WO1998009377A1 - Filtre piezo-electrique monte en surface - Google Patents
Filtre piezo-electrique monte en surface Download PDFInfo
- Publication number
- WO1998009377A1 WO1998009377A1 PCT/JP1997/002977 JP9702977W WO9809377A1 WO 1998009377 A1 WO1998009377 A1 WO 1998009377A1 JP 9702977 W JP9702977 W JP 9702977W WO 9809377 A1 WO9809377 A1 WO 9809377A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- shield
- gap
- output
- input
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims description 11
- 238000005192 partition Methods 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 241001122767 Theaceae Species 0.000 claims 1
- 230000008878 coupling Effects 0.000 abstract description 13
- 238000010168 coupling process Methods 0.000 abstract description 13
- 238000005859 coupling reaction Methods 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 238000007667 floating Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 210000003323 beak Anatomy 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/56—Monolithic crystal filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Definitions
- the wood invention is a surface-mounted pressure filter.
- a film-shaped shield electrode with a uniform ground potential is formed on the inner surface of the package body consisting of a meta-mount type insulator.
- the piezoelectric filter element is supported on a package tree with the input / output vibrating electrode pair facing the flat film-shaped shield electrode.
- Countermeasures have been proposed to dispose them facing each other with a gap (for example, Japanese Patent Application Laid-Open No. 6-29776-3 ⁇ 4, Japanese Patent Application Laid-Open No. 6-855999-), US 9 29 A).
- the measures described above reduce the gap between the shield electrode provided on the package body and the human output vibrating electrode pair
- the floating capacitance li e is applied to the human output vibrating electrode pair 7 1, 7 2 and the shield electrode 7 3! Iij. , And, ⁇ ⁇ S S tends to decrease next.
- the present invention has been made in view of such circumstances, and aims to provide a ⁇ mounted type ⁇ ? G filter that has a structure that can increase the guaranteed attenuation compared to conventional measures. I have. Disclosure of the invention
- a human output vibration pair is formed by opening a predetermined gap on one side of the conductive substrate, and a pair of human output vibrations is formed on the opposite surface thereof.
- a multi-mode piezoelectric filter having common electrodes formed so as to face each other has a piezoelectric body supported at a predetermined position on a peripheral portion of the piezoelectric substrate by a metaphysical type knocking body made of an insulating material.
- the filter element is supported by the package body with its input / output vibrating electrode pair facing the package body side, and the human output is required to face the input / output vibrating electrode of the package body.
- the shield 3 ⁇ 4pole of the earth potential along the gap of j is formed with a predetermined gap opened to this ⁇ ; conductive substrate. Attached here In the, the shield 3 ⁇ 4 pole width, j- law, width dimension of the Giyappu Preferably, it should be within 4 times the law.
- the shield electrode may be formed of a conductive material film formed at the tip of a ridge having a metamorphic shape of 30 or may be formed of a wire. Les ,.
- the input / output vibration of this package body On the surface facing the pair, apart from the shield electrode that mediates along the gap, on the I side of the mountain, two shield electrodes are formed that face the human-powered vibration electrode and the 1-force-force vibration electrode, respectively. In this case, it is necessary that the two shield electrodes have a larger gap between the shield electrode and the compressible plate than the shield electrode along the gap.
- each pit of each of the human output vibration electrode pairs is formed on each pit.
- a predetermined part of the periphery of the piezoelectric filter element is attached to the package body (supports the shield part along the gear on the upper surface of the partition wall of each pit) at the periphery of these bits.
- shield electrodes facing the input vibration electrode and the output vibration electrode, respectively, are formed on the bottom surface of each pit can be adopted.
- a bit is formed in a package body, and a predetermined portion of a peripheral portion of the piezoelectric filter element is formed in a state where an input / output vibrating electrode pair faces the pit.
- the package is supported by the package body, and a shield electrode extending along the gap is formed on the upper part of the pit facing the gap between the input / output vibrating electrode pair. It is also possible to adopt a configuration in which a shield electrode facing the input vibration pole and the 111-force vibration is formed in a wall forming the bottom of the main body.
