because it has an unsaturated bond in the main chain, and is susceptible to oxidation deterioration and thermal deterioration.
- European Patent Publication No. 0 457 749 (U.S. Patent No. 5,084,531, U.S. Patent No. 5,225,486) is substantially unsaturated in the main chain
- the method recommends those 7 0 mole 0/0 containing 4-substituted structure with respect to the structure and location of the unsaturated bond portion in the polybutene is subjected to epoxidation. This implies the recommendation of a raw material of polybutene in which unsaturated bonds are present in the main chain, not at the terminal, and epoxy groups are necessarily generated in the main chain.
- the low-molecular-weight liquid epoxidized polybutene binds to the epoxy resin via the epoxy structure formed in the central portion of the main chain, and the polybutene chain connected to the binding portion inevitably binds to the epoxy resin. It will be extremely short. Therefore, it is difficult to generate a phase-separated structure (sea-island structure) with this structure.
- the method of improving the impact resistance etc. by improving the flexibility of the epoxy resin cured product constituting the continuous phase is inferior to the heat resistance represented by HDT as compared with the improvement by the phase separation structure. As described above.
- phenolic resins have been used in a wide variety of ways, either alone or in combination with other resins, but they have particularly good electrical insulation properties, sufficient mechanical strength, and good heat resistance. Due to its low thermal expansion coefficient, flame-retardant properties, and low cost, it is widely used for electrical and mechanical parts.
- low toughness which is a common drawback of thermosetting resins, is also the greatest drawback of phenol resins, and various studies have been made from various viewpoints.
- Japanese Patent Application Laid-Open No. 61-168652 discloses an improvement in the impact resistance of a specific phenolic resin using an aromatic polyester.
- Japanese Patent Application Laid-Open No. Sho 62-596660 discloses kneading an emulsion polymerization latex of a functional rubber having a functional group such as an epoxy group, a hydroxyl group, a carboxyl group, or an amino group into a phenol resin.
- Japanese Patent Application Laid-Open No. 3-171149 discloses a method in which a conjugated gen-based rubber latex such as NBR having good compatibility is added to an anion-based surfactant and then dispersed in a resin before a phenol resin dehydration step.
- the present invention provides an epoxy resin, a phenol resin, and the like suitable for encapsulation of semiconductors and the like with improved impact resistance, thermal crack resistance, oxidation resistance, and heat resistance deterioration without impairing the heat resistance represented by HDT.
- the present invention provides a thermosetting resin composition.
- these thermosetting resin compositions are compositions in which the volume shrinkage is reduced, and the surface smoothness of SMC (Sheet Molding Compound) molded products, the adhesion of paints and coatings on coatings and coatings, and the adhesion of adhesives. This solves the problem of deformation due to strength or shrinkage difference of each part of FRP. Disclosure of the invention
- the present inventors have made intensive studies and found that the above object can be achieved by using an epoxy group-containing liquid polybutene having a specific structure, and have completed the present invention.
- the first aspect of the present invention is a thermosetting resin composition containing a thermosetting resin (A) and an epoxy group-containing liquid polybutene (B) in which an epoxy structure is formed substantially only at a molecular terminal.
- a second aspect of the present invention is the second aspect of the present invention, characterized in that at least 80 mol% of the repeating units in the epoxy-containing liquid polybutene (B) main chain structure has a structure represented by the following formula (I). 2.
- a third aspect of the present invention is that the epoxy group-containing liquid polybutene (B) has a number average molecular weight in the range of 300 to 6000, wherein It is a curable resin composition.
- a fourth aspect of the present invention is any one of the first to third aspects of the present invention, wherein the main phase structure of the resin phase is a sea-island structure including the continuous phase (1) and the dispersed phase (2).
- the fifth aspect of the present invention is that the main phase structure of the resin phase exhibits a sea-island structure composed of the continuous phase (1) and the dispersed phase (2), and the finer phase is formed inside the dispersed phase (2). 4.
- the thermosetting resin composition according to any one of the first to third aspects of the present invention which has a phase structure in which a dispersed phase (2-1) exists.
- the sixth aspect of the present invention is that the main phase structure of the resin phase is a continuous phase (1) and a dispersed phase.
- It has a sea-island structure consisting of (2), and has an interfacial layer all over the periphery of the dispersed phase (2).
