DE19681497T1 - Verfahren und Vorrichtung zum Waschen von Siliciumblöcken mit Wasser zur Entfernung von partikulärem Material - Google Patents

Verfahren und Vorrichtung zum Waschen von Siliciumblöcken mit Wasser zur Entfernung von partikulärem Material

Info

Publication number
DE19681497T1
DE19681497T1 DE19681497T DE19681497T DE19681497T1 DE 19681497 T1 DE19681497 T1 DE 19681497T1 DE 19681497 T DE19681497 T DE 19681497T DE 19681497 T DE19681497 T DE 19681497T DE 19681497 T1 DE19681497 T1 DE 19681497T1
Authority
DE
Germany
Prior art keywords
water
particulate material
remove particulate
silicon blocks
washing silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19681497T
Other languages
English (en)
Inventor
Yoshihiro Suzuki
Koichi Kato
Keiichi Takami
Ryoichi Kawamura
Takehiro Watanabe
Masahiro Kosako
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunEdison Inc
Original Assignee
SunEdison Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SunEdison Inc filed Critical SunEdison Inc
Publication of DE19681497T1 publication Critical patent/DE19681497T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
DE19681497T 1995-07-13 1996-07-12 Verfahren und Vorrichtung zum Waschen von Siliciumblöcken mit Wasser zur Entfernung von partikulärem Material Withdrawn DE19681497T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7201745A JPH0936080A (ja) 1995-07-13 1995-07-13 加工済シリコンインゴットの洗浄方法
PCT/US1996/011627 WO1997002905A1 (en) 1995-07-13 1996-07-12 Method and apparatus for washing silicon ingot with water to remove particulate matter

Publications (1)

Publication Number Publication Date
DE19681497T1 true DE19681497T1 (de) 1998-12-17

Family

ID=16446246

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681497T Withdrawn DE19681497T1 (de) 1995-07-13 1996-07-12 Verfahren und Vorrichtung zum Waschen von Siliciumblöcken mit Wasser zur Entfernung von partikulärem Material

Country Status (5)

Country Link
JP (1) JPH0936080A (de)
KR (1) KR19990028611A (de)
DE (1) DE19681497T1 (de)
GB (1) GB2318075B (de)
WO (1) WO1997002905A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06314070A (ja) * 1992-09-24 1994-11-08 Shiina:Kk ボラード及びそれを用いた誘導装置
DE19742680B4 (de) * 1997-09-26 2006-03-02 Siltronic Ag Reinigungsverfahren für scheibenförmiges Material
KR20010052580A (ko) * 1998-06-08 2001-06-25 헨넬리 헬렌 에프 웨이퍼 클리닝 용액 내의 금속 불순물의 농도를 감시하기위한 공정
DE60022619T2 (de) * 2000-04-01 2006-03-16 Robert Bosch Gmbh Verfahren und Vorrichtung zum Laden eines piezoelektrischen Elements
US6481447B1 (en) * 2000-09-27 2002-11-19 Lam Research Corporation Fluid delivery ring and methods for making and implementing the same
KR20030035152A (ko) 2001-10-30 2003-05-09 주식회사 하이닉스반도체 반도체웨이퍼 제조방법
WO2007051356A1 (fr) * 2005-11-07 2007-05-10 Jianzhong Yuan Procédé de traitement d’une plaquette de silicium utilisée pour une cellule solaire
DE102008004548A1 (de) 2008-01-15 2009-07-16 Rec Scan Wafer As Waferstapelreinigung
WO2009114043A1 (en) * 2008-03-07 2009-09-17 Automation Technology, Inc. Solar wafer cleaning systems, apparatus and methods
DE102009035343A1 (de) 2009-07-23 2011-01-27 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Reinigung von Substraten an einem Träger
DE102009035341A1 (de) 2009-07-23 2011-01-27 Gebr. Schmid Gmbh & Co. Vorrichtung zur Reinigung von Substraten an einem Träger
KR101064268B1 (ko) * 2011-04-05 2011-09-14 한국생산기술연구원 와이어소에 설치되는 웨이퍼지지장치
CN102275234B (zh) * 2011-06-29 2014-03-12 沈利军 单晶/多晶硅片多线切割自动脱胶方法及其装置
CN102514113A (zh) * 2012-01-06 2012-06-27 无锡市奥曼特科技有限公司 一种全自动硅棒粘胶板脱胶设备
KR101428585B1 (ko) * 2013-04-24 2014-08-12 한국에너지기술연구원 와이어 소를 이용한 반도체 웨이퍼 절단 방법 및 장치
CN105642619A (zh) * 2015-03-04 2016-06-08 张磊 一种开方洗吹松动机
CN108515628B (zh) * 2018-07-12 2020-07-10 深圳市旺多光学有限公司 一种用于玻璃切割及清洗的装置
KR102221914B1 (ko) * 2018-12-03 2021-03-03 일륭기공(주) 샤프트 조인트에 구비된 스플라인 홈 이물질 제거 장치
CN112871813A (zh) * 2019-11-29 2021-06-01 隆基绿能科技股份有限公司 一种切片机清洗方法和清洗装置
CN112440394A (zh) * 2020-11-18 2021-03-05 连城凯克斯科技有限公司 一种线切机提料过程用自动喷淋装置
CN112846920A (zh) * 2021-02-08 2021-05-28 南京铁道职业技术学院 一种机械设备加工工件清洗装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4484417A (en) * 1982-11-22 1984-11-27 W. J. Savage Company Sawing apparatus
US4619081A (en) * 1985-02-28 1986-10-28 General Signal Corporation Combined nozzle with air foil
DE3640645A1 (de) * 1986-11-28 1988-06-09 Wacker Chemitronic Verfahren zum zersaegen von kristallstaeben oder -bloecken vermittels innenlochsaege in duenne scheiben
DE3815018A1 (de) * 1987-05-06 1988-12-01 Dan Science Co Traegerreinigungs- und -trocknungsvorrichtung
US4949700A (en) * 1987-12-17 1990-08-21 Tokyou Seimitsu Co., Ltd. Ingot support device in slicing apparatus
US4997490A (en) * 1990-08-02 1991-03-05 Bold Plastics, Inc. Method of cleaning and rinsing wafers
US5186192A (en) * 1990-12-14 1993-02-16 Shin-Etsu Handotai Co., Ltd. Apparatus for cleaning silicon wafer
JP2901098B2 (ja) * 1991-04-02 1999-06-02 東京エレクトロン株式会社 洗浄装置および洗浄方法
JP2903916B2 (ja) * 1992-11-30 1999-06-14 信越半導体株式会社 半導体インゴット加工方法
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
JP2853506B2 (ja) * 1993-03-24 1999-02-03 信越半導体株式会社 ウエーハの製造方法
US5950643A (en) * 1995-09-06 1999-09-14 Miyazaki; Takeshiro Wafer processing system

