USD840365S1 - Cover ring for a plasma processing apparatus - Google Patents
Cover ring for a plasma processing apparatus Download PDFInfo
- Publication number
- USD840365S1 USD840365S1 US29/610,999 US201729610999F USD840365S US D840365 S1 USD840365 S1 US D840365S1 US 201729610999 F US201729610999 F US 201729610999F US D840365 S USD840365 S US D840365S
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- US
- United States
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- processing apparatus
- plasma processing
- cover ring
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Description
This application contains subject matter related to the following co-pending U.S. design patent applications:
Application Ser. No. 29/610,995, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application Ser. No. 29/610,996, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application Ser. No. 29/610,998, filed herewith and entitled “Ring for a Plasma Processing Apparatus”; and
Application Ser. No. 29/611,001, filed herewith and entitled “Discharge Chamber for a Plasma Processing Apparatus”.
The box labelled as 10 in FIG. 8 is shown in broken lines and forms no part of the claimed design.
Claims (1)
- The ornamental design for a cover ring for a plasma processing apparatus, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2017-1755F JP1584146S (en) | 2017-01-31 | 2017-01-31 | |
JP2017-001755 | 2017-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD840365S1 true USD840365S1 (en) | 2019-02-12 |
Family
ID=59593506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/610,999 Active USD840365S1 (en) | 2017-01-31 | 2017-07-18 | Cover ring for a plasma processing apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | USD840365S1 (en) |
JP (1) | JP1584146S (en) |
TW (1) | TWD190344S (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD875053S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD875055S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD875054S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD882536S1 (en) * | 2017-04-28 | 2020-04-28 | Applied Materials, Inc. | Plasma source liner |
USD891636S1 (en) * | 2018-10-25 | 2020-07-28 | Hitachi High-Tech Corporation | Ring for a plasma processing apparatus |
USD913979S1 (en) * | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
USD918273S1 (en) * | 2019-05-14 | 2021-05-04 | Dana Gonzalez | Shoe and float collar device |
USD925481S1 (en) * | 2018-12-06 | 2021-07-20 | Kokusai Electric Corporation | Inlet liner for substrate processing apparatus |
USD931241S1 (en) * | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
USD953986S1 (en) * | 2020-08-11 | 2022-06-07 | Neturen Co., Ltd. | Rectifier |
USD953985S1 (en) * | 2020-08-11 | 2022-06-07 | Neturen Co., Ltd. | Rectifier |
USD954649S1 (en) * | 2020-08-11 | 2022-06-14 | Neturen Co., Ltd. | Rectifier |
USD954648S1 (en) * | 2020-08-11 | 2022-06-14 | Neturen Co., Ltd. | Rectifier |
USD956705S1 (en) * | 2019-11-07 | 2022-07-05 | Lam Research Corporation | Cooling plate for a semiconductor processing apparatus |
USD1003243S1 (en) * | 2021-06-28 | 2023-10-31 | Kokusai Electric Corporation | Heat insulator cover of semiconductor manufacturing apparatus |
USD1008967S1 (en) * | 2022-05-16 | 2023-12-26 | Japan Aviation Electronics Industry, Limited | Collar for connector |
US12100577B2 (en) | 2019-10-25 | 2024-09-24 | Applied Materials, Inc. | High conductance inner shield for process chamber |
Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD404369S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Manifold cover for use in a semiconductor wafer heat processing apparatus |
US20030066484A1 (en) * | 2001-09-26 | 2003-04-10 | Kawasaki Microelectronics, Inc. | Electrode cover, plasma apparatus utilizing the cover, and method of fitting the cover onto the plasma electrode |
USD491963S1 (en) * | 2002-11-20 | 2004-06-22 | Tokyo Electron Limited | Inner wall shield for a process chamber for manufacturing semiconductors |
USD494551S1 (en) | 2002-12-12 | 2004-08-17 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
US20050150452A1 (en) * | 2004-01-14 | 2005-07-14 | Soovo Sen | Process kit design for deposition chamber |
US20050258280A1 (en) * | 2004-05-24 | 2005-11-24 | Shin-Etsu Chemical Co., Ltd. | Shower plate for plasma processing apparatus and plasma processing apparatus |
US7186171B2 (en) * | 2005-04-22 | 2007-03-06 | Applied Materials, Inc. | Composite retaining ring |
USD557226S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD557425S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD559993S1 (en) * | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD559994S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
US20080121620A1 (en) * | 2006-11-24 | 2008-05-29 | Guo G X | Processing chamber |
USD638550S1 (en) * | 2009-11-13 | 2011-05-24 | 3M Innovative Properties Company | Sample processing disk cover |
USD638951S1 (en) * | 2009-11-13 | 2011-05-31 | 3M Innovative Properties Company | Sample processing disk cover |
