EP2396629A2 - Procédé de fabrication d'un capteur avec enveloppage sans soudure d'un élément capteur - Google Patents

Procédé de fabrication d'un capteur avec enveloppage sans soudure d'un élément capteur

Info

Publication number
EP2396629A2
EP2396629A2 EP10708741A EP10708741A EP2396629A2 EP 2396629 A2 EP2396629 A2 EP 2396629A2 EP 10708741 A EP10708741 A EP 10708741A EP 10708741 A EP10708741 A EP 10708741A EP 2396629 A2 EP2396629 A2 EP 2396629A2
Authority
EP
European Patent Office
Prior art keywords
sensor
sensor element
molding compound
mold cavity
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10708741A
Other languages
German (de)
English (en)
Inventor
Nedelco Christov
Rostislav Slavik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of EP2396629A2 publication Critical patent/EP2396629A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G01K1/10—Protective devices, e.g. casings for preventing chemical attack
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components

Definitions

  • the invention relates to a method for producing a sensor with seamless encapsulation of a sensor element and a sensor produced by this method.
  • Injection molding is a method in which a sensor element is inserted into a mold cavity, after which the liquid and hot injection molding compound is injected into the mold cavity and fills it, wherein the sensor element is enclosed by the injection molding compound.
  • injection molding is a method in which a sensor element is inserted into a mold cavity, after which the liquid and hot injection molding compound is injected into the mold cavity and fills it, wherein the sensor element is enclosed by the injection molding compound.
  • the injected under high pressure injection molding compound may shift the sensor element in its position in the mold cavity, which would ultimately lead to a low-quality sensor.
  • the object of the invention to provide a method for producing a sensor and a sensor produced by this method, in which the sensor element is enclosed as close as possible from the injection molding compound, whereby the penetration of water, acid, oil or other aggressive substances from the environment of the sensor is permanently prevented in the sensor.
  • the sensor should be as inexpensive to produce.
  • the object is achieved according to the independent claims by a method for producing a sensor with seamless encapsulation of a sensor element and a sensor produced by this method.
  • the sensor element By inserting the sensor element in a mold cavity and the mechanical fixation of the sensor element in the mold cavity by at least one movable fixing element which engages in a second region of the mold cavity in the mold cavity, the sensor element can be very accurately fixed in its position in the mold cavity.
  • the fixation is mechanically stable so that the later injected injection molding compound can not move the sensor element from its position.
  • the position of the sensor element in the sensor is maintained very accurately, resulting in high quality sensors.
  • the sensor element is a Hall sensor element intended to detect the change in an external magnetic field, it is of great importance that the sensor element is located exactly at the prescribed position in the sensor. This is permanently ensured by the engaging in the mold cavity fixing element.
  • the relative position of the sensor element in the mold cavity remains unchanged.
  • the injection-molding compound has cured sufficiently far in a first region of the mold cavity that the injection-molding compound hardened in the first region fixes the sensor element in its position, a further fixation of the sensor element is achieved which is sufficient to prevent a subsequent displacement of the sensor element. Effectively prevent sorides.
  • the removal of the fixing element takes place before the injection molding compound located in the second region hardens, so that the still liquid injection molding compound at least partially fills the free space left by the removed fixing element in the mold cavity.
  • the still liquid injection molding material at least partially fills the free space left by the removed fixing element in the mold cavity results in a completely seamless enclosure of the sensor element with the injection molding compound.
  • the sensor element After the curing of the injection molding composition, the sensor element thus has a seamless sheathing through which no water, acid, oil or other aggressive substances from the environment of the sensor can penetrate into the sensor.
  • a pre-coating may also be understood as a pre-coating, for example with a metal or with a ceramic material.
  • the thermal conductivity can be improved towards the sensor, which may be of great importance, for example, in temperature sensors.
  • an externally applied magnetic flux is concentrated towards the sensor element by means of a pre-extrusion with a suitable material.
  • At least one receiving element for the fixing element is injection-molded onto the sensor element with the pre-injection. This achieves a particularly good fixation of the sensor element in the mold cavity, which leads to a very accurate positioning of the sensor element in the sensor.
  • the fixing element engage in the receiving element and thus mechanically fix the sensor element until the hardened in the first area Injection molding the sensor element sufficiently fixed in position.
  • FIG. 3 shows the sensor element known from FIG. 2 with the stamped grid in a mold cavity
  • FIG. 5 shows the injection-molding compound solidified in the mold cavity in a first region
  • FIG. 11 shows the fixing elements which are moved out of the mold cavity
  • FIG. 12 shows a sensor produced by the method
  • FIG. 15 shows a section through the sensor known from FIG. 14, FIG.
  • FIG. 17 shows the sensor known from FIG. 16 from a different perspective
  • Fig. 1 shows a sensor 9 according to the prior art.
  • This sensor 9 may be, for example, a temperature sensor, in particular an oil temperature sensor, a rotational speed sensor or another sensor 9, in which the sensor element 2 must be well protected against the effects of dirt, gaseous or liquid media.
