WO1997007549A1 - Solar cell module and its manufacturing method - Google Patents
Solar cell module and its manufacturing method Download PDFInfo
- Publication number
- WO1997007549A1 WO1997007549A1 PCT/JP1996/002275 JP9602275W WO9707549A1 WO 1997007549 A1 WO1997007549 A1 WO 1997007549A1 JP 9602275 W JP9602275 W JP 9602275W WO 9707549 A1 WO9707549 A1 WO 9707549A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solar cell
- moisture
- polymer
- frame
- cell panel
- Prior art date
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- 230000032683 aging Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000001860 citric acid derivatives Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- UCVPKAZCQPRWAY-UHFFFAOYSA-N dibenzyl benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC=2C=CC=CC=2)C=1C(=O)OCC1=CC=CC=C1 UCVPKAZCQPRWAY-UHFFFAOYSA-N 0.000 description 1
- YLJJAVFOBDSYAN-UHFFFAOYSA-N dichloro-ethenyl-methylsilane Chemical compound C[Si](Cl)(Cl)C=C YLJJAVFOBDSYAN-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- GKGXKPRVOZNVPQ-UHFFFAOYSA-N diisocyanatomethylcyclohexane Chemical compound O=C=NC(N=C=O)C1CCCCC1 GKGXKPRVOZNVPQ-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 description 1
- NUFVQEIPPHHQCK-UHFFFAOYSA-N ethenyl-methoxy-dimethylsilane Chemical compound CO[Si](C)(C)C=C NUFVQEIPPHHQCK-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-N hexanedioic acid Natural products OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- VKSCZTWQDPUHIK-UHFFFAOYSA-N isocyanic acid;trimethoxy(propyl)silane Chemical compound N=C=O.CCC[Si](OC)(OC)OC VKSCZTWQDPUHIK-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002604 lanthanum compounds Chemical class 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- DRRZZMBHJXLZRS-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]cyclohexanamine Chemical compound CO[Si](C)(OC)CCCNC1CCCCC1 DRRZZMBHJXLZRS-UHFFFAOYSA-N 0.000 description 1
- DBIJGSRXWPQTLH-UHFFFAOYSA-N n-butyloctan-1-amine Chemical compound CCCCCCCCNCCCC DBIJGSRXWPQTLH-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000008029 phthalate plasticizer Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007717 redox polymerization reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004590 silicone sealant Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- NFBOTFJHZAHUJK-UHFFFAOYSA-N sulfamic acid;toluene Chemical compound NS(O)(=O)=O.CC1=CC=CC=C1 NFBOTFJHZAHUJK-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000005628 tolylene group Chemical group 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- KEROTHRUZYBWCY-UHFFFAOYSA-N tridecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C(C)=C KEROTHRUZYBWCY-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S30/00—Structural details of PV modules other than those related to light conversion
- H02S30/10—Frame structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a solar cell module and a method of manufacturing the same, and more particularly, to mounting a solar cell panel on an appropriate frame.
- a specific moisture-curable hot-melt adhesive is used as the mounting adhesive.
- the solar cell module can be bonded without using a primer, has excellent durability such as weather resistance, and has excellent reliability and quality of battery functions, and its production can be performed easily and quickly.
- a primer has excellent durability such as weather resistance, and has excellent reliability and quality of battery functions
- solar cell modules generally include a solar cell panel in which solar cells are arranged on the surface opposite to the light-receiving surface of a light-transmitting plate. And a frame for mounting the solar cell panel.
- a mounting frame for example, a tie having four frames that can be fitted from all sides with respect to the peripheral edge of the solar cell panel is often used, but in this case, four frames are used.
- Each frame must be fitted to the end of the solar cell panel, and these four frames must be fixed to each other by means of screws or other means to form a frame.
- a seal material is interposed to fix the solar pack panel and the frame, but depending on the thickness of the seal material, the outer dimensions of the frame and, consequently, the entire solar cell module may be distorted. .
- butyl rubber is used as the sealing material because it blocks moisture (relatively low water vapor transmission) and is inexpensive. Due to this, butyl rubber may undergo aging under high temperature and load when packing and transporting solar modules to tropical areas, for example, and the panels may settle under their own weight. For this reason, an elastic member is filled in the gap between the lower surface of the panel and the frame in the vicinity of the butyl rubber-based sealing material to prevent the panel from settling (see Japanese Utility Model Application Laid-Open No. 3-150600). Japanese Patent Application Laid-Open Publication No. 4-1304577, which uses a silicone-based sealing material to provide weatherability and heat resistance in addition to the butyl rubber-based sealing material. ing.
