WO1997002905A1 - Procede et equipement de lavage de lingots de silicium a l'eau pour eliminer les matieres particulaires - Google Patents

Procede et equipement de lavage de lingots de silicium a l'eau pour eliminer les matieres particulaires Download PDF

Info

Publication number
WO1997002905A1
WO1997002905A1 PCT/US1996/011627 US9611627W WO9702905A1 WO 1997002905 A1 WO1997002905 A1 WO 1997002905A1 US 9611627 W US9611627 W US 9611627W WO 9702905 A1 WO9702905 A1 WO 9702905A1
Authority
WO
WIPO (PCT)
Prior art keywords
ingot
water
washing
set forth
particulate matter
Prior art date
Application number
PCT/US1996/011627
Other languages
English (en)
Inventor
Yoshihiro Suzuki
Koichi Kato
Keiichi Takami
Ryoichi Kawamura
Takehiro Watanabe
Masahiro Kosako
Original Assignee
Memc Electronic Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials, Inc. filed Critical Memc Electronic Materials, Inc.
Priority to US09/000,061 priority Critical patent/US6006736A/en
Priority to GB9800212A priority patent/GB2318075B/en
Priority to DE19681497T priority patent/DE19681497T1/de
Publication of WO1997002905A1 publication Critical patent/WO1997002905A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing

Definitions

  • a method for preparing semiconductor wafers from monocrystailine ingots comprises the steps of mounting the ingot on a holder.
  • the ingot is sliced through at closely spaced longitudinal intervals thereby forming slits, each pair of slits defining a semiconductor wafer in the ingot.
  • the sliced ingot is washed with water to remove particulate matter from the ingot which was generated during the step of slicing through the ingot and adhered to the ingot and which accumulates in the slits.
  • Washing the ingot with detergent chemically removes particulate matter remaining following the step of washing the ingot with water.
  • the step of washing the ingot with detergent occurs after said step of washing the ingot with water.
  • the wafers are then separated from the holder for further individual processing of the wafers.
  • Figure 4 is an enlarged fragmentary elevation of the pre-washing machine of Figure 2 showing a holder arm supporting the ingot at the right end of sliced silicon ingot;
  • the holder arms 8 are formed as shown in Figures 4 and 5, and pivotally mounted on respective brackets 8a attached to the upper frame portion 10b of the pre-washing machine 10. Together the holder arms 8 and brackets 8a constitute "supports" in the preferred embodiment. Air-cylinders 9 mounted on the brackets 8a are operable to pivot the holder arms between a lowered position (as shown in Fig. 4) and a raised position (as shown in Figure 5) .
  • the nozzles 12a, 12b and 12d-g are preferably arranged at angles of between about 60° and 90° toward the horizontal from a downward direction.
  • the nozzle 12c is angled upwardly from the horizontal to spray the underside of the holder 3 and the carbon block 4.
  • the pump 13 preferably delivers water to each nozzle 12a - g at a pressure of in the range of about 10-30 k9 / cm 2 and each of the nozzles delivers water to the ingot 2 in jets at a rate in the range of about 5-10 ll ers / m ⁇ nute .
  • the spray angle of the jets from the nozzles 12a - g is preferably selected to be between 30° and 120°. The jets penetrate the slits 5 and flush away much of the particulate matter from the ingot.
  • the nozzles 12a - g mounted on the supporting arm 15 are reciprocated by a carrying device 16 between the position of the arm 15 denoted by a solid line and the position of the arm 15a denoted by a dotted line in Figure 2.
  • the supporting arm 15 carries the nozzles 12a - g over the entire length of the ingot 2 three to four times over a period of about 10 minutes.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

La présente invention concerne un procédé et un équipement de lavage d'un lingot de silicium scié (2), qui réduisent la consommation du détergent utilisé pour nettoyer le lingot (2) après le sciage pour former des plaquettes distinctes de semi-conducteur (1). Le lingot (2) est pris comme une unité montée sur un support (3), après le sciage, pour l'amener à une machine de prélavage. Cette machine projette des jets (12) d'eau chaude ou très chaude sur le lingot (2). Les projections d'eau enlèvent une grande partie de la poussière. Ainsi, quand le lingot (2) est ensuite lavé avec un détergent, il y a moins de poussière à enlever, ce qui accroît la durée de vie efficace d'une quantité donnée de détergent.
PCT/US1996/011627 1995-07-12 1996-07-12 Procede et equipement de lavage de lingots de silicium a l'eau pour eliminer les matieres particulaires WO1997002905A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US09/000,061 US6006736A (en) 1995-07-12 1996-07-12 Method and apparatus for washing silicon ingot with water to remove particulate matter
GB9800212A GB2318075B (en) 1995-07-13 1996-07-12 Method and apparatus for washing silicon ingot with water to remove particulate matter
DE19681497T DE19681497T1 (de) 1995-07-13 1996-07-12 Verfahren und Vorrichtung zum Waschen von Siliciumblöcken mit Wasser zur Entfernung von partikulärem Material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7/201745 1995-07-13
JP7201745A JPH0936080A (ja) 1995-07-13 1995-07-13 加工済シリコンインゴットの洗浄方法

Publications (1)

Publication Number Publication Date
WO1997002905A1 true WO1997002905A1 (fr) 1997-01-30

Family

ID=16446246

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1996/011627 WO1997002905A1 (fr) 1995-07-12 1996-07-12 Procede et equipement de lavage de lingots de silicium a l'eau pour eliminer les matieres particulaires

Country Status (5)

Country Link
JP (1) JPH0936080A (fr)
KR (1) KR19990028611A (fr)
DE (1) DE19681497T1 (fr)
GB (1) GB2318075B (fr)
WO (1) WO1997002905A1 (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6509672B2 (en) * 2000-04-01 2003-01-21 Robert Bosch Gmbh Method and apparatus for charging a piezoelectric element
DE19742680B4 (de) * 1997-09-26 2006-03-02 Siltronic Ag Reinigungsverfahren für scheibenförmiges Material
WO2007051356A1 (fr) * 2005-11-07 2007-05-10 Jianzhong Yuan Procédé de traitement d’une plaquette de silicium utilisée pour une cellule solaire
DE102008004548A1 (de) 2008-01-15 2009-07-16 Rec Scan Wafer As Waferstapelreinigung
WO2009114043A1 (fr) * 2008-03-07 2009-09-17 Automation Technology, Inc. Systèmes, appareils et procédés de nettoyage de galette solaire
CN102275234A (zh) * 2011-06-29 2011-12-14 浙江光益硅业科技有限公司 单晶/多晶硅片多线切割自动脱胶方法及其装置
CN102514113A (zh) * 2012-01-06 2012-06-27 无锡市奥曼特科技有限公司 一种全自动硅棒粘胶板脱胶设备
CN105642619A (zh) * 2015-03-04 2016-06-08 张磊 一种开方洗吹松动机
CN108515628A (zh) * 2018-07-12 2018-09-11 颜涛 一种用于玻璃切割及清洗的装置
CN112440394A (zh) * 2020-11-18 2021-03-05 连城凯克斯科技有限公司 一种线切机提料过程用自动喷淋装置
CN112871813A (zh) * 2019-11-29 2021-06-01 隆基绿能科技股份有限公司 一种切片机清洗方法和清洗装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06314070A (ja) * 1992-09-24 1994-11-08 Shiina:Kk ボラード及びそれを用いた誘導装置
DE69900914T2 (de) * 1998-06-08 2002-11-28 Memc Electronic Materials Verfahren zur überwachung der konzentration von metallischen verunreinigungen in einer reinigungslösung für wafer
US6481447B1 (en) * 2000-09-27 2002-11-19 Lam Research Corporation Fluid delivery ring and methods for making and implementing the same
KR20030035152A (ko) 2001-10-30 2003-05-09 주식회사 하이닉스반도체 반도체웨이퍼 제조방법
DE102009035343A1 (de) 2009-07-23 2011-01-27 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Reinigung von Substraten an einem Träger
DE102009035341A1 (de) 2009-07-23 2011-01-27 Gebr. Schmid Gmbh & Co. Vorrichtung zur Reinigung von Substraten an einem Träger
KR101064268B1 (ko) * 2011-04-05 2011-09-14 한국생산기술연구원 와이어소에 설치되는 웨이퍼지지장치
KR101428585B1 (ko) * 2013-04-24 2014-08-12 한국에너지기술연구원 와이어 소를 이용한 반도체 웨이퍼 절단 방법 및 장치
KR102221914B1 (ko) * 2018-12-03 2021-03-03 일륭기공(주) 샤프트 조인트에 구비된 스플라인 홈 이물질 제거 장치
CN112846920A (zh) * 2021-02-08 2021-05-28 南京铁道职业技术学院 一种机械设备加工工件清洗装置

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US4484417A (en) * 1982-11-22 1984-11-27 W. J. Savage Company Sawing apparatus
US4619081A (en) * 1985-02-28 1986-10-28 General Signal Corporation Combined nozzle with air foil
EP0269997A2 (fr) * 1986-11-28 1988-06-08 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Procédé et dispositif de correction de la direction de coupe pour scier des tiges ou blocs de cristal
US4941489A (en) * 1987-05-06 1990-07-17 Dan Science Co., Ltd. Carrier cleaning and drying apparatus
US4949700A (en) * 1987-12-17 1990-08-21 Tokyou Seimitsu Co., Ltd. Ingot support device in slicing apparatus
US4997490A (en) * 1990-08-02 1991-03-05 Bold Plastics, Inc. Method of cleaning and rinsing wafers
US5186192A (en) * 1990-12-14 1993-02-16 Shin-Etsu Handotai Co., Ltd. Apparatus for cleaning silicon wafer
US5421905A (en) * 1991-04-02 1995-06-06 Tokyo Electron Limited Method for washing wafers
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
US5447890A (en) * 1993-03-24 1995-09-05 Shin-Etsu Handotai Co., Ltd. Method for production of wafer
US5484326A (en) * 1992-11-30 1996-01-16 Shin-Etsu Handotai Company, Ltd. Semiconductor ingot machining method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5950643A (en) * 1995-09-06 1999-09-14 Miyazaki; Takeshiro Wafer processing system

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4484417A (en) * 1982-11-22 1984-11-27 W. J. Savage Company Sawing apparatus
US4619081A (en) * 1985-02-28 1986-10-28 General Signal Corporation Combined nozzle with air foil
EP0269997A2 (fr) * 1986-11-28 1988-06-08 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Procédé et dispositif de correction de la direction de coupe pour scier des tiges ou blocs de cristal
US4941489A (en) * 1987-05-06 1990-07-17 Dan Science Co., Ltd. Carrier cleaning and drying apparatus
US4949700A (en) * 1987-12-17 1990-08-21 Tokyou Seimitsu Co., Ltd. Ingot support device in slicing apparatus
US4997490A (en) * 1990-08-02 1991-03-05 Bold Plastics, Inc. Method of cleaning and rinsing wafers
US5186192A (en) * 1990-12-14 1993-02-16 Shin-Etsu Handotai Co., Ltd. Apparatus for cleaning silicon wafer
US5421905A (en) * 1991-04-02 1995-06-06 Tokyo Electron Limited Method for washing wafers
US5484326A (en) * 1992-11-30 1996-01-16 Shin-Etsu Handotai Company, Ltd. Semiconductor ingot machining method
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
US5447890A (en) * 1993-03-24 1995-09-05 Shin-Etsu Handotai Co., Ltd. Method for production of wafer

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19742680B4 (de) * 1997-09-26 2006-03-02 Siltronic Ag Reinigungsverfahren für scheibenförmiges Material
US6509672B2 (en) * 2000-04-01 2003-01-21 Robert Bosch Gmbh Method and apparatus for charging a piezoelectric element
WO2007051356A1 (fr) * 2005-11-07 2007-05-10 Jianzhong Yuan Procédé de traitement d’une plaquette de silicium utilisée pour une cellule solaire
WO2009091264A3 (fr) * 2008-01-15 2009-10-01 Rec Scanwafer As Nettoyage d'une pile de tranches
WO2009091264A2 (fr) * 2008-01-15 2009-07-23 Rec Scanwafer As Nettoyage d'une pile de tranches
DE102008004548A1 (de) 2008-01-15 2009-07-16 Rec Scan Wafer As Waferstapelreinigung
WO2009114043A1 (fr) * 2008-03-07 2009-09-17 Automation Technology, Inc. Systèmes, appareils et procédés de nettoyage de galette solaire
CN102275234A (zh) * 2011-06-29 2011-12-14 浙江光益硅业科技有限公司 单晶/多晶硅片多线切割自动脱胶方法及其装置
CN102514113A (zh) * 2012-01-06 2012-06-27 无锡市奥曼特科技有限公司 一种全自动硅棒粘胶板脱胶设备
CN105642619A (zh) * 2015-03-04 2016-06-08 张磊 一种开方洗吹松动机
CN108515628A (zh) * 2018-07-12 2018-09-11 颜涛 一种用于玻璃切割及清洗的装置
CN112871813A (zh) * 2019-11-29 2021-06-01 隆基绿能科技股份有限公司 一种切片机清洗方法和清洗装置
CN112440394A (zh) * 2020-11-18 2021-03-05 连城凯克斯科技有限公司 一种线切机提料过程用自动喷淋装置

Also Published As

Publication number Publication date
JPH0936080A (ja) 1997-02-07
DE19681497T1 (de) 1998-12-17
GB2318075A (en) 1998-04-15
GB2318075B (en) 1999-03-03
KR19990028611A (ko) 1999-04-15
GB9800212D0 (en) 1998-03-04

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