CN100490605C - 印刷电路板 - Google Patents
印刷电路板 Download PDFInfo
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- CN100490605C CN100490605C CNB200510101244XA CN200510101244A CN100490605C CN 100490605 C CN100490605 C CN 100490605C CN B200510101244X A CNB200510101244X A CN B200510101244XA CN 200510101244 A CN200510101244 A CN 200510101244A CN 100490605 C CN100490605 C CN 100490605C
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
一种印刷电路板,包括一第一接口的针脚孔、一第二接口的针脚孔及一信号线,所述第一接口的针脚孔及第二接口的针脚孔重叠;所述信号线对应电气连接至所述第一接口的针脚孔的中心点或所述第二接口的针脚孔的中心点;所述重叠的两针脚孔之间由铜箔进行导通。通过上述设计,可减少设计过程中的分析、纠错及验证过程,从而保证了信号的正常传输,提高了设计效率。
Description
【技术领域】
本发明涉及一种印刷电路板,特别涉及一种对不同接口的针脚孔共同布线(layout)的印刷电路板。
【背景技术】
由于规范更新换代和技术的不断改进,为了满足不同厂商对接口的需求,同时有效的节省布线空间,在对印刷电路板进行布线设计时会考虑对不同的接口的针脚孔采用共同布线。针脚孔是设置在印刷电路板上的孔,接口零件的针脚可插入并焊接于其内,以实现接口器件与印刷电路板上对应信号线间的电气连接。
比如,目前计算机主要采用两种串行外设接口—USB(Universal SerialBus,通用串行总线)接口和IEEE(The Institute of Electrical and ElectronicsEngineers,电机电子工程师协会)1394接口,此两串行外设接口均集成于印刷电路板上。USB接口是一种计算机系统与外围设备连接的输入/输出接口。USB接口通过一个4针脚的标准插头,采用菊花链形式把所有的外设连接起来。IEEE 1394接口是一具有视频数据传输速度的串行接口,它是将PC和消费类电器连接起来的重要桥梁。目前,IEEE 1394接口广泛应用于数字成像领域,是唯一支持数字摄录机的总线接口。随着用户需求的不断提高,USB接口和IEEE 1394接口将同时提供不同的服务以共同处理所有外部输入输出。
请参阅图1至图3,印刷电路板上IEEE 1394接口的安装区10中A区的针脚孔与图2中USB接口的安装区20中B区的针脚孔的布局完全对应,如IEEE1394接口的针脚孔12与USB接口针脚孔22对应。故在印刷电路板布线设计时,可以对A区及B区进行共同布线,即在印刷电路板布线时,把A区及B区对应的针脚孔重叠,以节省布线空间。
请继续参阅图4,在设计过程中,理想情况下A区IEEE 1394接口的针脚孔12的中心点O1与B区USB接口的对应针脚孔22的中心点O2应该完全重合于一点,相应的信号线40将连接至该重合点以同时完成不同接口的电气连接。但是由于设计工具存在误差,所以上述两针脚孔12、22的中心点O1、O2不能完全重合。如果所述信号线40接至IEEE 1394接口的针脚孔12的中心点O1,则USB接口工作时信号传输将会出现断路;同理,如果所述信号线40接至USB接口的针脚孔22的中心点O2,则IEEE 1394接口工作时信号传输将会出现断路;从而影响了整个印刷电路板的工作稳定性。故设计过程中必须花费大量时间分析和解决所述断路问题,以使上述两接口接入时均可正常工作,从而浪费了人力并将浪费大量时间。
【发明内容】
鉴于以上内容,有必要提供一种可满足共同布线针脚孔的不同接口同时正常工作的印刷电路板。
一种印刷电路板,包括一第一接口的针脚孔、一第二接口的针脚孔及一信号线,所述第一接口的针脚孔及第二接口的针脚孔重叠;所述信号线对应电气连接至所述第一接口的针脚孔的中心点或所述第二接口的针脚孔的中心点;所述重叠的两针脚孔之间由铜箔进行导通。
相较现有技术,本发明所述两重叠的针脚孔之间由铜箔进行导通,从而使得每一重叠的针脚孔的中心点与所述印刷电路板上的信号线连接,减少了设计时的排错分析及验证改进过程,提高了设计效率。
【附图说明】
下面结合附图及较佳实施方式对本发明作进一步详细描述。
图1是现有印刷电路板上IEEE 1394接口的安装区的示意图。
图2是现有印刷电路板上USB接口的安装区的示意图。
图3是现有印刷电路板上IEEE 1394接口及USB接口共同布线的示意图。
图4是现有技术中IEEE 1394接口及USB接口共同布线的针脚孔的放大示意图。
图5是本发明印刷电路板的较佳实施方式的部分共同布线的针脚孔的放大示意图。
【具体实施方式】
请参阅图5,本发明印刷电路板的较佳实施方式以印刷电路板上IEEE1394接口和USB接口对应的针脚孔来加以说明。所述印刷电路板包括两信号层(图未标示)、若干IEEE 1394接口的针脚孔、若干USB接口的针脚孔及若干信号线。所述IEEE 1394接口的针脚孔及USB接口的针脚孔布局相同的部分采用共同布线。所述信号线对应电气连接至所述IEEE 1394接口的针脚孔的中心点或所述USB接口的针脚孔的中心点。