  • the sensor element 2 is usually pre-molded with a plastic and the pre-injection 7, a further injection molding compound 6 is molded. This is necessary because the sensor element 2 is forced from the injection molding compound 6 during injection molding process by the high injection pressure from its position, which ultimately the position of the sensor element 2 in the pre-injection 7 and relative to the injection molding material 6 is not clearly defined, resulting in massive inaccuracies in the function of the sensor 9 can lead.
  • the sensor element 2 is generally mounted on a stamped grid 10, which is also referred to as a leadframe, wherein the stamped grid 10 for the mechanical stabilization of the sensor Sorides in Unumspritzten state is used. After the extrusion of the sensor element 2 with a plastic, the stamped grid is used for the electrical connection of the sensor element with the subsequent evaluation electronics.
  • an evaluation for the sensor element 2 may be placed on the lead frame 10, wherein the transmitter may also be enclosed by the pre-injection 7 or the injection molding compound 6.
  • the connection to the subsequent electronics is ensured via the electrical connection pins 11, which are kept free in the injection molding process.
  • a connection element 14 is formed by the injection molding compound 6.
  • connecting elements 13 can be seen, which are also formed from the injection molding compound 6 and which serve for the mechanical connection of the sensor 9 with other components, for example in the vehicle. It is conceivable, for example, that such a sensor 9 is designed as a temperature sensor and is clipped into a container containing the medium whose temperature is to be measured, or is screwed. Important in all these sensors 9 is that the sensor element 2 is effectively protected against mechanical damage, chemical damage by aggressive media and the ingress of liquids and gases. With regard to the tightness with respect to the media just mentioned, the connection area 12 between the pre-encapsulation 7 and the injection-molding compound 6 represents a particular weak point.
  • connection area 12 between the Vorumspritzung 7 and the injection molding compound 6 thermal stresses arise, which can be leaking the connection portion 12, which at this point aggressive media can penetrate into the sensor 9 particularly easy. This can lead to the destruction of the sensor 9.
  • a particularly high demand is placed on the robustness and the longevity of such sensors. Therefore, it is desirable to have as few or no connection partners as possible.
  • a method for producing a sensor 9 with seamless encapsulation of a sensor element 2 is shown in FIGS. 2 to 6 and FIGS. 7 to 12.
  • FIG. 2 shows a sensor element 2 which is mounted on a stamped grid 10. At the stamped grid 10, the electrical connection pins 11 can be seen.
  • the sensor element known from FIG. 2 with the stamped grid 10 is inserted into a mold cavity 1.
  • the position of the sensor element 2 in the mold cavity 1 is determined by movable fixing elements 5.
  • These movable fixing elements 5 engage through holes in the mold cavity 1 into the interior of the mold cavity 1 and hold the sensor element 2 and the stamped grid 10 in the desired position.
  • the sensor element 2 is held exactly on the central axis of symmetry of the mold cavity 1 by the movable fixing elements 5.
  • the mold cavity 1 is not yet injected with injection molding compound 6.
  • FIG. 4 shows how the injection-molding compound 6 has penetrated into the mold cavity 1 under the pressure P, the injection molding compound 6 having enclosed the sensor element 2 and the stamped grid 10 in the desired manner.
  • the injection-molding compound 6 is still in the liquid and thus in a warm state.
  • the movable fixing elements 5 can now be pulled out of the still liquid injection-molding compound 6 in the second region.
  • the cavities left behind by the movable fixing elements 5 are filled by the still liquid injection molding compound 6.
  • the sensor element 2 Since the injection-molding compound 6 has already hardened in the first region 3, the sensor element 2 remains in its predetermined position within the mold cavity 1 even after the removal of the movable fixing elements 5. By the subsequent flowing of the still liquid injection molding compound 6 into the cavities left by the movable fixing elements 5 This results in a completely seamless encapsulation of the sensor element 2 and of the stamped grid 10 attached thereto, which can be seen very clearly in FIG.
  • Fig. 6 shows the finished sensor 9 after removal from the mold cavity 1. It can be seen that the injection molding compound 6, the sensor element 2 and the lead frame 10 completely and seamlessly encloses. Only the electrical connection pins 11 project out of the injection-molding compound 6. By means of a suitable design of the sensor 9, however, care can be taken that no aggressive media occur in the region of the exit points of the electrical connection pins 11, so that the sensor element 2 is permanently protected by the seamless encapsulation with the injection molding compound 6, resulting in a more durable and less expensive Sensor 9 is provided.
  • FIGS. 7 to 12 once again show the method according to the invention for producing the sensor 9 with seamless encapsulation of a sensor element 2, in which case a pre-injection 7 takes place.
  • a pre-injection 7 takes place.
  • the sensor element 2 may only be covered by a very specific material.
  • the sensor element is surrounded by the injection-molding compound 6, for example with a ceramic compound, before the actual encapsulation, which of course does not take place in a conventional injection molding process, but by pressing and tempering the ceramic material.
  • Fig. 7 the sensor element 2 with the connected lead frame 10 and the electrical connection pins 11 can be seen.
  • the sensor element 2 from FIG. 7 is inserted into a preform nest 15 in FIG. 8.
  • Vorformnest 15 for example, a shotcrete be injected for pre-injection or a ceramic material are introduced, which then surrounds the sensor element 2 and parts of the lead frame 10.
  • the thus prepared sensor element 2 is then, as shown in Fig. 9, inserted with the pre-injection 7 in the mold cavity 1.
  • the sensor element 2 is in turn fixed with the movable fixing elements 5, which engage in the mold cavity 1 through recesses in the walls of the mold cavity 1.
  • FIG. 10 shows how the injection-molding compound 6 is injected into the mold cavity 1 under the pressure P, the injection-molding compound 6 enclosing the sensor element 2 and the pre-injection 7 as well as parts of the stamped grid 10.
