Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70691—Handling of masks or workpieces
  • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
  • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
  • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

• the present invention relates to a holding device, a holding method, and an exposure device for exposing a pattern of a mask to a substrate using a mask and a substrate held by the holding device, and particularly to manufacturing devices such as a liquid crystal display element and a semiconductor element.
• the present invention relates to a holding device and a holding method suitable for use in a lithography step, an exposure apparatus, and a device manufacturing method. Background art
• a circuit pattern formed on a mask or a reticle (hereinafter, referred to as a “reticle”) is formed on a wafer or glass coated with a resist (photosensitive agent).
• a resist photosensitive agent
• Various exposure apparatuses that transfer onto a substrate such as a plate are used.
• a reticle pattern is projected onto a wafer using a projection optical system in accordance with the miniaturization of the minimum line width (device rule) of the pattern accompanying the recent high integration of integrated circuits.
• a reduction projection exposure apparatus that performs reduction transfer is mainly used.
• FIG. 26 is a perspective view showing a reticle holder for holding the reticle.
• the reticle holder 100 has an opening 102 formed in the center portion, pedestal portions 104 provided at a plurality of positions (three places) on the upper surface, and a pedestal portion 100. 4 provided with suction pads 106 provided on the upper surface, respectively.
• the reticle holder 100 is provided so as to be two-dimensionally movable in the X and Y directions with respect to the base 110.
• the suction pad 106 is provided at a position facing the lower surface of the reticle R, and is connected to a compressor (suction device) (not shown). Then, the gas in the space between the lower surface of the reticle R and the suction pad 106 is sucked by the compressor, and the space between the lower surface of the reticle R and the suction pad 106 is sucked.
• the reticle R is adsorbed and held by the reticle holder 100 by setting the pressure of the reticle R to be lower than the external pressure.
• the reticle R has a pattern in the center of the lower surface, and the pattern surface (that is, the center of the lower surface of the reticle R) is provided with a pellicle PE for protecting the pattern surface. Therefore, reticle holder 100 sucks and holds a portion of reticle R underside other than pellicle PE.
• the contact surface between the suction pad 106 of the reticle holder 100 and the reticle R is large.
• the size (area) of the surface of reticle R that is attracted to reticle holder 100 by pellicle PE is restricted. If a large area of the lower surface of the reticle R other than the pellicle PE is to be sucked and held, for example, a region at the outer edge of the lower surface of the reticle R (hereinafter referred to as an “accuracy non-guaranteed region”) having no predetermined surface accuracy ) Up to the reticle holder 100.
• the contact surface of the reticle R with the suction pad 106 is distorted, and the influence of the distortion is caused by a region having a predetermined surface accuracy at the center of the reticle R (hereinafter, “accuracy assurance region”). ), The surface accuracy of the pattern surface decreases, and a problem arises in that accurate exposure processing cannot be performed.
• a region near the pellicle PE which is an accuracy assurance region, (hereinafter, referred to as an “inner edge region”) may be held by suction.
• the reticle holder 100 holds the inner edge region because the reticle holder 100 interferes with the transfer device for loading / unloading the reticle R with respect to the reticle holder 100. Absent. That is, when loading and unloading the reticle R with respect to the reticle holder 100, a transfer device having a fork portion is used.
• the fork portion When the reticle R is supported by the fork portion, the fork portion is connected to the reticle R. It supports the lower part other than the pellicle PE.
• the pedestal portion 104 of the reticle holder 100 When loading and unloading the reticle R with respect to the reticle holder 100 using this transfer device, the pedestal portion 104 of the reticle holder 100 is used to prevent interference between the reticle holder 100 and the fork portion. Shape and size, or adsorption The position and size of the pad 106 are restricted, and the position and size of the surface on which the reticle R is adsorbed are also restricted.
• the reticle R may be distorted.
• the present invention has been made in view of such circumstances, and has a holding device and a holding method capable of holding a reticle (mask) stably without deteriorating the surface accuracy in an accuracy assurance area, and the holding method.
• An object of the present invention is to provide an exposure apparatus including an apparatus and capable of performing accurate exposure processing, and a device manufacturing method capable of accurately manufacturing a device. Disclosure of the invention
• a first aspect of the present invention is a holding device for holding a surface to be adsorbed of a flat sample.
• the holding device includes: a first holding unit that faces a first region having a predetermined surface accuracy of the suction surface; and a second holding unit that faces a second region other than the first region of the suction surface. And a suction device that sucks gas in a space between the suctioned surface and the first holding unit and the second holding unit.
• the suction device includes: a first suction device that suctions a gas in a space between the surface to be sucked and the first holding unit; and a gas in a space between the surface to be sucked and the second holding unit.
• a second suction device for performing suction may be provided.
• a second aspect of the present invention is a holding method for holding a suctioned surface of a flat sample.
• the first area having a predetermined surface accuracy of the attracted surface and the second area other than the first area of the attracted surface are respectively transferred to the first holding unit and the second holding unit. Yotsu And hold them individually.
• the first area having a predetermined surface accuracy of the surface to be sucked and the second area other than the first area of the surface to be sucked are respectively formed by the first holding unit and the first holding unit.
• the first holding unit and the second holding unit may be arranged adjacent to each other, and a boundary between the first holding unit and the second holding unit may be arranged at least in a first region of the sample. In this case, even if the sample is deformed so as to bend, the separation between the sample and the first holding unit is suppressed. Therefore, the holding device can stably hold the sample.
• the second holding unit and the second region of the sample may be set to have a predetermined interval.
• the suction force of the second holding unit on the second region is smaller than the suction force of the first holding unit on the first region. Therefore, it is possible to suppress the deformation of the sample caused by the second holding unit sucking the second region with a strong suction force.
• the amount of gas suction per unit time by the first suction device and the amount of gas suction per unit time by the second suction device may be controlled.
• the suction force of the second holding portion on the second region can be smaller than the suction force of the first holding portion on the first region, and the second holding portion suctions the second region with a strong suction force. This can suppress the deformation of the sample caused by this.
• the area of the first holding unit with respect to the first region may be set larger than the area of the second holding unit with respect to the second region.
• the suction force of the second holding portion on the second region can be made smaller than the suction force of the first holding portion on the first region, so that the second holding portion holds the second region with a strong suction force. Deformation of the sample due to suction can be suppressed.
• a pattern of a mask held by a mask holder is transferred to a substrate holder.
• An exposure apparatus that exposes a substrate held by a holder.
• the holding device is used for at least one of a mask holder and a substrate holder.
• Another aspect of the present invention is a device manufacturing method including a lithographic process, wherein the exposure apparatus is used in the lithography step.
• a high-quality device is manufactured because an exposure apparatus capable of performing an accurate and stable exposure process while maintaining a mask or a substrate at a predetermined surface accuracy is used. be able to.