如图示,IEEE 1394接口的针脚孔52与对应USB接口的针脚孔54采用共同布线,即两者重叠设计。所述IEEE 1394接口的针脚孔52及USB接口的针脚孔54均贯穿所述印刷电路板,其中所述IEEE 1394接口的针脚孔52的中心点为A1,所述USB接口的针脚孔54的中心点为A2。所述信号线56电气连接至所述IEEE 1394接口的针脚孔52的中心点A1或USB接口的针脚孔54的中心点A2。如果所述信号线56连接至所述IEEE 1394接口的针脚孔52的中心点A1,则IEEE 1394接口器件的针脚与所述印刷电路板上的对应信号线56实现电性连接;如果所述信号线56连接至所述USB接口的针脚孔54的中心点A2,则USB接口器件的针脚与所述印刷电路板上的对应信号线56实现电性连接。
在IEEE 1394接口的针脚孔52与USB接口的针脚孔54共同布线时,理论上所述IEEE 1394接口的针脚孔52的中心点A1与USB接口的针脚孔54的中心点A2应该重合于一点,但在印刷电路板布线设计时,由于设计工具恒存在误差,故A1、A2不可能重合。故,本较佳实施方式中,将所述IEEE 1394接口的针脚孔52与USB接口的针脚孔54之间通过铜箔58来进行导通。所述铜箔58位于所述印刷电路板的上层信号层。由于在印刷电路板工艺制造过程中,针脚孔会吸铜,从而可使两针脚孔的中心点A1和A2之间恒电气连接,从而可使所述信号线56同时与所述IEEE 1394接口的针脚孔52的中心点A1及USB接口的针脚孔54的中心点A2都电气相连,达到了设计目的,提高了整个印刷电路板的质量和稳定性。
由于上述IEEE 1394接口的针脚孔52及USB接口的针脚孔54共同布线,所以按照该方法设计的印刷电路板的同一外设接口既可以使用IEEE 1394接口设备,也可使用USB接口设备,更好的满足了不同客户的要求。
同理,对于可共同布线的其它不同接口的针脚孔,也可应用上述方法来设计。
Claims (2)
1.一种印刷电路板,包括一第一接口的针脚孔、一第二接口的针脚孔及一信号线;所述第一接口的针脚孔及第二接口的针脚孔重叠;所述信号线对应电气连接至所述第一接口的针脚孔的中心点或所述第二接口的针脚孔的中心点;其特征在于:所述重叠的两针脚孔之间由铜箔进行导通。
2.如权利要求1所述的印刷电路板,其特征在于:所述第一接口及第二接口的针脚孔均贯穿所述印刷电路板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB200510101244XA CN100490605C (zh) | 2005-11-11 | 2005-11-11 | 印刷电路板 |
US11/309,280 US7587816B2 (en) | 2005-11-11 | 2006-07-21 | Method of improving the stability of a circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CNB200510101244XA CN100490605C (zh) | 2005-11-11 | 2005-11-11 | 印刷电路板 |
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CN1964597A CN1964597A (zh) | 2007-05-16 |
CN100490605C true CN100490605C (zh) | 2009-05-20 |
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CNB200510101244XA Expired - Fee Related CN100490605C (zh) | 2005-11-11 | 2005-11-11 | 印刷电路板 |
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CN (1) | CN100490605C (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101452496B (zh) * | 2007-12-06 | 2010-09-22 | 英业达股份有限公司 | 获取信号线的布设路径的方法 |
CN102223761A (zh) * | 2010-04-16 | 2011-10-19 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板和印刷电路板组合 |
CN102264190A (zh) * | 2010-05-31 | 2011-11-30 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
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EP0197148A1 (en) * | 1983-11-29 | 1986-10-15 | Ibiden Co, Ltd. | Printed-circuit board for mounting electronic element and method of manufacture thereof |
US5282312A (en) * | 1991-12-31 | 1994-02-01 | Tessera, Inc. | Multi-layer circuit construction methods with customization features |