- thermosetting resin composition according to any one of the first to third aspects of the present invention, wherein the thermosetting resin composition has a phase structure in which (3) exists.
- thermosetting resin according to any one of the first to third aspects of the present invention, wherein the thermosetting resin (A) is an epoxy resin or a phenol resin. It is a resin composition.
- an eighth aspect of the present invention is a thermosetting resin (A;), an epoxy group-containing liquid polybutene having an epoxy structure formed substantially only at the molecular terminal (B), and a curing agent (C).
- a thermosetting resin composition obtained by curing a composition containing an accelerator (D)
- the epoxy group-containing liquid polybutene (B) is mixed with the (A), (C), (D) a step of preparing a suspension-like mixture comprising a part of the component selected from (D).
- thermosetting resin (A) is initially a liquid low molecular weight compound (sometimes called a prepolymer), but undergoes a chemical change by the action of heat, a catalyst, ultraviolet rays, or the like.
- phenol resin, urea resin, melamine resin, epoxy resin, urethane resin, silicon resin, alkyd resin, aryl resin, unsaturated polyester resin, diaryl phthalate resin, furan resin, imido resin, etc. are listed.
- the phenolic resin in the thermosetting resin (A) used in the present invention is not particularly limited and is commercially available.
- the molar ratio of phenols to formalin and the molar ratio of phenols to formaldehyde are not limited.
- the mixture was charged into a reaction vessel at a mixing ratio of 0.5 to 1.0, and a catalyst such as oxalic acid, hydrochloric acid, sulfuric acid, toluenesulfonic acid, etc. was added, and the mixture was heated and refluxed for an appropriate time.
- a novolak-type phenol resin which can be obtained by a method of removing water by vacuum dehydration or standing dehydration to remove separated water, and further removing remaining water and unreacted phenols.
- Resol type phenolic resin can also be used in the same way by controlling the thermal history during dynamic vulcanization in detail.
- the epoxy resin in the thermosetting resin (A) used in the present invention is not limited in properties, epoxy equivalent, molecular weight, molecular structure and the like, and a compound having two or more oxirane rings in one molecule can be applied.
- Various known epoxy resins can be used.
- glycidyl ether epoxy resins such as bisphenol A, bisphenol F, brominated bisphenol A, or novolac glycidyl ether, and glycidyl esters such as glycidyl hexahydrophthalate or glycidyl dimer Epoxy resin, triglycidyl isocyanate
- Glycidylamine type epoxy resin such as nurate or tetraglycidyldiaminodiphenylmethane
- linear aliphatic type epoxy resin such as epoxidized polybutadiene or epoxy soybean oil
- 3,4-epoxy-16-methylcyclohexyl methyl carboxylate or 3,4-epoxycyclohexylmethylcarboxylate and other alicyclic epoxy resins, etc., and one or more of these can be used.
- Preferred epoxy resins include those which are liquid at room temperature.For example, dalicidyl acrylate produced between epichlorohydrin and an aromatic compound having at least one hydroxyl group under an alkaline reaction condition.
- Tenor-type epoxy resins include bisphenol A-based epoxy resins, and commercially available products include Epicort # 828 (manufactured by Yuka Shell Epoxy Co., Ltd.).
- the epoxy group-containing liquid polybutene (B) used in the present invention is obtained by subjecting the terminal vinylidene group of the polybutene having a terminal vinylidene group structure to a known reaction, for example, an epoxidation reaction with peroxide or the like (US Pat. 3 822 5 5).
- a known reaction for example, an epoxidation reaction with peroxide or the like (US Pat. 3 822 5 5).
- a method for producing a polybutene containing a large amount of a polybutene having a terminal bilidene structure the present inventors exemplify Japanese Patent Application Laid-Open No. 10-31628.
- the epoxy group-containing liquid polybutene (B) in the present invention is obtained as a high-purity product and used as it is or as a mixture with polybutene.
- a polybutene having a predetermined molar percentage or more of a terminal vinylidene structure is produced. It is efficient to obtain a polybutene solution containing a liquid polybutene containing a predetermined mol% of epoxy groups by reacting and converting a predetermined mol% or more of the terminal biylidene group of the 4- olefin polymer having a lithiumden structure. is there.
- the functional group content of the epoxy group-containing liquid polybutene (B) can be confirmed by 13 C—NMR measurement, 1 H — NMR measurement, or TLC (Thin Layer Chromatography).
- the repeating unit in the main chain structure has a structure represented by the following formula (I).
- the epoxy group-containing liquid polybutene (B) according to the present invention is mainly composed of an epoxy group-containing liquid polybutene having a terminal structure as shown in the following formula (II). Epoxy group-containing liquid polybutene (B) having a terminal structure as shown in formula (II). If the epoxy group-containing liquid polybutene having a terminal structure as shown in the following formula (II) is less than 50 mol% of the total epoxy group-containing liquid polybutene (B), EP-A-0 457 74 Problems like those in No. 9 appear.
- the epoxy group-containing liquid polybutene (B) according to the present invention has a structure represented by the following formula (III), and the structure represented by () n in the formula represents the structure described in the following. Is not limited, and 80 mol% or more is shown in parentheses in the formula. What is necessary is just to correspond to the structure performed. By satisfying this condition, the chemical structure of the main chain does not contain tertiary carbon, which is susceptible to oxidative deterioration, so that properties excellent in heat resistance deterioration can be imparted as described above.
- the epoxy group-containing liquid polybutene having the above structure can be easily obtained by producing a polybutene having a terminal vinylidene group having the above structure according to Japanese Patent Application Laid-Open No. 10-306128 and using this as a raw material. be able to.
- the epoxy group-containing liquid polybutene (B) according to the present invention has a number average molecular weight in the range of 300 to 600,000 by adjusting n in the above formula (III).
- n in the above formula (III).
- the polybutene chain bonded to the epoxy resin becomes extremely short as shown in European Patent Publication No. 0 457 749, and it must be solubilized in the epoxy resin composition.
- the effect of improving the impact resistance and the like is dominant, and the heat resistance represented by HDT is inferior.
- the epoxy group-containing liquid polybutene (B) is prepared based on 100 parts by mass of the thermosetting resin (A) and the curing agent (C) in total. 1 to 200 parts by mass, preferably 5 to 100 parts by mass can be added.
- the curing agent (C) optionally added according to the present invention may be any one that can be cured by reacting with the thermosetting resin (A) or the epoxy group-containing liquid polybutene (B).
- epoxy resins include aliphatic polyamines, alicyclic polyamines, aromatic polyamines, and acid anhydrides (eg, methylhexahydrophthalic anhydride, phthalic anhydride derivatives, etc.).
- Examples include polyaddition type curing agents such as phenol novolak resin and polymerbutane, and catalytic type curing agents such as aromatic tertiary amines, imidazole compounds and Lewis acid complexes. Also here The curing agents listed in the above may be used alone or in combination as long as they do not inhibit the curing.
- a curing accelerator (D ) As the components other than the thermosetting resin (A), the curing agent (C), and the epoxy group-containing polybutene (B) used in the present invention, a curing accelerator (D ).
- BDMA benzyldimethylamine
- 1-benzithley 2-pheninoleimidazonole 2-heptadecylimidazole
- 2-heptadecylimidazole 2-1,6-dihydroxyimidazonole
- 2,5-dihydroxyimidazonole 2,5-dihydroxyimidazonole.
- thermosetting resin composition when an epoxy resin is used as an example, the total amount of the thermosetting resin (A) and the curing agent (C) is 100 parts by mass. 0 to 20% by weight of the accelerator (D) can be added.
- the main phase structure of the resin component observed by an electron microscope after the curing reaction is a sea-island structure composed of a continuous phase (1) and a dispersed phase (2) (hereinafter referred to as “phase structure I”).
- phase structure I a sea-island structure composed of a continuous phase (1) and a dispersed phase (2)
- the main component of the continuous phase (1) is a cured product composed of a composition containing the thermosetting resin (A) (hereinafter abbreviated as “cured product”), and the main component of the dispersed phase (2) is an epoxy group-containing product.
- cured product a composition containing the thermosetting resin
- B Liquid polybutene
- the main phase structure of the resin component observed with an electron microscope is a sea-island structure composed of a continuous phase (1) and a dispersed phase (2), and a finer dispersion inside the dispersed phase. It has a phase structure in which the phase (2-1) exists (hereinafter referred to as “phase structure II”), or a sea-island structure consisting of the continuous phase (1) and the dispersed phase (2).
- phase structure II phase structure in which the phase (2-1) exists
- phase structure III has an interfacial layer (3) throughout the outer periphery of (). It is most preferable that the phase structure satisfying both “phase structure II” and “phase structure ⁇ ” be the main phase structure.