- the butyl rubber-based sealing material is still deteriorated and is exposed from the frame to impair the appearance. Eventually, rainwater or the like is allowed to enter, thereby impairing the battery function.
- the silicone-based sealing material has a moisture-curing property, but is a paste at room temperature. Curing and curing are required for several days, and slight vibrations such as movement and stacking in the uncured state may cause a gap between the panel and the frame.
- the inventors of the present invention should solve the problems of erecting labor and distortion of external dimensions due to the frame structure, and the problems in quality and manufacturing process of the improved sealing method related to petit-gol-based sealing materials.
- a frame was provided around the entire edge of the solar cell panel, supporting the opposite side from the light-receiving surface of the light-transmitting plate, and the light-receiving surface of the light-transmitting plate was opened.
- a moisture-curable composition mainly composed of urethane prepolymer obtained by reacting a polyhydroxy compound with an excessive amount of a polyisocyanate compound as an adhesive for attaching a solar cell panel to the frame. It has been found that the use of a hot-melt adhesive can produce a solar cell module that eliminates all of the above-mentioned problems.
- urethane prepolymer obtained by reacting a polyhydroxy compound with an excessive amount of a polyisocyanate compound as an adhesive for attaching a solar cell panel to the frame.
- the moisture-curing adhesive mainly composed of a polymer containing at least two hydrolyzable silyl groups in one molecule.
- the present invention provides a solar cell panel in which a solar cell element is disposed on a surface opposite to a light receiving surface of a light transmitting plate, and a light receiving surface of the light transmitting plate which is provided over the entire periphery of an end of the solar cell panel. And a frame that has a protruding piece that supports the opposite surface and that has the light-receiving surface of the light-transmitting plate open.
- the above solar cell panel has at least two hydrolyses per molecule on the protruding piece of the frame.
- a solar cell module characterized in that it is bonded and fixed with a moisture-curable hot-melt adhesive containing a polymer containing a reactive silyl group as a main component, and at least 2 A step of melt-coating a moisture-curable hot-melt adhesive containing two hydrolyzable silyl group-containing polymers as a main component, and placing a solar cell panel on the melt-coated protrusions of the frame, and then cooling.
- a solar cell panel comprising the steps of: developing the initial adhesive strength of the hot melt-type adhesive by solidification; and completely solidifying the mixture by moisture curing to fix and fix the solar cell panel on the projection of the frame. It provides a method for manufacturing a pond module.
- a polymer containing at least two hydrolyzable silyl groups in one molecule which is a main component polymer of the moisture-curable hot melt adhesive used in the present invention; Then, it is roughly divided into two types.
- the contents are as follows.
- the polymer (A) is a functional group capable of reacting with an isocyanate group as a starting polymer, that is, a hydroxyl group (OH :), a mercapto group (SH), or a mono-substituted or unsubstituted amino group (NHR, where R is a polymer having at least two H, an alkyl group, a fuunyl group, etc.
- the starting polymer (generally, a molecular weight of 1,000 to 50,000, preferably 3,000 to 30,000), and the starting polymer (OH-containing polymer, SH-containing polymer, NHR-containing polymer) )
- the diisocyanate compound for example, tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate, naphthylene diisocyanate, para-phenylene diisocyanate.
- Anetate Tetramethylxylylenediocyanate, Hexamethylenediocyanate, Disic Hexyl methane diisocyanate, isoferon diisocyanate, lysine diisocyanate, hydrogenated xylylene diisocyanate, cyclohexyl diisocyanate, trizine diisocyanate, etc.
- An alkoxysilane having a functional group capable of reacting with the NCO eg, aminopropyl trimethoxysilane, 7-aminobutyryl propyltriethoxyquin silane, n-aminobutylpyrmethyldimethoxysilane, N-aminoaminoethylamido
- N-aminotriaminosilane N-aminoethylaminobu pillmethyldimethoxysilane, 1,3-diaminoisoprovirtrimethoxysilane, ⁇ -N-pheny
- isocyanate alkoxysilane eg, isocyanate propyl triethoxyquin silane, isocyanate propyl trimethoxy silane, isocyanate propyl methyl dimethoxine
- isocyanate trimethoxysilane, diisocyanate dimethoxysilane, etc. in an amount of about equivalent to excess to introduce a hydrolyzable silyl group.
- ⁇ H-containing polymers include water or polyhydric alcohols such as ethylene glycol, propylene glycol, glycerin, trimethylolpropane, pentaerythritol, sorbitol, sucrose, propylene oxide or propylene.
- Polyol polyols obtained by addition polymerization of ethylene oxide and other alkylene oxides such as ethylene oxide
- the SH-containing polymer has the formula:
- R is one C 2 H 4 —, one C 3 H 6 —, one C 2 H 4 — 0—C 2 H 4 —, one C 2 H 4 — ⁇ CH 2 — ⁇ C 2 H 4 —, C 3 H 6 — O— C 3 H 6 — 0— C 3 H 6
- liquid polysulphide polymer of a transparent amber color and a liquid at room temperature to a viscous liquid.
- the formula manufactured by Toray Chocoal Corporation is a liquid polysulphide polymer of a transparent amber color and a liquid at room temperature to a viscous liquid.
- HS - (C 2 H 4 OCH 2 0 C 2 H 4 SS) nC 2 H 4 0 CH 2 0 C 2 H 4 - indicated by SH, with an average molecular weight of 4000, trade name "Chiokoru LP- 2", "the LP-12, LP-32J, etc., and the company's brand name, Chocol LP-31 (average molecular weight 7500).
- NHR-containing polymer examples include, for example, trade names “JEFFAMINE D-230”, “D-400”, “T-403”, and “T EDR-148 ”and the like are commercially available (the structure of such a commercially available product is represented by H 2 N—PPG—NH 2 ).
- the polymer (B) is an acrylate monomer (for example, ethyl acrylate, propyl acrylate, n-butyl acrylate, isoptyl acrylate, amyl acrylate, hexyl acrylate, 2-ethyl hexyl acrylate) And at least one of linear, branched and alicyclic alkyl esters having 2 to 8 carbon atoms such as cyclohexyl acrylate and ⁇ -butyl acrylate, and vinylalkoxysilane (for example, Nyltrimethoxysilane, vinylmethyldimethoxysilane, vinyltriethoxytolan, vinyldimethylmethoxysilane, vinyltris (-methoxyethoxyquin) silane, etc.) and (meth) acryloxyalkoxysilane (for example, At least one selected from the group consisting of methoxysilane, alphamethacryloxypropylmethyldimethoxan
- Radical polymerization initiators for example, ⁇ '-azobisisobutyronitrile, a'-azobisisovalero
- Radical copolymerization using a known polymerization method, bulk polymerization, solution polymerization, or the like using tolyl, benzoyl peroxide, methyl ethyl ketone peroxide, or the like, or a redox catalyst (for example, a transition metal salt). , Amine and the like, and a peroxide radical polymerization initiator) to carry out redox polymerization.
- 0.001 to 0.05 mole (particularly 0.02 to 0.03 mole) of mercaptoalkoxysilane (chain transfer agent) is used per mole of acrylate monomer.
- the vinylalkoxysilane and / or (meth) acryloxyalkoxysilane may be used in an amount of 0.4 to 2.0 moles per mole of the helical alkoxylane.
- methacryl Acid esters methyl methacrylate, ethyl methacrylate, ⁇ -butyl methacrylate, isobutyl methacrylate, 2-ethylhexyl methacrylate, lauryl methacrylate, tridecyl methacrylate, benzyl methacrylate G, hexylmethac Relate, tetrahydrofurfuryl methacrylate, 2-hydroxyl methacrylate, 2-hydroxypropyl methacrylate, glycidyl methacrylate, 2-methyl oxyl methyl methacrylate , 2-ethoxyhexyl methacrylate, dimethylaminoethyl methacrylate, etc., and the other acrylates (methyl acrylate, glycidyl acrylate, methyl oxyl methyl methacrylate , 2-ethoxyhexyl methacrylate, dimethylaminoethyl methacrylate, etc., and the other acryl
- moisture-curable hot melt adhesive (hereinafter referred to as “moisture-curable HMA”) used in the present invention contains the above-mentioned polymer (A) or (B) as a main component, and usually uses a thermoplastic polymer as necessary.
