WO1985002515A1 - Carte de circuit imprime permettant de monter un element electronique et son procede de fabrication - Google Patents

Carte de circuit imprime permettant de monter un element electronique et son procede de fabrication Download PDF

Info

Publication number
WO1985002515A1
WO1985002515A1 PCT/JP1984/000565 JP8400565W WO8502515A1 WO 1985002515 A1 WO1985002515 A1 WO 1985002515A1 JP 8400565 W JP8400565 W JP 8400565W WO 8502515 A1 WO8502515 A1 WO 8502515A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
metal plate
opening
back surface
bonding layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP1984/000565
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Katsumi Mabuchi
Toshimi Komura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to AT84904181T priority Critical patent/ATE53739T1/de
Priority to DE8484904181T priority patent/DE3482545D1/de
Publication of WO1985002515A1 publication Critical patent/WO1985002515A1/ja
Priority to FI852798A priority patent/FI86943C/fi
Anticipated expiration legal-status Critical
Priority to SG41/91A priority patent/SG4191G/en
Priority to HK71692A priority patent/HK71692A/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1064—Partial cutting [e.g., grooving or incising]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Definitions

  • the present invention relates to a printed wiring board used for mounting various chip components and / or electronic components such as semiconductor elements, and a method of manufacturing the same.
  • the present invention is to provide a pre-soot wiring board which is excellent in dissipating heat generated from a mounted electronic component and in which moisture hardly penetrates into the electronic component from the outside, and a method of manufacturing the same. .
  • plastic The material of these pre-sotted wiring boards is plastic and / or ceramic, and plastic is most widely used.
  • printed wiring boards made of plastic have excellent dimensional accuracy and mechanical strength, but are superior to ceramic boards such as aluminum, but their thermal conductivity is extremely low, about 160 times that of aluminum ceramics.
  • conventional plastic substrates have not yet been fully satisfied as substrates on which highly integrated ICs and electronic components with high power consumption are mounted.
  • a concave portion having a predetermined depth is provided in a portion of the substrate on which the semiconductor and the integrated circuit chip are mounted, a through hole having a predetermined shape is provided in the concave portion, and a peripheral portion of the through hole is used as a support portion, and a semiconductor is provided on an upper surface of the support portion.
  • a printed circuit board for mounting a semiconductor and an integrated circuit chip on which a thin metal plate for supporting an integrated circuit chip is mounted.
  • a circuit board for f is characterized by being processed.
  • the moisture penetrates into the recess for mounting the LSI through the adhesive layer that joins the substrate and the reinforcing member, and thus has a disadvantage that the life of the LSI is shortened.
  • a support print of one or more layers is provided in an integrated module mainly composed of a pre-soot wiring board and a logic unit chip fixed thereto.
  • the wiring board is provided with an opening, into which the step of the heat radiating device that is correctly joined to the supporting printed wiring board extends, and on the opposite side of the supporting pre-soot wiring board, the logic unit heats up on the step of the heat radiating device.
  • An integrated module is disclosed which is directly secured by a medium of good conductivity.
  • the step of the heat radiator is joined to the opening of the printed wiring board, external moisture easily enters the logic unit through this joint, so that the logic unit is likely to break down and its life is short.
  • the present invention eliminates and improves the above disadvantages of the prior art, and has excellent heat dissipation, water resistance, high reliability, and easy formation of high-density wiring, and a method of manufacturing the same.
  • the purpose is to provide.
  • a printed wiring board including a plastic material, wherein an opening penetrating from a front surface to a back surface of the printed circuit board is formed in a region where the electronic component is mounted.
  • a metal plate is adhered to the back surface via a bonding layer, and the end of the opening on the back surface of the substrate is closed by the metal plate.
  • a plating film is integrally formed between the plastic material and the bonding layer to be formed and the inside of the opening of the metal plate that closes the end of the opening on the back surface of the substrate.
  • the electronic component mounting pre-slot has a plating film integrally formed on at least the outer peripheral region other than the region adhered to the substrate, the outer side surface of the bonding layer, and the side surface and the back surface of the metal plate.
  • the present invention relates to a wire substrate and a method of manufacturing the same, wherein the integrally formed coating film can prevent moisture from entering the opening through which the electronic component is mounted via a plastic material and a bonding layer from the outside. it can.
  • FIGS. 4 (a), (b)-, (c) and (d). ) Is the electronic component board of the present invention.
  • FIGS. 5 and 6 are plan views respectively showing an embodiment of a shape of a metal plate for positioning a metal plate used for a mounting printed wiring board and a shape of a concave portion formed on the back surface of the substrate.
  • FIG. 7 is a longitudinal sectional view of the electronic component mounting printed wiring board, showing the manufacturing process of the electronic component mounting board.
  • FIG. 7 is a bin grid array package manufactured using the electronic component mounting substrate of the present invention.
  • FIG. 8 is a perspective view of an example of the substrate as viewed from the back surface, and FIG. 8 is a longitudinal sectional view taken along the line-in FIG. -Best mode for carrying out the invention
  • FIG. 1 shows a vertical section of an opening 3 for mounting electronic components provided on a printed wiring board 1 containing a plastic material and a structure around the opening 3), and gold foil on the upper and lower surfaces.
  • a metal plate 5 is adhered via a bonding layer 7 to the lower surface of the substrate 1 on which the substrate 2 is adhered, that is, the peripheral region of the lower end of the opening 3 on the back surface of the substrate 1 via the bonding layer 7.
  • a plating film 9 is applied to the back surface of the substrate and a region where the metal plate 5 is not bonded.
  • a plating film 11 is integrally formed on the inner wall of the opening 3 and the bottom surface formed by the metal plate 5.
  • a laminated board formed by laminating a plastic material and glass cloth or paper is widely used as a substrate.
  • the plastic material epoxy resin, polyimide resin, triazine resin and phenol resin are used. Although one or more resins selected from the above are used, a substrate containing the above-mentioned conventional plastic material can also be used in the present invention.
  • the plastic material 1 and the bonding layer 7 have a property of absorbing and penetrating moisture, in the case of a conventional board which is not integrally formed with the wood coating, the electronic component is directly provided on the metal plate at the bottom of the opening.
  • the heat generated by the operation of the electronic components is well dissipated through the metal plate, but the moisture that enters from outside into the opening through the plastic material and the bonding layer was prevented. .
  • the substrate of the present invention is provided with the plating films 9 and 11 as described above, the bonding layer 7 is shielded from the outside air by the coating 9] 9, and the plating film 11 is formed in the opening 3. Due to the fact that it is shielded from the plastic material 1 and the bonding layer 7, when the electronic component is mounted and operated, it is possible to completely prevent moisture from entering the opening 3 from the outside.
  • FIG. 2 and 3 each show a longitudinal section of the structure of another embodiment of the printed wiring board of the present invention. Unlike the one shown in FIG. 1, the back side of the board 1 is depressed in the direction of the front side.
  • the metal plate 5 is bonded to the downward bottom surface of the formed concave portion, that is, the step portion 13 via the bonding layer 7.
  • the gap between the metal plate 5 and the side wall of the concave portion is smaller than that of the substrate shown in FIG. 3].
  • a groove .15 is formed in which a plating film formed so as to fill the gap in the gap is slightly indented.
  • the plating film 9 is formed on the side wall of the recess of the gap, the side surface of the metal plate 5 and the bottom of the gap. The forces formed in one piece; gaps 1 and 2 still remain.
  • the substrate shown in FIG. 3 has a larger area of the plating film on the back side of the substrate! )
  • the heat dissipation is further improved because of the widening. Therefore, even in the case of the substrate shown in FIGS. 2 and 3, since the plating films 9 and 11 are integrally formed as in the case of the substrate shown in FIG. It is possible to completely prevent moisture from intruding into the part 3 from the outside, and it has good heat dissipation like the conventional substrate.
  • FIGS. 4 (a), (b), (c) and (d) show a substrate having the structure shown in FIGS. 2 and 3 in which a metal plate is provided on the bottom surface in the recess provided on the back surface of the printed wiring board.
  • a metal plate is provided on the bottom surface in the recess provided on the back surface of the printed wiring board.
  • FIGS. 7 (a) and 7 (b) it can be seen that the metal plate 5 is extremely easily and reliably positioned and adhered to the bottom surface of the concave portion by providing the projections 1 at the four corners or four sides of the metal plate 5. .
  • FIGS. 7 (c) and 7 (d) show the state in which the deformed portion or projection 14 is provided on the inner wall of the recess, respectively. You can fist the same effect.
  • the adhesive used for the substrate of the present invention is epoxy resin, polyimide resin, acrylic resin, triazine resin or a modified resin thereof, and these resins have adhesiveness, heat resistance, durability and electric insulation. It is used advantageously because of its excellent properties.
  • As the metal plate a plate having relatively high thermal conductivity such as copper, copper alloy, iron, iron alloy, aluminum, aluminum alloy can be advantageously used. Copper, nickel, gold, and the like can be used as the material of the plating film.
  • FIG. 5 (a) to 5 (d) are views showing a longitudinal section of the substrate of the present invention in the order of manufacturing steps.
  • an opening 3 penetrating the substrate is formed by punching or cutting in the substrate 1 on which the metal foil 2 is adhered to the upper surface and the lower surface.
