WO1997006199A1 - Composition solidifiable de resine epoxy - Google Patents
Composition solidifiable de resine epoxy Download PDFInfo
- Publication number
- WO1997006199A1 WO1997006199A1 PCT/JP1995/001557 JP9501557W WO9706199A1 WO 1997006199 A1 WO1997006199 A1 WO 1997006199A1 JP 9501557 W JP9501557 W JP 9501557W WO 9706199 A1 WO9706199 A1 WO 9706199A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- epoxy resin
- compound
- curing agent
- group
- bis
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 103
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 103
- 239000000203 mixture Substances 0.000 title claims abstract description 50
- 239000000463 material Substances 0.000 claims abstract description 66
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 55
- 239000003054 catalyst Substances 0.000 claims abstract description 17
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 11
- 238000006243 chemical reaction Methods 0.000 claims abstract description 9
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims description 54
- -1 amide compound Chemical class 0.000 claims description 52
- 229920006295 polythiol Polymers 0.000 claims description 22
- 239000002253 acid Substances 0.000 claims description 17
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 10
- 239000010457 zeolite Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910021536 Zeolite Inorganic materials 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 150000001735 carboxylic acids Chemical class 0.000 claims description 5
- 239000004088 foaming agent Substances 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 4
- 229910000037 hydrogen sulfide Inorganic materials 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000004927 clay Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 239000003463 adsorbent Substances 0.000 abstract description 16
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 9
- 230000004048 modification Effects 0.000 abstract 2
- 238000012986 modification Methods 0.000 abstract 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 30
- 238000010521 absorption reaction Methods 0.000 description 21
- 239000000047 product Substances 0.000 description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 19
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 18
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 239000004593 Epoxy Substances 0.000 description 13
- 230000008859 change Effects 0.000 description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
- 239000003085 diluting agent Substances 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 150000002989 phenols Chemical class 0.000 description 8
- 239000003566 sealing material Substances 0.000 description 8
- 238000001179 sorption measurement Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000004848 polyfunctional curative Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 238000002715 modification method Methods 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 241001024304 Mino Species 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 235000019645 odor Nutrition 0.000 description 5
- 239000000049 pigment Substances 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- ZWVMLYRJXORSEP-LURJTMIESA-N (2s)-hexane-1,2,6-triol Chemical compound OCCCC[C@H](O)CO ZWVMLYRJXORSEP-LURJTMIESA-N 0.000 description 4
- QPUYECUOLPXSFR-UHFFFAOYSA-N 1-methylnaphthalene Chemical compound C1=CC=C2C(C)=CC=CC2=C1 QPUYECUOLPXSFR-UHFFFAOYSA-N 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 4
- 239000004604 Blowing Agent Substances 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 239000011358 absorbing material Substances 0.000 description 4
- 150000001299 aldehydes Chemical class 0.000 description 4
- 150000004982 aromatic amines Chemical class 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000006482 condensation reaction Methods 0.000 description 4
- 238000004925 denaturation Methods 0.000 description 4
- 230000036425 denaturation Effects 0.000 description 4
- 150000004985 diamines Chemical class 0.000 description 4
- 239000003925 fat Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- UPCIBFUJJLCOQG-UHFFFAOYSA-L ethyl-[2-[2-[ethyl(dimethyl)azaniumyl]ethyl-methylamino]ethyl]-dimethylazanium;dibromide Chemical compound [Br-].[Br-].CC[N+](C)(C)CCN(C)CC[N+](C)(C)CC UPCIBFUJJLCOQG-UHFFFAOYSA-L 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 235000013824 polyphenols Nutrition 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 229920001221 xylan Polymers 0.000 description 3
- MQCPOLNSJCWPGT-UHFFFAOYSA-N 2,2'-Bisphenol F Chemical compound OC1=CC=CC=C1CC1=CC=CC=C1O MQCPOLNSJCWPGT-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- LVLNPXCISNPHLE-UHFFFAOYSA-N 2-[(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1CC1=CC=CC=C1O LVLNPXCISNPHLE-UHFFFAOYSA-N 0.000 description 2
- URFNSYWAGGETFK-UHFFFAOYSA-N 4,4'-Dihydroxybibenzyl Chemical compound C1=CC(O)=CC=C1CCC1=CC=C(O)C=C1 URFNSYWAGGETFK-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000003242 anti bacterial agent Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000001877 deodorizing effect Effects 0.000 description 2
- 238000003795 desorption Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000002440 hydroxy compounds Chemical class 0.000 description 2
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004584 polyacrylic acid Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-N sodium;hydron;carbonate Chemical compound [Na+].OC(O)=O UIIMBOGNXHQVGW-UHFFFAOYSA-N 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000012970 tertiary amine catalyst Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 235000010215 titanium dioxide Nutrition 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- 239000003981 vehicle Substances 0.000 description 2
- 150000004823 xylans Chemical class 0.000 description 2
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 2
- CFQZKFWQLAHGSL-FNTYJUCDSA-N (3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e)-octadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoic acid Chemical compound OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C CFQZKFWQLAHGSL-FNTYJUCDSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- 150000000185 1,3-diols Chemical class 0.000 description 1
- KJDRSWPQXHESDQ-UHFFFAOYSA-N 1,4-dichlorobutane Chemical compound ClCCCCCl KJDRSWPQXHESDQ-UHFFFAOYSA-N 0.000 description 1
- MJVIZWIQHKRBPI-UHFFFAOYSA-N 1-(aziridin-1-yl)but-3-en-2-ol Chemical compound C=CC(O)CN1CC1 MJVIZWIQHKRBPI-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- ALLIZEAXNXSFGD-UHFFFAOYSA-N 1-methyl-2-phenylbenzene Chemical group CC1=CC=CC=C1C1=CC=CC=C1 ALLIZEAXNXSFGD-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical group CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- VVJIVFKAROPUOS-UHFFFAOYSA-N 2,2-bis(aminomethyl)propane-1,3-diamine Chemical compound NCC(CN)(CN)CN VVJIVFKAROPUOS-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- QUWAJPZDCZDTJS-UHFFFAOYSA-N 2-(2-hydroxyphenyl)sulfonylphenol Chemical compound OC1=CC=CC=C1S(=O)(=O)C1=CC=CC=C1O QUWAJPZDCZDTJS-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- LROZSPADHSXFJA-UHFFFAOYSA-N 2-(4-hydroxyphenyl)sulfonylphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=CC=C1O LROZSPADHSXFJA-UHFFFAOYSA-N 0.000 description 1
- GAMCKBORIMJJBE-UHFFFAOYSA-N 2-(dimethylamino)-4-methylphenol Chemical compound CN(C)C1=CC(C)=CC=C1O GAMCKBORIMJJBE-UHFFFAOYSA-N 0.000 description 1
- CUFXMPWHOWYNSO-UHFFFAOYSA-N 2-[(4-methylphenoxy)methyl]oxirane Chemical compound C1=CC(C)=CC=C1OCC1OC1 CUFXMPWHOWYNSO-UHFFFAOYSA-N 0.000 description 1
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 description 1
- KLVCOODRARORAQ-UHFFFAOYSA-N 2-[[2,4-bis(oxiran-2-ylmethyl)phenoxy]methyl]oxirane Chemical compound C(C1CO1)OC1=C(C=C(C=C1)CC1CO1)CC1CO1 KLVCOODRARORAQ-UHFFFAOYSA-N 0.000 description 1
- PPEASEWKOGNDKZ-UHFFFAOYSA-N 2-[[2,6-bis(oxiran-2-ylmethyl)phenoxy]methyl]oxirane Chemical compound C1OC1COC(C(=CC=C1)CC2OC2)=C1CC1CO1 PPEASEWKOGNDKZ-UHFFFAOYSA-N 0.000 description 1
- AGXAFZNONAXBOS-UHFFFAOYSA-N 2-[[3-(oxiran-2-ylmethyl)phenyl]methyl]oxirane Chemical compound C=1C=CC(CC2OC2)=CC=1CC1CO1 AGXAFZNONAXBOS-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical class CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- RKSBPFMNOJWYSB-UHFFFAOYSA-N 3,3-Bis(4-hydroxyphenyl)pentane Chemical compound C=1C=C(O)C=CC=1C(CC)(CC)C1=CC=C(O)C=C1 RKSBPFMNOJWYSB-UHFFFAOYSA-N 0.000 description 1
- MXHIGVLOGPIQHM-UHFFFAOYSA-N 3-[2-[bis(2-cyanoethyl)amino]ethyl-(2-cyanoethyl)amino]propanenitrile Chemical compound N#CCCN(CCC#N)CCN(CCC#N)CCC#N MXHIGVLOGPIQHM-UHFFFAOYSA-N 0.000 description 1
- CGFCKPWPXHKFPU-UHFFFAOYSA-N 3-chloro-4-[1-(2-chloro-4-hydroxyphenyl)ethyl]phenol Chemical compound C=1C=C(O)C=C(Cl)C=1C(C)C1=CC=C(O)C=C1Cl CGFCKPWPXHKFPU-UHFFFAOYSA-N 0.000 description 1
- 125000004179 3-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C(Cl)=C1[H] 0.000 description 1
- 125000004207 3-methoxyphenyl group Chemical group [H]C1=C([H])C(*)=C([H])C(OC([H])([H])[H])=C1[H] 0.000 description 1
- JKETWUADWJKEKN-UHFFFAOYSA-N 4-(3,4-diaminophenyl)sulfonylbenzene-1,2-diamine Chemical compound C1=C(N)C(N)=CC=C1S(=O)(=O)C1=CC=C(N)C(N)=C1 JKETWUADWJKEKN-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- NBOCQTNZUPTTEI-UHFFFAOYSA-N 4-[4-(hydrazinesulfonyl)phenoxy]benzenesulfonohydrazide Chemical compound C1=CC(S(=O)(=O)NN)=CC=C1OC1=CC=C(S(=O)(=O)NN)C=C1 NBOCQTNZUPTTEI-UHFFFAOYSA-N 0.000 description 1
- IQIQZPUFQOLLKG-UHFFFAOYSA-N 4-[[4-[(4-hydroxyphenyl)methyl]-2,3,5,6-tetramethylphenyl]methyl]phenol Chemical compound CC=1C(C)=C(CC=2C=CC(O)=CC=2)C(C)=C(C)C=1CC1=CC=C(O)C=C1 IQIQZPUFQOLLKG-UHFFFAOYSA-N 0.000 description 1
- 125000003143 4-hydroxybenzyl group Chemical group [H]C([*])([H])C1=C([H])C([H])=C(O[H])C([H])=C1[H] 0.000 description 1
- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 1
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 241000272814 Anser sp. Species 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bisphenol F Natural products C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- HIBWGGKDGCBPTA-UHFFFAOYSA-N C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 Chemical compound C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 HIBWGGKDGCBPTA-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000009261 D 400 Substances 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 241000255925 Diptera Species 0.000 description 1
- 102100025027 E3 ubiquitin-protein ligase TRIM69 Human genes 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 101000830203 Homo sapiens E3 ubiquitin-protein ligase TRIM69 Proteins 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical group SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- 238000006845 Michael addition reaction Methods 0.000 description 1
- LRPHBKFWUUMWLP-UHFFFAOYSA-N NN.C#N Chemical compound NN.C#N LRPHBKFWUUMWLP-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- MZKYENSEDHHEJJ-UHFFFAOYSA-N OC(=O)c1ccc(C(O)=O)c(N=O)c1N=O Chemical compound OC(=O)c1ccc(C(O)=O)c(N=O)c1N=O MZKYENSEDHHEJJ-UHFFFAOYSA-N 0.000 description 1
- 241000238814 Orthoptera Species 0.000 description 1
- 241000609816 Pantholops hodgsonii Species 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- 235000011941 Tilia x europaea Nutrition 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000000274 adsorptive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- GETQZCLCWQTVFV-UHFFFAOYSA-N anhydrous trimethylamine Natural products CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 1
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- ZMOOAVPSGXARRF-UHFFFAOYSA-N benzene-1,4-dicarbothioic s-acid Chemical compound SC(=O)C1=CC=C(C(S)=O)C=C1 ZMOOAVPSGXARRF-UHFFFAOYSA-N 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- VJRITMATACIYAF-UHFFFAOYSA-N benzenesulfonohydrazide Chemical compound NNS(=O)(=O)C1=CC=CC=C1 VJRITMATACIYAF-UHFFFAOYSA-N 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- WARCRYXKINZHGQ-UHFFFAOYSA-N benzohydrazide Chemical class NNC(=O)C1=CC=CC=C1 WARCRYXKINZHGQ-UHFFFAOYSA-N 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- JODNECOOAJMIKX-UHFFFAOYSA-N butane-1,2,3-tricarboxylic acid Chemical compound OC(=O)C(C)C(C(O)=O)CC(O)=O JODNECOOAJMIKX-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- SURLGNKAQXKNSP-DBLYXWCISA-N chlorin Chemical compound C\1=C/2\N/C(=C\C3=N/C(=C\C=4NC(/C=C\5/C=CC/1=N/5)=CC=4)/C=C3)/CC\2 SURLGNKAQXKNSP-DBLYXWCISA-N 0.000 description 1
- BULLHNJGPPOUOX-UHFFFAOYSA-N chloroacetone Chemical compound CC(=O)CCl BULLHNJGPPOUOX-UHFFFAOYSA-N 0.000 description 1
- 235000019219 chocolate Nutrition 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 239000012611 container material Substances 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 229930003836 cresol Chemical class 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- DIOQZVSQGTUSAI-NJFSPNSNSA-N decane Chemical compound CCCCCCCCC[14CH3] DIOQZVSQGTUSAI-NJFSPNSNSA-N 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000004332 deodorization Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 125000006003 dichloroethyl group Chemical group 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical compound CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229940069417 doxy Drugs 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000006266 etherification reaction Methods 0.000 description 1
- 229940035423 ethyl ether Drugs 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 235000012055 fruits and vegetables Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 230000000855 fungicidal effect Effects 0.000 description 1
- 239000000417 fungicide Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical group O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000003230 hygroscopic agent Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 229910052920 inorganic sulfate Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910001723 mesolite Inorganic materials 0.000 description 1
- BADMSSMVCZUHOB-UHFFFAOYSA-N methanamine;n-propylpropan-1-amine Chemical compound NC.CCCNCCC BADMSSMVCZUHOB-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 229910052680 mordenite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- HVOYZOQVDYHUPF-UHFFFAOYSA-N n,n',n'-trimethylethane-1,2-diamine Chemical compound CNCCN(C)C HVOYZOQVDYHUPF-UHFFFAOYSA-N 0.000 description 1
- IMNDHOCGZLYMRO-UHFFFAOYSA-N n,n-dimethylbenzamide Chemical compound CN(C)C(=O)C1=CC=CC=C1 IMNDHOCGZLYMRO-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N n-butylhexane Natural products CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910000273 nontronite Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- UWBHMRBRLOJJAA-UHFFFAOYSA-N oxaluric acid Chemical compound NC(=O)NC(=O)C(O)=O UWBHMRBRLOJJAA-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical group NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000000575 pesticide Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 150000003109 potassium Chemical class 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910000275 saponite Inorganic materials 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- HYHCSLBZRBJJCH-UHFFFAOYSA-N sodium polysulfide Chemical compound [Na+].S HYHCSLBZRBJJCH-UHFFFAOYSA-N 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000013268 sustained release Methods 0.000 description 1
- 239000012730 sustained-release form Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
- 229940094989 trimethylsilane Drugs 0.000 description 1
- JSPLKZUTYZBBKA-UHFFFAOYSA-N trioxidane Chemical compound OOO JSPLKZUTYZBBKA-UHFFFAOYSA-N 0.000 description 1
- SBXWFLISHPUINY-UHFFFAOYSA-N triphenyltin Chemical compound C1=CC=CC=C1[Sn](C=1C=CC=CC=1)C1=CC=CC=C1 SBXWFLISHPUINY-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
- C08J9/104—Hydrazines; Hydrazides; Semicarbazides; Semicarbazones; Hydrazones; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Definitions
- the present invention relates to a curable epoxy resin composition capable of obtaining a cured product having hygroscopicity or adsorptivity.
- the present invention particularly relates to an epoxy resin composition that can be cured at room temperature and can be used as a coating material, a sealing material, an adhesive, or the like that provides a cured product having hygroscopicity or adsorptivity.
- Epoxy resin is a cured product obtained by curing ordinary bisphenol A-type epoxy resin with polyimide, which is widely used for paints, electricity, civil engineering, bonding, etc. Has almost no hygroscopicity or adsorptivity like ordinary synthetic resins such as thermoplastics and thermosetting resins, and is accepted as a preferred property in applications such as ordinary paints, electricity, civil engineering, etc. Have been. However, the fact that it has little hygroscopicity conversely raises the problem of condensation on the resin surface etc. in a highly humid, very airtight and sealed atmosphere. When used as materials for vehicle interior materials, transport containers, storage warehouses, etc., materials having hygroscopicity, hygroscopicity or hygroscopicity are desired.
- odor problems are liable to occur, and a deodorizing material that simply absorbs malodorous substances and that adsorbs malodorous components is also required. It not only absorbs odors and materials that have the function of releasing moisture during drying to control the humidity of the atmosphere.
- a material that adsorbs and retains components such as fragrances and gradually releases them.
- thermoplastic resins In order to satisfy such demands, materials in which various adsorbents and moisture-absorbing components are mixed with various thermoplastic resins have been developed, but these have already been molded into films, sheets, plates, rods, etc. It is a curable composition that can be applied in the field and can be applied to the surface of a conventional hygroscopic or non-absorbent synthetic resin material.
- a curable composition that can be used as a sealing material, an adhesive, a sealing material, and the like is desired.
- An object of the present invention is to provide a curable epoxy resin which can be used as a coating material, a sealing material, an adhesive, etc., which provides a cured product having hygroscopicity or adsorptivity and which can be cured at room temperature. Decide to provide the composition. Disclosure of the invention
- the curable epoxy resin composition of the present invention comprises (a) an epoxy resin (A), (b) an amine compound curing agent (B-1), a modified product thereof (B-2) and a polythiol compound cured.
- Epoxy resin curing agent (B) selected from the group consisting of the agent (B-3), (c) a moisture absorbing or adsorbing material (C), and epoxy resin curing agent (B).
- FIG. 1 is a diagram showing the weight change rate of the plate-like molded bodies used in Examples 1 to 3.
