USD913979S1 - Inner shield for a substrate processing chamber - Google Patents
Inner shield for a substrate processing chamber Download PDFInfo
- Publication number
- USD913979S1 USD913979S1 US29/703,655 US201929703655F USD913979S US D913979 S1 USD913979 S1 US D913979S1 US 201929703655 F US201929703655 F US 201929703655F US D913979 S USD913979 S US D913979S
- Authority
- US
- United States
- Prior art keywords
- processing chamber
- substrate processing
- inner shield
- view
- elevation view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/703,655 USD913979S1 (en) | 2019-08-28 | 2019-08-28 | Inner shield for a substrate processing chamber |
TW109300959F TWD214316S (zh) | 2019-08-28 | 2020-02-27 | 基板處理腔室的內部護罩 |
JPD2020-21837F JP1683107S (zh) | 2019-08-28 | 2020-02-27 | |
JPD2020-3692F JP1683051S (zh) | 2019-08-28 | 2020-02-27 | |
TW110301539F TWD218527S (zh) | 2019-08-28 | 2020-02-27 | 基板處理腔室的內部護罩 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/703,655 USD913979S1 (en) | 2019-08-28 | 2019-08-28 | Inner shield for a substrate processing chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
USD913979S1 true USD913979S1 (en) | 2021-03-23 |
Family
ID=74872257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/703,655 Active USD913979S1 (en) | 2019-08-28 | 2019-08-28 | Inner shield for a substrate processing chamber |
Country Status (3)
Country | Link |
---|---|
US (1) | USD913979S1 (zh) |
JP (2) | JP1683107S (zh) |
TW (2) | TWD214316S (zh) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210066050A1 (en) * | 2019-08-28 | 2021-03-04 | Applied Materials, Inc. | High conductance inner shield for process chamber |
USD933725S1 (en) | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD941371S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD946638S1 (en) * | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD969760S1 (en) * | 2019-12-02 | 2022-11-15 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD973609S1 (en) * | 2020-04-22 | 2022-12-27 | Applied Materials, Inc. | Upper shield with showerhead for a process chamber |
US11551960B2 (en) | 2020-01-30 | 2023-01-10 | Applied Materials, Inc. | Helical plug for reduction or prevention of arcing in a substrate support |
USD980813S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
USD980887S1 (en) * | 2021-03-18 | 2023-03-14 | Illinois Tool Works Inc. | Chamber |
USD980814S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD997111S1 (en) * | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
USD998575S1 (en) * | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
USD1007449S1 (en) * | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD1012051S1 (en) * | 2019-06-17 | 2024-01-23 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1733479S (ja) | 2022-01-20 | 2022-12-28 | 基板処理チャンバ用基板支持体 |
Citations (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5762748A (en) | 1992-08-27 | 1998-06-09 | Applied Materials, Inc | Lid and door for a vacuum chamber and pretreatment therefor |
US6583064B2 (en) | 1998-03-31 | 2003-06-24 | Lam Research Corporation | Low contamination high density plasma etch chambers and methods for making the same |
US20040149216A1 (en) | 2002-11-13 | 2004-08-05 | Anelva Corporation | Plasma processing apparatus |
US20070113783A1 (en) * | 2005-11-19 | 2007-05-24 | Applied Materials, Inc. | Band shield for substrate processing chamber |
USD557425S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
US20100291319A1 (en) | 2007-09-29 | 2010-11-18 | Tokyo Electron Limited | Plasma processing apparatus and plasma processing method |
US20110108524A1 (en) | 2009-08-31 | 2011-05-12 | Rajinder Dhindsa | Local plasma confinement and pressure control arrangement and methods thereof |
USD642605S1 (en) * | 2010-04-02 | 2011-08-02 | Applied Materials, Inc. | Lid assembly for a substrate processing chamber |
USD655258S1 (en) * | 2010-10-21 | 2012-03-06 | Tokyo Electron Limited | Side wall for reactor for manufacturing semiconductor |
US20130098554A1 (en) | 2011-10-25 | 2013-04-25 | Lam Research Corporation | Window and mounting arrangement for twist-and-lock gas injector assembly of inductively coupled plasma chamber |
US20130284700A1 (en) | 2012-04-26 | 2013-10-31 | Applied Materials, Inc. | Proportional and uniform controlled gas flow delivery for dry plasma etch apparatus |
USD693782S1 (en) * | 2012-11-19 | 2013-11-19 | Epicrew Corporation | Lid for epitaxial growing device |
USD703160S1 (en) * | 2011-01-27 | 2014-04-22 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
USD711331S1 (en) * | 2013-11-07 | 2014-08-19 | Applied Materials, Inc. | Upper chamber liner |
USD716239S1 (en) * | 2013-11-06 | 2014-10-28 | Applied Materials, Inc. | Upper chamber liner |
USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD804436S1 (en) * | 2015-06-12 | 2017-12-05 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
US9865437B2 (en) | 2014-12-30 | 2018-01-09 | Applied Materials, Inc. | High conductance process kit |
USD812578S1 (en) * | 2016-02-26 | 2018-03-13 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