  • a metal plate 5 is bonded to a peripheral region on the back surface of the substrate at the lower end of the opening via a metal foil 2 and a bonding layer 7.
  • FIG. 1A an opening 3 penetrating the substrate is formed by punching or cutting in the substrate 1 on which the metal foil 2 is adhered to the upper surface and the lower surface.
  • FIG. 2B a metal plate 5 is bonded to a peripheral region on the back surface of the substrate at the lower end of the opening via a metal foil 2 and a bonding layer 7.
  • FIG. 1A an opening 3 penetrating the substrate is formed by punching or cutting in the substrate 1 on which the metal foil 2 is adhered to the upper surface and the lower surface.
  • FIG. 2B
  • the substrate intended by the present invention can be obtained by integrally applying the plating films 11 and 9 to the side surfaces of the bonding layer on the back side.
  • Figure (d) shows the base shown in Figure (c).
  • FIG. 5 is a view showing an example of an embodiment after a plate is obtained and further processed as described below. For example, a photosensitive resin film is applied to the surface of the substrate shown in FIG. After the pattern is formed, the conductor circuit is formed in the usual way through an etching process.
  • any electronic component such as a semiconductor element is mounted in the opening 3 via a silver paste or the like.
  • FIGS. 6 (a) to 6 (e) are views showing the manufacturing steps of another embodiment of the printed wiring board for mounting electronic components according to the present invention in the order of steps.
  • FIG. 6 (a) is a longitudinal sectional view showing a state 10 in which a concave portion 17 is formed using an end mill on the back surface of the substrate 1 on which the metal foil 2 is adhered to the upper surface and the lower surface of the substrate.
  • a metal plate 5 is bonded to the bottom surface of the concave portion 17 via the bonding layer 7.
  • FIG. 1 (c) the front side of the substrate 1 is cut by a Jen mill to form the electronic component mounting opening 3 until the metal plate 5 reaches at least.
  • FIG. 1 (c) the front side of the substrate 1 is cut by a Jen mill to form the electronic component mounting opening 3 until the metal plate 5 reaches at least.
  • FIG. 6E is a diagram showing an example of an embodiment after the substrate of the present invention shown in FIG. 5A is obtained and further processed as described below.
  • the substrate shown in FIG. 5A After a photosensitive resin film is formed on the surface of the substrate and a desired circuit pattern is formed, a conductor circuit is formed by an ordinary method through an etching process.
  • 3 ⁇ 4Electronic components are mounted via silver paste.
  • FIG. 7 is a perspective view of an example of a pin grid array package manufactured using the electronic component mounting substrate of the present invention, as viewed from the back surface of the substrate, and FIG.
  • FIG. 8 is a longitudinal sectional view of the substrate shown in FIG. 7 taken along line AA.
  • the LSI 19 is mounted in the opening 3 of the printed wiring board 1 of the present invention 5 and the peripheral area of the LSI is sealed with the epoxy resin 22.
  • Contact The connection conductor pin 21 is fixed to a through hole 23 electrically connected to the circuit.
  • the electronic components of the semiconductor device are firmly bonded to the metal plate having good heat conductivity via the plating film, In addition to being able to quickly and reliably absorb and dissipate the heat generated by the mounted electronic components, it is also possible to apply a metal coating inside the opening of the board, and furthermore, the backside of the board, the backside of the metal plate, and in some cases Since the metal coating is integrally formed in the gap between the concave portion and the metal plate, it is possible to completely prevent external moisture from entering the opening through the plastic material and the bonding layer.
  • the back surface side of the metal plate may be made to protrude larger than the flat surface on the back side of the substrate, or the back side. Since it can be on the same plane as the plane, a thin substrate with a reduced thickness can be provided.
  • the electronic component mounting board of the present invention can be advantageously used as a semiconductor element mounting board such as a chip carrier, a pin grid array package, and a hybrid board, as well as a camera, a watch, and an interior board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
PCT/JP1984/000565 1983-11-29 1984-11-27 Carte de circuit imprime permettant de monter un element electronique et son procede de fabrication Ceased WO1985002515A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AT84904181T ATE53739T1 (de) 1983-11-29 1984-11-27 Gedruckte schaltungsplatte zur montierung eines elektronischen elementes und herstellungsverfahren dafuer.
DE8484904181T DE3482545D1 (de) 1983-11-29 1984-11-27 Gedruckte schaltungsplatte zur montierung eines elektronischen elementes und herstellungsverfahren dafuer.
FI852798A FI86943C (fi) 1983-11-29 1985-07-17 Tryckkopplingsplaot foer montering av elektroniska delar och foerfaranden foer tillverkning av den
SG41/91A SG4191G (en) 1983-11-29 1991-01-28 Printed-circuit board for mounting electronic element and method of manufacture thereof
HK71692A HK71692A (en) 1983-11-29 1992-09-17 Printed-circuit board for mounting electronic element and method of manufacture thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP58/225237 1983-11-29
JP58225237A JPS60116191A (ja) 1983-11-29 1983-11-29 電子部品搭載用基板の製造方法