- FIG. 2 shows the rate of change in weight of the plate-like compact used in Examples 4 and 5.
- epoxy resin (A) used in the present invention examples include various epoxy resins that can be used for paints, adhesives, sealing materials, and the like. Such epoxy resins have the general formula:
- Z represents a hydrogen atom, a methyl group, a dimethyl group, etc.
- Z is an epoxy resin having an average of more than one substituted or unsubstituted glycidyl group in the molecule, for example, a glycidyl ether group.
- Examples of the epoxy resin (A-1) having an average of more than one glycidyl ether group in the molecule include the following:
- the multi-valued liquor is a poly-glycidyl ether (A_1-1),
- an initial condensate of a phenol and a carbonyl compound for example, an initial condensate of a phenolic resin, a product of a phenolic chlorin condensation reaction, a phenolic oxal condensation reaction) Products, phenol-l-pentanol condensation reaction products, resorcinol-l-aceton condensation reaction products, xylene-phenol-formalin precondensates), phenols Polyglycidyl ethers of polynuclear polyvalent phenols such as the condensation products of polynuclear polyphenols with ⁇ -methylated aromatic compounds ((—1-5),
- polyhydric alcohols mononuclear polyvalent vinyls, polynuclear divalent vinyls, and polynuclear polyvalent alcohols exemplified in the above (1) to (5).
- a polyglycidyl ether '(A) obtained by adding an alkylenoxide such as ethylenoxide, propylenoxide, or butylene oxide to a glycidyl ether of the hydroxyl group of the compound is added.
- alkylenoxide such as ethylenoxide, propylenoxide, or butylene oxide
- the epoxy resin (A-2) having an average of more than one glycidyl ester group in the molecule includes, for example, polyglycidyl esters of aliphatic polycarboxylic acids and aromatic carboxylic acids. Examples include homopolymers and copolymers of glycidyl esters of steric acid and acrylic acid.
- the epoxy resin (A-3) having an average of more than one glycidylamino group or glycidylimino group in a molecule is, for example, an epoxy resin having an alkyl substituent on the aniline or benzene nucleus.
- Aromatic amines such as nilin; initial condensates of the aromatic amines with aldehydes such as formaldehyde; the aromatic amines and the aldehydes and phenols; Of the initial condensate of Polyglycidyl compounds converted to lumino groups or glycidyl imino groups are exemplified.
- epoxy resins a group of preferred ones are polynuclear divalent poly (polyglycidyl ether) (A1-113) exemplified in the above (3) and (6).
- Alkylene oxides such as ethylenoxide, propylenoxide, butylene chloride, etc. are added to the polynuclear monovalent phenol thus added, and the hydroxy group is added to the hydroxyl group.
- epoxy resins may be used alone, two or more of them may be used in combination, or may be used in combination with another resin compatible with the above-mentioned epoxy resin.
- examples of such a resin include a phosphoric acid-modified epoxy resin, a chelating-capable epoxy resin, a synthetic rubber-modified epoxy resin, a urethane-modified epoxy resin, and a polysulfide-modified epoxy resin.
- Thermosetting resins such as epoxy resins such as fats, unsaturated polyester resins, funoxoxy resins, phenolic resins, and xylene resins; and polyester resins, polyethylene resins, etc. Examples include vinyl acetate copolymers, chocolate resins, coal and petroleum resins, modified butagen ⁇ nitrile resins, and vinyl acetate resins.
- diluents for the epoxy resin include, for example, olefin oxide, glycidyl methacrylate, octylene oxyxide, ary J regis dig » Regiri sJi tere, 21-ethyl hexyl ether, vinylcyclohexene mono-oxide, styrene styrene, and phenyl Monoepoxy compounds such as butyl ether, p-sec.—butylphenylglycidyl ether, cresylglycidyl ether, and 1-vinyloxide; for example, butadioxoxide, dimethylpentanedioxide, diglycidyl ether, butane Diol jiglycidyl ether, ethylene glycol jiglyether, di- or polyethylene glycol diglyceride, and ethylene glycol. ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇
- Triglycidyl ether Triglycidyl ether, glycerin triglycidyl ether, limonenedioxide, resorcindiglycidyl ether, 2,6-diglycidyl phenyl glycidyl ether, 2,4-diglycidyl phenyl glycidyl ether, etc.
- Reactive diluents such as di- or polyepoxy compounds, for example, non-reactive diluents such as dibutyl phthalate, glycol ether monoester, styrene and funools can also be used.
- the epoxy resin curing agent (B) used in the present invention includes an amine compound curing agent (B-1) and its modified product (B-2), and a polythiol compound curing agent (B-3).
- B-1 an amine compound curing agent
- B-2 its modified product
- B-3 a polythiol compound curing agent
- Specific examples of the amide compound curing agent (B-1) include, for example, ethylenediamine, trimethylenediamine, tetramethylenediamine, hexamethylene.
- Mouth Pinoreamin methylamine bis-propylamine, tetra (aminomethyl) methane, tetrakis (2 — Rinominezoleaminometyl) Polyethylene (polymethylene) or polyalkylenepolyamine (eg, 13-dimethylamine) Methyl naphthalene, 1,4 end R Mino methyl naphthalene, 4,4'-dia mino methyl biphenyl, ortho-, meta- or radiator range Aliphatic diamines having an aromatic ring structure such as Rmin ( ⁇ , ⁇ '—DiRminoxylene), for example, 1,3—Diamino ⁇ pentane, 1 4-diamino ⁇ hexane, 1 cyclohexyl ⁇ mino 1 3 ⁇ minopun, 1, 3 ⁇ No cyclohexane, 1 2 — Mino hexanox, 1 min Mino 3 — Aminomethyl 3, 5, 5 _ Trimethylsilicon
- ATU has a melting point of 47-48 ° C containing a spiro ring in the molecule and an active hydrogen equivalent of 68.6, but the commercially available product is a trademark of Epomelet, and can be used with various modified liquid curing agents.
- phenols used in the above-mentioned Mannich denaturation method include phenol, alkyl-substituted phenol, cresol, and phenol-substituted phenol.
- Anisol, bisphenol-A, bisphenol-F and mixtures thereof are typical examples, and are used in the Mannich denaturation method described in the above.