- Phase structure I mainly consists of a component related to an epoxy group-containing liquid polybutene, which is a low elastic modulus and an elastic tough material, in a continuous phase (1) mainly composed of a cured product that is a high elastic modulus and a brittle material.
- This is a phase structure in which a dispersed phase (2) in the unit of ⁇ am as a component exists.
- the interface between the continuous phase (1) and the dispersed phase (2) separates due to the difference in the Poisson's ratio between the components of the continuous phase (1) and the dispersed phase (2).
- phase structure I the affinity between the continuous phase (1) and the dispersed phase (2) increases due to the similarity in the chemical structure, and thus the phase is consumed.
- the energy that is consumed is large. Since the stress (strain) is consumed (released) by the separation of the interface, it causes fatal destruction of the material in a continuous phase mainly composed of a thermosetting resin, for example, a cured epoxy resin. Cracks do not occur, and impact resistance and thermal crack characteristics are improved.
- Phase structure IIJ consists of a continuous phase (1) mainly composed of a cured product that is a high elastic modulus and brittle material, and a component related to an epoxy group-containing liquid polybutene (B) that has a low elastic modulus and elasticity.
- the main component is a phase structure in which a dispersed phase of ⁇ units (2) exists, and the dispersed phase (2) also has a finer dispersed phase (2-1).
- This structure is a structure that is confirmed by the phase structure of high-impact polystyrene and ABS resin, and is called the salami structure.
- Phase structure III refers to a liquid crystalline polybutene (B) containing an epoxy group, which has a low elastic modulus and is an elastic and tough material, in a continuous phase (1) mainly composed of a cured product that is a high elastic modulus and a brittle material.
- a composition comprising a thermosetting resin (A) which is a phase structure having a dispersed phase (2) in units of zm and having a low elastic modulus over the entire outer peripheral portion thereof and an elastic tough material. This is a phase structure in which an interfacial layer (3) of which the main component is a component reacted between a cured product made of the above and an epoxy group-containing liquid polybutene (B) exists.
- This structure is a structure confirmed by the phase structure of impact-resistant polypropylene resin (block-type polypropylene), and is called a multilayer structure. That is, in the high-impact polypropylene resin, a dispersed phase composed of polyethylene is present in a continuous phase composed of polypropylene, and an interface layer composed of an ethylene-propylene copolymer rubber is present around the polyethylene dispersed phase.
- phase Structure III when deformation occurs due to stress, in addition to the consumption (release) of the stress (strain) generated in “Phase Structure I”, the continuous phase (1) or the dispersed phase ( Since the same stress (strain) is consumed (released) by interfacial delamination between 2) and the interfacial layer (3), the interfacial delamination energy generated per unit volume is larger than that of “phase structure I”. Accordingly, cracks and the like that cause fatal rupture of the material do not occur in the continuous phase mainly composed of the cured product, and the impact resistance and thermal crack properties are more effectively improved.
- a phase structure that satisfies both the “Phase Structure II” and the “Phase Structure III”, that is, the elastic phase with a low elastic modulus is contained in a continuous phase (1) mainly composed of a hardened material that is a high elastic modulus and a brittle material It has a phase structure in which a m-phase dispersed phase (2) mainly composed of an epoxy group-containing liquid polybutene (B), which is a toughness / toughness material, is present. Fine dispersed phase (2-1) (a phase mainly composed of a cured product) is present, and the entire outermost peripheral portion of the dispersed phase (2) has a low elastic modulus and is a thermosetting material that is an elastic and tough material.
- the mechanism of the effect of reducing the volume shrinkage in the thermosetting resin composition according to the present invention is basically that the epoxy group-containing liquid polybutene according to the present invention has a low volume shrinkage and a thermosetting property. This is thought to be due to the chemical interaction with the resin, but the above-mentioned “Phase Structure I”, “Phase Structure II”, and “Phase Structure nij” It is thought that this contributes to stress relaxation during the curing reaction.
- thermosetting resin (A;) containing an epoxy group It must contain a liquid polybutene (B), a curing agent (C) and a curing accelerator (D).
- the epoxy group-containing liquid polybutene (B) B)) to form a suspension mixture comprising a part of a component selected from (A), (C) and (D) (hereinafter referred to as “suspension mixture”). Is preferred.
