WO1996000645A1 - Procede d'enrobage avec une paroi mince d'un circuit electronique aligne avec precision avec la paroi d'enveloppe et circuit electronique a cet effet - Google Patents

Procede d'enrobage avec une paroi mince d'un circuit electronique aligne avec precision avec la paroi d'enveloppe et circuit electronique a cet effet Download PDF

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Publication number
WO1996000645A1
WO1996000645A1 PCT/EP1995/002497 EP9502497W WO9600645A1 WO 1996000645 A1 WO1996000645 A1 WO 1996000645A1 EP 9502497 W EP9502497 W EP 9502497W WO 9600645 A1 WO9600645 A1 WO 9600645A1
Authority
WO
WIPO (PCT)
Prior art keywords
spacer
electrical circuit
centering
casting mold
mold
Prior art date
Application number
PCT/EP1995/002497
Other languages
German (de)
English (en)
Inventor
Hans Wilhelm Wehling
Reinhard Stumpe
Joachim Kuhn
Original Assignee
Itt Automotive Europe Gmbh
Bmw Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Itt Automotive Europe Gmbh, Bmw Ag filed Critical Itt Automotive Europe Gmbh
Priority to EP95925772A priority Critical patent/EP0804329B1/fr
Priority to US08/765,487 priority patent/US6056909A/en
Priority to DE59506744T priority patent/DE59506744D1/de
Publication of WO1996000645A1 publication Critical patent/WO1996000645A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/026—Housings for speed measuring devices, e.g. pulse generator

Definitions

  • the invention relates to an electronic circuit arranged in a sealed manner, at least a part of the electronic circuit being intended to be precisely aligned at a very short distance from the outer surface of the cast casing.
  • an electronic circuit can be, for example, a gearwheel sensor with Hall IC, or ABS sensor with Hall IC, which must be tightly coupled to a rotating system in order to measure a rotary movement.
  • the information obtained in this way can be used, for example, for speed measurement in tachometers or for steering angle measurement in steering gears.
  • Such sensors are subject to the conditions that, on the one hand, they should be very robust and thus well sealed against the influences of the environment.
  • the problems dealt with here include treated in DE-OS 41 42 727 and DE-OS 41 41 958.
  • the Hall IC has previously been held in a version which, if appropriate, also accommodated further sections of an electronic circuit at another point and inserted the version so assembled centered in a housing.
  • the housing itself could in turn consist of several parts which, for example in the form of a metal sleeve or plastic sleeve, provided a secure thin-walled covering of the circuit, while the part of the housing which was not critical with regard to the wall thickness was formed by a plastic section .
  • the object of the invention is, in particular, to make it possible for the walls of the housing to be very thin when necessary and, in the region of this thin housing wall, at least one electrical component to be oriented very precisely towards this wall.
  • the object of the invention is further to provide a method for producing such an electrical circuit and to disclose a device with which this method can be carried out. - 3 -
  • the invention is therefore based on a method which results from the preamble of claim 1 and solves the problem to be solved with regard to the desired method by the successive steps resulting from the characterizing part of claim 1.
  • the inventive method consists in providing the electrical circuit with a housing by encapsulation with a slowly hardening plastic.
  • the electrical circuit which can be applied, for example, to a printed circuit board, is held in the desired position during the casting process and during solidification via the centering holder.
  • the centering holder is then withdrawn, the electrical circuit being held in the desired position by the plastic which has not yet fully solidified. Since the soft plastic largely fills the resulting cavity during the retraction of the centering holder, it is thus achieved on the one hand that the electrical circuit remains in its position in the plastic housing, while on the other hand the circuit is completely encased in plastic.
  • the wrapping process can be further improved by maintaining the injection pressure in the injection molding process while turning back so that not only the recesses resulting from the withdrawal are filled by suction forces and gravity, but also the injection pressure at the same time Filling the recesses contributes.
  • the electrical circuit which is preferably on a conductor plate is applied, one will center by means of the centering holder in such a way that centering fingers distributed over its surface or circumference hold the plate in position during the casting or spraying process.
  • a certain displacement can occur, however, in that the casting or injection pressure acting on the circuit board warps it and thus the distance of the circuit board in its central region, which is not supported by the centering fingers, during the casting process has an indefinite distance from the bottom of the mold. This occurs particularly when the distance between the printed circuit board or one of its components and the bottom of the mold is to be very small, so that the tolerance of this distance obtained during casting becomes very large.
  • the invention proposes the combination of features according to claim 2.
  • the spacer and the centering device can be moved independently of one another, that is to say can be withdrawn from the mold one after the other at a defined time interval. This creates the possibility, during a first period in which the plastic is still very thin, to additionally support the point of the electrical circuit (eg the Hall IC) which is critical for the distance by the spacer and the printed circuit board by the centering holder. Since the spacers only protrude slightly from the bottom of the mold because of the required spacing, this will be withdrawn as long as the plastic mass is still soft enough to seal the resulting cavity without joints and tightly. However, the plastic must not be so soft that the position of the component could change during the withdrawal of the spacer. In a second step, as already explained above, the centering fingers are then withdrawn, so that there is a seamless complete encapsulation of the electrical circuit.
  • the point of the electrical circuit eg the Hall IC
  • the two holders can advantageously also be withdrawn in the reverse order.
  • the printed circuit board equipped with the electrical circuit floats during the casting process and thus does not assume the prescribed position.
  • the critical point for example the Hall element
  • the spacer defines the desired thickness of the housing wall above the critical circuit board point.
  • a locking device is additionally used, which presses the circuit board against the spacer and thus ensures that, for example, the Hall IC also rests securely on the spacer finger during the casting process.
  • the locking device be withdrawn shortly before the spacer. If, at the same time, both the locking device and the spacer are withdrawn, the advantage is that the suction forces are approximately large in both directions, so that the circuit board remains securely in place in this area.
  • the invention proposes the use of the combination of features according to claim 7.
  • the spacer then has a spacer finger which can be inserted into the interior of the mold and which supports the Hall element of the electrical circuit.
  • it can also be a different component or a location of the electrical circuit that is essential for the distance.
  • the centering fingers are grouped around the central spacing finger at a suitable distance.
  • the centering fingers can be evenly distributed on the side wall of the casting space. You can also be designed such that they attack the edge region of the circuit board of the electrical circuit or act directly on the edge of the circuit board (claim 9).
  • the combination of features can also be - 8th -
  • the spacer finger is not given a diameter that is too large, so that the suction forces and the area to be closed by the flowing plastic do not become too large when it moves back.
  • the diameter of this finger should also not be too small in order to allow a sufficient contact surface for the component.
  • the centering effect in the lateral direction of the circuit board can be achieved by a corresponding beveling of the support surfaces on the centering fingers.
  • the conical course of these surfaces also makes it easier to withdraw the centering fingers from the hardening casting compound.
  • the combination of features according to claim 12 is recommended in a further development of the invention.