Also Published As

Publication number Publication date
GB9800212D0 (en) 1998-03-04
GB2318075A (en) 1998-04-15
JPH0936080A (ja) 1997-02-07
GB2318075B (en) 1999-03-03
KR19990028611A (ko) 1999-04-15
WO1997002905A1 (en) 1997-01-30

Similar Documents

Publication Publication Date Title
DE19681497T1 (de) Verfahren und Vorrichtung zum Waschen von Siliciumblöcken mit Wasser zur Entfernung von partikulärem Material
DE69722335D1 (de) Vorrichtung und Verfahren zum Reinigen von zu behandelnden Gegenständen
DE69600392D1 (de) Vorrichtung und verfahren zum gestalten von bahndefiniertenkurven
DE19680561T1 (de) Vorrichtung und Verfahren zur Aufbereitung von Wasser
DE69511855D1 (de) Verfahren und vorrichtung zum behandeln von abwässerströmen
DE69315204D1 (de) Verfahren und Vorrichtung zur Reinigung von Wasser
DE69117940D1 (de) Vorrichtung und verfahren zum entfernen von verunreinigungen aus flüssigkeiten
DE69735531D1 (de) Verfahren und vorrichtung zum formen von strukturierten gegenständen
DE69507064D1 (de) Verfahren und Vorrichtung zum thermischen Cracken von Kunststoffabfällen
DE4495930D2 (de) Verfahren und Vorrichtung zum Abscheiden von Sand aus mit Sand und organischen Stoffen beladenem Abwasser
DE69617310D1 (de) Vorrichtung und Verfahren zur Reinigung von Abwasser
DE69513748D1 (de) Verfahren und Vorrichtung zum Speisen von flüssigem Rohmaterialgas
DE69600480D1 (de) Verfahren und vorrichtung zur behandlung von aggregat
DE69506988D1 (de) Verfahren und Vorrichtung zum Bruchtrennen von Pleueln
DE69619513D1 (de) Verfahren und vorrichtung zum züchten von einkristallen
ATA143190A (de) Verfahren und vorrichtung zum entholzen und zum aufbereiten von flachs
DE69120298D1 (de) Verfahren und vorrichtung zum trocknen von abfall
DE69813787D1 (de) Verfahren und vorrichtung zum aktivieren von verunreinigungen in einem halbleiter
DE59010748D1 (de) Verfahren und vorrichtung zum antreiben von wasserfahrzeugen
DE69523637D1 (de) Verfahren zum schärfen und vorrichtung zum erledigen dieses verfahrens
DE69603368D1 (de) Verfahren und vorrichtung zum dosieren von waschmitteln
AT378529B (de) Verfahren und vorrichtung zum reinigen von wasser
DE69602026D1 (de) Verfahren zum waschen von gegenständen und zur reinigung des angefallenen abwassers
DE69026043D1 (de) Vorrichtung und Verfahren zum Flottieren
DE69117643D1 (de) Verfahren und Vorrichtung zum Dosieren von Waschmitteln

Legal Events

Date Code Title Description
8130 Withdrawal