DE19681497T1 - Verfahren und Vorrichtung zum Waschen von Siliciumblöcken mit Wasser zur Entfernung von partikulärem Material - Google Patents
Verfahren und Vorrichtung zum Waschen von Siliciumblöcken mit Wasser zur Entfernung von partikulärem MaterialInfo
- Publication number
- DE19681497T1 DE19681497T1 DE19681497T DE19681497T DE19681497T1 DE 19681497 T1 DE19681497 T1 DE 19681497T1 DE 19681497 T DE19681497 T DE 19681497T DE 19681497 T DE19681497 T DE 19681497T DE 19681497 T1 DE19681497 T1 DE 19681497T1
- Authority
- DE
- Germany
- Prior art keywords
- water
- particulate material
- remove particulate
- silicon blocks
- washing silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7201745A JPH0936080A (ja) | 1995-07-13 | 1995-07-13 | 加工済シリコンインゴットの洗浄方法 |
PCT/US1996/011627 WO1997002905A1 (en) | 1995-07-13 | 1996-07-12 | Method and apparatus for washing silicon ingot with water to remove particulate matter |
Publications (1)
Publication Number | Publication Date |
---|---|
DE19681497T1 true DE19681497T1 (de) | 1998-12-17 |
Family
ID=16446246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19681497T Withdrawn DE19681497T1 (de) | 1995-07-13 | 1996-07-12 | Verfahren und Vorrichtung zum Waschen von Siliciumblöcken mit Wasser zur Entfernung von partikulärem Material |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH0936080A (de) |
KR (1) | KR19990028611A (de) |
DE (1) | DE19681497T1 (de) |
GB (1) | GB2318075B (de) |
WO (1) | WO1997002905A1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06314070A (ja) * | 1992-09-24 | 1994-11-08 | Shiina:Kk | ボラード及びそれを用いた誘導装置 |
DE19742680B4 (de) * | 1997-09-26 | 2006-03-02 | Siltronic Ag | Reinigungsverfahren für scheibenförmiges Material |
KR20010052580A (ko) * | 1998-06-08 | 2001-06-25 | 헨넬리 헬렌 에프 | 웨이퍼 클리닝 용액 내의 금속 불순물의 농도를 감시하기위한 공정 |
DE60022619T2 (de) * | 2000-04-01 | 2006-03-16 | Robert Bosch Gmbh | Verfahren und Vorrichtung zum Laden eines piezoelektrischen Elements |
US6481447B1 (en) * | 2000-09-27 | 2002-11-19 | Lam Research Corporation | Fluid delivery ring and methods for making and implementing the same |
KR20030035152A (ko) | 2001-10-30 | 2003-05-09 | 주식회사 하이닉스반도체 | 반도체웨이퍼 제조방법 |
WO2007051356A1 (fr) * | 2005-11-07 | 2007-05-10 | Jianzhong Yuan | Procédé de traitement d’une plaquette de silicium utilisée pour une cellule solaire |
DE102008004548A1 (de) | 2008-01-15 | 2009-07-16 | Rec Scan Wafer As | Waferstapelreinigung |
WO2009114043A1 (en) * | 2008-03-07 | 2009-09-17 | Automation Technology, Inc. | Solar wafer cleaning systems, apparatus and methods |
DE102009035343A1 (de) | 2009-07-23 | 2011-01-27 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Reinigung von Substraten an einem Träger |
DE102009035341A1 (de) | 2009-07-23 | 2011-01-27 | Gebr. Schmid Gmbh & Co. | Vorrichtung zur Reinigung von Substraten an einem Träger |