- the epoxy group-containing liquid polybutene (B) and a part of components selected from a thermosetting resin (A), a curing agent (C) and a curing accelerator (D) are mixed, and the liquid mixture is added to the liquid mixture.
- This suspension state means a state that does not substantially change even after leaving the mixture under the conditions for producing a suspension mixture for one day or more after the completion of mixing.
- a preferred suspension state is one that does not substantially change even when left under a suspension-like mixture production condition for one month or more.
- the structure is such that a plurality of finer dispersed phases (2-1) are present inside the dispersed phase (2), and / Alternatively, it can be confirmed that the main component has at least one interface layer (3) over the entire outer peripheral portion of the dispersed phase (2).
- This step establishes conditions that contribute to the formation of a phase structure preferable for impact resistance and the like of the finally obtained thermosetting resin composition before the curing reaction.
- thermosetting resin (A) and the curing agent (C) is as follows:
- (A) Z (C) is 5 or more, preferably 10 At least 20 or less.
- (A) / (C) is set to 0.2 or less, preferably 0.1 or less and 0.001 or more.
- a mixture in which either component (A) or (C) is in excess is prepared, and 100 parts by mass of the mixture is mixed with the epoxy group-containing liquid polybutene (B) 1 to 100 parts by mass.
- the suspension-like mixture of the present invention can be produced.
- (A) / (B) of the ordinary thermosetting resin composition is within the range of 0.5-1.5, but in preparing the suspension-like mixture of the present invention, as described above, any one of the two is used. The ingredients are formulated in large excess.
- the epoxy group-containing liquid polybutene (B) should be kept in a relation of 1 to 200 parts by mass with respect to 100 parts by mass of the thermosetting resin (A). Is mentioned.
- each component when the suspension-like mixture is formed, and there is no particular limitation on the form in which each component is agitated, as long as it can be dispersed uniformly. I just need.
- a forced stirrer such as a homogenizer.
- the suspension-like mixture described so far can contribute to the formation of a phase structure preferable for impact resistance and the like in the step of obtaining a final thermosetting resin composition.
- the ratio of the functional group equivalents of the thermosetting resin (A) and the hardened U (C) is preferably in the range of 0.2 to 5, preferably.
- the suspension-like mixture obtained in the previous step may be further added with a thermosetting resin (A) and / or a curing agent (B), and optionally with a curing accelerator ( D) will be applied as appropriate.
- thermosetting resin composition of the present invention can be obtained by curing the composition with the blending ratio adjusted to the final appropriate range by predetermined heating, catalysis or ultraviolet irradiation.
- liquid reactive rubbers liquid rubbers such as liquid ⁇ -olefin polymer, and elastomers.
- fillers such as impact modifiers such as core-structured elastomers, flame retardants, coupling agents, defoamers, pigments, dyes, antioxidants, weathering agents, lubricants, release agents, etc. Can be blended.
- the filler may also include fused silica, pulverized silica, talc, calcium carbonate, aluminum hydroxide, and the like. Silica is desirable, and these can be used alone or in combination of two or more kinds in an arbitrary amount.
- FIG. 1 is an enlarged view of the suspension mixture obtained in Example 5 of the present invention.
- FIG. 2 is an enlarged view showing the phase structure of the thermosetting resin composition obtained in Example 17 of the present invention.
- FIG. 3 is an enlarged view showing the phase structure of the cured product sample obtained in Comparative Example 3.
- Epoxidized polybutenes (Reference Production Examples 1 to 6) are described in US Pat.
- the production equipment includes a variable stirrer, a reaction temperature indicator, The sco was placed in a heat medium bath capable of controlling the temperature.
- a predetermined amount (shown in Table 2) of the epoxidized polybutenes of Reference Production Examples 1 to 6 was placed in the flask, into which Epicoat # 828 as a thermosetting resin, MH-700 as a curing agent, and curing acceleration.
- BDMA and a predetermined amount of each shown in Table 2 were charged as a batch. Thereafter, the reaction temperature was raised from room temperature to 100 ° C while stirring the mixture, and the reaction was carried out for 2 hours while maintaining the temperature at 100 ° C.
- the functional group (epoxy group), an epoxy resin containing bisphenol A-type diglycidyl ether as the main component, has an equivalent weight of about 190 g / eq.
- Functional group (acid anhydride group)
- the equivalent weight is about 168 gZe q.
- an epoxy resin composition was represented as the thermosetting resin composition.
- the epoxy resin composition of the present invention was prepared by the following procedure. First, as shown in Table 4, the suspensions of Examples 1 to 6 or Comparative Examples 1 and 2 were adjusted so that the mixing ratio was such that the functional group equivalent ratio of the curing agent Z epoxy resin component of the final composition was obtained. An insufficient amount of MH-700 was added to the mixture, and mixed at room temperature until the mixture became uniform. After adding 1 phr of BDMA as a curing accelerator to the mixture, (1) 2 hours at 100 ° C, (2) 2 hours at 120 ° C, and (2) 2 hours at 140 ° C. By giving the heating history at three stages of time, each epoxy resin composition was obtained.
- Comparative Example 5 shows a case where the same amount of the modified acrylulutrile.butadiene rubber CTBN1300X8 (manufactured by Ube Industries, Ltd.) was added instead of obtaining the suspension mixture of the present invention.
- Comparative Example 6 is a case where no relaxation stress material as a flexible component was added at all. In both cases, the equivalent ratio between the epoxy resin and the cured product, the amount of the curing accelerator, the heating history, and the like are the same as those in Examples 13 to 21 or Comparative Example.
- the cured product test piece was immersed in a 10% sodium hydroxide or n-heptane solution for 33 minutes, and the chemical resistance of the cured product was evaluated based on the change in mass before and after the immersion. Each test was performed twice, and the average was calculated.
- the heat distortion temperature (HDT) was measured according to the method of Japanese Industrial Standard JISK6911, and the heat resistance of the cured product was evaluated from the measured value. The measurement was performed five times, and the average value was obtained.
- the density before curing is determined at the moment of mixing by measuring the mixed components at regular time intervals, and extrapolating to zero time. For components that react when the temperature is raised, the density of the mixture is calculated from the respective densities of the components.
- the cured and adjusted density is determined by weighing in silicone oil or distilled water.
- Tables 4 and 5 show the compounding conditions of a series of epoxy resin compositions and the evaluation results of the physical properties. Table 4
- Example 15 to 18 had the “phase structure II” or the “phase structure IIIJ” according to the present invention.
- the observation example of Example 17 is shown in FIG. It was confirmed that Examples 3 to 6 and Examples 13 and 14 had the “phase structure I” according to the present invention.
- FIG. 3 shows an observation example of Comparative Example 3.
- Example 1 the final blending amount and ingredients were exactly the same as in Example 13. Without going through the process of forming the described suspension mixture, each component was charged at once and an attempt was made to obtain an impact-resistant thermosetting composition. The reaction time and reaction temperature were the same as in the above Examples. However, in the cured composition, a clear separation was confirmed between the cured product composed of the composition containing the thermosetting resin and the reactive monoolefin polymer, and the effect according to the present invention was sufficiently achieved by this method. Was not obtained.
- the manufacturing apparatus used in Examples 1 to 12 was used.
- a predetermined amount of the epoxidized polybutene of Reference Production Example 5 was placed in a flask as shown in Table 6, and YDCN-702 (manufactured by Toto Kasei Co., Ltd.) was used as the thermosetting resin, and MH-700 (made by Shinnichi This product (manufactured by Rika Co., Ltd.) and BDMA as a curing accelerator were charged all at once in the prescribed amounts shown in Table 6. Thereafter, the reaction temperature was raised from room temperature to 120 ° C. while stirring the mixture, and the reaction was carried out for 30 minutes while maintaining the temperature at 120 ° C.
- epoxy resin containing ortho-cresol type is an epoxy resin containing ortho-cresol type as a main component.
- the functional group (epoxy group) equivalent is about 205 g / eq.
- Functional group (acid anhydride group)
- the equivalent weight is about 168 g / eq.
- the phenolic resin composition of the present invention was produced by the following procedure.
- the required amount of nopolak phenol curing agent TD—2 1 3 1 was added to the suspension mixture prepared in Example 100 to 102 so that the mixing ratio of the final composition shown in Table 7 was obtained. (Manufactured by DIC Corporation), and 1 hr of TPP (triphenylsphine) was added to the mixture as a curing accelerator. After the addition, the mixture was kneaded at 120 ° C. with a plast mill (manufactured by Toyo Seiki Co., Ltd.) until uniform, to obtain the respective phenol resin compositions.
