WO1999018415A1 - Messvorrichtung zur messung der masse eines strömenden mediums - Google Patents
Messvorrichtung zur messung der masse eines strömenden mediums Download PDFInfo
- Publication number
- WO1999018415A1 WO1999018415A1 PCT/DE1998/002441 DE9802441W WO9918415A1 WO 1999018415 A1 WO1999018415 A1 WO 1999018415A1 DE 9802441 W DE9802441 W DE 9802441W WO 9918415 A1 WO9918415 A1 WO 9918415A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensor element
- sensor
- adhesive
- measuring device
- flow direction
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
- G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6845—Micromachined devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/76—Devices for measuring mass flow of a fluid or a fluent solid material
- G01F1/78—Direct mass flowmeters
- G01F1/80—Direct mass flowmeters operating by measuring pressure, force, momentum, or frequency of a fluid flow to which a rotational movement has been imparted
- G01F1/82—Direct mass flowmeters operating by measuring pressure, force, momentum, or frequency of a fluid flow to which a rotational movement has been imparted using a driven wheel as impeller and one or more other wheels or moving elements which are angularly restrained by a resilient member, e.g. spring member as the measuring device
Definitions
- Measuring device for measuring the mass of a flowing medium
- the invention is based on a measuring device for measuring the mass of a flowing medium according to the preamble of the main claim.
- a measuring device which comprises a plate-shaped sensor element with a dielectric membrane which is inserted into a recess in a sensor carrier.
- the sensor element is made of a semiconductor material, e.g. B. silicon and manufactured in micromechanical construction.
- the membrane consists of a dielectric material, for example silicon nitride or silicon oxide.
- There is a measuring resistor and a heating resistor on the dielectric membrane which are largely thermally insulated from a silicon frame surrounding the membrane due to the thin design of the membrane and the low thermal conductivity of the dielectric membrane.
- a cavity in the plate-shaped sensor element which extends from a bottom surface adjacent to the sensor carrier to the dielectric membrane and z. B. is produced by an etching process.
- the sensor element is fixed in the recess of the sensor carrier by means of an adhesive. Since the relatively thin membrane must be protected from excess pressure peaks, ventilation of the cavity provided below the membrane cannot be avoided. The ventilation of the recess of the measuring sensor or the back of the membrane must, however, take place in such a way that a flow of the medium on the back of the membrane is kept away, in order to avoid contributing to the measurement signal of the back flow.
- the adhesive area does not extend over the entire sensor element, but the sensor element is only glued into the recess of the sensor carrier on one side and the area of the sensor element which has the electrical membrane is located self-supporting in the recess.
- a flow channel is provided which is formed in the sensor carrier as a groove-shaped depression and extends around the sensor element.
- the recess formed in the sensor carrier is matched to the dimensions of the sensor element such that only a slight gap remains between the lateral boundary of the sensor element and the lateral boundary of the recess in the sensor carrier, which gap is only a restricted flow of the medium to the allowed cavity located below the dielectric membrane.
- DE 42 19 454 A1 shows a measuring device in which a sensor element with a dielectric membrane is inserted into the recess of a heat sink.
- the heat sink has a ventilation hole between the cooling fins to ensure ventilation of the back of the membrane.
- the measuring device according to the invention with the characterizing features of the main claim has the advantage that a relatively small tolerance in the positioning of the sensor element relative to the recess of the sensor carrier is to be maintained during manufacture. This increases the manufacturing yield and the manufacturing costs are reduced. Furthermore, the manufacturing speed can be increased. The ventilation of the back of the membrane facing away from the flowing medium is guaranteed with a sufficient opening cross section, so that destruction of the sensor element by pressure peaks is avoided.
- the adhesive seam also serves to compensate for tolerances between the sensor element and the sensor carrier and to compensate for different coefficients of thermal expansion.
- the adhesive seam extends into an area below the connection elements for connection to the connection wires, or that an additional adhesive seam is provided in this area in order to ensure a secure fixation of the sensor element in the area of the connection elements and a risk of breakage during attachment the connecting wire, e.g. B. to counteract by bonding.
- This recess of the sensor carrier can, for. B. be produced by deep embossing. The ventilation of the back of the membrane is guaranteed by the deepening of the sensor carrier.
- the sensor carrier has at least one adhesive displacement space, in which excess adhesive used to form the adhesive seam can be displaced when the sensor element is inserted into the recess of the sensor carrier. In this way, an accumulation of adhesive at unfavorable points, in particular in the cavity of the sensor element formed below the membrane, is prevented.
- an elastic silicone adhesive By using an elastic silicone adhesive, the mechanical tensioning of the sensor element is minimized even with different thermal expansion coefficients between the material of the sensor element and the material of the sensor carrier.
- FIG. 1 shows a section along the line I-I in FIG. 2 through a measuring device according to a first exemplary embodiment according to the invention
- FIG. 2 is a plan view of the measuring device of FIG. 1,
- Fig. 3 is a plan view of a measuring device according to a second embodiment of the invention and 4 shows a section along the line IV-IV in FIG. 3.
- the sensor carrier 1 shown in cross section in FIG. 1 is provided for a plate-shaped sensor element 2.
- the sensor carrier 1 and the sensor element 2 are part of a measuring device, not shown, for measuring the mass of a flowing medium, in particular the intake air mass of an internal combustion engine.
- the sensor carrier 1 serves to receive and hold the sensor element 2, which has a membrane-shaped sensor area, which is designed, for example, in the form of a dielectric membrane 4.
- the sensor element 2 or the membrane 4 can be produced by etching out a semiconductor body, for example a silicon wafer, in a so-called micromechanical construction, a cavity 5 being formed below the membrane 4.
- On the membrane 4 at least one temperature-dependent measuring resistor 6 and, for example, at least one heating resistor, not shown, is provided for measuring the mass of the flowing medium. B. are also produced by etching.
- a reference resistor can be provided on the sensor element 2 outside the membrane 4.
- the measuring resistor 6, the heating resistor and the reference resistor are electrically connected to an electronic control circuit (not shown in more detail), for example by conductor tracks and by means of wires 10 applied to connection elements 28 designed as bond pads.
- the electronic control circuit is used in a known manner to supply current or voltage to the resistors on the sensor element 2 and to evaluate the electrical signals emitted by the resistors.
- the control circuit can, for. B. in a housing or outside the housing of the measuring device.
- the dielectric membrane 4 consists, for example, of silicon nitride and / or silicon oxide.
- the heating resistor can be in the form of an electrical resistance layer which heats up when current flows and heats the membrane 4 to a temperature above the temperature of the medium to be measured.
- the heating resistor can consist, for example, of a metal or of appropriately doped silicon.
- the measuring resistor and the reference resistor can consist, for example, of an electrical resistance layer, the conductivity of which changes as a function of the temperature. Suitable materials for these resistance layers are metals or appropriately doped silicon.
- the sensor element 2 has a plate-shaped, for example rectangular shape and is oriented with its surface 8 facing the flowing medium approximately parallel to the medium flowing into the drawing plane of FIG.
- the direction of flow 9 of the medium is indicated in FIG. 2 by corresponding arrows and runs there from top to bottom.
- the heating resistor applied to the membrane 4 heats the membrane 4 to a temperature which is higher than the temperature of the medium flowing past.
- the amount of heat dissipated by the flowing medium essentially due to convection of the heating resistor depends on the mass of the flowing medium, so that the mass of the flowing medium can be determined by measuring the temperature of the membrane 4.
- the membrane temperature can be measured by means of the measuring resistor 6 or by measuring the resistance of the heating resistor.
- the reference resistor is used to compensate for the influence of the temperature of the flowing medium.
- the sensor carrier 1 is preferably made of metal and can be produced by folding a thin metal strip, for which stamping, bending, folding, deep-drawing and embossing processes are suitable. In the final state of the bent metal strip, approximately two elements 14 and 15 of equal size lie against one another.
- the non-curved element 14 surrounding the sensor element 2 is referred to as a frame element 14 and the element 15 bent below it is referred to as a holding element 15.
- the holding element 15 covers in the finished bent state of approximately 180 degrees an opening 16 of the non-bent frame element 14 in order to limit a recess 17 for receiving the sensor element 2 together with the frame element 14.