- Blends, fillers and plasticizers, and further suitable additives such as viscosity adjusting solvents, curing catalysts, tackifiers, softeners, thixotropes (benton, gay anhydride, gay acid derivatives, urea derivatives, etc.) ),
- a solid or semi-solid at room temperature usually at a temperature of 70 to 100 ° C, which is composed of a dye, a pigment, an antioxidant, an ultraviolet absorber, a flame retardant, a lanthanum compound, a dehydrating agent, and the like. It becomes a flowable paste or liquid by the heating.
- thermoplastic polymer improves the cohesive force of moisture-cured HMA, contributes to the development of the initial adhesive strength, lowers the glass transition temperature of moisture-cured HMA, imparts low-temperature elasticity, and reduces Changes in physical properties to high temperatures can be reduced, and also contributes to cost reduction of moisture-cured HMA.
- thermoplastic polymers include polyfunctional ring-containing active hydrogen-containing compounds (for example, bisphenol resins, terpene resins, cumarone resins, xylene resins, rosin ester resins having a molecular weight of 400 to 200,000).
- Styrene resins phenol resins, terpene phenol resins, rosin resins, polyester resins, etc.
- diols eg, ethylene glycol, 1,4-butanediol, 1.6-hexanediol, 1.8- Octanediol, polycarbonatediol, polytetramethylene glycol, hydrogenated polybutadienediol, boriacryldiol, polyoxyalkylenediol, polyoxyalkylene-added bisphenol, etc.
- triols for example, trimethylolpropane, glycerin, triethylene
- polyokine alkylene thiol, etc. and excess polyisocyanate compound [for example, 2.4- or 2,6-tolylene diisocyanate, 4,4'-diphenylmethanediisocyanate ( 1,3- or 1,4-xylylene diisocyanate, 1.5-naphthalenediisocyanate, isofuron diisocyanate, hexamethylene diisocyanate, tetramethylene diisocyanate, dimethyl diphenyl dimethyl Tandiisocyanate, cyclohexylmethanediisocyanate, p-phenylenediisocyanate, trimethylolpropane adducts of these polyisocyanates, or (Usually having a melting point of 70 to 100 ° C.), for example, a thermoplastic resin obtained from Toyo Chemical Laboratory Co., Ltd.
- thermoplastic polymers have a molecule in which a urethane bond and a ring compound are introduced, thereby giving off a molar cohesive energy and becoming thermoplastic.
- compatibility with the main component polymer (A) is improved due to the polarity due to the ring compound and the urethane bond.
- Other thermoplastic polymers include polyurethane resin, polyester resin, polyolefin resin, polyacrylic resin, ethylene-vinyl acetate copolymer, styrene-based resin, polyvinyl chloride resin, and polyamide.
- Resins, rubbers and the like can be used, and among them, ethylene-vinyl acetate copolymer is particularly preferable.
- the main component polymer (B) it is not necessary to use a thermoplastic polymer together if the polymerization component and the degree of polymerization are adjusted.
- Examples of the above-mentioned filler include a citric acid derivative, talc, metal powder, carbonated lump, clay, and carbon black.
- plasticizer examples include dibutyl phthalate, dioctyl phthalate, zinc hexyl phosphate, diisooctyl phthalate, diisodecyl phthalate, dibenzyl phthalate, butyl benzyl phthalate, and trioctyl phosphate. , Epoxy plasticizers, toluene monosulfoamide, black paraffin, adipic acid ester, castor oil and the like.
- the content of the main component polymer (A) or (B) is usually 20 to 60% (% by weight, the same applies hereinafter), preferably 30 to 5%. 0% or less for thermoplastic polymer, 50% or less for filler, 20% or less for plasticizer, and 10% or less for all additives. Preferably, it is selected.
- the content of the main component polymer (A) or (B) is less than 20%, the elongation of the basic physical properties in cold conditions does not occur, and the hardness is too high. It tends to occur easily.
- thermoplastic polymer If the content of the thermoplastic polymer exceeds 50%, the physical properties at cold tend to be unsatisfactory.
- the content of the filler exceeds 50%, the viscosity of the moisture-cured HMA at the time of heating and melting becomes too high, and the adhesiveness and physical properties tend to be impaired.
- the moisture-cured HMA can be prepared, for example, by the following procedure.
- thermoplastic polymer is melted and charged into a kettle capable of purging with nitrogen kept at a temperature close to the melting temperature.