  • the features according to claim 13 secure the electrical circuit before floating during the injection molding and at the same time provide care for an exact position for the critical point on the circuit board by clamping it between the locking device and the spacer.
  • the feature combination according to claim 14 can be recommended in a further development of the invention, insofar as a Hall sensor with magnet is used.
  • the centering fingers preferably three, centered on one another
  • the centering fingers have no inclined surfaces on which the edges of the printed circuit board rest, it cannot be ruled out that the edges of the printed circuit board are clamped between the side walls of the centering fingers.
  • the centering fingers are pulled back after the spacer finger, there is then the possibility that the centering fingers pull the printed circuit board downward and thus the prescribed distance in the region of the spacer is not maintained. For such cases, it is particularly advisable to withdraw the spacer after the centering fingers, so that even under these circumstances the defined position of the Hall element is maintained during the casting process.
  • the object of the invention is to provide a sensor which inexpensively fulfills the conditions described at the outset (exact alignment of at least one component of the associated electrical circuit with a very small wall thickness of the simply manufactured housing).
  • the invention proposes the combination of features set out in claim 15. Such a sensor works particularly precisely and provides a comparatively large output signal if the features listed in claim 16 are fulfilled.
  • the housing consists of several parts and thus the exact arrangement of the sensor also depended on the exact assembly of the housing parts, the difficulties encountered in the attachment can be overcome eliminate by the features of claim 17.
  • the housing according to the invention can also be used to secure the position of the feed cable according to claim 18, which applies in particular to the case where the longitudinal direction of the sensor is at an angle to the discharge direction of the cable. Fastening of the sensor is also made possible because a fastening tab can also be molded on.
  • FIG. 1 shows a casting mold according to the invention with an encapsulated electrical circuit according to the invention therein
  • FIG. 2 shows the casting mold according to FIG. 1, with the spacer and centering holder being withdrawn
  • FIG. 3 shows a section seen from below in FIG. 1 through the electrical circuit provided with a housing, the section being made along the surface of the electrical circuit,
  • FIG. 5 shows a view according to FIG. 4 with the locking device withdrawn with the second actuating device indicated.
  • 1 shows a cast housing 1 with cut housing parts 2 and 3 which are shown in sections and which surround the cavity to be poured out as a casting mold.
  • the electrical circuit 5 is arranged on a printed circuit board 6 and is here preferably configured as a sensor circuit which has a Hall IC 7 below the printed circuit board 5 and a magnet 8 above the printed circuit board.
  • a connecting line 9 leads to the electrical circuit 5 and can be connected to plugs. However, the plug contacts can also be located on the circuit housing 4, so that the plug can be integrated in the housing 4. As can be seen from FIG. 2, the connecting line runs at an angle, the housing 4 serving as kink protection.
  • the Hall IC 7 which can contain several Hall elements, is exactly aligned with its IC surface 12 opposite the bottom surface 10 of the casting mold 11 to be poured, and this only a very small amount Distance a of, for example, 0.3 mm.
  • the circuit housing 4 is intended to enclose the electrical circuit 5 seamlessly and absolutely tightly even in the region of the small distance a.
  • a centering bracket 13a, 13b and a spacer 14a, 14b are used, which can be moved independently of one another.
  • the centering bracket two jointly moving centering fingers 13a, 13b are shown in FIGS. 1 and 2, 1 the right centering finger 13b is shown in the position retracted into the mold 11.
  • the two centering fingers 13c and 13d in FIG. 2 are shown in the retracted position.
  • a spacer 14a, 14b, of which only the holding finger 14 is shown, which is shown in FIG. 2 in the retracted position and in FIG. 1 in the right one, is also used to align the electrical circuit 5, in particular the Hall IC 7 Half is shown in the retracted position 14a and on the right half of this figure in the retracted position 14b.
  • the distance a should be very small, for example about 0.3 mm.
  • FIG. 4 also shows a locking device 16 which is flanged to the housing 1 and which points with a locking pin through a channel 18 which projects obliquely through the housing half 3 to the magnet 8 of the electrical circuit 5.
  • the locking device 16 is shown in FIG. 4 with the state retracted into the mold 11, in which the locking pin 17 acts on the magnet 8 and is shown in the retracted state in FIG. 5.
  • the pin 17 can be driven in a manner known per se via an eccentric 19 which is connected to a crank (not shown).
  • a first actuating device 20 is indicated, which the centering fingers 13a via an eccentric 21 5 to 13d of the centering holder 13 is able to drive, while a second actuating device 22 in FIG. 5 engages the holding finger 14 of the spacer and the holding finger 14 is able to move into the casting mold 11 (see FIG. 14b) or extend (see FIG. 14a).
  • the mold 11 is closed in any order by placing the second housing part 2 on the first housing part 3 and the centering pin 17 locking device is extended until it is placed on the magnet 8 and the unit thus exerted by the force thus exerted Magnet 8, circuit board 6 and Hall IC 7 are clamped between spacer finger 14b and locking pin 17.
  • the IC surface 12 is thus at a predetermined distance a from the base surface 10 of the mold 11.
  • the slowly solidifying plastic is then passed through a suitable opening, preferably via the first housing part 2 is injected into the mold 11 under pressure until the mold 11 is filled under pressure with the holding means retracted into the mold.
  • the centering fingers 13b * are withdrawn until they are in the position shown in FIGS. 13a, 13c and 13d.
  • the spacer maintains its position 14b.
  • the pin 17 and the spacer finger 14 are withdrawn in a selectable order or simultaneously, so that these holding elements assume the position shown in FIG. 5 and FIG. 2.
  • the plastic which is still sufficiently soft, fills the cavity which results from the retraction, which also applies to the cavity with regard to the centering fingers 13.
  • the plastic used to form the circuit housing 4 is already sufficiently firm, so that due to the comparatively large printed circuit board area, the printed circuit board does not move even when the holding finger 14 or the pin 17 withdrawn.
  • the forces exerted in this way are comparatively small because the diameter of the spacer finger can be made very small and because of the small spacing the resulting cavity is quite small.
  • the suction effect on the electrical circuit 5 is anyway not particularly large due to the inclined position of the pin 17.
  • the casting mold can be constructed in such a way that the suction forces of the two last-mentioned holding elements cancel each other while being pulled back.
  • the invention additionally creates the possibility of - 15 -

