JP1683051S - - Google Patents

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Publication number
JP1683051S
JP1683051S JPD2020-3692F JP2020003692F JP1683051S JP 1683051 S JP1683051 S JP 1683051S JP 2020003692 F JP2020003692 F JP 2020003692F JP 1683051 S JP1683051 S JP 1683051S
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2020-3692F
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Japanese (ja)
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Publication of JP1683051S publication Critical patent/JP1683051S/ja
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JPD2020-3692F 2019-08-28 2020-02-27 Active JP1683051S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/703,655 USD913979S1 (en) 2019-08-28 2019-08-28 Inner shield for a substrate processing chamber

Publications (1)

Publication Number Publication Date
JP1683051S true JP1683051S (zh) 2021-04-12

Family

ID=74872257

Family Applications (2)

Application Number Title Priority Date Filing Date
JPD2020-3692F Active JP1683051S (zh) 2019-08-28 2020-02-27
JPD2020-21837F Active JP1683107S (zh) 2019-08-28 2020-02-27

Family Applications After (1)

Application Number Title Priority Date Filing Date
JPD2020-21837F Active JP1683107S (zh) 2019-08-28 2020-02-27

Country Status (3)

Country Link
US (1) USD913979S1 (zh)
JP (2) JP1683051S (zh)
TW (2) TWD218527S (zh)

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USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
JP1655453S (zh) * 2019-06-17 2020-03-23
US12100577B2 (en) * 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
USD896767S1 (en) * 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
US11551960B2 (en) 2020-01-30 2023-01-10 Applied Materials, Inc. Helical plug for reduction or prevention of arcing in a substrate support
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
US12080522B2 (en) 2020-04-22 2024-09-03 Applied Materials, Inc. Preclean chamber upper shield with showerhead
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980887S1 (en) * 2021-03-18 2023-03-14 Illinois Tool Works Inc. Chamber
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
JP1733479S (ja) 2022-01-20 2022-12-28 基板処理チャンバ用基板支持体

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US6129808A (en) 1998-03-31 2000-10-10 Lam Research Corporation Low contamination high density plasma etch chambers and methods for making the same
JP4141234B2 (ja) 2002-11-13 2008-08-27 キヤノンアネルバ株式会社 プラズマ処理装置
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
JP2009088298A (ja) 2007-09-29 2009-04-23 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
SG178288A1 (en) 2009-08-31 2012-03-29 Lam Res Corp A multi-peripheral ring arrangement for performing plasma confinement
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
USD655258S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US9947512B2 (en) 2011-10-25 2018-04-17 Lam Research Corporation Window and mounting arrangement for twist-and-lock gas injector assembly of inductively coupled plasma chamber
US9162236B2 (en) 2012-04-26 2015-10-20 Applied Materials, Inc. Proportional and uniform controlled gas flow delivery for dry plasma etch apparatus
USD693782S1 (en) * 2012-11-19 2013-11-19 Epicrew Corporation Lid for epitaxial growing device
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD711331S1 (en) * 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
JP1551512S (zh) * 2015-06-12 2016-06-13
JP1546799S (zh) * 2015-06-12 2016-03-28
JP1564934S (zh) * 2016-02-26 2016-12-05
JP1584146S (zh) * 2017-01-31 2017-08-21
JP1584241S (zh) * 2017-01-31 2017-08-21
JP1584906S (zh) * 2017-01-31 2017-08-28
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
JP1620194S (zh) * 2018-01-22 2018-12-10
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) * 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support

Also Published As

Publication number Publication date
USD913979S1 (en) 2021-03-23
TWD218527S (zh) 2022-05-01
JP1683107S (zh) 2021-04-12
TWD214316S (zh) 2021-10-01

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