Publications (1)

Publication Number Publication Date
WO1985002515A1 true WO1985002515A1 (fr) 1985-06-06

Family

ID=16826139

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1984/000565 Ceased WO1985002515A1 (fr) 1983-11-29 1984-11-27 Carte de circuit imprime permettant de monter un element electronique et son procede de fabrication

Country Status (7)

Country Link
US (2) US4737395A (https=)
EP (1) EP0197148B1 (https=)
JP (1) JPS60116191A (https=)
DE (1) DE3482545D1 (https=)
FI (1) FI86943C (https=)
SG (1) SG4191G (https=)
WO (1) WO1985002515A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4806808A (en) * 1986-09-12 1989-02-21 Siemens Aktiengesellschaft Printed circuit board for external rotor motor with recess for Hall transducers
CN112004318A (zh) * 2020-08-14 2020-11-27 无锡先仁智芯微电子技术有限公司 一种封装结构及其制作方法

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4993148A (en) * 1987-05-19 1991-02-19 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a circuit board
JPH0263141A (ja) * 1989-04-05 1990-03-02 Ibiden Co Ltd 電子部品搭載用基板の製造方法
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JP2813682B2 (ja) * 1989-11-09 1998-10-22 イビデン株式会社 電子部品搭載用基板
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SG4191G (en) 1991-04-05
FI86943C (fi) 1992-10-26
FI852798A0 (fi) 1985-07-17
EP0197148A1 (en) 1986-10-15
JPH0378795B2 (https=) 1991-12-16
EP0197148B1 (en) 1990-06-13
DE3482545D1 (de) 1990-07-19
FI852798L (fi) 1985-07-17
EP0197148A4 (en) 1987-06-29
FI86943B (fi) 1992-07-15
US4737395A (en) 1988-04-12
JPS60116191A (ja) 1985-06-22
US4773955A (en) 1988-09-27

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