• a mask having a suction surface having a convex shape in a first direction within a predetermined allowable range is provided by a pair of first suction holding portions disposed opposite to each other in the first direction.
• This is the method of holding the mask.
• the distance between the center-side support point and the outer support point of the mask in each of the suction holding units is set to one, and the distance between the center-side support points in each of the suction holding units is set to one.
• the mask is held so as to satisfy the relational expression.
• a mask having a suction surface having a convex shape in a first direction within a predetermined allowable range is formed by a pair of first suction devices arranged to face each other in the first direction.
• This is a device for holding the mask held by the holding unit.
• the distance between the support point on the center side of the mask and the support point on the outside of the mask in each of the suction holding units is one, and the distance between the support points on the center side in each of the suction holding units is one.
• the first suction holding sections are respectively arranged so as to satisfy the relational expression.
• the mask can be stably held by the first suction holding unit without deteriorating the surface accuracy of the entire mask, and the size of the entire surface on which the mask is sucked can be increased. Therefore, stable mask holding can be realized.
• FIG. 1 is an overall schematic diagram showing an embodiment of an exposure apparatus provided with the holding device of the present invention.
• FIG. 2 is an external perspective view of a stage device having a holding device constituting the exposure device.
• FIG. 3 is an external perspective view of the holding device of the present invention.
• FIG. 4 is an enlarged perspective view of a main part showing an embodiment of the holding device of the present invention.
• FIG. 5A and 5B are schematic views showing a state in which the mask is held by the holding device of the present invention.
• FIG. 5A is a top view
• FIG. 5B is an arrow A--A in FIG. 5A.
• FIG. FIG. 6 is an enlarged sectional view of a main part when a mask is held by the holding device of the present invention.
• 7A to 7D are views for explaining the relationship between the shape and deformation of the mask held by the holding device.
• FIG. 8 is a table showing the relationship between the size and interval of the second region and the maximum deflection of the mask.
• Figure 9 is a graph of the table in Figure 8.
• FIG. 10 is a sectional view showing another embodiment of the mask of the present invention.
• FIGS. 11 to 14 are enlarged perspective views showing the main parts of another embodiment of the holding device of the present invention.
• FIG. 15 is a perspective view showing another embodiment of the holding device of the present invention.
• FIG. 16 is a perspective view showing a state where the reticle is sucked in the embodiment.
• FIGS. 17 to 21 are enlarged cross-sectional views of main parts when the mask is held by the holding device.
• FIGS. 22 to 24 are cross-sectional views of the reticle for explaining the effects of another embodiment of the present invention.
• FIG. 25 is a flowchart illustrating an example of a semiconductor device manufacturing process.
• FIG. 26 is an external perspective view showing a conventional holding device. BEST MODE FOR CARRYING OUT THE INVENTION
• FIG. 1 is an overall schematic view of an exposure apparatus
• FIG. 2 is an external perspective view of a reticle stage having a reticle holder (holding device, mask holder) constituting the exposure apparatus.
• FIG. 3 is an external perspective view of the reticle holder
• FIG. 4 is an enlarged view of a main part of the reticle holder.
• 5 is a schematic view showing a state where the reticle is held by the reticle holder
• FIG. 5A is a top view
• FIG. 5B is a cross-sectional view taken along the line AA of FIG. 5A.
• FIG. 6 is an enlarged sectional view of a main part when the reticle is held by the reticle holder.
• the exposure apparatus 1 shown in FIG. 1 is a device that uniformly illuminates a rectangular (or arc-shaped) illumination area on a reticle (sample or mask) R formed in a flat plate shape by exposure illumination light from a light source (not shown).
• Illumination optical system IU that illuminates with illuminance, reticle holder 18 that holds reticle R, movable reticle stage (mask stage) 2 including reticle holder 18 and reticle surface plate 3 that supports reticle stage 2 ,
• a projection optical system PL that projects the illumination light emitted from the reticle R onto the wafer (substrate, photosensitive substrate) W, a wafer holder (holding device) that holds the wafer W, and a wafer holder. 4.
• a stage device 7 including a movable wafer stage (substrate stage) 5 including a stage 1 and a wafer surface plate 6 supporting the wafer stage 5, the stage device 4 and the projection optical system P And a body 8 supporting the L.
• the direction of the optical axis of the projection optical system PL is defined as a Z direction
• the direction perpendicular to the Z direction is defined as the Y direction
• the direction of the synchronous movement of the reticle R and the wafer W is defined as the Y direction
• the direction of the asynchronous movement is defined as the X direction.
• the rotation directions around each axis are 0 ° and ⁇ ⁇ .
• the illumination optics IU is supported by a support column 9 fixed to the top of the body 8. It is.
• the illumination light for exposure may be, for example, an ultraviolet bright line (g-line, h-line, i-line) and a KrF excimer laser beam (wavelength 248 ⁇ m) emitted from an ultra-high pressure mercury lamp. or ultraviolet light (D UV light), a r F excimer one laser light (wavelength 1 9 3 nm) and F 2 laser beam (wavelength: 1 5 7 nm) vacuum ultraviolet light, such as (V UV) and the like are found using.
• the body 8 is mounted on a base plate 10 placed horizontally on the floor, and has upper and lower sides formed with stepped portions 8a and 8b protruding inward, respectively. Have been.
• the reticle surface plate 3 is supported almost horizontally on the step 8a of the body 8 via the vibration isolating unit 11 at each corner (for the vibration isolating unit on the back side of the paper, Is not shown), and an opening 3a through which a pattern image formed on the reticle R passes is formed at the center thereof.
• metal or alumina ceramics can be used as the material of the reticle surface plate 3.
• the anti-vibration unit 11 has a configuration in which an air mount 12 whose internal pressure is adjustable and a voice coil motor 13 are arranged in series on the step 8a. With these vibration isolation units 11, micro vibrations transmitted to the reticle surface plate 3 via the base plate 10 and the body 8 are insulated at the micro G level (G is gravitational acceleration).
• a reticle stage 2 is supported on the reticle base 3 so as to be two-dimensionally movable along the reticle base 3.
• a plurality of air bearings (gas bearings) 14 are fixed to the bottom of the reticle stage 2, and the reticle stage 2 is placed on the reticle surface plate 3 with a clearance of about several microns by these air bearings 14. Floating supported.
• the pattern image of the reticle R that has passed through the openings 2a and 3a enters the projection optical system PL.
• the projection optical system PL here, both the object plane (reticle R) side and the image plane (wafer W) side are telecentric and have a circular projection field, and a refractive optical element using quartz or fluorite as an optical glass material.
• a 1/4 (or 1/5) reduction magnification refracting optical system consisting of a lens element) is used.
