JP1683107S - - Google Patents

Info

Publication number
JP1683107S
JP1683107S JPD2020-21837F JP2020021837F JP1683107S JP 1683107 S JP1683107 S JP 1683107S JP 2020021837 F JP2020021837 F JP 2020021837F JP 1683107 S JP1683107 S JP 1683107S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2020-21837F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP1683107S publication Critical patent/JP1683107S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2020-21837F 2019-08-28 2020-02-27 Active JP1683107S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/703,655 USD913979S1 (en) 2019-08-28 2019-08-28 Inner shield for a substrate processing chamber

Publications (1)

Publication Number Publication Date
JP1683107S true JP1683107S (zh) 2021-04-12

Family

ID=74872257

Family Applications (2)

Application Number Title Priority Date Filing Date
JPD2020-21837F Active JP1683107S (zh) 2019-08-28 2020-02-27
JPD2020-3692F Active JP1683051S (zh) 2019-08-28 2020-02-27

Family Applications After (1)

Application Number Title Priority Date Filing Date
JPD2020-3692F Active JP1683051S (zh) 2019-08-28 2020-02-27

Country Status (3)

Country Link
US (1) USD913979S1 (zh)
JP (2) JP1683107S (zh)
TW (2) TWD218527S (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
JP1655453S (zh) * 2019-06-17 2020-03-23
US20210066050A1 (en) * 2019-08-28 2021-03-04 Applied Materials, Inc. High conductance inner shield for process chamber
USD896767S1 (en) * 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
US11551960B2 (en) 2020-01-30 2023-01-10 Applied Materials, Inc. Helical plug for reduction or prevention of arcing in a substrate support
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980887S1 (en) * 2021-03-18 2023-03-14 Illinois Tool Works Inc. Chamber
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
JP1733479S (ja) 2022-01-20 2022-12-28 基板処理チャンバ用基板支持体

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5401319A (en) 1992-08-27 1995-03-28 Applied Materials, Inc. Lid and door for a vacuum chamber and pretreatment therefor
US6129808A (en) 1998-03-31 2000-10-10 Lam Research Corporation Low contamination high density plasma etch chambers and methods for making the same
JP4141234B2 (ja) 2002-11-13 2008-08-27 キヤノンアネルバ株式会社 プラズマ処理装置
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
JP2009088298A (ja) 2007-09-29 2009-04-23 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
SG178287A1 (en) 2009-08-31 2012-03-29 Lam Res Corp A local plasma confinement and pressure control arrangement and methods thereof
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
USD655258S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US9947512B2 (en) 2011-10-25 2018-04-17 Lam Research Corporation Window and mounting arrangement for twist-and-lock gas injector assembly of inductively coupled plasma chamber
US9162236B2 (en) 2012-04-26 2015-10-20 Applied Materials, Inc. Proportional and uniform controlled gas flow delivery for dry plasma etch apparatus
USD693782S1 (en) * 2012-11-19 2013-11-19 Epicrew Corporation Lid for epitaxial growing device
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD711331S1 (en) * 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
JP1546799S (zh) * 2015-06-12 2016-03-28
JP1551512S (zh) * 2015-06-12 2016-06-13
JP1564934S (zh) * 2016-02-26 2016-12-05
JP1584146S (zh) * 2017-01-31 2017-08-21
JP1584241S (zh) * 2017-01-31 2017-08-21
JP1584906S (zh) * 2017-01-31 2017-08-28
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
JP1620194S (zh) * 2018-01-22 2018-12-10
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) * 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support

Also Published As

Publication number Publication date
JP1683051S (zh) 2021-04-12
TWD218527S (zh) 2022-05-01
TWD214316S (zh) 2021-10-01
USD913979S1 (en) 2021-03-23

Similar Documents

Publication Publication Date Title
BR112019017762A2 (zh)
BR112021017339A2 (zh)
BR112021013854A2 (zh)
BR112021018450A2 (zh)
BR112021017939A2 (zh)
BR112021017892A2 (zh)
BR112019016141A2 (zh)
AU2020104490A4 (zh)
BR112021017738A2 (zh)
BR112021017782A2 (zh)
BR112019016138A2 (zh)
BR112019016142A2 (zh)
BR112021018168A2 (zh)
BR112021017728A2 (zh)
BR112021008711A2 (zh)
BR112021017234A2 (zh)
BR112021017355A2 (zh)
BR112021017173A2 (zh)
BR112021018102A2 (zh)
BR112021017083A2 (zh)
BR112021017637A2 (zh)
BR112021018452A2 (zh)
BR112021012348A2 (zh)
BR112021018250A2 (zh)
BR112021018093A2 (zh)