USD840364S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD840365S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD855027S1 (en) * | 2018-01-22 | 2019-07-30 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber of semiconductor |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD893441S1 (en) * | 2019-06-28 | 2020-08-18 | Applied Materials, Inc. | Base plate for a processing chamber substrate support |
-
2019
- 2019-08-28 US US29/703,655 patent/USD913979S1/en active Active
-
2020
- 2020-02-27 TW TW109300959F patent/TWD214316S/zh unknown
- 2020-02-27 JP JPD2020-21837F patent/JP1683107S/ja active Active
- 2020-02-27 TW TW110301539F patent/TWD218527S/zh unknown
- 2020-02-27 JP JPD2020-3692F patent/JP1683051S/ja active Active
Patent Citations (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5762748A (en) | 1992-08-27 | 1998-06-09 | Applied Materials, Inc | Lid and door for a vacuum chamber and pretreatment therefor |
US6583064B2 (en) | 1998-03-31 | 2003-06-24 | Lam Research Corporation | Low contamination high density plasma etch chambers and methods for making the same |
US20040149216A1 (en) | 2002-11-13 | 2004-08-05 | Anelva Corporation | Plasma processing apparatus |
USD557425S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
US20070113783A1 (en) * | 2005-11-19 | 2007-05-24 | Applied Materials, Inc. | Band shield for substrate processing chamber |
US20100291319A1 (en) | 2007-09-29 | 2010-11-18 | Tokyo Electron Limited | Plasma processing apparatus and plasma processing method |
US20110108524A1 (en) | 2009-08-31 | 2011-05-12 | Rajinder Dhindsa | Local plasma confinement and pressure control arrangement and methods thereof |
USD642605S1 (en) * | 2010-04-02 | 2011-08-02 | Applied Materials, Inc. | Lid assembly for a substrate processing chamber |
USD655258S1 (en) * | 2010-10-21 | 2012-03-06 | Tokyo Electron Limited | Side wall for reactor for manufacturing semiconductor |
USD703160S1 (en) * | 2011-01-27 | 2014-04-22 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
US20130098554A1 (en) | 2011-10-25 | 2013-04-25 | Lam Research Corporation | Window and mounting arrangement for twist-and-lock gas injector assembly of inductively coupled plasma chamber |
US20130284700A1 (en) | 2012-04-26 | 2013-10-31 | Applied Materials, Inc. | Proportional and uniform controlled gas flow delivery for dry plasma etch apparatus |
USD693782S1 (en) * | 2012-11-19 | 2013-11-19 | Epicrew Corporation | Lid for epitaxial growing device |
USD716239S1 (en) * | 2013-11-06 | 2014-10-28 | Applied Materials, Inc. | Upper chamber liner |
USD711331S1 (en) * | 2013-11-07 | 2014-08-19 | Applied Materials, Inc. | Upper chamber liner |
US9865437B2 (en) | 2014-12-30 | 2018-01-09 | Applied Materials, Inc. | High conductance process kit |
USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD804436S1 (en) * | 2015-06-12 | 2017-12-05 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
USD812578S1 (en) * | 2016-02-26 | 2018-03-13 | Hitachi High-Technologies Corporation | Upper chamber for a plasma processing apparatus |
USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD840364S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD840365S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
USD855027S1 (en) * | 2018-01-22 | 2019-07-30 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber of semiconductor |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD893441S1 (en) * | 2019-06-28 | 2020-08-18 | Applied Materials, Inc. | Base plate for a processing chamber substrate support |
Non-Patent Citations (1)
Title |
---|
International Search Report and Written Opinion for PCT/US2020/048302 dated Dec. 4, 2020. |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD946638S1 (en) * | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD933725S1 (en) | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD1012051S1 (en) * | 2019-06-17 | 2024-01-23 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing device |
US20210066050A1 (en) * | 2019-08-28 | 2021-03-04 | Applied Materials, Inc. | High conductance inner shield for process chamber |
USD969760S1 (en) * | 2019-12-02 | 2022-11-15 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
US11551960B2 (en) | 2020-01-30 | 2023-01-10 | Applied Materials, Inc. | Helical plug for reduction or prevention of arcing in a substrate support |
USD941371S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD970566S1 (en) * | 2020-03-23 | 2022-11-22 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD998575S1 (en) * | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
USD973609S1 (en) * | 2020-04-22 | 2022-12-27 | Applied Materials, Inc. | Upper shield with showerhead for a process chamber |
USD966357S1 (en) * | 2020-12-02 | 2022-10-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD980887S1 (en) * | 2021-03-18 | 2023-03-14 | Illinois Tool Works Inc. | Chamber |
USD1007449S1 (en) * | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD980813S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
USD980814S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD997111S1 (en) * | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
Also Published As
Publication number | Publication date |
---|---|
JP1683051S (zh) | 2021-04-12 |
TWD218527S (zh) | 2022-05-01 |
JP1683107S (zh) | 2021-04-12 |
TWD214316S (zh) | 2021-10-01 |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |