WO1992016969A1 - Tablette de resine de scellement pour semi-conducteur et son procede de fabrication - Google Patents

Tablette de resine de scellement pour semi-conducteur et son procede de fabrication Download PDF

Info

Publication number
WO1992016969A1
WO1992016969A1 PCT/JP1992/000345 JP9200345W WO9216969A1 WO 1992016969 A1 WO1992016969 A1 WO 1992016969A1 JP 9200345 W JP9200345 W JP 9200345W WO 9216969 A1 WO9216969 A1 WO 9216969A1
Authority
WO
WIPO (PCT)
Prior art keywords
tablet
resin
less
semiconductor
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP1992/000345
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Tomohiro Taruno
Shinichi Kanai
Hiroyuki Asao
Syoichi Kimura
Yoshio Toyoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of WO1992016969A1 publication Critical patent/WO1992016969A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B9/00—Making granules
    • B29B9/10—Making granules by moulding the material, i.e. treating it in the molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B29B11/14—Making preforms characterised by structure or composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B13/00—Conditioning or physical treatment of the material to be shaped
    • B29B13/02—Conditioning or physical treatment of the material to be shaped by heating
    • B29B13/022—Melting the material to be shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B29C43/06—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds continuously movable in one direction, e.g. mounted on chains, belts
    • B29C43/08—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds continuously movable in one direction, e.g. mounted on chains, belts with circular movement, e.g. mounted on rolls, turntables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
    • B29C49/071—Preforms or parisons characterised by their configuration, e.g. geometry, dimensions or physical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3676—Moulds for making articles of definite length, i.e. discrete articles moulds mounted on rotating supporting constuctions
    • B29C2043/3689—Moulds for making articles of definite length, i.e. discrete articles moulds mounted on rotating supporting constuctions on a support table, e.g. flat disk-like tables having moulds on the periphery
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2949/00—Indexing scheme relating to blow-moulding
    • B29C2949/07—Preforms or parisons characterised by their configuration
    • B29C2949/0715—Preforms or parisons characterised by their configuration the preform having one end closed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/16—Cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001—Combinations of extrusion moulding with other shaping operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001—Combinations of extrusion moulding with other shaping operations
    • B29C48/0011—Combinations of extrusion moulding with other shaping operations combined with compression moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/04—Particle-shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B29C48/08—Flat, e.g. panels flexible, e.g. films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0058—Liquid or visquous
    • B29K2105/0067—Melt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/065—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts containing impurities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/251—Particles, powder or granules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/253—Preform
    • B29K2105/255—Blocks or tablets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the resin composition is melted by a kneading extruder, and the melted resin composition is supplied to a tablet molding die by the pressing force of the kneading extruder, and the supply pressure of the melted resin composition is increased.
  • the pressurization time is shorter when the mold temperature is lower, and longer when the mold temperature is higher, but is generally about 20 seconds to 5 minutes.
  • the amount of fine powder adhering to 250 mesh or less is less than 0.05% by weight, preferably less than 0.002% by weight. Therefore, it is possible to cope with the recent tendency to clean semiconductor encapsulation factories.
  • the taper can be made substantially 0 (taper is 1200 or less), so that the pot of the transfer molding machine can be designed with high precision, and As a result, the clearance with the inner surface of the transfer molding die can be reduced as much as possible, the entrapment void can be effectively prevented, and the reliability of the obtained semiconductor device is improved.
  • the equipment shown in Fig. 3 was used. Mixing of resin composition, tablet molding Dimensions of mold 4, pre-mixing with Henschel mixer, cooling circulating water The temperature, molding pressure, etc. were the same as in Example 1.
  • the number of the tablet forming dies 4 on the turntable 3 is set to eight, and the temperature of the supply pipe 20 is adjusted to 80 to supply the molten resin composition from the kneading extruder 1 to the supply port. It is supplied to the tablet forming die 4 via the pipe 20 by the pushing force of the kneading extruder 1

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Geometry (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
PCT/JP1992/000345 1991-03-20 1992-03-19 Tablette de resine de scellement pour semi-conducteur et son procede de fabrication Ceased WO1992016969A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP3/81696 1991-03-20
JP8169691 1991-03-20
JP3/349648 1991-12-06
JP34964891 1991-12-06

Publications (1)

Publication Number Publication Date
WO1992016969A1 true WO1992016969A1 (fr) 1992-10-01

Family

ID=26422698

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1992/000345 Ceased WO1992016969A1 (fr) 1991-03-20 1992-03-19 Tablette de resine de scellement pour semi-conducteur et son procede de fabrication