- a main component polymer (A) or (B) is added under a nitrogen atmosphere, a filler and a plasticizer are added with stirring, and the mixture is defoamed and stirred under vacuum.
- a viscosity adjusting solvent and a curing catalyst are added as additives, and the mixture is further subjected to vacuum degassing and stirring to obtain a moisture-cured HMA.
- a plasticizer is charged into a reaction vessel in advance, and the main component polymer (A) or (B) is manufactured therein, and then the thermoplastic polymer, filler, and additive are sequentially added.
- Moisture-cured HMA can also be prepared by the following procedure.
- FIG. 1 shows an example of the solar cell module of the present invention, (a) is a plan view thereof, and (port) is a sectional view taken along line AA in (a).
- FIG. 2 is a cross-sectional view showing a part of another example of the solar cell module of the present invention.
- FIG. 3 is a flow sheet schematically showing an assembly line of the production method of the present invention.
- (Mouth) has a solar cell panel 4 in which a solar cell element 3 is disposed on a surface opposite to a light receiving surface 2a of a light transmitting plate 2; And a protruding piece 5 that is provided over the entire periphery of the end portion of the solar cell panel 4 and supports a surface opposite to the light receiving surface 2 a of the light transmitting plate 2, and the light receiving surface 2 a of the light transmitting plate 2 is open.
- the solar cell panel 4 is bonded and fixed on the protruding piece 5 of the frame 6 with the moisture-cured HMA 7 containing the polymer (A) or (B) as a main component. It is configured.
- a white plate glass is used as the translucent plate 2
- a plurality of crystalline solar cell elements 3 disposed on a surface opposite to the light receiving surface 2 a include, for example, ethylene monoacetic acid.
- the back side is covered with a sealing material 8 made of a vinyl copolymer (EVA) and covered with a back sheet 9 made of, for example, an aluminum foil sandwiched by polyvinyl fluoride (PVF).
- EVA vinyl copolymer
- PVF polyvinyl fluoride
- each solar cell element 3 is connected and connected in a sealing material 8 and connected to an output terminal in a terminal box provided on a back sheet 9 so that the power generation output can be taken out to the outside. I'm sorry.
- the exposed portion of the moisture-cured HMA 7 on the light receiving surface side can be covered with a molding 10 or the like as necessary.
- This molding 10 is attached before the moisture-cured HMA 7 is cooled and solidified, and is adhesively fixed between the solar cell panel 4, the frame 6, and the molding 10 together with the moisture-cured HMA 7 being cooled and moisture-cured. Will be.
- the use of the mall 10 is merely for the purpose of improving the appearance, and a state in which the mall 10 is omitted is shown in FIG.
- a crystalline solar cell element was used as the solar cell element 3 above.
- a solar cell element made of a thin film semiconductor such as amorphous silicone was directly provided on the surface opposite to the light receiving surface 2a of the light transmitting plate 2, and a protective layer such as an epoxy resin was coated on the solar cell element. Types can also be used.
- the structure of the solar cell panel is not particularly limited in the present invention.
- the frame 6 is a structure (for example, an aluminum die cast or an injection molded article of engineering plastic) integrally formed by injection molding, or an assembly of four frames having a predetermined shape.
- a solar cell array can be formed by screwing it to an array mounting base (not shown) provided outdoors.
- the method for manufacturing the solar cell module 1 according to the present invention includes a step of melt-coating the moisture-cured HMA 7 on the projecting pieces 5 of the frame 6, and a step of melting and coating the projecting pieces 5 of the frame 6. After the solar panel 4 is placed on the frame, the solidified body is cooled and solidified. In the following, the entire production of the solar cell module will be described along the assembly line of the solar cell module schematically shown in FIG.
- the solar cell panel 4 and / or the protruding piece 5 may be used to further increase the adhesive strength.
- An appropriate primer can be applied in advance to the bonding surface (usually to the bonding surface of the solar cell panel 4).
- a primer one or a mixture of at least one of a polyisocyanate compound, a silane coupling agent and a titanate coupling agent is dissolved and mixed in an organic solvent, and if necessary, an acrylic resin or a polyester resin is used.
- Chlorinated heavy An example is a solution to which a film-forming substance such as coalescing is added (usually a solvent solution having a solid content of 3 to 20%). The solution is applied by brush, spray, etc., then dried, and then moisture-cured HMA is melt-coated. do it. When this melting coating is automatically performed by a robot, a hot melt abrixator can be used.
