EP0956493A1 - Composant capteur de pression a raccord de tuyau - Google Patents

Composant capteur de pression a raccord de tuyau

Info

Publication number
EP0956493A1
EP0956493A1 EP98907848A EP98907848A EP0956493A1 EP 0956493 A1 EP0956493 A1 EP 0956493A1 EP 98907848 A EP98907848 A EP 98907848A EP 98907848 A EP98907848 A EP 98907848A EP 0956493 A1 EP0956493 A1 EP 0956493A1
Authority
EP
European Patent Office
Prior art keywords
base body
pressure
pressure sensor
sensor component
connection piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98907848A
Other languages
German (de)
English (en)
Inventor
Jürgen WINTERER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0956493A1 publication Critical patent/EP0956493A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Definitions

  • the invention relates to a pressure sensor component with a Druch connector, in particular with a hose connector, which can be mounted on the top side of a printed circuit board.
  • the pressure measurement is usually based on the piezoresistive principle. Alternatively, capacitive measuring principles can be used.
  • a semiconductor chip which generally consists of silicon, generally serves as the pressure sensor. In the case of piezoresistive measurement, a thin silicon membrane is arranged on the chip surface, which is electrically coupled to pressure-dependent resistors, which are likewise formed in the silicon substrate and are connected in a bridge circuit.
  • the semiconductor chip also includes a circuit associated with the sensor for amplifying and correcting the signals and for aligning and compensating the sensor.
  • the pressure sensor is therefore arranged in a housing which is open on one side, so that the pressure-sensitive surface of the sensor can come into direct or indirect contact with the medium to be measured.
  • a flowable filler generally a plastic gel. The filler is selected so that it passes the pressure on to the sensor in an unadulterated manner.
  • the open pressure sensor component can be used as such. If the medium to be measured is not the same as the surrounding medium, the medium to be measured must be brought to the sensor separately from the surrounding medium. A hose system connected to the sensor component is usually used for this purpose.
  • DE-A-4317312 describes a pressure sensor with a pressure chamber arranged in a plastic housing.
  • the pressure chamber has a pipe socket which engages in a connecting pipe of a housing cover. It is described that at low pressures it can be sufficient to provide a seal between the pipe socket and the connecting pipe with a potting compound which is used to cover ceramic chip capacitors.
  • the size of the housing should be kept as small as possible, and it should be possible to use the same basic housing shape as for a corresponding open sensor component without a hose connection.
  • the pressure sensor component should be suitable for connecting hoses of different diameters.
  • the pressure sensor component according to the invention comprises a base body, which is basically an open pressure sensor component that is commonly used, i.e. can correspond to a component without a hose attachment, and a pressure connector fitting this basic body.
  • the invention is characterized in that the base body and the pressure connector with a flowable filler are sealed against each other, which is also used to fill the chip carrier and to cover the semiconductor chip.
  • the base body is preferably designed to be open on one side and comprises the semiconductor chip mounted on the chip carrier and the connections contacted with it.
  • the pressure connector is advantageously placed on the base body and encloses the opening in the base body in which the semiconductor chip is located. This has the advantage that the filling of the chip carrier and thus the covering of the semiconductor chip and the sealing between the base body and the pressure connection piece can take place together.
  • the flowable filler used is one which is sufficiently elastic to pass on pressures to the pressure sensor without falsifying the measurement results.
  • the filler should be largely chemically inert to the media usually to be measured and should be easy to handle.
  • the filler is preferably a plastic gel and in particular a silicone-based gel.
  • the base body of the pressure sensor component can in principle have any shape and configuration that is usually used in pressure sensor components that can be mounted on printed circuit boards.
  • the base body expediently comprises a chip carrier made of plastic, in particular made of thermoplastic, which has an essentially flat chip carrier surface on which the semiconductor chip with an integrated pressure sensor is arranged. Embedded in the plastic mass are several connections that protrude from the side of the chip carrier. The semiconductor chip and connections are contacted with one another in the usual way, for example by means of bond wires. Alternatively, the chip can be attached to a metallic lead frame (lead frame) with integrated connections. to be in order.
  • the chip carrier preferably has at its edges a side wall which projects above the chip surface in its height and surrounds the chip carrier. This side wall limits the opening of the base body through which the medium to be measured is fed to the pressure sensor for pressure measurement.
  • the side wall of the base body expediently closes flat at its upper end. The pressure connector is placed on this side wall.
  • the pressure connector according to the invention is designed so that its end region, which rests on the side wall of the base body, bifurcates.
  • the end of the outer wall of the pressure connection piece facing the base body engages around the upper end region of the side wall.