Country Status (7)

Country Link
US (1) US5645787A (enExample)
EP (1) EP0530377A4 (enExample)
JP (1) JP2822273B2 (enExample)
KR (1) KR0135628B1 (enExample)
MY (1) MY109641A (enExample)
TW (1) TW220009B (enExample)
WO (1) WO1992016969A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5698152A (en) * 1994-02-23 1997-12-16 Nitto Denko Corporation Resin tablet for sealing semiconductor

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6361526B1 (en) * 1993-11-01 2002-03-26 Medtronic Xomed, Inc. Antimicrobial tympanostomy tube
CA2208355A1 (en) * 1994-12-23 1996-07-04 Cookson Singapore Pte Ltd Improved process for making preforms useful for encapsulating semiconductors
US5888443A (en) * 1996-05-02 1999-03-30 Texas Instruments Incorporated Method for manufacturing prepackaged molding compound for component encapsulation
TW517263B (en) * 2000-03-29 2003-01-11 Nitto Denko Corp Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
US6555400B2 (en) * 2001-08-22 2003-04-29 Micron Technology, Inc. Method for substrate mapping
DE602004002623T2 (de) * 2003-07-17 2007-01-18 Nitto Denko Corporation, Ibaraki Verfahren zur Herstellung eines Harzverkapselungsscheibchens für Halbleiter
KR101029974B1 (ko) * 2010-12-22 2011-04-20 금성산기 주식회사 반도체 소자용 로터리식 수지 태블릿 성형장치

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431004U (enExample) * 1977-08-02 1979-03-01
JPS5653145U (enExample) * 1979-05-09 1981-05-11
JPS597009A (ja) * 1982-07-03 1984-01-14 Toshiba Corp 高密度タブレツトおよびそれを使用した半導体樹脂封止方法
JPS6140353A (ja) * 1984-07-31 1986-02-26 Shin Etsu Chem Co Ltd 半導体封止用樹脂タブレツトの製造方法および製造装置
JPS61270121A (ja) * 1985-05-24 1986-11-29 Hitachi Ltd 成形方法および装置
JPS6351108A (ja) * 1986-08-20 1988-03-04 Mitsubishi Electric Corp タブレツトの製造方法
JPS6354468A (ja) * 1986-08-25 1988-03-08 Shin Etsu Chem Co Ltd 半導体封止用樹脂組成物及びその製造方法
JPH01129424A (ja) * 1987-11-15 1989-05-22 Omron Tateisi Electron Co 電子素子の樹脂封止方法
JPH02171220A (ja) * 1988-12-24 1990-07-02 T & K Internatl Kenkyusho:Kk 電子部品の樹脂封止成形方法及び装置
JPH035103A (ja) * 1989-06-01 1991-01-10 Hitachi Ltd タブレットの製造装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5631004B2 (enExample) * 1971-10-06 1981-07-18
JPS5853145B2 (ja) * 1977-06-27 1983-11-28 古河電気工業株式会社 海底掘削機
JPS5631004A (en) * 1979-08-21 1981-03-28 Yoshio Moriguchi Flap molding apparatus for pocket
JPS5853145A (ja) * 1981-09-26 1983-03-29 Toshiba Corp 三極形イオンポンプ
JPS597008A (ja) * 1982-07-03 1984-01-14 Toshiba Corp 高密度タブレツトおよびそれを使用した半導体樹脂封止方法
JPS6040214A (ja) * 1983-08-13 1985-03-02 Matsushita Electric Works Ltd タブレツトの製造方法
JPS60251633A (ja) * 1984-05-28 1985-12-12 Michio Osada トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置
JPS6135908A (ja) * 1984-07-30 1986-02-20 Shin Etsu Chem Co Ltd 半導体封止用樹脂タブレツトの製造方法
JPS61177210A (ja) * 1985-02-01 1986-08-08 Shin Etsu Chem Co Ltd 半導体封止用樹脂タブレツトの製造装置
JPS62261403A (ja) * 1986-05-08 1987-11-13 Mitsubishi Electric Corp モ−ルド樹脂
US4826931A (en) * 1986-10-09 1989-05-02 Mitsubishi Denki Kabushiki Kaisha Tablet for resin-molding semiconductor devices
JP2694293B2 (ja) * 1989-03-18 1997-12-24 トーワ株式会社 高圧縮成形樹脂タブレットの成形方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5431004U (enExample) * 1977-08-02 1979-03-01
JPS5653145U (enExample) * 1979-05-09 1981-05-11
JPS597009A (ja) * 1982-07-03 1984-01-14 Toshiba Corp 高密度タブレツトおよびそれを使用した半導体樹脂封止方法
JPS6140353A (ja) * 1984-07-31 1986-02-26 Shin Etsu Chem Co Ltd 半導体封止用樹脂タブレツトの製造方法および製造装置
JPS61270121A (ja) * 1985-05-24 1986-11-29 Hitachi Ltd 成形方法および装置
JPS6351108A (ja) * 1986-08-20 1988-03-04 Mitsubishi Electric Corp タブレツトの製造方法
JPS6354468A (ja) * 1986-08-25 1988-03-08 Shin Etsu Chem Co Ltd 半導体封止用樹脂組成物及びその製造方法
JPH01129424A (ja) * 1987-11-15 1989-05-22 Omron Tateisi Electron Co 電子素子の樹脂封止方法
JPH02171220A (ja) * 1988-12-24 1990-07-02 T & K Internatl Kenkyusho:Kk 電子部品の樹脂封止成形方法及び装置
JPH035103A (ja) * 1989-06-01 1991-01-10 Hitachi Ltd タブレットの製造装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0530377A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5698152A (en) * 1994-02-23 1997-12-16 Nitto Denko Corporation Resin tablet for sealing semiconductor