• the imaged light flux from the portion illuminated by the illumination light enters the projection optical system PL, and a partially inverted image of the circuit pattern is formed in a circular field of view on the image plane side of the projection optical system PL.
• An image is formed by being limited to a slit shape at the center.
• the projected partial inverted image of the circuit pattern is reduced to the resist layer on the surface of one of the plurality of shot areas on wafer W arranged on the imaging plane of projection optical system PL. Transcribed.
• a flange 23 integrated with the lens barrel is provided on the outer circumference of the lens barrel of the projection optical system PL.
• the projection optical system PL is provided with a lens barrel base 25 composed of an object or the like that is supported substantially horizontally on a stepped portion 8b of the body 8 via an anti-vibration unit 24. Inserted from above in the Z direction, the flange 23 is engaged.
• a ceramic material having high rigidity and low thermal expansion may be used as the lens barrel base 25, a ceramic material having high rigidity and low thermal expansion may be used.
• the flange 23 may be made of a material having a low thermal expansion, such as Inver (Inver; nickel 36%, manganese 0.25%, and a low expansion material made of iron containing trace amounts of carbon and other elements. Alloy) is used.
• the flange 23 constitutes a so-called kinematic support mount for supporting the projection optical system P L at three points with respect to the barrel base 25 via points, surfaces and V-grooves.
• the anti-vibration unit 24 is arranged at each corner of the lens barrel base 25 (the anti-vibration unit on the back side of the drawing is not shown), and an air mount 26 and a voice coil motor 2 whose internal pressure can be adjusted. 7 are arranged in series on the step 8b.
• vibration isolating units 24 micro vibrations transmitted to the lens barrel surface plate 25 (and the projection optical system P L) via the base plate 10 and the body 8 are insulated at the micro G level.
• the stage device 7 includes a wafer stage 5, a wafer surface plate 6 that supports the wafer stage 5 so as to be movable in a two-dimensional direction along the XY plane, and a sample stage that is provided integrally with the wafer stage 5 and that holds the wafer W by suction.
• ST, X stage XG, X stage X It is mainly composed of a synchronous stage device that moves synchronously with G.
• a plurality of air bearings (gas bearings) 28 which are non-contact bearings are fixed on the bottom surface of the wafer stage 5, and these air bearings 28 move the wafer stage 5 onto the wafer surface plate 6. For example, it is levitated and supported through a clearance of about several microns.
• the wafer surface plate 6 is supported almost horizontally above the base plate 10 via a vibration isolation unit 29.
• the anti-vibration unit 29 is disposed at each corner of the wafer surface plate 6 (the anti-vibration unit on the back side of the drawing is not shown), and the air mount 30 and the Pois coil motor 3 which can adjust the internal pressure are provided. 1 is arranged on the base plate 10 in parallel. By these vibration isolating units 29, the micro vibration transmitted to the wafer surface plate 6 via the base plate 10 is insulated at the micro G level.
• the X guide stage XG has a long shape along the X direction, and movers 36 and 36 formed of armature units are provided at both ends in the length direction.
• the stators 37, 37 having magnet units corresponding to the movers 36, 36 are provided on support portions 32, 32 projecting from the base plate 10.
• the moving coil 36 and the stator 3 7 constitute moving coil type linear motors 3 3, 3 3, and the movable element 3 6 interacts electromagnetically with the stator 3 7.
• the X guide stage XG moves in the Y direction, and also rotates in the 0 Z direction by adjusting the drive of the linear motors 33, 33.
• the linear stage 33 allows the stage 8 (and the sample stage ST, hereinafter simply referred to as the wafer stage 5) to be substantially integrated with the X guide stage XG by the linear guide 33 in the Y and 0 Z directions. To be driven.
• a mover 34a of an X trim motor is mounted on one X direction side of the X guide stage XG.
• the stator 34 b of the X trim motor is provided on the body 8. Therefore, the reaction force when driving the wafer stage 5 in the X direction is transmitted to the base plate 10 via the X trim module 34 and the body 8.
• the wafer stage 5 is connected to the X guide stage XG via a magnet that maintains a predetermined amount of gear in the Z direction and a magnetic guide consisting of an actuator and an X guide. It is supported and held by the stage XG in a non-contact manner so as to be relatively movable in the X direction.
• the wafer stage 5 is driven in the X direction by electromagnetic interaction by an X linear motor 35 embedded in the X guide stage XG.
• the wafer W is fixed to the upper surface of the wafer stage 5 via a wafer holder 41 by vacuum suction or the like.
• the stage device 7 is provided with a sample stage detection device for detecting the position information of the sample stage ST.
• the sample stage detection device consists of an X movable mirror 43 extending along the Y direction on the side edge on the sample stage ST, and a laser interferometer (interferometer) arranged opposite to the X movable mirror 43 4 and 4 are provided.
• the laser interferometer 44 irradiates laser light (detection light) toward the reflecting surface of the X movable mirror 43 and the reference mirror 42 fixed to the lower end of the projection optical system PL, and reflects the laser light.
• the position of the sample stage ST (and thus the wafer W) in the X direction can be determined to a predetermined resolution.
• detection is performed in real time with a resolution of about 0.5 to 1 nm.
• a Y moving mirror extending along the X direction on the side edge of the sample stage ST is opposed to the Y moving mirror at an interval in the X direction.
• a Y laser interferometer (interferometer) is provided.
• the Y laser interferometer has a reference mirror (fixed to the reflecting surface of the Y moving mirror and the lower end of the barrel of the projection optical system PL). (Not shown), and the relative displacement between the Y-moving mirror and the reference mirror is measured based on the interference between the reflected light and the incident light.
• the position of the table ST (and thus the wafer W) in the Y direction and the direction (rotation about the axis perpendicular to the relative movement direction) (rotation about the Z axis) are determined at a predetermined resolution, for example, about 0.5 to 1 nm. Detect in real time.
• three laser interferometers 45 are fixed to three different places on the flange 23 of the projection optical system PL (however, in FIG. 1, one of these laser interferometers is fixed). Representatively shown).
• the portion of the lens barrel base 2 5 facing each laser interferometer 4 5, the opening 2 5 a are formed respectively from the laser interferometer 4 5 via these openings 2 5 a in the z-direction
• the laser beam (measuring beam) is irradiated toward the wafer surface plate 6.
• a reflection surface is formed on the upper surface of the wafer surface plate 6 at a position facing each of the measurement beams. Therefore, the three laser interferometers 45 measure the three different Z positions of the wafer surface plate 6 with reference to the flange 23, respectively. (However, FIG.
• a reflection surface may be formed on the upper surface of the sample stage ST, and an interferometer for measuring three different Z-direction positions on the reflection surface with reference to the projection optical system PL or the flange 23 may be provided. .