  • the injected injection molding compound 6 cools down, as a result of which it becomes solid or at least viscous and thus ensures mechanical fixation of the sensor element 2 in the mold cavity.
  • the cooling of the injection-molding compound 6 in the first region 3 of the mold cavity 1 can be assisted by a cooling element 16. It is conceivable that the cooling element 16 as
  • Coolant leading piping system is placed around the first region 3 of the mold cavity 1.
  • a coolant for example, cold air or a liquid such as water or oil can be used. It is important that the first area 3 of the cavity form a rapid cooling of the
  • Injection molding compound 6 leads, while the injection molding compound 6 in the second region 4 of the mold cavity continues to be liquid. Since the injection-molding compound 6 is now cooled in the first region of the mold cavity 1 and thus a mechanical stabilization of the sensor element 2 in the mold cavity is ensured, the movable fixation elements 5 are pulled out of the mold cavity 1, which is illustrated in FIG. 11. After the movable fixing elements 5 have been pulled out of the mold cavity 1, the still liquid injection molding compound 6 in the second region 4 of the mold cavity 1 can fill the cavities left behind by the movable fixing elements 5. This in turn leads to the production of a sensor 9 with a completely seamless encapsulation of the sensor element 2.
  • FIG. a sensor 9 can be seen, in which the sensor element 2 and the pre-extrusion 7 are completely and seamlessly enclosed by the injection-molding compound 6.
  • the sensor 9 shown here is classified as extremely robust and durable, where it is very inexpensive to produce.
  • FIG. 13 shows a special embodiment of the pre-extrusion molding 7.
  • the mold cavity 1, which is filled with the injection-molding compound 6 under the pressure P, can be seen once again.
  • the pre-injection 7 now has receiving elements 8, in which the movable guide elements 5 engage.
  • the method for producing the sensor 9 according to FIG. 13 is analogous to the production of the sensor 9 according to FIGS. 7 to 12.
  • the movable fixing elements 5 are removed from the mold cavity 1, wherein they release their connection with the receiving elements 8.
  • FIGS. 14 to 18 show sensors 9 which are produced by the method according to the invention for producing a sensor 9 with seamless encapsulation of the sensor element 2.
  • FIG. 14 shows a sensor 9, which has a completely seamless encapsulation of the sensor element 2, connecting elements 13 having been formed by the injection molding compound which serve for a mechanical connection of the sensor 9, for example to a liquid container.
  • FIG. 15 shows a section through the sensor 9 known from FIG. 14 with seamless encapsulation of the sensor element 2. It can be seen that no seams are present in the entire injection-molding compound 6 which could lead to the penetration of an aggressive medium into the sensor ,
  • FIG. 16 shows a further section through a sensor 9 with seamless encapsulation of a sensor element 2.
  • the sensor element 2 has a pre-encapsulation 7.
  • This pre-extrusion 7 is also completely surrounded by the injection-molding compound 6, which in turn does not form any seams in the injection-molding compound 6.
  • the electrical connection pins 11 of the sensor 9 can be seen in FIG. 16, which can be protected in a suitable manner from aggressive media.
  • FIG. 17 shows the sensor 9 known from FIG. 16 from a different perspective. Again, it can be seen that the sensor element 2 and the pre-injection 7 are completely and seamlessly surrounded by the injection-molding compound 6.
  • FIG. 18 again shows the principle of removing the movable fixing elements 5 after the injection molding compound 6 has been injected into the mold cavity 1.
  • the already cooled injection molding compound 6 in the first region 3 of the mold cavity 1 holds the sensor element 2 in its position.
  • the movable fixing elements 5 are removed from the still liquid injection molding compound 6 in the second region of the mold cavity 1 from this.
  • the additional flow of the still liquid injection molding compound 6 into the cavities left by the movable fixing elements 5 after removal results in the desired seamless encapsulation of the sensor element 2 and of the stamped grid 10.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un capteur, avec enveloppage sans soudure d'un élément capteur, ainsi qu'un capteur fabriqué à l'aide de ce procédé. Afin de mettre en œuvre un procédé de fabrication d'un capteur ainsi que de fournir un capteur produit à l'aide de ce procédé, l'élément capteur étant enveloppé aussi étroitement que possible par la matière de moulage par injection, ce qui empêche durablement la pénétration dans le capteur d'eau, d'acide, d'huile et d'autres substances agressives provenant de l'environnement du capteur, les étapes suivantes sont exécutées : poser l'élément capteur (2) dans un support de moulage (1), immobiliser mécaniquement l'élément capteur (2) dans le support de moulage (1) à l'aide d'au moins un élément d'immobilisation mobile (5) qui est placé dans une deuxième zone (4) du support de moulage (1) et qui fait saillie dans le support de moulage (1), injecter une matière de moulage par injection (6) dans une première zone (3) du support de moulage (1), attendre que la matière de moulage par injection (6) durcisse suffisamment dans une première zone (3) du support de moulage (1) pour que la matière de moulage par injection (6) durcie dans la première zone (3) immobilise l'élément capteur (2) dans sa position, retirer l'élément d'immobilisation mobile (5) avant que la matière de moulage par injection (6) présente dans la deuxième zone (4) ne durcisse, si bien que la matière de moulage par injection (6) encore liquide remplit au moins partiellement l'espace libre laissé dans le support de moulage (1) par l'élément d'immobilisation (5) retiré.
EP10708741A 2009-02-11 2010-02-09 Procédé de fabrication d'un capteur avec enveloppage sans soudure d'un élément capteur Withdrawn EP2396629A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009008457A DE102009008457A1 (de) 2009-02-11 2009-02-11 Verfahren zur Herstellung eines Sensors mit nahtloser Umspritzung eines Sensorelementes
PCT/EP2010/051527 WO2010092029A2 (fr) 2009-02-11 2010-02-09 Procédé de fabrication d'un capteur avec enveloppage sans soudure d'un élément capteur