USD667561S1 (en) * | 2009-11-13 | 2012-09-18 | 3M Innovative Properties Company | Sample processing disk cover |
USD717746S1 (en) * | 2013-11-06 | 2014-11-18 | Applied Materials, Inc. | Lower chamber liner |
JP1551512S (en) | 2015-06-12 | 2016-06-13 | ||
USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD802545S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Lower chamber for a plasma processing apparatus |
-
2017
- 2017-01-31 JP JPD2017-1755F patent/JP1584146S/ja active Active
- 2017-03-17 TW TW106301395F patent/TWD190344S/en unknown
- 2017-07-18 US US29/610,999 patent/USD840365S1/en active Active
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD404369S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Manifold cover for use in a semiconductor wafer heat processing apparatus |
US20030066484A1 (en) * | 2001-09-26 | 2003-04-10 | Kawasaki Microelectronics, Inc. | Electrode cover, plasma apparatus utilizing the cover, and method of fitting the cover onto the plasma electrode |
USD491963S1 (en) * | 2002-11-20 | 2004-06-22 | Tokyo Electron Limited | Inner wall shield for a process chamber for manufacturing semiconductors |
USD494551S1 (en) | 2002-12-12 | 2004-08-17 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
US20050150452A1 (en) * | 2004-01-14 | 2005-07-14 | Soovo Sen | Process kit design for deposition chamber |
US20050258280A1 (en) * | 2004-05-24 | 2005-11-24 | Shin-Etsu Chemical Co., Ltd. | Shower plate for plasma processing apparatus and plasma processing apparatus |
USD559994S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD559993S1 (en) * | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
US7186171B2 (en) * | 2005-04-22 | 2007-03-06 | Applied Materials, Inc. | Composite retaining ring |
USD557226S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD557425S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
US20080121620A1 (en) * | 2006-11-24 | 2008-05-29 | Guo G X | Processing chamber |
USD638951S1 (en) * | 2009-11-13 | 2011-05-31 | 3M Innovative Properties Company | Sample processing disk cover |
USD638550S1 (en) * | 2009-11-13 | 2011-05-24 | 3M Innovative Properties Company | Sample processing disk cover |
USD667561S1 (en) * | 2009-11-13 | 2012-09-18 | 3M Innovative Properties Company | Sample processing disk cover |
USD717746S1 (en) * | 2013-11-06 | 2014-11-18 | Applied Materials, Inc. | Lower chamber liner |
JP1551512S (en) | 2015-06-12 | 2016-06-13 | ||
USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD802545S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Lower chamber for a plasma processing apparatus |
USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
Non-Patent Citations (4)
Title |
---|
Ichino et al., Design U.S. Appl. No. 29/610,995, filed Jul. 18, 2017. |
Ichino et al., Design U.S. Appl. No. 29/610,996, filed Jul. 18, 2017. |
Ichino et al., Design U.S. Appl. No. 29/610,998, filed Jul. 18, 2017. |
Nunomura et al., Design U.S. Appl. No. 29/611,001, filed Jul. 18, 2017. |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD875055S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD875054S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD882536S1 (en) * | 2017-04-28 | 2020-04-28 | Applied Materials, Inc. | Plasma source liner |
USD875053S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
USD891636S1 (en) * | 2018-10-25 | 2020-07-28 | Hitachi High-Tech Corporation | Ring for a plasma processing apparatus |
USD925481S1 (en) * | 2018-12-06 | 2021-07-20 | Kokusai Electric Corporation | Inlet liner for substrate processing apparatus |
USD918273S1 (en) * | 2019-05-14 | 2021-05-04 | Dana Gonzalez | Shoe and float collar device |
USD931241S1 (en) * | 2019-08-28 | 2021-09-21 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
USD913979S1 (en) * | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
USD971167S1 (en) * | 2019-08-28 | 2022-11-29 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
US12100577B2 (en) | 2019-10-25 | 2024-09-24 | Applied Materials, Inc. | High conductance inner shield for process chamber |
USD956705S1 (en) * | 2019-11-07 | 2022-07-05 | Lam Research Corporation | Cooling plate for a semiconductor processing apparatus |
USD953986S1 (en) * | 2020-08-11 | 2022-06-07 | Neturen Co., Ltd. | Rectifier |
USD953985S1 (en) * | 2020-08-11 | 2022-06-07 | Neturen Co., Ltd. | Rectifier |
USD954649S1 (en) * | 2020-08-11 | 2022-06-14 | Neturen Co., Ltd. | Rectifier |
USD954648S1 (en) * | 2020-08-11 | 2022-06-14 | Neturen Co., Ltd. | Rectifier |
USD1003243S1 (en) * | 2021-06-28 | 2023-10-31 | Kokusai Electric Corporation | Heat insulator cover of semiconductor manufacturing apparatus |
USD1008967S1 (en) * | 2022-05-16 | 2023-12-26 | Japan Aviation Electronics Industry, Limited | Collar for connector |
Also Published As
Publication number | Publication date |
---|---|
JP1584146S (en) | 2017-08-21 |
TWD190344S (en) | 2018-05-11 |
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