• reticle stage 2 includes a reticle coarse movement stage 16 and a reticle holder (holding device) 18 as a reticle fine movement stage provided on reticle coarse movement stage 16. (In Fig. 1, these are shown as one stage.)
• a pair of Y linear motors (stage driving devices) 15 and 15 are connected to reticle coarse movement stage 16, and reticle coarse movement stage 16 is mounted on reticle surface plate 3.
• the Y linear motors 15 and 15 are driven at a predetermined stroke in the Y-axis direction.
• Each Y linear motor 15 is mounted on a reticle surface plate 3 by a plurality of air bearings 19 which are non-contact bearings, and is supported by a plurality of stators 20 which are levitated and extend in the Y-axis direction.
• a movable member 21 is provided correspondingly and fixed to a reticle coarse movement stage 16 via a connecting member 22.
• the stator 20 moves in the ⁇ Y direction according to the movement of the reticle coarse movement stage 16 in the + Y direction.
• the movement of the stator 20 cancels the reaction force caused by the movement of the reticle coarse movement stage 16 and also prevents the center of gravity from changing.
• the stator 20 may be provided on the body 8 instead of on the reticle surface plate 3.
• the air bearing 19 is omitted, the stator 20 is fixed to the body 8, and the movement of the reticle coarse movement stage 16 acts on the stator 20. Force may escape to the floor via body 8.
• the reticle coarse movement stage 16 is guided in the Y-axis direction by a pair of Y guides 51, 51 fixed to the upper surface of an upper protruding portion 3b formed in the center of the reticle surface plate 3 and extending in the Y-axis direction. It has become so.
• the reticle coarse movement stage 16 is These Y guides 51 and 51 are supported by air bearings (gas bearings) not shown in a non-contact manner.
• the reticle coarse movement stage 16 and the ⁇ guides 51, 51 are made of, for example, metal or alumina ceramics.
• a reticle holder (reticle fine movement stage) 18 is provided with a pair of X voice coil motors 17 X and a pair of ⁇ voice coil motors 17 ⁇ .
• the reticle holder 18 is floated with respect to the upper surface 16 a of the reticle coarse movement stage 16 by an air bearing (not shown), and is moved in the X, Y and X directions on the reticle coarse movement stage 16 by the voice coil motor. It is designed to be driven minutely.
• the reticle holder 18 is made of ceramics, and in particular, is made of a colloidal ceramic. Since this cordierite-based material has almost no coefficient of thermal expansion, the reticle holder 18 is suppressed from expanding due to heat generated from an actuator (voice coil motor) or the like as a stage driving device. Further, reticle coarse movement stage 16 is also made of ceramics, and ceramics made of cordierite or SiC can be used. Reticle coarse movement stage 16 may be made of metal such as stainless steel.
• a pair of Y movable mirrors 52 a and 52 b made of corner cups, and at the end of the reticle holder 18 in the + X direction, An X movable mirror 53 composed of a plane mirror extending in the Y-axis direction is provided. Then, three laser interferometers (all not shown) that irradiate the measuring beams to these movable mirrors 52 a, 52 b, and 53 measure the distance to each movable mirror. The position of the reticle stage 2 in the X, Y, and (rotation around the ⁇ axis) direction is measured with high accuracy.
• the positional information of reticle stage 2 (reticle holder 18 and reticle coarse movement stage 16) measured by the laser interferometer is output to the control device, and the control device controls reticle stage 2 based on the measurement result of the laser interferometer.
• the stage drive (linear motor 15, voice coil motor 17X, 17mm) is driven to move to the predetermined position.
• the drive of the linear motors 33 and 35 for the wafer stage 5 is controlled by a control (not shown). It is totally controlled by the device.
• the reticle holder 18 has pedestal portions 60 (6OA, 60B, 60C) provided at a plurality of predetermined positions so as to protrude in the Z direction. And suction pads 62 respectively provided on the upper surface of 60. In this embodiment, three pedestals 60 and three suction pads 62 are provided.
• the opening 2 a through which the pattern image of the reticle R can pass is formed.
• an opening 2 a is formed in the center of reticle coarse movement stage 16.
• each of the suction pads 62 provided on the pedestal portion 60 has an annular groove portion 61 formed so as to extend in the Y direction, and It has a boundary portion 65 formed on the inside, a first fine hole (first suction device) 70 a and a second fine hole (second suction device) 7 Ob connected to the annular groove portion 61. ing. As shown in FIG. 4, each of the fine holes 70 a and 70 b is connected to a compressor (suction device) 72 via a suction passage 71.
• the pores 70 a are arranged in a first suction portion (first holding portion) 63 3 which is a linear portion on the opening 2 a side of the annular groove portion 61, and the pores 7 O b are arranged in the annular groove portion.
• the first suction part 63 and the second suction part 64 are arranged in a second suction part (second holding part) 64 which is a straight part on the opposite side of the opening 2a. (See the shaded area of A).
• each of the first suction unit 63 and the second suction unit 64 is arranged at a plurality of positions (three places) with respect to the lower surface Ra of the reticle R, and the first suction unit 63 and the second suction unit The two suction portions 64 are arranged adjacent to each other with the boundary portion 65 interposed therebetween.
• Each of the suction passages 71 is provided with a valve 71a capable of adjusting a gas suction amount per unit time sucked from the fine holes 70a and 70b.
• the operation of the valves 71a is individually controlled by the control device CONT. That is, the amount of gas suction per unit time by the first pores 70a and the amount of gas suction per unit time by the second pores 70b can be individually controlled by the controller CONT. It has become.
• FIG. 4 shows only the suction pads 62 provided on the pedestal portions 60A and 60B, but the suction pad provided on the pedestal portion 60C has the same configuration. are doing. As shown in FIG. 3, FIG. 5B and FIG.
• the reticle R is a pellicle PE for protecting a pattern area PA having a pattern formed in the center of the lower surface (adsorbed surface) Ra.
• the pedestal portion 60 of the reticle holder 18 is adapted to hold a holdable area CA, which is a portion of the lower surface of the reticle R other than where the ⁇ icle PE is provided.
• the reticle R has an accuracy assurance area (first area) AR1 having a predetermined surface accuracy including the pattern area PA, and an accuracy non-assurance area AR2 other than the accuracy assurance area AR1 on the lower surface Ra. are doing. That is, the lower surface Ra of the reticle R is not processed so that the entire surface has a predetermined surface accuracy, and the predetermined surface accuracy is not guaranteed at the outer edge.
• the central portion is a flat portion, and the outside of the central portion is away from the pedestal portion 60 from the center side to the outside.
• the taper ⁇ ⁇ is formed in The plane portion formed at the center of the lower surface of the reticle R is an accuracy assurance region A R1, and the tapered portion is an accuracy assurance region A R 2.