- a shield electrode of earth potential provided along a gap between the human output vibrating electrode and the input / output vibrating electrode is formed.
- the resulting lines of electric force are cut off, and the electromagnetic coupling between these input vibration electrodes and the I river is prevented.As a result, the generation of leakage current that reduces the guaranteed attenuation ift is suppressed.
- the shield electrode does not entirely oppose the human output vibration electrode pair, but is formed along the gap between these input and output vibration electrode pairs. Even if they are as close to each other as possible, there is no delay between the input and output vibrating electrode pairs, and the stopping power of the above-described magnetic coupling does not deteriorate.
- the shield ilfe may be formed of a conductive material film formed at the tip of a ridge having a triangular cross section, or may be formed of a wire. In the same way as with ⁇ , it is possible to prevent electromagnetic coupling between human output and the working electrode pair,
- the shield electrode formed along the gap is not effective in shielding electromagnetic interference from the outside to the output power ill pole pair, human shield and output vibration electrode are required for electromagnetic shielding to the outside. It is desirable to provide a shield electrode different from the above shield electrode in opposition to each of the above. In this case, the shield electrode for electromagnetic shielding to the outside is not for the electromagnetic shielding of the input / output vibration electrode pair liil, so the shield electrode for electromagnetic shielding to the outside and the human output vibration electrode pair By increasing the gap between and to a certain degree or more, the floating volume ⁇ in this gap can be suppressed.
- the tip of the protrusion constitutes a shield tongue that qualitatively blocks the electromagnetic coupling between the input and output vibrations and it poles, and the conductive material film remains.
- a shield 3 ⁇ 4 pole for ⁇ shielding against external brief description of the n drawings exhibits the same work-Ko ⁇ the above ⁇
- FIG. 2 is an exploded perspective view of the embodiment of the present invention
- FIG. 2 is a cut-away view showing FIG. 1, excluding 3 ⁇ 4 ⁇ 2 2 in the assembled state
- FIG. 2 is a schematic enlarged view of a part of FIG.
- (4) is a graph showing the filter characteristics when the shield electrode 30 is removed, and (B) is a shield electrode. 7 is a graph showing filter characteristics in a state where 30 is provided.
- FIG. 5 is a graph showing a change in the guaranteed attenuation when only the width W of the shield electrode 30 is changed in the embodiment of the present invention.
- FIG. 6 is a sectional view of a main part of another embodiment of the present invention.
- FIG. 7 is a perspective view of a package body according to still another embodiment of the present invention.
- FIG. 8 is an explanatory view of still another embodiment of the present invention, and is a cross-sectional view of a package body taken along a gap between an input / output vibrating electrode.
- FIG. 9 is a cross-sectional view of a main part of still another embodiment of the present invention.
- Figure io shows the output of a conventional pressure range filter.
- a shield electrode is formed on the entire surface facing the S-pole pair, and in these questions i]
- the stray capacitance generated when the gap is approached is explained as 1-1.
- 1 is an exploded perspective view of the embodiment of the present invention
- 2 is a cut-away riii diagram showing the assembled state of the embodiment with the lid 2 removed.
- the package 2 is composed of a package body 21 made of an insulating material such as ceramic, and a package tree 2 1.
- the body of the package is formed by a metal cover : 22 and is covered by a cover (not shown) on the bottom of the package.
- the piezoelectric filter end-1 has its input electrode 11 and output electrode 12 facing the bottom of bits 41 and 42, respectively.
- J l-:? g ⁇ 'l- 3 ⁇ 43 ⁇ 4 1 ( ) who is supported by the package body 21 near the periphery of the pits 4 1 and 4 at a part of the three corners!
- the J-poles 11 and 12 and the common electrode 13 are drawn out to three corner portions of the piezoelectric substrate 10 by the corresponding lead-out electrodes.
- three connection pads 51 are formed near the edges of the pits 41 and 2 at positions corresponding to the above-mentioned corners.