Also Published As

Publication number Publication date
US5645787A (en) 1997-07-08
MY109641A (en) 1997-03-31
TW220009B (enExample) 1994-02-01
JP2822273B2 (ja) 1998-11-11
EP0530377A1 (en) 1993-03-10
EP0530377A4 (en) 1993-10-06
KR0135628B1 (ko) 1998-04-24

Similar Documents

Publication Publication Date Title
US20130015607A1 (en) Compact production apparatus and method for producing compact
JP3037552B2 (ja) 半導体封止用樹脂タブレット及び半導体封止装置とその製造方法
WO1992016969A1 (fr) Tablette de resine de scellement pour semi-conducteur et son procede de fabrication
US20040067153A1 (en) Method for producing composite metal product
JPWO1992016969A1 (ja) 半導体封止用樹脂タブレット及びその製造方法
JP2592753B2 (ja) 半導体封止用樹脂タブレット
EP0799118B1 (en) Improved process for making preforms useful for encapsulating semiconductors
JP2878649B2 (ja) 半導体封止用樹脂タブレット及びその製造方法と半導体封止方法
JPH05315174A (ja) 希土類樹脂結合型磁石及びその製造方法
JP3846825B2 (ja) 顆粒状半導体封止用エポキシ樹脂組成物の製造方法
JP2968934B2 (ja) 半導体封止用樹脂タブレットの製造方法
JP4321016B2 (ja) エポキシ樹脂成形材料タブレットの製造方法
JP3436490B2 (ja) 半導体封止成形方法及び装置
CN110978205A (zh) 一种陶瓷激光3d打印用废料回收装置
JPS6135908A (ja) 半導体封止用樹脂タブレツトの製造方法
JP3112993B2 (ja) ナイロンとセラミックスの複合材の製造方法
JP7465703B2 (ja) 光半導体封止用樹脂成形物およびその製造方法
JP3140868B2 (ja) レゾール型フェノール樹脂成形材料
JP2985832B2 (ja) 半導体装置用樹脂封止装置及びその樹脂封止方法
JPH07116303B2 (ja) 摩擦板の製造法
JPH04324914A (ja) 希土類永久磁石の製造方法
KR20250151023A (ko) 과립형 에폭시 몰딩 컴파운드 제조 방법 및 장치
JPH10180839A (ja) 押出ダイ及びそれを用いた半導体封止用エポキシ樹脂組成物の製造方法
JPH10249852A (ja) 樹脂タブレットの製造方法および装置
CN112592460A (zh) 光半导体密封用树脂成型物及其制造方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): JP KR US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IT LU MC NL SE

WWE Wipo information: entry into national phase

Ref document number: 1992907112

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1992907112

Country of ref document: EP

ENP Entry into the national phase

Ref country code: US

Ref document number: 1995 464386

Date of ref document: 19950605

Kind code of ref document: A

Format of ref document f/p: F

ENP Entry into the national phase

Ref country code: US

Ref document number: 1996 702117

Date of ref document: 19960823

Kind code of ref document: A

Format of ref document f/p: F

WWW Wipo information: withdrawn in national office

Ref document number: 1992907112

Country of ref document: EP