- the compound having a carbonyl group for example, formaldehyde, NO.
- Representative examples are Laholmaldehyde, Aceta j-redehyde, Benza J-rehdehyde, Rhoseth, and their mixtures, etc., for each of which other funnels and others Can also be used.
- Epoxy compounds used in the above-mentioned epoxy compound addition modification method include, for example, various epoxy resins exemplified as the epoxy resin (A) and reactive diluents for the epoxy resin. Examples include the various epoxy compounds and the like. Examples of the substituted or unsubstituted acryl compounds that can be used in the above-mentioned Michael addition modification method include, for example, acrylic acid, methacrylic acid, and acrylic acid. Representative examples include chloronitrile, acrylyl mid, esteryl acrylate, and methacrylate, and in each case, other epoxy compounds and other substitutions or other substitutions. Unsubstituted factor A lil compound can also be used.
- Other polycarboxylic acids can also be used.
- the polythiol compound curing agent (B-3) is a polythiol compound having at least two mercapto groups (one SH), and is used as such a polythiol compound curing agent (B_3).
- a preferred group is an ester compound of an organic carboxylic acid (B-3-11) having at least one mercapto group and a polyhydroxyl compound (B-3-1-2). B—3—1).
- organic carboxylic acids (B-3-1-11) include, for example, mercaptoacetic acid,) 9-mercaptopropionic acid, 0-mercaptobenzoic acid, thioglycolic acid and the like.
- Organic carboxylic acids having at least two mercapto groups and organic carboxylic acids having at least two or more mercapto groups such as, for example, dimercaptoaliphatic carboxylic acids;
- Examples of the polyhydroxyl compound (B—3-1—2) include ethylene glycol, diethyl glycol, poly (oxyethylene) glycol, and propylene glycol.
- poly (oxyfif "rovilene") glycol polyoxyethylene polyoxypropylene glycol, prono, 1,3-diol, Butane 1, 4 —diol, polyoxybutyl Renglycol, pentane-1,5—diol, hexane-1,6, -diol, hexane-1,2,4,6—triol, hexane-1,1, 2,6-Triol, Hexane 1, 2, 2-5-Triol, glycerin, 1, 1, 1-Trimethylol pronoun, Pentaeri Trit, poly (ebichlorohydrin), sorbit, mannite and the above-mentioned polyhydric alcohols include, for example, ethylenoxide or Z and And polyoxyalkylene polyols obtained by adding alkylenoxysides such as propylene glycol and the like.
- Another preferable group of the polythiol compound curing agent (B-3) is a hydroxyyl compound (B-3-2-1) having one or more mercapto groups. It is an ester compound (B-3-2) with carboxylic acid (B-3-2-2).
- Examples of the above-mentioned hydroxy compound (B—3—2—1) include, for example, 2—mercaptoethanol, 1—mercapto1-2—prono2 ”, 2— Melcapto isoprol.Nor, 3—Melcaptobutanol, 4—Melcaptobutanol, 3—Melcapto1-1,2—Ppi.
- 1-Fe-N-Lu 2 Merucaptoethanol, 0_Melkafu, toluenol and other hydroxy compounds having at least one mercapto group.
- polycarboxylic acid B-3-2-2
- Another preferred group of the above-mentioned polycompound-based curing agent (B_3) is a polyepoxy compound (B-3-3-1-1) and a hydrogen sulfide or polythiol compound (B--3).
- 3-3-2) is a polythiol compound (B_3-3) obtained by the reaction with a polyepoxy compound (C-3-3-1).
- polythiol compound-based curing agents (B-3) another preferred group is obtained by reacting the above-mentioned polyhydroxyl compound (B_3-4-11-1) with epichlorohydrin.
- Compounds exemplified as the xyl compound (B-3_1-2) are exemplified.
- polythiol compound curing agents (B-3) another preferred group is, for example, dithioterephthalic acid, 2,2′-dimercapto-ethylether, liquid polysulfide resin, Polyalkylene olepolole having a rucaptan group at the end, poly (thiol) compound obtained by the reaction of bis (dichloroethyl) formal with sodium polysulfide (B— 3-5).
- the catalyst (D) that promotes the reaction between the epoxy group and the mercaptan group used in the present invention uses the epoxy compound curing agent (B-1) as the epoxy resin curing agent (B).
- a polythiol compound curing agent (B-3) is used as the epoxy resin curing agent (B).
- a catalyst (D) include, in addition to the amine compound hardener exemplified as the epoxy resin hardener (B) of ⁇ , for example, di-n-butylamine and N-methylcyclohexane. Hexinole, pyridine, picolin, dimethyl, dimethyl, dimethylamino, p-cresole, N, N'-dimension j Rare ethylene mins and screws (4—methyl diene mino sq.
- the amount of the epoxy resin curing agent (B) to be added is such that the active hydrogen contained in the epoxy resin curing agent (B) is 0.5 to 2.0 with respect to one equivalent of the epoxy group contained in the epoxy resin (A).
- An amount equivalent to the equivalent is preferred, and particularly an amount equivalent to 0.7 to 1.5 equivalent is preferred. If the amount is too small, curing will be slow, and if it is too large, a desired flexible cured product cannot be obtained, which is not preferable.
- the amount of the catalyst (D) may be selected according to the amount of the polythiol compound curing agent (III-3) contained in the curable epoxy resin composition of the present invention. 0.1 to 10 parts by weight, especially 1 to 7 parts by weight, is preferred.
- Examples of the moisture-absorbing or adsorbing material (C) to be incorporated into the curable epoxy resin composition of the present invention include, for example, activated carbon, activated alumina, and silica gel: , Merlino , Jismondin, amisite, gallonite, gobinsite, narushimu, iraikite, borinjyait, romoitaito, ugagawaraite, Shiano N Site, Wilhenda Sonite, Gummerinite, Forgersite, Elyonite, Talent Freight, Levine, Mazatite, Nat Alpha Light, Teto La soda dolphite, no, la soda dolphite, mesolite, scole site, tomsonite, gonaldite, editing tonite, mordenite, dachcaldite, ebisu Line light, ferrite, biquitite, hyurlandite, clino petit mouth light, stele site, stele light, valley light G Natural lite
- Synthetic zeolites such as Zeolite D, Zeolite Ding, Zeolite bL, Zeolite hW, Zeolite C; for example, polyacrylic acid salt Crosslinked product, hydrolyzate of starch-acrylonitrile-graphite copolymer, neutralized product of starch-acrylic acid-graphite polymer, and vinyl acetate copolymer Hygroscopic polymers, such as modified products, modified cross-linked polyvinyl alcohol, partially neutralized cross-linked polyacrylic acid, cross-linked isobutylene-maleic anhydride copolymer, etc .; Other moisture-absorbing or adsorbing materials such as activated clay such as montmorillonite, neu-sigma-fillite, neudelite, nontronite and saponite can be used.
- moisture-absorbing or adsorbing materials preferred ones have not only hygroscopicity but also adsorptiveness, and particularly preferred are activated carbon and zeolite.
- activated carbon and zeolite particularly preferred are activated carbon and zeolite.
- some advance The above-mentioned adsorbing material on which the 557 component is adsorbed can also be used.
- the amount of the moisture absorbing or adsorbing material (C) is preferably from 10 to 200% by weight, particularly preferably from 20 to 50% by weight, based on 100 parts by weight of the epoxy resin. If the amount is too small, the desired moisture absorption or adsorption performance of the cured product will not be sufficiently exhibited. If the amount is too large, a cured product having desired mechanical strength and other physical properties will not be obtained.
- the curable epoxy resin composition of the present invention further comprises a foaming agent (E), and while being foamed, is cured to form a foamed cured product.
- a cured resin can be obtained.
- the foaming agent (E) include azo compounds such as azobisisobutyronitrile, azozical carbonyl, azobisformol, azobisaminobenzen and the like; , N'-Dinitrosopentamethylene L-tetramine, N, N'-dimethylone;, N'-Nitroso compound such as dinitrosoterephthalate; benzene Hydrazide compounds such as sulfonylhydrazide, toluenesulfonylhydrazide, p, '-oxobis (benzenesulfonylhydrazide); for example, methylhydrazine siloxane
- Other organic foaming agents such as ethylene; inorganic foaming agents such as sodium hydrogencarbonate
- foaming can also be performed with carbon dioxide generated by the reaction between polyisocyanate and water.
- the curable epoxy resin composition of the present invention can contain other inorganic fillers.
- inorganic fillers include epoxy resins. Fillers used for paints, adhesives, sealing materials, etc. of oxy resin can be used. Examples of such inorganic fillers include titanium dioxide, magnesium oxide, and zirconium oxide. And inorganic oxides such as aluminum oxide, inorganic sulfates such as barium sulfate, carbonated calcium, silica, clay, talc and the like.
- an auxiliary agent such as a surfactant or an antifoaming agent for the purpose of defoaming can be used. If the amount used is small, the epoxy resin of the present invention can be used. The intended performance of the composition is not impaired.
- additives can further be used in the backoxy resin composition of the present invention.
- additives include coloring pigments such as red stalks, graphite, yellow iron oxide, titanium white, phthalocyanine blue, phthalocyanine green, etc .; , Molybdenic acid, phosphoric acid, boric acid, fluoride, lead oxide, etc .; anti-pigment pigments; for example, Las Flakes, Stainless Flakes, Flake pigments such as flakes; fibrous materials such as asbestos, vegetable fibers, glass fibers, carbon fibers, and synthetic fibers; for example, cuprous oxide, triphenyltin high Antioxidants such as oxides, bis-tributyl-tin, etc.
- chelating agents such as ethylenediamine tetraacetic acid
- copper powder, copper alloy powder, zinc powder, aluminum Metal powders such as nickel powder, iron powder, etc . for example, AChlopro Build Trimethyxylene, Talk U SJ F.
- the epoxy resin composition of the present invention is prepared by, for example, mixing a moisture absorbing or adsorbing material, an inorganic filler, a diluent, etc., with an epoxy resin in advance using a dispersing machine such as a sand mill or a three-roll, and dispersing them uniformly.
- a dispersing machine such as a sand mill or a three-roll
- the curable epoxy resin composition of the present invention can be used, for example, as a sealing material, a coating agent, a casting agent, a molding agent, a dipping material, and an adhesive.
- a sealing material for example, as a sealing material, a coating agent, a casting agent, a molding agent, a dipping material, and an adhesive.
- the moisture absorption / desorption function, deodorization function, sustained release function, and other various air absorption / desorption functions of the cured product for example, for a sealed multi-layer window Spacers, automotive interior materials, freshness preserving materials, numbering materials, materials for preventing deterioration of stored substances, materials for preventing water droplet adhesion, long-term preservation materials for fruits and vegetables, storage and warehouse interior materials, deodorizing materials, vehicle interior materials, special Ingredient-carrying materials (fungicide, freshness preserving agent, guard, pesticide, antibacterial agent, etc.), anti-condensation material, humidity control material, wall material, wall decoration material, soundproofing
- the epoxy resin curing agent and the catalyst were uniformly mixed in advance, and this mixture, the epoxy resin, and the moisture-absorbing material were mixed with a mixer to obtain an epoxy resin composition having the components and the amounts shown in Table 11.
- the obtained composition was cured at room temperature to obtain a 50 x 50 x 3 mm plate-shaped molded body.
- FIG. 11 shows the rate of change in weight with respect to the initial dry weight when this plate-like compact was immersed in ion-exchanged water at room temperature.
- the main components in Table 11 are as follows.
- Epoxy resin (1) Bisphenol I-north F-type epoxy resin
- Epoxy resin curing agent (1) Polyamide amine epoxy resin hardener (EH-351 manufactured by Asahi Denka Kogyo Co., Ltd.)
- Catalyst (1) Tertiary amine catalyst
- FIG. 1 shows the weight change rate in the case of only the moisture absorption or the adsorption material (1) as Comparative Example 5. Examples 4 to 5
- FIG. 12 shows the rate of change in weight with respect to the initial dry weight when this plate-like compact was immersed in ion-exchanged water at room temperature.
- the main components in Table 1 are as follows.
- Epoxy resin (1) Same as epoxy resin (1) in Table 1.
- Epoxy resin curing agent (1) Same as epoxy resin curing agent (1) in Table-1.