- connection pads 51 are connected to the package body.
- 2 Through 1 is connected to an external connection pad (not shown) for surface mounting formed on the back ⁇ & ⁇ .
- the shield electrode 30 is formed, which is the shield electrode 30 of the pits 4 1, 4 2.
- the shield electrode 30 is connected to the input of the piezoelectric filter element 1.
- the output vibrating electrode pair will be along the gap G of 1 1 and 12 m.
- shields 7 poles 1 and 32 are formed at the bottom of each bit 41 and 42, respectively.
- the shield electrodes 30, 31, and i 2 are each metallized by screen printing W (tungsten) metallization, for example, at the corresponding cylinder of the ceramic forming the package body 21, and Au is resolved there. It is formed by sticking.
- W tungsten
- Each of these shield electrodes 30, 31, 32 is connected to the package book (through a through-hole through the book 21, grounding formed on the back side of the package tree rest 21). They are connected to the connection pads 30 u, 31 a, and 32 a, respectively, and set to the ground potential, respectively.
- the shield electrode 30 on 43 is 1 () m, and the shield range 31 and 2 on the bottom of the pits 41 and 42 is about 20 times that of T ' ⁇ 0.2 mm.
- the width of the partition 4 between the pits 41 and 42 is 0.1 mm, and the shield electrode 30 is formed over the entire width of the partition -43.
- the width W is 0.1 mm. ⁇ 3 ⁇ 4
- the width W g of the gap G between the input and output vibrating electrode pairs 11 and 12 of the filter element 1 is 0.11 mm. According to the following embodiment, human output j? e; gap of pole pairs 1 1, ⁇ 2 liij
- the filter characteristics as shown in Fig. 4 ( ⁇ ) were improved when only the shield electrode '0' was removed from the above embodiment, but the shield? 1; pole 3 ()
- the frequency of the cores is set to 9 ().
- ffl; is set to ⁇
- g-pole Approximately 55 d13 without 30 was added. This increased to about 9 () dB.
- the center frequency F of the filter is 90 MHz, and the preservation attenuation is the attenuation at a frequency of 1 Hz.
- the gap T between the shield electrode 30 and the pressure-sensitive substrate 10 becomes smaller as the narrower, the more the electromagnetic coupling between the input and output vibrating electrode pairs 11 and 12 stops.
- the thickness be about 1 () ⁇ m from the viewpoint of ease of production and yield.
- this gap T depends on the width W of the shield electrode 0, but by setting it to about 40 ⁇ m or less, the electromagnetic coupling of the human output vibrating electrode pair 11 and 12 ⁇ is prevented. lh, it is known that a good guaranteed damping property can be obtained,
- 7 ⁇ of the pits 41 and 4 in the above embodiment mainly serves as a magnetic pole between the piezoelectric filter element ⁇ and the outside.
- I / O oscillations Pairs 1 to 1 2 2 1 Not much to prevent magnetic coupling. Therefore, for these shield poles: 3 1, 3 2, the input and output vibrations ⁇ ⁇ undesired fi! L with pole pairs 1 1, 1 2-
- the gap T 'between the plate 10 and the gap T' should be sufficiently larger than the gap T between the shield electrode 30 and the piezoelectric plate 10; It is preferable that the length of the package body 21 is 0.1 mm or more. The structure and manufacturing method of the package body 21 in the embodiment of the present invention are described below.
- each layer can be pressed into the required shape at the required stage, laminated, and then sintered.
- each shield electrode 3 0, 1, 3 2, u like this similarly to the appropriate site in the green sheet one Bok stage it is possible to use a method when was the electrolysis plated after metallization
- the shield electrodes 31 and 32 formed on the bottom of the pits 41 and 42 are At the time of ⁇ , ', it is easy for the shield electrode on the bulkhead 43 to be more flexible than the compressible Approaching to about 10 ⁇ m
- the shield ig pole for preventing the magnetic coupling of I to the outside does not need to be particularly provided inside the package body 21, and as shown in FIG.