  • An end or partial area of the end of the outer wall of the pressure connector facing the base body runs along the outside of the side wall of the base body, another end or partial area of the end of the outer wall of the pressure connector facing the base body runs along the inside of the side wall of the Basic body.
  • the space which is between the end of the pressure connection piece which faces the base body and the end region of the side wall of the base body which faces the pressure connection piece is preferably filled as completely as possible with the flowable filler, so that a gas-tight seal is formed between the base body and the pressure connection piece.
  • the space is particularly advantageously filled simultaneously with the covering of the semiconductor chip.
  • the flowable filler is placed on the increase the pressure connector on the base body through the opening in the pressure connector into the base body cavity.
  • the filling height and length of the inner end regions of the pressure connector are matched to one another in such a way that the filler is drawn by capillary forces into the space between the pressure connector and side parts of the base body. All that is required is a filling process in order to provide the interior of the base body with filler and to seal the base body and the pressure connection piece against one another.
  • Chip carriers with a flow stop edge running around the inside of the side wall of the base body are preferably used to produce open pressure sensor components.
  • This flow stop edge has the effect that, when filling, the filler does not penetrate beyond this edge into areas of the base body which should not be contaminated with the filler.
  • Such base bodies can also be used within the scope of the invention. In order to ensure that the space between the end region of the side wall of the base body and the end of the attached pressure connection piece is adequately filled, the end area of the pressure connection piece that runs along the inner
  • Wall of the body side parts runs so long that it protrudes over the flow stop edge and covers it. In this way, capillary forces can also be effective in the area of the flow stop edge, which pull the filler into the space between the pressure connection piece and the base body side wall.
  • the usual open pressure sensor components with a flow stop edge can also be used unchanged for the pressure sensor components according to the invention are used with connection.
  • a particularly secure attachment of the pressure connection piece to the base body can be achieved if two or more attachment lugs are formed in the pressure connection piece, which can snap into corresponding attachment openings or attachment recesses in the base body. If only two fastening lugs are used, these are preferably on opposite sides of the pressure connection piece.
  • the fastening lugs are preferably formed in the region of the outer ends of the pressure connecting piece, which in the assembled state run along the outer side wall of the base body.
  • the fastening lugs protrude particularly preferably at the end region of the outer ends of the pressure connection piece in the direction of the base body.
  • the fastening lugs can be chamfered or rounded in their edge region.
  • the pressure connector according to the invention is preferably designed for the connection of a hose through which the medium to be measured can be fed to the pressure sensor in the base body.
  • a pressure connector is used that is suitable for attaching hoses of different diameters.
  • a pressure connector with a tapered connector can be mentioned, on which hoses of different diameters can be fitted. The suitable hose diameter can then be selected according to the respective application.
  • FIG. 1 shows a schematic sectional view of a pressure sensor component according to the invention
  • FIG. 2 shows a schematic view of the main body of the pressure sensor component according to the invention
  • FIG. 3 schematically shows a sectional view of a further embodiment of the pressure sensor component according to the invention.
  • a pressure sensor component 1 which comprises a base body 2 and a pressure connection piece 8.
  • the base body 2 is arranged on the component side 9 of a printed circuit board 10. It contains a chip carrier 3 made of thermoplastic material, in the central region of which a semiconductor chip 4 is attached.
  • the semiconductor chip 4 has an integrated pressure sensor and an associated electrical circuit. Both are not shown for the sake of clarity.
  • the pressure sensor works according to the piezoresistive system.
  • the semiconductor chip 4 is electrically conductively connected to the metallic connections 5 via bond wires 19.
  • the connections 5 are to your predominantly embedded in the chip carrier 3. Only their ends are led out of the base body in opposite lower lateral areas.
  • the pressure sensor component according to the invention has four connections on two opposite sides of the chip carrier 3.
  • the connections 5 are only on the circuit board with their extreme ends on.
  • the roof-shaped design of the base body underside also serves to reduce stress. Due to the distance between the central region of the base body 2 and the printed circuit board 10, deflections of the printed circuit board are transmitted to the base body to a lesser extent.
  • the base body In its side 11 remote from the printed circuit board, the base body has an opening 7 on one side, which is delimited by the side parts (side wall) 14 of the base body 2.
  • the medium to be measured is fed to the pressure sensor through this opening 7.
  • the interior of the opening 7 of the base body is partially filled with a flowable filler 6, in particular with a silicone-based gel.
  • the gel completely covers the semiconductor chip 4, bonding wires 19 and the part of the connections 5 lying in the interior.