• the tapered shape of the reticle R can be formed by polishing the outer edge of the lower surface Ra of the reticle R with a polishing device.
• the second suction part 64 of the suction pad 62 is set so as to face the non-guaranteed area AR2 on the lower surface Ra of the reticle R. Then, the suction device 72 draws the gas in the space between the accuracy assurance area AR 1 of the lower surface Ra of the reticle R and the first suction portion 63 through the pores (first suction device) 70 a. Suction, so that the gas in the space between the AR 2 and the second suction unit 64 is not sucked through the pores (second suction device) 70 b so that the accuracy is not guaranteed on the lower surface Ra of the reticle R. It is.
• a boundary portion 65 between the adjacent first suction portion 63 and second suction portion 64 is disposed at least in the accuracy assurance area AR1 of the lower surface Ra of the reticle R. It is set to be.
• the gas in the space between the accuracy assurance area AR1 and the first suction unit 63 and the gas in the space between the accuracy non-guaranteed area AR2 and the second suction unit 64 are defined by pores 7 0 a and pore 7 0
• the pores 70 The gas sucked through a contains a part of the gas in the space between the non-guaranteed area AR2 and the second suction section 64, and the gas sucked through the pores 70b guarantees the accuracy. It contains a part of the gas in the space between the area AR 1 and the first suction part 63.
• the upper end face of the first suction part 63 and the upper end face of the second suction part 64 are formed at the same height position. That is, the upper surface of the suction pad 62 is flush.
• the first suction part 63 and the accuracy assurance area AR 1 as a flat part are in contact with each other, and the second suction part 64 and the accuracy non-guaranteed area AR 2 as a tapered part have a predetermined interval H. ing. That is, although the gas suction amount per unit time from the first pores 70a and the gas suction amount per unit time from the second pores 70b are set to the same value, By providing the interval H, the area of the lower surface Ra of the reticle R sucked by the first suction unit 63 becomes larger than the area sucked by the second suction unit 64, that is, as shown in FIG.
• R a A is larger than R a B, so that the suction force of the second suction unit 64 on the reticle R is larger than that of the first suction unit 63 on the reticle R.
• the distance H is set to such an extent that the reticle R is not distorted by the suction of the non-guaranteed area AR 2 by the second suction unit 64, and the second suction unit 64 and the first suction unit 6 3
• the reticle R is set to such an extent that it can be held stably.
• a predetermined reticle R is loaded on the reticle holder 18 by a reticle transport device (not shown).
• the accuracy assurance area AR 1 and the first suction unit 63 of the reticle R holding area CA are opposed to each other, and the accuracy non-guaranteed area AR Loading is performed while performing positioning so that 2 and the second suction section 64 face each other.
• the suction pads 62 are aligned so that the boundary 65 between the first suction unit 63 and the second suction unit 64 is arranged at least in the accuracy assurance area AR1.
• the control device CONT drives the suction device 72 and controls the valves 7 la provided respectively in the suction passages 71 so that the first fine holes 7 are formed.
• the gas suction amount per unit time by 0a and the gas suction amount per unit time by the second pore 70b are set to preset values.
• the controller CONT sets the same amount of gas suction per unit time from the first pore 70a and the same amount of gas suction per unit time from the second pore 70b. Set to a value.
• the reticle R is suction-held by the first suction unit 63 and the second suction unit 64 by the accuracy guarantee area A R1 and the accuracy non-guaranteed area A R2, respectively.
• the first suction unit 63 and the second suction unit 64 use the wide range of the reticle R holding area CA so that the reticle R can be stably mounted on the reticle holder 18. Even when the reticle stage 2 moves at high speed, the reticle R and the reticle holder 18 do not deviate due to the inertial force.
• the reticle R has the accuracy assurance area AR 1 held by the first suction unit 63 and the accuracy non-guaranteed area AR 2 is individually held by the second suction unit 64.
• the holder 18 holds the reticle R stably without deformation.
• the first suction section 63 Since the area of the lower surface Ra of the reticle R to be sucked is larger than the area sucked by the second suction unit 64, the suction force of the second suction unit 64 to the reticle R is the first suction force. It is set to be weaker than the suction force for reticle R in section 63. Therefore, when the non-guaranteed area AR2 is sucked and held, it is possible to suppress distortion of the entire reticle R due to sucking and holding the non-guaranteed area AR2.
• the leak amount from the interval H (that is, the interval H) is set so as not to distort the reticle R and not to decrease the stable holding force on the reticle R. That is, even if the reticle stage 2 moves at high speed, the reticle R and the reticle holder 18 are set so as not to be displaced by the inertial force. Then, reticle R held in reticle holder 18 is illuminated. By irradiating the exposure light from the bright optical system IU, the pattern formed on the reticle R can be accurately exposed on the wafer W via the projection optical system PL.
• the accuracy assurance area AR1 is held by the first suction unit 63, and the accuracy non-guaranteed area AR2 is held by the second suction unit 64.
• the reason why R can be stably held without deformation will be described with reference to FIGS. 7A to 7D, FIGS. 8 and 9.
• FIG. 7A to 7D show the area of the taper portion of the reticle R, that is, the non-guaranteed area AR2 of the reticle R, and the size L of the AR2 are set to different values.
• FIG. 9 is a view schematically showing a result of simulating the shape (deformation) of a reticle R when suction and holding are performed by a suction unit 63 and a second suction unit 64.
• Fig. 7A is a diagram when the size L of the non-guaranteed area is set to 5.5 mm
• Fig. 7B is a diagram when the size L is set to 7.5 mm
• Fig. 7C is
• FIG. 7D is a diagram when the size L is set to 9.0 mm
• FIGS. 7A to 7D are diagrams when the size L is set to 10.5 mm.
• the maximum value H of the interval between the second suction unit 63 and the non-accuracy area AR2 is set to the same value (0. (Suction pad 62) is the same.
• FIG. 7A is a simulation result diagram when the size L of the non-guaranteed area A R 2 is set to 5.5 mm.
• the accuracy guarantee area AR 1 is held by the first suction unit 63
• the accuracy non-guaranteed area AR 2 is held by the second suction unit 64.
• the boundary 65 between the first suction unit 63 and the second suction unit 64 is located in the accuracy guarantee area AR1.
• FIG. 7B is a simulation result diagram when the size L of the non-guaranteed area A R 2 is set to 7.5 mm.
• the accuracy guarantee area AR 1 is held by the first suction unit 63
• the accuracy non-guaranteed area AR 2 is held by the second suction unit 64.
• the boundary 65 between the first suction unit 63 and the second suction unit 64 is arranged on the non-guaranteed area AR2 side.