- the frame element 14 or the recess 17 has a cross section which corresponds approximately to the rectangular shape of the sensor element 2, for example.
- the sensor element 2 is accommodated in the recess 17 with its surface 8 approximately flush with a surface 18 of the frame element 14.
- the holding element 15 Before the metal strip is folded, the holding element 15 can be deformed by means of a tool acting on the outer surface 22 of the holding element 15, for example an embossing tool, in such a way that two elevations 20, 21 are formed in cross section in the exemplary embodiment.
- the elevations 20, 21 are each delimited in the cross section shown in FIG. 1 by adhesive displacement spaces 23, 24 and 25 to be described in more detail.
- the sensor carrier 1 has a flattened portion 49 on its end face facing the flow direction 9 in order to improve the inflow behavior and to counteract the deposition of dirt particles.
- the plate-shaped sensor element 2 is glued into the recess 17 of the sensor carrier 1 by means of an adhesive applied along adhesive seams 26, 27 in the form of beads of adhesive. As can be seen better from FIG.
- a first adhesive seam 26 is cruciform and is used for gluing the sensor element 2 onto the plateau-shaped elevation 20.
- Pads formed connecting elements 28 are provided, which are used for the electrical connection of conductor tracks of the sensor element 2 with connecting lines 10.
- the first adhesive seam 26 serves to fix the sensor element 2 in the area of the connection elements 28 in order to achieve a secure bond connection.
- the second adhesive seam 27 is, as can be seen from FIG. 2, U-shaped in the embodiment shown in Figures 1 and 2.
- the second adhesive seam 27 is used to glue the sensor element 2 in the region of the plateau-shaped elevation 21.
- the two adhesive seams 26 and 27 are each formed between the bottom surface 29 of the sensor element 2 and the surface 31 or 30 of the elevations 20 and 21 of the holding element 15.
- the second adhesive seam 27 is designed such that it extends between the bottom surface 29 of the sensor element 2 and the sensor carrier 1 around the cavity 5 and is only opened by a cutout 40 on the side facing away from the flow direction 9.
- the adhesive seam is U-shaped and has a section 41 facing the flow direction 9 and two sections 42 and 45 running in the flow direction 9.
- the sections 42 and 45 extending in the flow direction 9 form two legs of the second U-shaped adhesive seam 27.
- the cutout 40 in the exemplary embodiment in FIGS. 1 and 2 extends between the two sections 42 and 45 running in the flow direction 9, ie the adhesive seam 27 is opened over the entire area facing away from flow direction 9.
- the cutout 40 serves to vent the cavity 5 of the sensor element 2.
- the opening cross section of the recess 40 defines a throttle point.
- This opening cross-section is expediently determined such that there is a sufficiently rapid pressure compensation, preventing destruction of the membrane 4, between the front of the membrane 4 facing the flowing medium and the back 44 of the membrane 4 facing away from the flowing medium and facing the cavity 5.
- the opening cross section of the cutout 40 is to be dimensioned so small that a flow of the medium in the cavity 5 is prevented or at least sufficiently suppressed.
- the opening cross section of the cutout 40 is determined on the one hand by the width b of the cutout 40 shown in FIG. 2 and on the other hand by the thickness d of the adhesive seam 27 shown in FIG. 1.
- the thickness of the adhesive seam d can, for. B.
- spacers 43a - 43i can be adjusted by spacers 43a - 43i.
- the spacers 43a-43i can e.g. B. by an embossing process using a z. B. needle-shaped embossing tool which engages the holding element 15 on the outer surface 22 are formed.
- the adhesive seams 26 and 27 can be applied as fine beads of adhesive using a conventional metering method.
- a suitable adhesive is preferably an adhesive that remains elastic after curing, in particular an elastic silicone adhesive. Mechanical stresses between the sensor element 2 and the sensor carrier 1 are thereby minimized. Mechanical stresses occur in particular as a result of the different thermal expansion coefficients of the sensor carrier 1, which is preferably made of a metal sheet, and of the sensor element 2, which is preferably made of a semiconductor material.
- the adhesive displacement spaces 23, 24 and 25 already described are on the side facing the flow direction 9 through further adhesive displacement spaces 46 and 47 connected.