  • the gel almost completely fills the space between the upper end regions 13 of the side parts 14 and the pressure connector 8 resting on the side parts.
  • the pressure connector 8 completely surrounds the opening 7 in the base body 2.
  • the end 12 of the pressure connector 8 facing the base body 2 is bifurcated so that an inner wall 12a and an outer wall 12b of the end 12 are formed. Outer and inner wall encompass the upper end region 13 of the Side wall 14.
  • the inner wall 12a of the end 12 of the pressure connector 8 facing the base body 2 is so long that it covers a flow stop edge 16 formed on the inside 15 of the side wall 14 of the base body.
  • This construction enables the interior of the base body 2 and the space between the side wall 14 and the pressure connector 8 to be filled simultaneously with filler 6.
  • the filler 6 is filled through the opening in the pressure connector 8, in this case a connecting piece for one Hose, introduced into the interior of the base body 2.
  • the fill level is chosen so that the filler 6 can penetrate from below into the gap between the inner wall 15 of the chip carrier 3 and the inner end 12a of the pressure connector 8. Capillary forces pull the filler further up in this gap, overcoming the flow stop edge 16, which would limit the flow of filler 6 without a pressure connection piece 8 attached, and almost fills the space between the pressure connection piece 8 and the base body side wall 14 completely on. In this way, it is possible to fill the interior of the base body 2 and to seal between the pressure connector 8 and the base body 2 in one step. An additional sealing step is not necessary.
  • the base body and the pressure connector are preferably firmly connected to one another beforehand by means of gluing, welding or mutual engagement (clamps).
  • a particularly secure fastening of the pressure connection piece can be achieved if it is provided with two or more fastening lugs which engage in corresponding fastening openings or recesses in the base body.
  • FIG. 3 Here is a schematic cross section through a possible embodiment of a inventive pressure sensor component shown.
  • Base body 2 and pressure connector 8 are shown in a highly simplified manner, since only one possible arrangement of fastening lugs and openings is to be shown.
  • the cross-sectional axis is rotated by 90 ° with respect to that in FIG. 1.
  • the pressure connector 8 has in its lower end region two fastening lugs 17 which project in the direction of the base body 2.
  • fastening recesses 18 on two opposite outer sides, into which the fastening lugs 17 engage in the pressure sensor component according to the invention.
  • the sides of the fastening lugs facing the fastening recesses can be rounded or beveled, as is illustrated by the example of the fastening lug on the left in FIG. 3.
  • the fastening lugs 17 can extend over the entire length of the side walls of the base body or only over a more or less large partial area of these side walls. In the latter case, the fastening lugs not only prevent the pressure connector from lifting off the base body, but also prevent the pressure connector from sliding sideways.
  • the sealing of the pressure connector and base body is also carried out in the above-described manner in this case.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention concerne un composant capteur de pression (1) comportant un corps de base (2) et un élément de raccordement à la pression (8). Le corps de base renferme un porte-puce (3) sur lequel est montée une puce semi-conductrice (4) à capteur de pression intégré. Cette puce semi-conductrice est en contact avec des connexions (5) qui sortent latéralement du corps de base. Le corps de base est ouvert d'un côté, et l'ouverture (7) est délimitée par des parties latérales (14) du porte-puce (3). L'élément de raccordement à la pression (8) est logé sur les régions terminales supérieures (13) des parties latérales (14). L'invention est caractérisée en ce que la matière de remplissage (6), avec laquelle l'espace intérieur du corps de base (2) est rempli et la puce semi-conductrice (4) est recouverte, sert simultanément à raccorder et étanchéifier l'élément de raccordement à la pression (8) et le corps de base (2). Les extrémités (12) de l'élément de raccordement à la pression (8) sont de préférence configurées de sorte que la matière de remplissage (6) soit aspirée par capillarité dans l'espace intermédiaire entre les parties latérales (14) et l'élément de raccordement à la pression (8). Idéalement, l'élément de raccordement à la pression (8) est configuré de manière à permettre le montage de tuyaux de différents diamètres.
EP98907848A 1997-01-29 1998-01-21 Composant capteur de pression a raccord de tuyau Withdrawn EP0956493A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19703206 1997-01-29
DE19703206A DE19703206C2 (de) 1997-01-29 1997-01-29 Drucksensor-Bauteil mit Schlauchanschluß
PCT/DE1998/000187 WO1998034089A1 (fr) 1997-01-29 1998-01-21 Composant capteur de pression a raccord de tuyau

Publications (1)

Publication Number Publication Date
EP0956493A1 true EP0956493A1 (fr) 1999-11-17

Family

ID=7818683

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98907848A Withdrawn EP0956493A1 (fr) 1997-01-29 1998-01-21 Composant capteur de pression a raccord de tuyau

Country Status (6)

Country Link
US (1) US6393922B1 (fr)
EP (1) EP0956493A1 (fr)
JP (1) JP2001509890A (fr)
CN (1) CN1241257A (fr)
DE (1) DE19703206C2 (fr)
WO (1) WO1998034089A1 (fr)

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Also Published As

Publication number Publication date
US6393922B1 (en) 2002-05-28
CN1241257A (zh) 2000-01-12
DE19703206C2 (de) 2002-01-24
DE19703206A1 (de) 1998-07-30
WO1998034089A1 (fr) 1998-08-06
JP2001509890A (ja) 2001-07-24

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