- the assembly line in Fig. 3 is divided into a frame line 21 and a solar panel line 23. Here, first, the solar cell panel 4 is taken out from the panel pallet 25 and the solar cell panel is taken out. Panel on line 2 3 Supply to Stage II.
- a primer 27 (for example, Primer # 435-5-40, manufactured by Sunstar Giken Co., Ltd.) was applied to the bonding surface of the solar cell panel 4 at the primer coating station 2. After that, it is left for about 1 minute as the drying time of the primer 27 in the open station 3, and then moved to the unloading station ⁇ . At an appropriate time, the frame line 21 from the unloading station ⁇ ⁇ is attached to the panel. It is carried out to the matching station (3). In the case where the primer coating is not performed, the solar cell panel 4 is taken out from the panel pallet 25 described above, and is directly transported to the panel joining station (3).
- Primer # 435-5-40 manufactured by Sunstar Giken Co., Ltd.
- the assembled frame 6 is loaded into the frame loading station (1).
- a frame manufacturing station (not shown) for manufacturing the frame 6 may be provided prior to the frame loading station.
- the material heated and melted at 70 to 100 of the moisture-cured HMA 7 containing the polymer (A) or (B) as a main component is applied to the projecting piece 5 ( And the peripheral portion in the frame 6 may be included, the same applies to the following).
- the primer A primer may be applied to the protruding piece 5 in advance in the same manner as in the stage II.
- the unprimed solar cell panel 4 which has been subjected to the primer treatment from the above-mentioned unloading station ⁇ or removed from the panel pallet 25 is placed on the projecting piece 5. Place.
- the frame 6 is assembled in accordance with the outer peripheral shape of the solar cell panel 4, a structure such as a shelf portion in which the protruding pieces 5 are stuck inside the frame 6 is provided. Therefore, the solar cell panel 4 can be easily attached and bonded.
- the moisture-cured HMA used in such a production method rapidly melts and rapidly loses its fluidity after cooling by cooling, and depending on the amount of application, solidifies within a few seconds to several minutes and develops an initial adhesive strength.
- the frame has sufficient strength to prevent displacement even when external force such as movement, accumulation, and packing is applied. There is no particular problem with the drawing).
- moisture hardening property since it has reactivity with moisture in the atmosphere (moisture hardening property), it will have rubber elasticity of higher hardness as the reaction proceeds thereafter.
- the work of transporting the solar cell panel 4 and the frame 6 and the work of applying the primer 27 and the moisture-curing HMA 7 in such an assembly line may be performed by appropriate robots 29 and 31.
- a general 6-axis articulated robot can be used.
- the (1) polymer (A) 100 Og is charged into a stirring and mixing machine purged with nitrogen, and the temperature is set to 80 ° C.
- 30 g of a thermoplastic polymer [Thermoplastic resin TOYO ACE U-B manufactured by Toyo Chemical Laboratory Co., Ltd.] melted at 90 ° C for 3 hours was added, and the mixture was stirred at the same temperature for 20 minutes, and then dicyclohexyl was added.
- 15 g of phthalate was added, then 80 s of pre-dried carbon black and 25 g of calcium carbonate were added, and the mixture was stirred under vacuum at 1 OmmHg for 30 minutes. (DBTDL) in 0.3% xylene solution], and further degassing and stirring for 30 minutes to obtain moisture-cured HMA, which is taken out into an aluminum cartridge and sealed.
- AIBN ⁇ '-azobisisobutyrate nitrinole
- the polymerization starts and the stirring and heating are continued while confirming that the viscosity increases.
- the remaining mixed solution is gradually dropped using a dropping funnel and supplied to a platform. After dropping, continue heating for about 30 minutes, add A1BN (0.1g) to the mixture, and heat and stir for about 1 hour to complete the copolymerization reaction. It was a colorless and transparent viscous liquid with an average molecular weight of 32 000 as determined by GPC.
- 2-ethylhexyl acrylate 147.2 g (0.8 mol), methyl methacrylate 20 g (0.2 mol), methacryloxypropyltrimethoxysilane 4.98 g (0.02 mol), 7-mercaptopropyl trimethoxysilane 0.49 g (0.0025 Mol) and 85 g of octyl phthalate.