- a shield electrode 91 for blocking coupling 4 may be formed inside the body forming the bottom of the package tree 21.
- the package wooden body 21 is composed of a portion consisting of two layers 21b and 21a from the bottom ⁇ ⁇ ⁇ of the pit 45, and a portion 21a c It has a layered structure, and shields the outside for magnetic shielding; 1 is a human-powered vibration electrode 11 and output vibration? At the position f corresponding to the 8 poles 12, it is slightly scraped between the scraps 2 1 and 1 a.
- the shield electrode 90 for shielding the magnetic field at the human-powered working electrode 11 and the output working electrode 12 is positioned along the gap between the input and output vibration pairs 11 and 1 at 45 hours. It is formed.
- the shield ilite 9 () is connected to the shield ⁇ 3 ⁇ 4 9 1 via a through hole 9 2 intercepting; 2 1b, and the shield power 9 1 It is connected to the ground contact pad 90a formed on the back side of the package body 21 through the hole 93, and the shield electrodes 90 and 91 are set to the ground level.
- the manufacturing method of the present embodiment is characterized in that, at the stage of ceramic grinding, a force is applied to a shape required for each expansion, and a manufacturing method of sintering after stacking is adopted.
- the shield electrodes 90 and 91 both use printing technology and can be used in the process of printing, so high-precision pattern jungling is performed. Can be useful
- the triangular ridges 44 are formed along the gap G of the M moving electrode pairs 1 1 and 1 2 and the human output vibrating electrode pairs 1 1 and 1 2 including the ridges 4 4 are formed.
- a conductive material film 34 having a ground potential is uniformly formed on the facing surface. In such a structure, the conductive forest material film 34 is very close to the pressure-sensitive substrate 1 () only at the tip of the ridge 44, that is, the portion along the gap G, and the human vibration electrode 1
- the tip of the ridge 44 constitutes the shield electrode 30 in the embodiment in which the ridge 44 is abruptly formed.
- the remaining portions constitute the shield electrodes 31 and 32 in the above-mentioned protruding form, and the same effect can be obtained.
- the package body ' ⁇ 1 shows a perspective view of the package body ' ⁇ 1 in which the shield electrode 3 () is formed by wire bonding.
- the package body ' ⁇ 1 shows a perspective view of the package body ' ⁇ 1 in which the shield electrode 3 () is formed by wire bonding.
- the structure of 21 and the shield electrodes 31 and 2 are exactly the same as those of the above-described embodiment, and the wires 35 are arranged along the upper surface of the two pits 41 and 42 [ ⁇ ]. Then, both ends of the wire 35 are bonded to the package body 21 with a conductive material 36 such as solder, and the wire 35 is connected to the package body 21 through a through hole formed in, for example, a bonding portion. It is connected to the ground connection pad (not to be connected) formed on the other side. Also in this example, it is possible for the wire 35 to be positioned along the gap between the human output vibration and the pole pair and to place the wire 35 very close to the piezoelectric ffi plate. The same effects as in the embodiment can be obtained.
- a wire When a wire is used as a shield electrode along the gear G between the input and output vibrating electrodes, as shown in Fig. 7, the wire must be along two partitions 41 Can also be used. That is, as shown in FIG. 8, a single pit 45 is formed on the package body 21 and the peripheral portion thereof is formed as shown in a sectional view of the package body 21 cut along the gap G in FIG. And pressure!