- the adhesive displacement spaces 23 and 24 are further connected by a further adhesive displacement space 48 facing away from the flow direction 9.
- excess adhesive applied can escape into the adhesive displacement spaces 23, 24, 25, 46, 47, 48, as is shown schematically in FIG. 1. This prevents in particular that when the sensor element 2 and the sensor carrier 1 are joined together, adhesive is pressed into the cavity 5 or even penetrates as far as the rear side 44 of the membrane 4.
- the adhesive seam 27 is to be placed in such a way that penetration of the adhesive into the cavity 5 is reliably prevented, since this can considerably impair the functionality of the measuring device according to the invention.
- FIG. 3 and 4 show a second exemplary embodiment of the measuring device according to the invention.
- 3 shows a plan view of the measuring device according to the invention
- FIG. 4 shows a section along the line IV-IV in FIG. 3.
- Elements already described are labeled with the same reference numerals, so that a repetitive description is not necessary.
- the one-piece adhesive seam 60 extends in a G-shape around the cavity 5 of the sensor element 2.
- the adhesive seam 60 has a section 61 facing the flow direction 9, two sections 62 and 63 running in the flow direction 9, and a section 64 facing away from the flow direction 9.
- the section 64 facing away from the flow direction does not completely connect the sections 62 and 63 running in the flow direction 9, so that a cutout 40 results on the side facing away from the flow direction 9.
- the cutout 40 extends from a first section 62 running in the flow direction 9 to a free end 65 of the section 64 of the adhesive seam 60 facing away from the flow direction 9.
- the recess 40 interrupts the section 64 facing away from the flow direction 9 at another point.
- a plurality of such cutouts can also be provided in section 64 facing away from flow direction 9.
- the second section 63 extending in the direction of flow is widened so that it extends into the area below the connection elements 28 designed as bond pads, so that the sensor element in the area of the connection elements 28 are relined with adhesive. This ensures a high breaking strength of the sensor element 2 during the application of the bond connections. Further the sensor element 2 is particularly well locked in the area of the connecting elements 28 by the adhesive seam 60, so that even when using an elastic adhesive, for. B. a silicone adhesive, a good bond connection can be realized.
- the adhesive seam 60 can extend into the edge region of the recess 17 formed in the frame element 14.
- a recess 66 is formed in the holding element 15 of the sensor carrier 1. B. introduced by means of a deep embossing process.
- the recess 66 serves as an adhesive displacement space and receives excess adhesive.
- the depression 66 also serves to vent the cavity 5 of the sensor element 2.
- the depression 66 is essentially L-shaped and extends through the cutout 40 of the adhesive seam 60 to an extended section 67.
- the extended section 67 is therefore not covered by the sensor element 2 and is with the flowing medium to be measured for pressure equalization z. B. connected via holes, not shown, in the holding element 15.
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Volume Flow (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52074199A JP3784420B2 (ja) | 1997-10-01 | 1998-08-21 | 流れ媒体の質量を測定するための測定装置 |
US09/319,149 US6318170B1 (en) | 1997-10-01 | 1998-08-21 | Measurement device for measuring the mass of a flowing medium |
EP98951183A EP0941456A1 (de) | 1997-10-01 | 1998-08-21 | Messvorrichtung zur messung der masse eines strömenden mediums |
KR1019997004781A KR100579429B1 (ko) | 1997-10-01 | 1998-08-21 | 유동 매질의 질량측정장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19743409A DE19743409A1 (de) | 1997-10-01 | 1997-10-01 | Meßvorrichtung zur Messung der Masse eines strömenden Mediums |
DE19743409.6 | 1997-10-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1999018415A1 true WO1999018415A1 (de) | 1999-04-15 |
Family
ID=7844293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1998/002441 WO1999018415A1 (de) | 1997-10-01 | 1998-08-21 | Messvorrichtung zur messung der masse eines strömenden mediums |
Country Status (8)
Country | Link |
---|---|
US (1) | US6318170B1 (de) |
EP (1) | EP0941456A1 (de) |
JP (1) | JP3784420B2 (de) |
KR (1) | KR100579429B1 (de) |
CN (1) | CN1109879C (de) |
DE (1) | DE19743409A1 (de) |
RU (1) | RU2196965C2 (de) |
WO (1) | WO1999018415A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001249041A (ja) * | 2000-03-06 | 2001-09-14 | Unisia Jecs Corp | 流量計測装置 |
WO2002008699A1 (de) * | 2000-07-21 | 2002-01-31 | Robert Bosch Gmbh | Luftdicht verschlossener sensorträger |
KR20020033492A (ko) * | 2000-10-31 | 2002-05-07 | 다니구찌 이찌로오, 기타오카 다카시 | 감열식 유량센서 |
EP1255642A1 (de) * | 2000-02-14 | 2002-11-13 | Redwood Microsystems, Inc. | Verfahren zum befestigen einer mikromeschanischen vorrichtung an einem verteilkanal und danach erhaltene flüssigkeitsverteileinrichtung |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3514666B2 (ja) * | 1999-06-30 | 2004-03-31 | 株式会社日立製作所 | 熱式空気流量センサ |
JP3555017B2 (ja) * | 1999-09-22 | 2004-08-18 | 三菱電機株式会社 | 感熱式流量センサ |
DE19952055A1 (de) * | 1999-10-28 | 2001-05-17 | Bosch Gmbh Robert | Massenflußsensor mit verbesserter Membranstabilität |
JP2001349759A (ja) * | 2000-06-08 | 2001-12-21 | Mitsubishi Electric Corp | 熱式流量センサ |
DE10036290A1 (de) | 2000-07-26 | 2002-02-07 | Bosch Gmbh Robert | Vorrichtung zur Bestimmung zumindest eines Parameters eines strömenden Mediums |
DE10210734B4 (de) * | 2002-03-12 | 2004-01-29 | J. Eberspächer GmbH & Co. KG | Wärmetauscheranordnung, insbesondere für ein Fahrzeugheizgerät |
JP2004028631A (ja) * | 2002-06-21 | 2004-01-29 | Mitsubishi Electric Corp | 流量センサ |
DE10343793A1 (de) * | 2003-09-22 | 2005-04-14 | Robert Bosch Gmbh | Heissfilmluftmassensensor mit Kontaktierung mittels anisotropem Leitkleber |
JP4428023B2 (ja) * | 2003-11-04 | 2010-03-10 | 株式会社デンソー | 流量測定装置 |
JP4609019B2 (ja) * | 2004-09-24 | 2011-01-12 | 株式会社デンソー | 熱式流量センサ及びその製造方法 |
DE102005016449A1 (de) * | 2005-04-11 | 2006-10-12 | Robert Bosch Gmbh | Beheizter Heißfilmluftmassenmesser |
JP2007024589A (ja) * | 2005-07-13 | 2007-02-01 | Hitachi Ltd | 気体流量計測装置 |
JP4317556B2 (ja) * | 2006-07-21 | 2009-08-19 | 株式会社日立製作所 | 熱式流量センサ |
JP2008058131A (ja) * | 2006-08-31 | 2008-03-13 | Hitachi Ltd | 熱式ガス流量計 |
JP5243348B2 (ja) * | 2009-06-12 | 2013-07-24 | 三菱電機株式会社 | 流量検出装置 |
JP5256264B2 (ja) | 2010-09-03 | 2013-08-07 | 日立オートモティブシステムズ株式会社 | 熱式空気流量センサ |
JP5197714B2 (ja) * | 2010-10-29 | 2013-05-15 | 三菱電機株式会社 | 流量検出装置 |
DE102011076170A1 (de) * | 2011-05-20 | 2012-11-22 | Robert Bosch Gmbh | Vorrichtung zur Erfassung mindestens einer Eigenschaft eines strömenden fluiden Mediums |
DE102012220098A1 (de) * | 2012-11-05 | 2014-05-08 | Robert Bosch Gmbh | Sensorvorrichtung zur Erfassung mindestens einer Strömungseigenschaft eines fluiden Mediums |
JP6361523B2 (ja) * | 2014-04-01 | 2018-07-25 | 株式会社デンソー | 流量センサの製造方法 |
CN107407585A (zh) * | 2015-03-05 | 2017-11-28 | 日立汽车系统株式会社 | 空气流量检测装置 |
DE102021203219B3 (de) | 2021-03-30 | 2022-06-23 | Vitesco Technologies GmbH | Luftmassensensor und Kraftfahrzeug |
WO2023217637A1 (en) * | 2022-05-09 | 2023-11-16 | X-Celeprint Limited | High-precision printed structures and methods of making |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4219454A1 (de) * | 1992-06-13 | 1993-12-16 | Bosch Gmbh Robert | Massenflußsensor |
DE19524634A1 (de) * | 1995-07-06 | 1997-01-09 | Bosch Gmbh Robert | Vorrichtung zur Messung der Masse eines strömenden Mediums |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4129042A (en) * | 1977-11-18 | 1978-12-12 | Signetics Corporation | Semiconductor transducer packaged assembly |
US4220852A (en) * | 1978-09-13 | 1980-09-02 | Westinghouse Electric Corp. | Radiation dosimeter assembly |
DE4426102C2 (de) * | 1994-07-22 | 1997-07-10 | Bosch Gmbh Robert | Sensorträger für eine Vorrichtung zur Messung der Masse eines strömenden Mediums und Verfahren zum Herstellen eines Sensorträgers |
DE4443767A1 (de) * | 1994-12-08 | 1996-06-13 | Giesecke & Devrient Gmbh | Elektronisches Modul und Datenträger mit elektrischem Modul |
-
1997
- 1997-10-01 DE DE19743409A patent/DE19743409A1/de not_active Withdrawn
-
1998
- 1998-08-21 EP EP98951183A patent/EP0941456A1/de not_active Withdrawn
- 1998-08-21 US US09/319,149 patent/US6318170B1/en not_active Expired - Fee Related
- 1998-08-21 WO PCT/DE1998/002441 patent/WO1999018415A1/de not_active Application Discontinuation
- 1998-08-21 CN CN98801457A patent/CN1109879C/zh not_active Expired - Fee Related
- 1998-08-21 KR KR1019997004781A patent/KR100579429B1/ko not_active IP Right Cessation
- 1998-08-21 RU RU99114597/28A patent/RU2196965C2/ru not_active IP Right Cessation
- 1998-08-21 JP JP52074199A patent/JP3784420B2/ja not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4219454A1 (de) * | 1992-06-13 | 1993-12-16 | Bosch Gmbh Robert | Massenflußsensor |
DE19524634A1 (de) * | 1995-07-06 | 1997-01-09 | Bosch Gmbh Robert | Vorrichtung zur Messung der Masse eines strömenden Mediums |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1255642A1 (de) * | 2000-02-14 | 2002-11-13 | Redwood Microsystems, Inc. | Verfahren zum befestigen einer mikromeschanischen vorrichtung an einem verteilkanal und danach erhaltene flüssigkeitsverteileinrichtung |
EP1255642A4 (de) * | 2000-02-14 | 2003-03-19 | Redwood Microsystems Inc | Verfahren zum befestigen einer mikromeschanischen vorrichtung an einem verteilkanal und danach erhaltene flüssigkeitsverteileinrichtung |
JP2001249041A (ja) * | 2000-03-06 | 2001-09-14 | Unisia Jecs Corp | 流量計測装置 |
WO2002008699A1 (de) * | 2000-07-21 | 2002-01-31 | Robert Bosch Gmbh | Luftdicht verschlossener sensorträger |
KR20020033492A (ko) * | 2000-10-31 | 2002-05-07 | 다니구찌 이찌로오, 기타오카 다카시 | 감열식 유량센서 |
Also Published As
Publication number | Publication date |
---|---|
CN1109879C (zh) | 2003-05-28 |
KR100579429B1 (ko) | 2006-05-15 |
RU2196965C2 (ru) | 2003-01-20 |
CN1241256A (zh) | 2000-01-12 |
DE19743409A1 (de) | 1999-04-08 |
EP0941456A1 (de) | 1999-09-15 |
JP2001508879A (ja) | 2001-07-03 |
JP3784420B2 (ja) | 2006-06-14 |
US6318170B1 (en) | 2001-11-20 |
KR20000069206A (ko) | 2000-11-25 |
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