- AIBN 0.3 g
- a copolymerization reaction is carried out in the same manner as in Example 3, (1) to obtain a polymer (B).
- the polymer (B) is a colorless and transparent viscous liquid having an average molecular weight of 56,000 as determined by GPC.
- a moisture-cured HMA is obtained under the same composition and conditions as in (2) of Example 3, except that 60 g of the polymer (B) of (1) is used.
- a butyl rubber hot melt type adhesive having the following composition is used.
- Butyl rubber (Bux rubber 065, manufactured by Exxon) ⁇ 20 atactic polypropylene [Mitsubishi Yuka Corporation,
- a commercially available one-component silicone sealant [Penguin Seal # 2505, manufactured by Sunstar Giken Co., Ltd.] is used.
- Polyoxypropylene ethylene triol having a molecular weight of 12500 (manufactured by Asahi Glass Co., Ltd., X8805, trifunctional, EO content: 12%, OH value: 13.8) 10 Og was charged into a nitrogen-purged reaction tank, and then placed under a nitrogen atmosphere.
- the amount of free NCO was 1.48%, the viscosity was 24000 cps / 80 ° C, and 3800 0 Ocps / 20 ° C
- DBTDL dibutyltin dilaurate
- Example 1 (2) a moisture-cured HMA is obtained with the same blending and conditions except that the perethane prepolymer of (1) is used in place of the polymer (A).
- each of the adhesives was applied to two untested test steel plates (12.5 X 25). After the both steel sheets were bonded by melt coating at 60 to 100, they were subjected to the following test items, and the results are shown in Table 1 below.
- Normal adhesive strength After standing for 7 days at 65% RH for 20 days, measure the shear strength at a tensile speed of 50 mmZ min.
- Weather resistance Apply the adhesive in a bead shape on a glass plate, expose the adhesive to the surface of the adhesive, and observe the adhesive surface for cracks.
- Test items 1 2 3 4 1 2 3 Initial bond strength 0.4 0.3 0.2 0.2 0.3 1.0 Not measurable 0.3
- the present invention when attaching the solar cell panel 4 to the frame 6, instead of the moisture-curable hot-melt adhesive mainly composed of urethane prepolymer, the one-molecule
- a moisture-cured HMA based on a polymer (A) or (B) containing at least two hydrolyzable silyl groups as the main component provides excellent adhesion, and the resulting solar cell module is especially installed outdoors It can fully satisfy the high demands on durability such as weather resistance, and can have excellent reliability and quality of the battery function.
- the use of the frame 6 having the projection 5 and the humidity Cured Based on the initial adhesive strength of HMA and strong moisture curing, there is no dimensional error during assembly of the solar cell module and no displacement of the frame after assembly. Also, it can be carried out in a simple and quick work.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Photovoltaic Devices (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96926625A EP0845816A4 (en) | 1995-08-14 | 1996-08-12 | SOLAR CELL MODULE AND MANUFACTURING METHOD THEREOF |
US09/011,661 US6172295B1 (en) | 1995-08-14 | 1996-08-12 | Solar battery module and method for assembling the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7/206955 | 1995-08-14 | ||
JP7206955A JPH0955530A (ja) | 1995-08-14 | 1995-08-14 | 太陽電池モジュールおよびその製造法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997007549A1 true WO1997007549A1 (en) | 1997-02-27 |
Family
ID=16531787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1996/002275 WO1997007549A1 (en) | 1995-08-14 | 1996-08-12 | Solar cell module and its manufacturing method |
Country Status (4)
Country | Link |
---|---|
US (1) | US6172295B1 (ja) |
EP (1) | EP0845816A4 (ja) |
JP (1) | JPH0955530A (ja) |
WO (1) | WO1997007549A1 (ja) |
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---|---|---|---|---|
EP1009037A1 (en) * | 1997-07-29 | 2000-06-14 | Kaneka Corporation | Solar cell module |
EP1009037A4 (en) * | 1997-07-29 | 2000-07-12 | Kaneka Corp | SOLAR CELL MODULE |
US6300555B1 (en) | 1997-07-29 | 2001-10-09 | Kaneka Corporation | Solar cell module |
Also Published As
Publication number | Publication date |
---|---|
EP0845816A4 (en) | 1999-07-21 |
JPH0955530A (ja) | 1997-02-25 |
EP0845816A1 (en) | 1998-06-03 |
US6172295B1 (en) | 2001-01-09 |
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