- End catalyst (1) Same as the end catalyst (1) in Table-1.
- Hygroscopic or adsorbent material (1) Same as hygroscopic or adsorbent material (1) in Table-1.
- Blowing agent (1) p, p'-oxybis (benzenesulfonyl hydrazide) P JP95 / 01557
- epoxy resin compositions of the present invention having the components and amounts shown in Table 13 were obtained.
- the resulting composition was cured at room temperature to form a 50 ⁇ 50 ⁇ 3 mm plate-like molded body.
- the results of evaluating the water absorption of this plate-like molded body according to JIS K709 are shown.
- the water absorption was evaluated for the water absorption in 23: water and the water absorption in boiling water.
- the water absorption is defined as the weight change per unit surface area (mg / cm2).
- the dried test specimen was immersed in boiling water for 30 minutes, cooled in room temperature water for 15 minutes, and the water absorption was measured as “water absorption A” .
- the dried test specimen was placed in 23 ion-exchanged water.
- the water absorption after immersion for 4 hours is expressed as "water absorption B".
- Epoxy resin (1) Same as epoxy resin (1) in Table-1.
- Epoxy resin curing agent (2) Polythiol type I epoxy resin curing agent (Eh-317 manufactured by Asahi Denka Kogyo Co., Ltd.)
- Ammine catalyst (1) Same as the ammine catalyst (1) in Table-1.
- Hygroscopic or adsorbent material (1) Same as hygroscopic or adsorbent material (1) in Table-1.
- Moisture-absorbing or adsorbing material (2) Same as moisture-absorbing or adsorbing material (2) in Table-2.
- Hygroscopic or adsorbent material (3) series force gel powder u
- Moisture absorption or adsorption material (4) Activated alumina powder.
- Hygroscopic or adsorbent material (5) Water-absorbing polymer powder.
- epoxy resin compositions of the present invention comprising the components and the amounts shown in Tables 1 and 4 were obtained.
- the obtained composition was cured at room temperature to obtain a foam molded article.
- the apparent density and the thermal conductivity were evaluated in order to evaluate the heat insulation of the obtained foamed molded article.
- the results are shown in the table.
- PT / JP95 / 01557 A decrease in apparent density and a decrease in thermal conductivity due to foaming were confirmed.
- the main components in Tables 4 and 5 are as follows.
- Epoxy resin (1) Epoxy resin (1) same as 1 epoxy resin (1) Bisphenol A-type epoxy resin (Asahi Denka Kogyo Co., Ltd. EP-100) Epoxy resin curing agent (1) Same as epoxy resin curing agent (1) in Table-1
- Min catalyst (1) Same as Min catalyst (1) in Table-1.
- Hygroscopic or adsorbent material Same as hygroscopic or adsorbent material (1) in Table-1
- Blowing agent (1) Same as blowing agent (1) in Table-2.
- Blowing agent (1) 0 1.7 4.4 9.0 19 0 Apparent density 1.082 0.686 0.373 0.313 0.363 1.080 (g / cm 3 )
- Bisphenol F-type epoxy epoxy resin was obtained by uniformly mixing the following components with a mixer to obtain the composition of the present invention.
- the obtained composition was molded into a plate of 100 ⁇ 100 ⁇ 3 mm to obtain an odor test piece. Then, a gasket with a volume of about 100 ⁇ 1, which is sealed except for nozzles for gas flow, is attached? After introducing the test piece into the Z-polyethylene laminating bag, set it as an odor component. Fill it with 800 ml of nitrogen gas mixed with 300 ppm of aldehyde, and wait for a predetermined time. The concentration of aldehyde was determined. The concentration of the odorous gas component was determined using a gas u-matograph. The results are shown in Table 16. 7 Table 1 6
- a epoxy resin composition of the present invention having the components and amounts shown in Table 7 was obtained.
- the obtained composition is cured and molded to form a 50 x 50 x 3 mm plate, and the molded plate is placed in a constant temperature / humidity box, and the weight change due to moisture absorption after one week and one month has elapsed. The weight change rate was determined, and the moisture absorption performance was evaluated.
- Weight change rate is also defined as weight change per unit area (mg / cm 2 ).
- the temperature was kept constant at 50 t, and the relative humidity was evaluated at 30% and 80%, respectively.
- Table 17 shows the conditions and results. The main components in Table 17 are as follows.
- Epoxy resin (1) Same as epoxy resin (1) in Table-1.
- Epoxy resin curing agent (2) Same as epoxy resin curing agent (2) in Table-3.
- Rin curing agent Same as Amin curing II (1) in Table 1.
- Hygroscopic or adsorbent material Same as hygroscopic or adsorbent material in Table 1 1).
- Hygroscopic or adsorbent material (2) Same as hygroscopic or adsorbent material (2) in Table 1.
- an epoxy resin composition which can be cured at room temperature and which can be used as a coating material, a sealing material, an adhesive, etc., which gives a cured product having hygroscopicity or adsorptivity, is obtained. It can be used in many applications that take advantage of the hygroscopic or adsorptive properties of materials.