• the suction operation on reticle R is also performed by first suction portion 63 and second suction portion 64 of pedestal portion 60C on the opposite side.
• a reaction force M3 'against bending acts on reticle R, and the center of moment C is on boundary 65, so the moment around point C is balanced. Therefore, the first suction part 63 and the accuracy assurance area AR 1 do not come apart.
• FIG. 7C is a simulation result diagram when the size L of the non-guaranteed area AR2 is set to 9. Omm.
• the accuracy assurance area AR 1 and a part of the accuracy non-guaranteed area AR 2 are held in the first suction unit 63, and the accuracy non-guaranteed area AR 2 is held in the second suction unit 64.
• the first suction unit 63 and the second suction unit 64 The boundary 65 is located completely on the non-guaranteed area AR2 side.
• FIG. 7C is 6 OA (or 6 OB), the suction performed on the reticle R by the first suction portion 63 and the second suction portion 64 of the pedestal portion 60C on the opposite side.
• a reaction force M5 'against bending acts on the reticle R as shown in FIG. 7C.
• the deformation of the reticle R ends when the deformation of the reticle R progresses and the point C 1 of the reticle R comes into contact with the boundary 65 and the moment around this point C 1 is balanced with the reaction force M5 ′.
• FIG. 7D is a simulation result diagram when the size L of the non-guaranteed area A R 2 is set to 10.5 mm.
• the accuracy assurance area AR1 is not held in any of the first and second suction units 63 and 64
• the t-degree non-guaranteed area AR2 is held in the first and second suction units 63 and 64.
• the boundary 65 between the first suction section 63 and the second suction I section 64 is arranged on the non-guaranteed area AR2 side.
• the deformation of the reticle R ends when the accuracy non-guaranteed area AR2 comes into contact with the first suction unit 63 and the second suction unit 64, as indicated by a broken line R '.
• the size L is set to 5.5 mm or less
• the boundary 65 between the first suction unit 63 and the second suction unit 64 is the accuracy assurance area of the reticle R.
• AR 1 Is set to be larger than the area for the accuracy non-guaranteed area AR2 of the second suction unit 64, thereby preventing the separation between the first suction unit 63 and the accuracy guaranteed area AR1.
• generation of distortion of reticle R can be prevented.
• FIG. 8 shows the maximum deflection of the reticle R when the size L of the non-guaranteed area AR2 and the maximum distance H between the second suction unit 64 and the non-guaranteed area AR2 were changed. It is a simulation result obtained.
• FIG. 9 is a graph of the table of FIG. 8, in which the vertical axis represents the maximum deflection of the reticle R, and the horizontal axis represents the size L of the non-guaranteed area A R 2.
• the maximum deflection of the reticle R is the distance in the Z direction between the edge of the reticle R and the center of the reticle R when the reticle R is lifted and deformed.
• the maximum deflection value of the reticle R dramatically increases when the size L is 2.5 mm, 5.5 mm, and 7.5 mm. From this, the deformation of the reticle R greatly depends on the size L of the non-guaranteed area AR2, that is, whether or not the first non-guaranteed area AR2 is suctioned by the first suction unit 63.
• the shape of the non-guaranteed area AR 2 of the reticle R is not limited to the tapered shape, and the second suction section 6 4 may be formed according to the shape of the second suction section 64 that sucks and holds the non-guaranteed area AR 2 of the reticle R. It suffices that a predetermined interval H is set between the reticle R and the non-guaranteed area AR 2 of the reticle R.
• the non-guaranteed area A R2 may be a step formed in a direction away from the second suction section 64.
• the pores connected to the suction device 72 via the suction passage 71 are linear portions of the annular groove 61 formed in the suction pad 62 so as to extend in the Y direction.
• the number of pores provided in the force annular groove 61 which is a configuration provided in each of the certain first suction unit 63 and the second suction unit 6, can be one.
• the first suction part 63 and the second suction part 64 are continuous because they are part of the annular groove part 61, and the suction operation can be stably performed even if only one pore 70 is provided. It can be carried out.
• a suction passage 71 is provided in each of the plurality of pores. The suction operation may be performed by the connection and the suction device 72.
• the gas suction amount per unit time from the first pores 70a and the gas suction amount per unit time from the second pores 70b are set to the same value.
• each suction amount may be set differently.
• the controller CONT may individually control the valves 71a provided in the plurality of connection passages 71, respectively.
• a suction device 72 is separately provided for each of the suction passages 71, and the control device CONT controls the output of each of the suction devices 72 individually. You may do so.
• the suction force of the second suction unit 64 on the accuracy non-guaranteed area AR2 is reduced by the first force.
• the accuracy assurance area of the suction part 63 is set to be weaker than the suction force for the AR 1, but the amount of gas suction per unit time from the first pore 70 a
• the accuracy non-guaranteed area of the second suction part 64 is reduced by the suction force of the first suction part 63 to the accuracy non-guaranteed area. You may set so that it may become weaker than the suction force with respect to AR1.
• the linear portions are respectively the first suction portion 63 and the second suction portion 64.
• the suction pad 62 may be provided with a first suction section 63 and a second suction section 64 independently of each other.
• the first suction unit 63 and the second suction unit are provided with pores 70 in each of the first suction unit 63 and the second suction unit 64 and individually connected to the suction device 72. 6 4 enables the suction operation.
• the suction force of the first suction unit 63 with respect to the accuracy assurance region AR 1 and the suction force of the second suction unit 64 with the accuracy non-guaranteed region AR 2 can be controlled independently of each other.
• the height position of the first suction unit 63 and the height position of the second suction unit 64 are set to be the same, but as shown in FIG.
• the height position 64 may be set to be lower than the first suction section 63 with respect to the lower surface Ra of the reticle R. In this way, a taper portion is formed on reticle R. Even without this, a predetermined interval H can be formed between the second suction unit 64 and the non-guaranteed area AR2 of the reticle R.
• the height position of the second suction unit 64 may be set to be higher than the first suction unit 63 with respect to the lower surface Ra of the reticle R. .
• the second suction unit 64 and the non-guaranteed area AR A predetermined distance H can be formed between them.
• the height position of the second suction section 64 is set according to the shape of the lower surface Ra of the reticle R.
• a pedestal portion provided with the first suction portion 63 and a pedestal portion provided with the second suction portion 64 are provided independently, and one of the two pedestal portions can be moved in the Z direction.
• the height position of the first suction unit 63 or the second suction unit 64 may be controlled by moving the pedestal portion supported by the support device and movably supported in the Z direction in the Z direction.
• the pedestals may be arranged side by side in the X direction or may be arranged separated in the Y direction.
• each of the pedestal portions 60A, 60B, and 60C shown in FIG. 3 is supported by a supporting device that can move in a direction approaching / separating from the opening 2a (that is, the X direction), and is placed.