- TPP triphenylsphine
- Comparative Example 100 is a case where no relaxation stress material is added. Also in this case, the equivalent ratio of the ortho-cresol epoxy resin to the novolak phenol curing agent, the amount of the curing accelerator, the heating and kneading method, and the like were the same as those described above.
- Table 7 shows the blending conditions of a series of fuanol resin compositions and the evaluation results of the physical properties.
- thermosetting resin obtained by a curing reaction of a composition obtained by blending a thermosetting resin, a curing agent, a curing accelerator, and a liquid polybutene having an epoxy group having a specific structure can solve the conventional problems in physical properties.
- the main phase structure is a sea-island structure composed of a continuous phase mainly composed of a cured product composed of a thermosetting resin-containing composition and a dispersed phase mainly composed of epoxy group-containing liquid polybutene.
- a plurality of finer dispersed phases are present inside the main dispersed phase structure, and / or a phase structure having at least one interface layer in the entire outer peripheral portion of the dispersed phase.
- the epoxy group-containing liquid polybutene is combined with a part of components selected from a thermosetting resin, a curing agent, and a curing accelerator added as necessary. It has been found that the above-described phase structure is effectively exhibited by preparing a suspended liquid mixture consisting of
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Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02730721A EP1422266A4 (en) | 2001-05-31 | 2002-05-27 | THERMOSETTING RESIN COMPOSITION |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2001-164855 | 2001-05-31 | ||
JP2001164855 | 2001-05-31 | ||
JP2001205678A JP2003049074A (ja) | 2001-05-31 | 2001-07-06 | 熱硬化性樹脂組成物 |
JP2001-205678 | 2001-07-06 |
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WO2002100951A1 true WO2002100951A1 (fr) | 2002-12-19 |
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ID=26616102
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Application Number | Title | Priority Date | Filing Date |
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PCT/JP2002/005115 WO2002100951A1 (fr) | 2001-05-31 | 2002-05-27 | Composition de resine thermodurcissable |
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US (1) | US20030176598A1 (ja) |
EP (1) | EP1422266A4 (ja) |
JP (1) | JP2003049074A (ja) |
CN (1) | CN1463283A (ja) |
WO (1) | WO2002100951A1 (ja) |
Cited By (1)
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WO2024057920A1 (ja) * | 2022-09-16 | 2024-03-21 | 株式会社スリーボンド | 水素ガスシール用二液硬化型樹脂組成物およびその硬化物 |
Families Citing this family (10)
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JP3941937B2 (ja) * | 2002-11-22 | 2007-07-11 | 新日本石油株式会社 | エポキシ樹脂組成物 |
JP3941938B2 (ja) * | 2002-11-22 | 2007-07-11 | 新日本石油株式会社 | エポキシ樹脂組成物 |
JP4754185B2 (ja) * | 2004-05-27 | 2011-08-24 | リンテック株式会社 | 半導体封止用樹脂シートおよびこれを用いた半導体装置の製造方法 |
JP4842566B2 (ja) * | 2004-06-08 | 2011-12-21 | 三井化学株式会社 | 帯電防止剤 |
DE102009000180A1 (de) * | 2009-01-13 | 2010-07-15 | Evonik Degussa Gmbh | Verfahren zur Herstellung von mehrschichtig beschichteten Gummipartikeln und mehrschichtig beschichtete Gummipartikel |
BR112014006050A2 (pt) * | 2011-09-15 | 2017-04-04 | Klüber Lubrication München Se & Co Kg | graxa de alta temperatura |
US9353251B2 (en) | 2011-12-22 | 2016-05-31 | Toyota Boshoku Kabushiki Kaisha | Thermoplastic resin composition and method for producing same |
JP6715523B2 (ja) * | 2015-05-13 | 2020-07-01 | パナソニックIpマネジメント株式会社 | エポキシ樹脂組成物 |
BR112018014714A2 (ja) | 2016-03-31 | 2018-12-11 | Toyota Boshoku Kabushiki Kaisha | A thermoplastic resin composition, its manufacturing method, and a forming object |
CN117069987B (zh) * | 2023-10-17 | 2023-12-29 | 天津爱思达航天科技股份有限公司 | 一种碳纤维预浸料及其制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0415749A2 (en) * | 1989-08-31 | 1991-03-06 | Amoco Corporation | Epoxy resins containing epoxidized polybutenes |
JPH0641363A (ja) * | 1992-07-23 | 1994-02-15 | Nippon Petrochem Co Ltd | 架橋性樹脂組成物・架橋成形体およびその架橋成形体の製造方法 |
JPH06116363A (ja) * | 1992-10-02 | 1994-04-26 | Nippon Petrochem Co Ltd | 架橋性難燃組成物 |
JPH06116362A (ja) * | 1992-10-02 | 1994-04-26 | Nippon Petrochem Co Ltd | 半導電性樹脂組成物 |
JPH06306144A (ja) * | 1993-04-23 | 1994-11-01 | Nippon Oil Co Ltd | エポキシ樹脂組成物 |
JPH07220536A (ja) * | 1994-01-28 | 1995-08-18 | Hitachi Cable Ltd | 電力ケーブル |
JP2001089638A (ja) * | 1999-09-22 | 2001-04-03 | Toshiba Chem Corp | 液状封止用樹脂組成物 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3382255A (en) * | 1964-09-23 | 1968-05-07 | Rohm & Haas | Epoxidized olefinic polymers |
US5225486A (en) * | 1989-08-31 | 1993-07-06 | Amoco Corporation | Epoxy resins containing epoxidized polybutenes |
US5084531A (en) * | 1989-08-31 | 1992-01-28 | Amoco Corporation | Epoxy resins containing epoxidized polybutenes |
US5212261A (en) * | 1990-12-17 | 1993-05-18 | Henkel Research Corporation | Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems |
US6043401A (en) * | 1992-05-26 | 2000-03-28 | Bp Amoco Corporation | Reactive, low molecular weight, viscous poly(1-olefins) and copoly(1-olefins) and their method of manufacture |
US5516832A (en) * | 1994-11-03 | 1996-05-14 | Dow Corning Corporation | Curable silicone rubber composition |
US5811483A (en) * | 1996-04-01 | 1998-09-22 | Syn-Coat Enterprises, Inc. | Water repellent system |
US6486267B1 (en) * | 2000-08-03 | 2002-11-26 | Avery Dennison Corporation | Release composition |
JP2003041123A (ja) * | 2001-05-25 | 2003-02-13 | Nippon Petrochemicals Co Ltd | 熱硬化性樹脂組成物、その製造方法及び懸濁液状混合物 |
-
2001
- 2001-07-06 JP JP2001205678A patent/JP2003049074A/ja active Pending
-
2002
- 2002-05-27 WO PCT/JP2002/005115 patent/WO2002100951A1/ja not_active Application Discontinuation
- 2002-05-27 EP EP02730721A patent/EP1422266A4/en not_active Withdrawn
- 2002-05-27 CN CN02801891A patent/CN1463283A/zh active Pending
- 2002-05-27 US US10/312,439 patent/US20030176598A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0415749A2 (en) * | 1989-08-31 | 1991-03-06 | Amoco Corporation | Epoxy resins containing epoxidized polybutenes |
JPH0641363A (ja) * | 1992-07-23 | 1994-02-15 | Nippon Petrochem Co Ltd | 架橋性樹脂組成物・架橋成形体およびその架橋成形体の製造方法 |
JPH06116363A (ja) * | 1992-10-02 | 1994-04-26 | Nippon Petrochem Co Ltd | 架橋性難燃組成物 |
JPH06116362A (ja) * | 1992-10-02 | 1994-04-26 | Nippon Petrochem Co Ltd | 半導電性樹脂組成物 |
JPH06306144A (ja) * | 1993-04-23 | 1994-11-01 | Nippon Oil Co Ltd | エポキシ樹脂組成物 |
JPH07220536A (ja) * | 1994-01-28 | 1995-08-18 | Hitachi Cable Ltd | 電力ケーブル |
JP2001089638A (ja) * | 1999-09-22 | 2001-04-03 | Toshiba Chem Corp | 液状封止用樹脂組成物 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024057920A1 (ja) * | 2022-09-16 | 2024-03-21 | 株式会社スリーボンド | 水素ガスシール用二液硬化型樹脂組成物およびその硬化物 |
Also Published As
Publication number | Publication date |
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CN1463283A (zh) | 2003-12-24 |
JP2003049074A (ja) | 2003-02-21 |
EP1422266A4 (en) | 2005-04-13 |
US20030176598A1 (en) | 2003-09-18 |
EP1422266A1 (en) | 2004-05-26 |
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