- the meta-mounting type ⁇ filter of the present invention is composed of a pair of 3 ⁇ 4 ,: Since the output range can reduce the ability to stop the magnetic coupling between the human output vibration electrode pair and the good guaranteed attenuation characteristics, it is particularly necessary to reduce the size. For example? ⁇ : It is particularly effective for intermediaries built into speakers, etc.,
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP97935892A EP0859465B1 (en) | 1996-08-30 | 1997-08-25 | Surface mounting piezoelectric filter |
US09/043,925 US5952898A (en) | 1996-08-30 | 1997-08-25 | Surface mounting piezoelectric filter with a shield electrode on a package partition wall |
KR1019980703202A KR100294104B1 (ko) | 1996-08-30 | 1997-08-25 | 표면실장형압전필터 |
DE69725552T DE69725552T2 (de) | 1996-08-30 | 1997-08-25 | Oberflächenmontiertes piezoelektrisches filter |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8/230581 | 1996-08-30 | ||
JP23058196A JP3239769B2 (ja) | 1996-08-30 | 1996-08-30 | 表面実装型圧電フィルタ |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998009377A1 true WO1998009377A1 (fr) | 1998-03-05 |
Family
ID=16909991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1997/002977 WO1998009377A1 (fr) | 1996-08-30 | 1997-08-25 | Filtre piezo-electrique monte en surface |
Country Status (9)
Country | Link |
---|---|
US (1) | US5952898A (ja) |
EP (1) | EP0859465B1 (ja) |
JP (1) | JP3239769B2 (ja) |
KR (1) | KR100294104B1 (ja) |
CN (1) | CN1151603C (ja) |
DE (1) | DE69725552T2 (ja) |
ID (1) | ID18132A (ja) |
TW (1) | TW445708B (ja) |
WO (1) | WO1998009377A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6459048B1 (en) * | 1999-06-25 | 2002-10-01 | Murata Manufacturing Co., Ltd. | Surface-mount electronic component |
JP2001177044A (ja) * | 1999-12-15 | 2001-06-29 | Murata Mfg Co Ltd | 電子部品モジュール及び圧電発振器 |
US6759688B2 (en) * | 2001-11-21 | 2004-07-06 | Microsemi Microwave Products, Inc. | Monolithic surface mount optoelectronic device and method for fabricating the device |
US7385463B2 (en) * | 2003-12-24 | 2008-06-10 | Kyocera Corporation | Surface acoustic wave device and electronic circuit device |
US8125788B2 (en) * | 2006-03-29 | 2012-02-28 | Kyocera Corporation | Circuit module and radio communications equipment, and method for manufacturing circuit module |
JP5727124B2 (ja) * | 2008-08-28 | 2015-06-03 | 日本電波工業株式会社 | 圧電振動子 |
CN101800525A (zh) * | 2010-03-05 | 2010-08-11 | 中国电子科技集团公司第二十六研究所 | 小型化多级级联单片压电滤波器 |
JP7205497B2 (ja) * | 2018-02-02 | 2023-01-17 | 株式会社大真空 | 圧電フィルタ |
KR102217603B1 (ko) * | 2018-11-30 | 2021-02-19 | 한국재료연구원 | 단속 미세조직 층이 형성된 전자부품 임베디드 금속 부품 및 이의 제조방법 |
KR20210022237A (ko) | 2019-08-19 | 2021-03-03 | 대주전자재료 주식회사 | 이차전지 및 이의 제조방법 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6365707A (ja) * | 1986-09-05 | 1988-03-24 | Toyo Commun Equip Co Ltd | 圧電フイルタの封止 |
JPH0256361U (ja) * | 1988-10-19 | 1990-04-24 | ||
JPH0279574U (ja) * | 1988-12-09 | 1990-06-19 | ||
JPH02261211A (ja) * | 1989-03-31 | 1990-10-24 | Nippon Dempa Kogyo Co Ltd | 多重モード型水晶振動子 |