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne un détecteur pour la mesure de la vitesse de rotation et de l'angle de rotation dans des véhicules automobiles. De tels détecteurs sont équipés de circuits intégrés Hall qui doivent être alignés avec précision à faible distance par rapport à un système de rotation. Pour protéger en même temps le circuit détecteur contre toutes influences nuisibles de l'environnement, on a utilisé jusqu'à présent un boîtier en plusieurs parties d'un coût élevé. L'invention a pour but l'obtention, pour le détecteur, d'un boîtier de construction simple, dont la paroi doit être très mince en certains endroits, et qui doit en même temps permettre un alignement précis du circuit intégré Hall. L'invention a également pour but l'obtention d'un boîtier qui, une fois fabriqué, peut être fixé, au moyen de vis, sur le moteur. L'invention consiste, dans son principe, à aligner avec précision le circuit détecteur et à l'entourer totalement hermétiquement de matière plastique, cela au moyen de dispositifs supports pouvant être actionnés séparément les uns des autres et en utilisant une matière plastique à lent durcissement. Ce procédé répond aux spécifications et aux exigences relatives à l'environnement et à l'industrie automobile, par exemple pour l'espace moteur et le coût des roues. Il est possible d'avoir recours simultanément à l'injection sous pression et à un vissage. Si les forces de vissage ne sont pas trop élevées, le matériau peut remplacer la douille injectée.
PCT/EP1995/002497 1994-06-29 1995-06-27 Procede d'enrobage avec une paroi mince d'un circuit electronique aligne avec precision avec la paroi d'enveloppe et circuit electronique a cet effet WO1996000645A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP95925772A EP0804329B1 (fr) 1994-06-29 1995-06-27 Procede d'enrobage avec une paroi mince d'un circuit electronique aligne avec precision avec la paroi d'enveloppe et circuit electronique a cet effet
US08/765,487 US6056909A (en) 1994-06-29 1995-06-27 Casting mold for precisely aligning an electronic circuit with a cast wall and method of using same
DE59506744T DE59506744D1 (de) 1994-06-29 1995-06-27 Verfahren zum dünnwandigen umgiessen einer zu der umgossenen wand genau ausgerichteten elektronikschaltung und elektronikschaltung hierzu