KR101064268B1 (ko) * | 2011-04-05 | 2011-09-14 | 한국생산기술연구원 | 와이어소에 설치되는 웨이퍼지지장치 |
CN102275234B (zh) * | 2011-06-29 | 2014-03-12 | 沈利军 | 单晶/多晶硅片多线切割自动脱胶方法及其装置 |
CN102514113A (zh) * | 2012-01-06 | 2012-06-27 | 无锡市奥曼特科技有限公司 | 一种全自动硅棒粘胶板脱胶设备 |
KR101428585B1 (ko) * | 2013-04-24 | 2014-08-12 | 한국에너지기술연구원 | 와이어 소를 이용한 반도체 웨이퍼 절단 방법 및 장치 |
CN105642619A (zh) * | 2015-03-04 | 2016-06-08 | 张磊 | 一种开方洗吹松动机 |
CN108515628B (zh) * | 2018-07-12 | 2020-07-10 | 深圳市旺多光学有限公司 | 一种用于玻璃切割及清洗的装置 |
KR102221914B1 (ko) * | 2018-12-03 | 2021-03-03 | 일륭기공(주) | 샤프트 조인트에 구비된 스플라인 홈 이물질 제거 장치 |
CN112871813A (zh) * | 2019-11-29 | 2021-06-01 | 隆基绿能科技股份有限公司 | 一种切片机清洗方法和清洗装置 |
CN112440394A (zh) * | 2020-11-18 | 2021-03-05 | 连城凯克斯科技有限公司 | 一种线切机提料过程用自动喷淋装置 |
CN112846920A (zh) * | 2021-02-08 | 2021-05-28 | 南京铁道职业技术学院 | 一种机械设备加工工件清洗装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4484417A (en) * | 1982-11-22 | 1984-11-27 | W. J. Savage Company | Sawing apparatus |
US4619081A (en) * | 1985-02-28 | 1986-10-28 | General Signal Corporation | Combined nozzle with air foil |
DE3640645A1 (de) * | 1986-11-28 | 1988-06-09 | Wacker Chemitronic | Verfahren zum zersaegen von kristallstaeben oder -bloecken vermittels innenlochsaege in duenne scheiben |
DE3815018A1 (de) * | 1987-05-06 | 1988-12-01 | Dan Science Co | Traegerreinigungs- und -trocknungsvorrichtung |
US4949700A (en) * | 1987-12-17 | 1990-08-21 | Tokyou Seimitsu Co., Ltd. | Ingot support device in slicing apparatus |
US4997490A (en) * | 1990-08-02 | 1991-03-05 | Bold Plastics, Inc. | Method of cleaning and rinsing wafers |
US5186192A (en) * | 1990-12-14 | 1993-02-16 | Shin-Etsu Handotai Co., Ltd. | Apparatus for cleaning silicon wafer |
JP2901098B2 (ja) * | 1991-04-02 | 1999-06-02 | 東京エレクトロン株式会社 | 洗浄装置および洗浄方法 |
JP2903916B2 (ja) * | 1992-11-30 | 1999-06-14 | 信越半導体株式会社 | 半導体インゴット加工方法 |
US5427644A (en) * | 1993-01-11 | 1995-06-27 | Tokyo Seimitsu Co., Ltd. | Method of manufacturing semiconductor wafer and system therefor |
JP2853506B2 (ja) * | 1993-03-24 | 1999-02-03 | 信越半導体株式会社 | ウエーハの製造方法 |
US5950643A (en) * | 1995-09-06 | 1999-09-14 | Miyazaki; Takeshiro | Wafer processing system |
-
1995
- 1995-07-13 JP JP7201745A patent/JPH0936080A/ja active Pending
-
1996
- 1996-07-12 GB GB9800212A patent/GB2318075B/en not_active Expired - Fee Related
- 1996-07-12 WO PCT/US1996/011627 patent/WO1997002905A1/en active IP Right Grant
- 1996-07-12 DE DE19681497T patent/DE19681497T1/de not_active Withdrawn
- 1996-07-12 KR KR1019970709933A patent/KR19990028611A/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
GB9800212D0 (en) | 1998-03-04 |
GB2318075A (en) | 1998-04-15 |
JPH0936080A (ja) | 1997-02-07 |
GB2318075B (en) | 1999-03-03 |
KR19990028611A (ko) | 1999-04-15 |
WO1997002905A1 (en) | 1997-01-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8130 | Withdrawal |