• the pedestal section is designed such that the second suction portions 64 provided on the respective pedestal sections hold the non-guaranteed area AR2. May be moved.
• the size of the first suction unit 63 and the size of the second suction unit 64 need not be the same, and may have different sizes (areas).
• the width (the size in the X direction) of the second suction unit 64 may be set smaller than the width (the size in the X direction) of the first suction unit 63.
• the size of the first suction unit 63 in the Y direction may be different from the size of the second suction unit 64 in the Y direction.
• Each of the suction pads 62 shown in FIG. 14 includes one first holding part 63 and three second holding parts 64 smaller than the first holding part 63.
• each of the three second holding portions 64 is set to be smaller than that of the first holding portion 63. And, between the second holding parts 6 4, there is a table having no suction function. The upper surface of the seat 63 is exposed. Even with such a configuration, the suction force of the second suction unit 64 for the non-guaranteed area AR2 can be made smaller than the suction force of the first suction unit 63 for the accuracy guaranteed area AR1. 8 can stably hold the reticle R without distortion.
• the number of the pedestal portions having the suction pads 62 is three, but the pedestal portions having the suction pads 62 can be provided at arbitrary plural places. Further, in the present embodiment, each of the suction pads 62 has the first suction part 63 and the second suction part 64, but the suction pads 62 provided on each of the plurality of pedestals are provided. Of the two, any of the suction pads may be provided with only the first suction part 63 and not provided with the second suction part 64.
• the suction pads 62 When a plurality of pedestals 60 having the suction pads 62 are provided, it is not necessary to perform the suction operation on the reticle R with all the suction pads 62.
• one of the suction pads 62 provided at a plurality of locations may be used to perform the suction operation on the reticle R using any one of the suction pads 62, and the other suction pads 62 may not perform the suction operation.
• the configuration may be such that That is, it is possible to adopt a configuration in which the suction operation of the plurality of suction pads 62 is switched.
• the amount of gas suction per unit time from the pores 70 b provided in the second suction unit 64 (that is, the suction force of the second suction unit 64 with respect to the accuracy non-guaranteed area AR 2), or
• the suction position of the suction unit 64 with respect to the reticle R can be set according to the shape (degree of deformation) of the reticle R.
• the amount of gas suction per unit time from the pores 70 b is controlled so that the reticle R held by the reticle holder 18 is flat so that accurate exposure processing can be performed, or as described above.
• the second suction unit 64 is movably provided as described above, the position is controlled.
• the setting of the gas suction amount per unit time from the pores 70b and the setting of the position of the second suction unit 64 can be performed, for example, by measuring the shape (deformation amount) of the reticle R using a shape measuring device (optical shape sensor, etc.). ), And based on the measurement result, the shape of the reticle R may be adjusted to a desired shape.
• the tapered portion of the reticle R is defined as the non-guaranteed area AR2.
• a part of the taper section may include the accuracy guaranteed area. If the reticle holder 18 does not have a sufficient suction holding force for the reticle R, for example, a predetermined pressing device may be used to move the upper surface of the reticle R corresponding to the position held by the reticle holder 18 from above to below. By pressing toward, the holding force can be improved.
• an interval H is provided between the second holding unit 64 and the non-guaranteed area AR2 of the reticle R. Since the interval H is, for example, about 5 iz m, the gas (air) ), The second holding unit 64 can perform a suction operation on the reticle R.
• the holding device of the present invention is applied to a reticle holder, but may be applied to a wafer holder 41 for holding a wafer W.
• the holding device of the present invention can be applied to, for example, a reticle inspection device, a device for forming a circuit pattern on a reticle, and the like, in addition to the exposure device.
• a semiconductor wafer W for a semiconductor device not only a semiconductor wafer W for a semiconductor device, but also a glass substrate for a liquid crystal display device, a ceramic wafer for a thin film magnetic head, and the like are applied.
• a step-and-scan type scanning exposure apparatus for synchronously moving a reticle R and a wafer W to run and scan a reticle R pattern.
• the present invention is also applied to a step 'and' repeat type projection exposure apparatus (stepper) that exposes the pattern of the reticle R while the reticle R and the wafer W are stationary and sequentially moves the wafer W in steps. be able to.
• the type of the exposure apparatus 1 is not limited to an exposure apparatus for manufacturing a semiconductor device for exposing a semiconductor device pattern onto a wafer W, but may be an exposure apparatus for manufacturing a liquid crystal display element, a thin-film magnetic head, an imaging device (CCD), or a reticle. It can be widely applied to an exposure device for manufacturing a device.
• emission lines g-line (436 nm), h-line (404.7 nm), i-line (365 nm)), K r F excimer Mareza (2 4 8 nm), a r F excimer laser (1 9 3 nm), F 2 not only laser (1 5 7 nm)
• charged particle beams such as X-ray or electron beam Can be.
• a thermionic emission type lanthanum hexaporite (L a B 6 ) or tantalum (T a) can be used as an electron gun.
• a configuration using a reticle R may be used, or a configuration may be used in which a pattern is directly formed on a wafer without using the reticle R.
• a high frequency such as a YAG laser or a semiconductor laser may be used.
• the magnification of the projection optical system PL may be not only a reduction system but also any of an equal magnification system and an enlargement system.
• a material that transmits far ultraviolet rays such as quartz or fluorite is used as the glass material when far ultraviolet rays such as an excimer laser is used, and a catadioptric system is used when an F 2 laser or X-ray is used.
• a refraction optical system may be used (the reticle R may be of a reflection type), and when an electron beam is used, an electron optical system including an electron lens and a deflector may be used as the optical system.
• the optical path through which the electron beam passes is in a vacuum state.
• the present invention can also be applied to an aperture exposure apparatus that exposes the pattern of the reticle R by bringing the reticle R and the wafer W into close contact with each other without using the projection optical system PL.
• each of the stages 2 and 5 may be of a type that moves along a guide, or may be a guideless type without a guide.
• each stage 2 and 5 consists of a magnet unit (permanent magnet) with a two-dimensionally arranged magnet and an armature unit with a two-dimensionally arranged coil, and drives each stage 2 and 5 by electromagnetic force
• a flat motor may be used.
• one of the magnet unit and the armature unit may be connected to the stages 2 and 5, and the other of the magnet unit and the armature unit may be provided on the moving surface side (base) of the stages 2 and 5. .
• the exposure apparatus 1 controls various subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy.
• Manufactured by assembling Before and after this assembly, various optical systems must be adjusted to achieve optical accuracy in order to ensure these various accuracies. For various mechanical systems, adjustments are made to achieve mechanical accuracy, and for various electrical systems, adjustments are made to achieve electrical accuracy.