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4422739.6 1994-06-29
DE4422739A DE4422739A1 (de) 1994-06-29 1994-06-29 Verfahren zum dünnwandigen Umgießen einer zu der umgossenen Wand genau ausgerichteten Elektronikschaltung und Elektronikschaltung hierzu

Publications (1)

Publication Number Publication Date
WO1996000645A1 true WO1996000645A1 (fr) 1996-01-11

Family

ID=6521802

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1995/002497 WO1996000645A1 (fr) 1994-06-29 1995-06-27 Procede d'enrobage avec une paroi mince d'un circuit electronique aligne avec precision avec la paroi d'enveloppe et circuit electronique a cet effet

Country Status (6)

Country Link
US (1) US6056909A (fr)
EP (1) EP0804329B1 (fr)
CZ (1) CZ285614B6 (fr)
DE (2) DE4422739A1 (fr)
ES (1) ES2138223T3 (fr)
WO (1) WO1996000645A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6334361B1 (en) * 1996-03-29 2002-01-01 Continental Teves Ag & Co., Ohg Plastic resistor and process for producing it

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19841498C2 (de) * 1998-09-10 2002-02-21 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
DE10155537B4 (de) * 2001-01-05 2016-02-11 Continental Teves Ag & Co. Ohg Verfahren und Spritzgussform zur Herstellung von Kraftfahrzeugsensoren
JP3473602B2 (ja) * 2001-11-05 2003-12-08 三菱電機株式会社 回転センサ及びその製造金型
US6793530B2 (en) * 2002-08-12 2004-09-21 Alan Walse Electronic connector and method of making
JP2005172687A (ja) * 2003-12-12 2005-06-30 Sumiden Electronics Kk 磁気変量検出センサ
DE102007036264A1 (de) * 2007-08-02 2009-02-05 Robert Bosch Gmbh Verfahren zur Herstellung eines Bewegungssensors
DE102007041007A1 (de) * 2007-08-29 2009-03-05 Metabowerke Gmbh Elektroeinrichtung für ein handgeführtes Elektrohandwerkzeuggerät
DE102007060604A1 (de) * 2007-12-13 2009-06-18 Continental Teves Ag & Co. Ohg Magnetfeld-Sensorelement
DE102007061004A1 (de) * 2007-12-18 2009-06-25 Bayerische Motoren Werke Aktiengesellschaft Verfahren zur Integration eines Sensors in ein Bauteil, insbesondere in einen Stoßfänger eines Kraftfahrzeugs
DE102014216353A1 (de) 2013-08-23 2015-02-26 Baumer Electric Ag Sensorgehäuse für einen kabelgebundenen Sensor und kabelgebundener Sensor
DE102015103516A1 (de) * 2015-03-10 2016-09-15 Witte Automotive Gmbh Handhabe mit Elektronikeinheit
CN111347615A (zh) * 2018-12-21 2020-06-30 大陆-特韦斯股份有限公司 制造传感器的方法、定位销直接固定构件壳体

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3363040A (en) * 1965-10-12 1968-01-09 Aoki Katashi Apparatus and process for injection molding a plastic tray
CH576334A5 (fr) * 1975-02-27 1976-06-15 Demag Kunststofftech
FR2576245A1 (fr) * 1985-01-23 1986-07-25 Jaeger Procede d'enrobage d'un capteur allonge, dispositif de moulage pour la mise en oeuvre du procede, capteur obtenu et armature intervenant dans la fabrication du capteur
US5137677A (en) * 1989-03-09 1992-08-11 Mitsubishi Denki K.K. Hall sensor device and method of producing the same
WO1993014618A1 (fr) * 1992-01-13 1993-07-22 Asm-Fico Tooling B.V. Appareil de moulage d'une grille de connexion et de puces disposees sur celle-ci
EP0642026A1 (fr) * 1993-09-01 1995-03-08 Sumitomo Electric Industries, Limited Procédé pour la fabrication d'un capteur de rotation et l'assemblage d'un capteur de rotation

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1792758U (de) * 1958-09-04 1959-07-30 Ciba Geigy Vorrichtung zum herstellen von umhuellungen aus kunststoff.
GB1131612A (en) * 1964-11-05 1968-10-23 Hubel Aro Developments Ltd Improvements relating to frame members
DE1979338U (de) * 1967-06-23 1968-02-22 Standard Elektrik Lorenz Ag Vorrichtung zum umspritzen von elektrischen bauelementen, insbesondere kondensatorwickeln, mit einer erhaertenden masse.
DE1902832B2 (de) * 1969-01-21 1971-11-04 Verfahren zum einbetten bzw umhuellen von elektrischen bau elementen
GB1313748A (en) * 1969-09-18 1973-04-18 Dunlop Holdings Ltd Moulding
DE2141556A1 (de) * 1971-08-19 1973-02-22 Aro Plastics Dev Ltd Verfahren zum spritzgiessen von plastischem werkstoff
GB1370075A (en) * 1972-04-20 1974-10-09 Ici Ltd Injection moulding
GB1510300A (en) * 1974-04-01 1978-05-10 Ici Ltd Injection moulding
GB1442069A (en) * 1974-04-25 1976-07-07 Worldwide Plastics Dev Moulding
US4470786A (en) * 1981-07-28 1984-09-11 Omron Tateisi Electronics Co. Molding apparatus with retractable preform support pins
DE3137883C2 (de) * 1981-09-23 1983-12-08 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Isolieren von Hallmagnetschranken
JPS59127842A (ja) * 1983-01-13 1984-07-23 Toshiba Corp 樹脂モ−ルド装置
US4629597A (en) * 1985-07-08 1986-12-16 Northern Telecom Limited Forming of cable splice closures
EP0257681A3 (fr) * 1986-08-27 1990-02-07 STMicroelectronics S.r.l. Procédé pour la fabrication de dispositifs à semi-conducteur encapsulés dans de la lumière plastique et dispositifs ainsi obtenus
SU1509266A1 (ru) * 1987-07-06 1989-09-23 Всесоюзный Научно-Исследовательский, Проектно-Конструкторский И Технологический Институт Релестроения Литьева форма дл изготовлени полимерных изделий с арматурой
DE3819835A1 (de) * 1988-06-10 1989-12-14 Siemens Ag Verfahren zur herstellung eines kunststoffumspritzten elektrischen bauelements
SU1597278A1 (ru) * 1988-06-29 1990-10-07 Всесоюзный Научно-Исследовательский, Проектно-Конструкторский И Технологический Институт Релестроения Литьева форма дл изготовлени полимерных изделий с пластинчатой арматурой
SU1666326A1 (ru) * 1988-07-25 1991-07-30 Предприятие П/Я А-7160 Форма дл изготовлени изделий из полимерного материала с арматурой
DE4031490A1 (de) * 1990-03-22 1991-09-26 Schwenk Oskar Gmbh & Co Kg Bohrungsmessgeraet
JPH04102338A (ja) * 1990-08-22 1992-04-03 Toshiba Corp 樹脂封止型半導体装置の製造方法及び製造装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3363040A (en) * 1965-10-12 1968-01-09 Aoki Katashi Apparatus and process for injection molding a plastic tray
CH576334A5 (fr) * 1975-02-27 1976-06-15 Demag Kunststofftech
FR2576245A1 (fr) * 1985-01-23 1986-07-25 Jaeger Procede d'enrobage d'un capteur allonge, dispositif de moulage pour la mise en oeuvre du procede, capteur obtenu et armature intervenant dans la fabrication du capteur
US5137677A (en) * 1989-03-09 1992-08-11 Mitsubishi Denki K.K. Hall sensor device and method of producing the same
WO1993014618A1 (fr) * 1992-01-13 1993-07-22 Asm-Fico Tooling B.V. Appareil de moulage d'une grille de connexion et de puces disposees sur celle-ci
EP0642026A1 (fr) * 1993-09-01 1995-03-08 Sumitomo Electric Industries, Limited Procédé pour la fabrication d'un capteur de rotation et l'assemblage d'un capteur de rotation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6334361B1 (en) * 1996-03-29 2002-01-01 Continental Teves Ag & Co., Ohg Plastic resistor and process for producing it

Also Published As

Publication number Publication date
ES2138223T3 (es) 2000-01-01
EP0804329A1 (fr) 1997-11-05
CZ285614B6 (cs) 1999-09-15
CZ380896A3 (cs) 1998-03-18
US6056909A (en) 2000-05-02
EP0804329B1 (fr) 1999-09-01
DE59506744D1 (de) 1999-10-07
DE4422739A1 (de) 1996-01-04

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