JPH0386623U (ja) * | 1989-12-25 | 1991-09-02 | ||
JPH0685599A (ja) * | 1992-08-31 | 1994-03-25 | Nippon Dempa Kogyo Co Ltd | 多重モード水晶振動子 |
JPH0779127A (ja) * | 1991-06-27 | 1995-03-20 | Nippon Dempa Kogyo Co Ltd | 多重モード型圧電振動子 |
JPH0897668A (ja) * | 1994-09-22 | 1996-04-12 | Murata Mfg Co Ltd | 負荷容量内蔵型圧電共振子およびその製造方法 |
Family Cites Families (8)
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JPS5923910A (ja) * | 1982-07-30 | 1984-02-07 | Toyo Commun Equip Co Ltd | 多段接続モノリシツク・フイルタ |
JP2718706B2 (ja) * | 1988-08-20 | 1998-02-25 | 株式会社リコー | 画像形成装置 |
JPH0279574A (ja) * | 1988-09-16 | 1990-03-20 | Atein Kaihatsu Kk | 映像信号伝送方式 |
JPH0298207A (ja) * | 1988-10-05 | 1990-04-10 | Nippon Dempa Kogyo Co Ltd | 多重モード型圧電振動子 |
JPH02119406A (ja) * | 1988-10-28 | 1990-05-07 | Nippon Dempa Kogyo Co Ltd | 多重モード型圧電振動子 |
JPH0386623A (ja) * | 1989-08-31 | 1991-04-11 | Tekunoba:Kk | スライドルーフ装置 |
JPH066164A (ja) * | 1992-06-18 | 1994-01-14 | Murata Mfg Co Ltd | チップ形電子部品およびその製造方法 |
US5382929A (en) * | 1992-07-31 | 1995-01-17 | Ndk, Nihon Dempa Kogyo Company, Ltd. | Monolithic crystal filter |
-
1996
- 1996-08-30 JP JP23058196A patent/JP3239769B2/ja not_active Expired - Lifetime
-
1997
- 1997-08-23 TW TW086112150A patent/TW445708B/zh not_active IP Right Cessation
- 1997-08-25 KR KR1019980703202A patent/KR100294104B1/ko not_active IP Right Cessation
- 1997-08-25 DE DE69725552T patent/DE69725552T2/de not_active Expired - Fee Related
- 1997-08-25 WO PCT/JP1997/002977 patent/WO1998009377A1/ja active IP Right Grant
- 1997-08-25 CN CNB971911797A patent/CN1151603C/zh not_active Expired - Fee Related
- 1997-08-25 US US09/043,925 patent/US5952898A/en not_active Expired - Lifetime
- 1997-08-25 ID IDP972953A patent/ID18132A/id unknown
- 1997-08-25 EP EP97935892A patent/EP0859465B1/en not_active Expired - Lifetime
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6365707A (ja) * | 1986-09-05 | 1988-03-24 | Toyo Commun Equip Co Ltd | 圧電フイルタの封止 |
JPH0256361U (ja) * | 1988-10-19 | 1990-04-24 | ||
JPH0279574U (ja) * | 1988-12-09 | 1990-06-19 | ||
JPH02261211A (ja) * | 1989-03-31 | 1990-10-24 | Nippon Dempa Kogyo Co Ltd | 多重モード型水晶振動子 |
JPH0386623U (ja) * | 1989-12-25 | 1991-09-02 | ||
JPH0779127A (ja) * | 1991-06-27 | 1995-03-20 | Nippon Dempa Kogyo Co Ltd | 多重モード型圧電振動子 |
JPH0685599A (ja) * | 1992-08-31 | 1994-03-25 | Nippon Dempa Kogyo Co Ltd | 多重モード水晶振動子 |
JPH0897668A (ja) * | 1994-09-22 | 1996-04-12 | Murata Mfg Co Ltd | 負荷容量内蔵型圧電共振子およびその製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP0859465A4 * |
Also Published As
Publication number | Publication date |
---|---|
US5952898A (en) | 1999-09-14 |
CN1200206A (zh) | 1998-11-25 |
ID18132A (id) | 1998-03-05 |
DE69725552T2 (de) | 2004-08-05 |
JPH1075150A (ja) | 1998-03-17 |
KR100294104B1 (ko) | 2001-09-17 |
JP3239769B2 (ja) | 2001-12-17 |
TW445708B (en) | 2001-07-11 |
EP0859465A1 (en) | 1998-08-19 |
DE69725552D1 (de) | 2003-11-20 |
EP0859465B1 (en) | 2003-10-15 |
EP0859465A4 (en) | 2002-05-02 |
KR19990067243A (ko) | 1999-08-16 |
CN1151603C (zh) | 2004-05-26 |
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