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1995/001557 WO1997006199A1 (fr) | 1995-08-04 | 1995-08-04 | Composition solidifiable de resine epoxy |
EP95927973A EP0870790A1 (en) | 1995-08-04 | 1995-08-04 | Curable epoxy resin composition |
AU31910/95A AU3191095A (en) | 1995-08-04 | 1995-08-04 | Curable epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1995/001557 WO1997006199A1 (fr) | 1995-08-04 | 1995-08-04 | Composition solidifiable de resine epoxy |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997006199A1 true WO1997006199A1 (fr) | 1997-02-20 |
Family
ID=14126151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1995/001557 WO1997006199A1 (fr) | 1995-08-04 | 1995-08-04 | Composition solidifiable de resine epoxy |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0870790A1 (ja) |
AU (1) | AU3191095A (ja) |
WO (1) | WO1997006199A1 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000143864A (ja) * | 1998-11-13 | 2000-05-26 | Inst Fr Petrole | 少なくとも1つの熱可塑性ポリマ―と、少なくとも1つの改質エポキシ樹脂と、少なくとも1つの発泡剤とを含む胞状物材料 |
EP0899300A3 (en) * | 1997-08-26 | 2000-12-06 | Nissan Motor Co., Ltd. | Epoxy resin type composition for stiffening vehicle body |
JP2007210224A (ja) * | 2006-02-10 | 2007-08-23 | Toray Ind Inc | 繊維系ボード |
JP2007302753A (ja) * | 2006-05-10 | 2007-11-22 | Toho Earthtech Inc | アミン系硬化剤組成物 |
JP2008133404A (ja) * | 2006-11-29 | 2008-06-12 | Yokohama Rubber Co Ltd:The | 接着剤組成物 |
JP2008133400A (ja) * | 2006-11-29 | 2008-06-12 | Yokohama Rubber Co Ltd:The | エポキシ接着剤組成物 |
JP2014534310A (ja) * | 2011-10-24 | 2014-12-18 | インスティトゥト キミク デ サリア セッツ ファンダシオ プリバーダ | 接着剤組成物 |
KR101625390B1 (ko) | 2016-01-11 | 2016-05-30 | 최종남 | 고기능성의 건축·토목 자재용 frp 및 이로부터 제조된 frp 전주 |
WO2018159564A1 (ja) * | 2017-02-28 | 2018-09-07 | 味の素株式会社 | 樹脂組成物 |
CN113003647A (zh) * | 2021-03-25 | 2021-06-22 | 深圳市南峰水处理服务有限公司 | 一种环保型除菌复合水处理剂及制备方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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NL1009134C2 (nl) * | 1998-05-12 | 1999-08-24 | Vincent Alfred Joseph Woudsma | Werkwijze voor het repareren c.q. opvullen c.q. verlijmen c.q. beschermen van organische of anorganische materialen d.m.v. menging en/of verdunning van elastische uithardbare epoxy gebaseerde producten. |
JP4438207B2 (ja) * | 2000-02-24 | 2010-03-24 | 三菱マテリアル株式会社 | 表面処理シリカ粉末及びその製造方法 |
AU2003264680A1 (en) * | 2003-07-02 | 2005-02-25 | Arkema | Method for production of objects from thermosetting resins |
KR100886600B1 (ko) | 2006-01-02 | 2009-03-05 | 아르끄마 프랑스 | 열경화성 수지로부터의 대상물의 제조 방법 |
DE202013012732U1 (de) | 2012-12-11 | 2018-12-18 | Fischerwerke Gmbh & Co. Kg | Epoxybasierte Masse für Befestigungszwecke |
DE102017105312A1 (de) * | 2017-03-13 | 2018-09-13 | Werner Klockemann | Thio-Epoxidharze und Verfahren zu Ihrer Herstellung |
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JPS54148896A (en) * | 1978-05-15 | 1979-11-21 | Asahi Chem Ind Co Ltd | Epoxy resin composition for curing wet surface |
JPS63312317A (ja) * | 1987-06-15 | 1988-12-20 | Asahi Denka Kogyo Kk | エポキシ樹脂組成物 |
JPH01197553A (ja) * | 1988-02-02 | 1989-08-09 | Catalysts & Chem Ind Co Ltd | 発泡用エポキシ樹脂組成物 |
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CA2031128A1 (en) * | 1989-12-01 | 1991-06-02 | Yoshio Ishida | Two-component epoxy resin compositions |
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- 1995-08-04 EP EP95927973A patent/EP0870790A1/en not_active Withdrawn
- 1995-08-04 AU AU31910/95A patent/AU3191095A/en not_active Abandoned
- 1995-08-04 WO PCT/JP1995/001557 patent/WO1997006199A1/ja not_active Application Discontinuation
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JPS52109553A (en) * | 1976-03-12 | 1977-09-13 | Nitsusou Kenzai Kougiyou Kk | Water containing epoxy resin |
JPS60106826A (ja) * | 1983-11-15 | 1985-06-12 | Denki Kagaku Kogyo Kk | 半導体装置封止用エポキシ樹脂組成物 |
JPS6166762A (ja) * | 1984-09-08 | 1986-04-05 | Somar Corp | 粉体塗料用エポキシ樹脂組成物 |
JPS61133228A (ja) * | 1984-11-30 | 1986-06-20 | Hitachi Chem Co Ltd | エポキシ樹脂の硬化方法 |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0899300A3 (en) * | 1997-08-26 | 2000-12-06 | Nissan Motor Co., Ltd. | Epoxy resin type composition for stiffening vehicle body |
JP2000143864A (ja) * | 1998-11-13 | 2000-05-26 | Inst Fr Petrole | 少なくとも1つの熱可塑性ポリマ―と、少なくとも1つの改質エポキシ樹脂と、少なくとも1つの発泡剤とを含む胞状物材料 |
JP2007210224A (ja) * | 2006-02-10 | 2007-08-23 | Toray Ind Inc | 繊維系ボード |
JP2007302753A (ja) * | 2006-05-10 | 2007-11-22 | Toho Earthtech Inc | アミン系硬化剤組成物 |
JP2008133404A (ja) * | 2006-11-29 | 2008-06-12 | Yokohama Rubber Co Ltd:The | 接着剤組成物 |
JP2008133400A (ja) * | 2006-11-29 | 2008-06-12 | Yokohama Rubber Co Ltd:The | エポキシ接着剤組成物 |
JP2014534310A (ja) * | 2011-10-24 | 2014-12-18 | インスティトゥト キミク デ サリア セッツ ファンダシオ プリバーダ | 接着剤組成物 |
KR101625390B1 (ko) | 2016-01-11 | 2016-05-30 | 최종남 | 고기능성의 건축·토목 자재용 frp 및 이로부터 제조된 frp 전주 |
WO2018159564A1 (ja) * | 2017-02-28 | 2018-09-07 | 味の素株式会社 | 樹脂組成物 |
CN113003647A (zh) * | 2021-03-25 | 2021-06-22 | 深圳市南峰水处理服务有限公司 | 一种环保型除菌复合水处理剂及制备方法 |
CN113003647B (zh) * | 2021-03-25 | 2022-08-26 | 深圳市南峰水处理服务有限公司 | 一种环保型除菌复合水处理剂及制备方法 |
Also Published As
Publication number | Publication date |
---|---|
EP0870790A4 (ja) | 1998-11-04 |
EP0870790A1 (en) | 1998-10-14 |
AU3191095A (en) | 1997-03-05 |
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