Publications (1)

Publication Number Publication Date
EP2396629A2 true EP2396629A2 (fr) 2011-12-21

Family

ID=42317539

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10708741A Withdrawn EP2396629A2 (fr) 2009-02-11 2010-02-09 Procédé de fabrication d'un capteur avec enveloppage sans soudure d'un élément capteur

Country Status (5)

Country Link
US (1) US20120043131A1 (fr)
EP (1) EP2396629A2 (fr)
JP (1) JP2012517367A (fr)
DE (1) DE102009008457A1 (fr)
WO (1) WO2010092029A2 (fr)

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US9750886B2 (en) 2013-02-19 2017-09-05 Novo Nordisk A/S Drug delivery device with dose capturing module
WO2014128156A1 (fr) 2013-02-19 2014-08-28 Novo Nordisk A/S Module capteur rotatif à commutateur axial
EP2958610B1 (fr) 2013-02-19 2016-11-30 Novo Nordisk A/S Dispositif d'administration de médicament avec module de capture de dose dans une cartouche
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WO2015075136A1 (fr) 2013-11-21 2015-05-28 Novo Nordisk A/S Ensemble capteur rotatif avec commutateur axial et élément de redondance
CN105722540B (zh) * 2013-11-21 2019-06-28 诺和诺德股份有限公司 具有空间有效设计的旋转传感器组件
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Also Published As

Publication number Publication date
JP2012517367A (ja) 2012-08-02
WO2010092029A3 (fr) 2011-04-14
DE102009008457A1 (de) 2010-08-12
US20120043131A1 (en) 2012-02-23
WO2010092029A2 (fr) 2010-08-19

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