• the process of assembling the exposure apparatus from various subsystems includes mechanical connections, wiring connections of electric circuits, and piping connections of pneumatic circuits among the various subsystems. It goes without saying that there is an assembly process for each subsystem before the assembly process from these various subsystems to the exposure apparatus.
• a comprehensive adjustment is performed to ensure various precisions of the entire exposure apparatus. It is desirable to manufacture the exposure apparatus in a clean room where the temperature, cleanliness, etc. are controlled.
• a step 201 for designing device functions and performance a step 202 for fabricating a mask (reticle) based on this design step, and a wafer made of silicon material Wafer manufacturing step 204 for exposing a reticle pattern to a wafer using the exposure apparatus 1 of the above-described embodiment, device assembling step (including dicing step, bonding step, and packaging step) 2 0 5, inspection step 206, etc.
• FIGS. 15 to 21 are explanatory diagrams of the second embodiment of the present invention.
• This embodiment is characterized in that a so-called pin chuck holder is used as the reticle holder 90.
• Other configurations of the device may be the same as those of the first embodiment described above.
• FIG. 15 is a perspective view of the reticle holder 90. At the center of the reticle holder 90, a rectangular opening 2a is formed. On both sides of the opening 2a on the upper surface of the reticle holder 90, a long and narrow rectangular suction line is formed along each side. Pad 91 is formed.
• These suction pads 91 include a partition wall 92 surrounding a rectangular decompression region 95 to maintain a degree of vacuum, a large number of pins 96 formed at intervals in the decompression region 95, and And an exhaust hole 94 that opens into the area 95.
• the width and height of the partition 92 are constant over the entire circumference, and the upper end surface of the partition 92 and the pin 96 are polished so as to have exactly the same height from the upper surface of the holder.
• the height error between the partition wall 92 and the pin 96 can usually be suppressed to 50 nm or less.
• the material of the reticle holder 90 is Ceramic is the best.
• Each of the exhaust holes 94 is connected to a vacuum pipe (not shown) so that the gas in the decompression region 95 can be exhausted.
• FIG. 16 shows a state in which the reticle R is attracted to the reticle holder 90, and a portion in contact with the reticle R is shown by oblique lines.
• FIG. 17 is an enlarged cross-sectional view showing a case where the reticle R whose end is not taped is attracted to the reticle holder 90.
• the upper end surface (adsorbing surface) of the partition wall 92 is a reticle R.
• FIG. 18 shows a case where the outside of the reticle R is tapered from a position 5.5 mm from the edge as an embodiment of the present invention.
• the center between the partition walls 92 of each suction pad 91 of the reticle holder 90 is located 6.5 mm from the edge of the reticle R.
• the start point P1 of the taper is located outside the center between the partition walls 92 of the suction pads 91 of the reticle holder 90. Therefore, since the moment M2 around the point P1 generated by the decompression in the decompression area 95 is larger than the counterclockwise moment M1, the portion G inside the reticle from the point P1 is peeled off from the suction pad 91. No momentum is generated.
• the taper start point p3 when the taper start point p3 is set at a position 9 mm from the edge of the reticle, the moment M3 in the direction of distorting the reticle R is further increased, as shown in Fig. 21.
• the taper start point P 4 is located on the upper end face of the inner partition 92. When placed, the amount of distortion of reticle R is maximized.
• the taper start point of the reticle R is centered in the width direction of the suction pad 91 as shown by the taper start point P 1 in FIG. It may be more outside. For example, if the center between the partition walls 92 of each suction pad 91 of the reticle holder 90 is located 6.5 mm from the edge of the reticle R, the taper starts from outside the edge of 6 mm from the edge.
• the taper starts from outside the edge of 6 mm from the edge.
• interval 1 2 the distance between the support points of the outer caused when the reticle R to the support point of the center side is placed and the reticle R [delta], the product of the adsorption area of the suction holder and the atmospheric pressure ⁇ , the longitudinal elastic modulus of the reticle R is denoted by ⁇ , and the second moment of area of the reticle R is denoted by I.
• the boundary condition is
• Equations (21), (22), and (23) show reticle deformation due to stress P. Therefore, if the shape of the reticle under no stress is the shape of Eq. (21), Eq. (22) or Eq. (23), apply stress P to the opposite side as shown in Fig. 23. Can be corrected to a perfect plane.
• the stress P is a value obtained by multiplying the atmospheric pressure by the suction area.
• the territory of 1e is the adsorption area.
• FIG. 24 shows a suitable design example in this case. Support points 2, 'support points 3 outside the, 3' 2 is provided, the suction region 2 whether et 3 and 2, from 3, since each increased by region 1 3 to a larger attraction force And frictional force is obtained.
• Reticle periphery such as region 1 3 generally poor flatness, is brought into contact with support points on these regions 1 3, since the reticle R is largely bent, it is necessary to avoid.
• a taper is provided at the end of reticle R, and processing is performed so that the attracted surface of the reticle after suction shown by the solid line is away from the support points 3 and 3 '. It should be left.
• the amount of separation (retreat) h is preferably 5 or less. Surface accuracy of the area 1 3, region 1 2 surface accuracy (typically, 500 nm or less) for bract coarse not compared with, Working area 1 3 is easy.
• the support point of the reticle holder 3 By previously cutting the depth 5 about im of a portion corresponding to 3 ', can reach the same purpose possible to, the support point areas 1 3 and the reticle holder of the suction surface of the reticle 3, it is also possible to have moved backward, respectively both of a portion corresponding to 3 '. '
• the reticle pattern surface is slightly bent by gravity (self-weight of the reticle) after the reticle is sucked and held, but this amount can be calculated in advance.
• each of the first area having the predetermined surface accuracy on the suctioned surface and the second area other than the first area on the suctioned surface is formed by the first holding unit and the second holding unit. Since the holding unit and the holding unit individually hold by suction, the sample can be stably held by the first holding unit without deteriorating the surface accuracy of the entire sample, and the second holding unit can be held. As a result, the entire surface on which the sample is adsorbed can be enlarged, and stable holding is possible.

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• 2002
  • 2002-02-13 WO PCT/JP2002/001200 patent/WO2002065519A1/ja active Application Filing
  • 2002-02-13 CN CNA02804844XA patent/CN1507649A/zh active Pending
  • 2002-02-13 KR KR1020037010681A patent/KR100855527B1/ko not_active IP Right Cessation
  • 2002-02-13 JP JP2002565351A patent/JP4196675B2/ja not_active Expired - Fee Related
• 2003
  • 2003-08-13 US US10/639,651 patent/US7081946B2/en not_active Expired - Fee Related
• 2006
  • 2006-02-23 US US11/359,468 patent/US20060146312A1/en not_active Abandoned

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