JP2000354212A (ja) * | 1999-06-11 | 2000-12-19 | Toshiba Corp | ドライブ基板装置 |
CN1309525A (zh) * | 2000-01-31 | 2001-08-22 | 株式会社东芝 | 印刷电路板 |
US20040173822A1 (en) * | 2003-03-05 | 2004-09-09 | Achyut Dutta | High speed electronics interconnect and method of manufacture |
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US4443278A (en) * | 1981-05-26 | 1984-04-17 | International Business Machines Corporation | Inspection of multilayer ceramic circuit modules by electrical inspection of green specimens |
US5367764A (en) * | 1991-12-31 | 1994-11-29 | Tessera, Inc. | Method of making a multi-layer circuit assembly |
US5822856A (en) * | 1996-06-28 | 1998-10-20 | International Business Machines Corporation | Manufacturing circuit board assemblies having filled vias |
US6115262A (en) * | 1998-06-08 | 2000-09-05 | Ford Motor Company | Enhanced mounting pads for printed circuit boards |
US6388208B1 (en) * | 1999-06-11 | 2002-05-14 | Teradyne, Inc. | Multi-connection via with electrically isolated segments |
JP4092890B2 (ja) * | 2001-05-31 | 2008-05-28 | 株式会社日立製作所 | マルチチップモジュール |
US7096555B2 (en) * | 2003-09-19 | 2006-08-29 | Viasystems Group, Inc. | Closed loop backdrilling system |
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2005
- 2005-11-11 CN CNB200510101244XA patent/CN100490605C/zh not_active Expired - Fee Related
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2006
- 2006-07-21 US US11/309,280 patent/US7587816B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0197148A1 (en) * | 1983-11-29 | 1986-10-15 | Ibiden Co, Ltd. | Printed-circuit board for mounting electronic element and method of manufacture thereof |
US5282312A (en) * | 1991-12-31 | 1994-02-01 | Tessera, Inc. | Multi-layer circuit construction methods with customization features |
JP2000354212A (ja) * | 1999-06-11 | 2000-12-19 | Toshiba Corp | ドライブ基板装置 |
CN1309525A (zh) * | 2000-01-31 | 2001-08-22 | 株式会社东芝 | 印刷电路板 |
US20040173822A1 (en) * | 2003-03-05 | 2004-09-09 | Achyut Dutta | High speed electronics interconnect and method of manufacture |
Also Published As
Publication number | Publication date |
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US7587816B2 (en) | 2009-09-15 |
US20070111595A1 (en) | 2007-05-17 |
CN1964597A (zh) | 2007-05-16 |
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