USD812578S1 - Upper chamber for a plasma processing apparatus - Google Patents

Upper chamber for a plasma processing apparatus Download PDF

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Publication number
USD812578S1
USD812578S1 US29/572,169 US201629572169F USD812578S US D812578 S1 USD812578 S1 US D812578S1 US 201629572169 F US201629572169 F US 201629572169F US D812578 S USD812578 S US D812578S
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Prior art keywords
processing apparatus
plasma processing
upper chamber
view
elevational view
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US29/572,169
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English (en)
Inventor
Takashi Uemura
Kohei Sato
Susumu Tauchi
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Assigned to HITACHI HIGH-TECHNOLOGIES CORPORATION reassignment HITACHI HIGH-TECHNOLOGIES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SATO, KOHEI, TAUCHI, SUSUMU, UEMURA, TAKASHI
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Publication of USD812578S1 publication Critical patent/USD812578S1/en
Assigned to HITACHI HIGH-TECH CORPORATION reassignment HITACHI HIGH-TECH CORPORATION CHANGE OF NAME AND ADDRESS Assignors: HITACHI HIGH-TECHNOLOGIES CORPORATION
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US29/572,169 2016-02-26 2016-07-26 Upper chamber for a plasma processing apparatus Active USD812578S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-004151 2016-01-13
JPD2016-4151F JP1564934S (enrdf_load_stackoverflow) 2016-02-26 2016-02-26

Publications (1)

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USD812578S1 true USD812578S1 (en) 2018-03-13

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US29/572,169 Active USD812578S1 (en) 2016-02-26 2016-07-26 Upper chamber for a plasma processing apparatus

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US (1) USD812578S1 (enrdf_load_stackoverflow)
JP (1) JP1564934S (enrdf_load_stackoverflow)
TW (1) TWD180288S (enrdf_load_stackoverflow)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD818447S1 (en) * 2017-04-28 2018-05-22 Applied Materials, Inc. Plasma feedthrough flange
USD826300S1 (en) * 2016-09-30 2018-08-21 Oerlikon Metco Ag, Wohlen Rotably mounted thermal plasma burner for thermalspraying
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD907593S1 (en) * 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD916038S1 (en) * 2019-03-19 2021-04-13 Hitachi High-Tech Corporation Grounded electrode for a plasma processing apparatus
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1066440S1 (en) * 2022-10-28 2025-03-11 Applied Materials, Inc. Process chamber pumping liner
USD1094319S1 (en) * 2022-02-10 2025-09-23 Hitachi High-Tech Corporation Upper chamber for a plasma processing device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153907A (en) * 1977-05-17 1979-05-08 Vactec, Incorporated Photovoltaic cell with junction-free essentially-linear connections to its contacts
USD274836S (en) * 1982-12-02 1984-07-24 Smith Edward J Space heater assembly
US5641375A (en) * 1994-08-15 1997-06-24 Applied Materials, Inc. Plasma etching reactor with surface protection means against erosion of walls
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US20010023821A1 (en) * 1999-07-12 2001-09-27 Randy Harris Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
USD448729S1 (en) * 1999-12-14 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Stator of AC generator for vehicles
US20010035131A1 (en) * 2000-04-26 2001-11-01 Takeshi Sakuma Single-substrate-heat-processing apparatus for semiconductor process
US20040069223A1 (en) * 2002-10-10 2004-04-15 Taiwan Semiconductor Manufacturing Co., Ltd. Wall liner and slot liner for process chamber
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
US20120018402A1 (en) * 2010-07-21 2012-01-26 Applied Materials, Inc. Plasma processing apparatus and liner assembly for tuning electrical skews
US20130292254A1 (en) * 2012-03-28 2013-11-07 Santosh Kumar Methods and apparatuses for cleaning electroplating substrate holders
US20140097088A1 (en) * 2009-06-17 2014-04-10 Novellus Systems, Inc. Electrofill vacuum plating cell
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
US20160307743A1 (en) * 2015-04-17 2016-10-20 Lam Research Corporation Chamber with vertical support stem for symmetric conductance and rf delivery

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153907A (en) * 1977-05-17 1979-05-08 Vactec, Incorporated Photovoltaic cell with junction-free essentially-linear connections to its contacts
USD274836S (en) * 1982-12-02 1984-07-24 Smith Edward J Space heater assembly
US5641375A (en) * 1994-08-15 1997-06-24 Applied Materials, Inc. Plasma etching reactor with surface protection means against erosion of walls
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US20010023821A1 (en) * 1999-07-12 2001-09-27 Randy Harris Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
USD448729S1 (en) * 1999-12-14 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Stator of AC generator for vehicles
US20010035131A1 (en) * 2000-04-26 2001-11-01 Takeshi Sakuma Single-substrate-heat-processing apparatus for semiconductor process
US20040069223A1 (en) * 2002-10-10 2004-04-15 Taiwan Semiconductor Manufacturing Co., Ltd. Wall liner and slot liner for process chamber
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
US20140097088A1 (en) * 2009-06-17 2014-04-10 Novellus Systems, Inc. Electrofill vacuum plating cell
US20120018402A1 (en) * 2010-07-21 2012-01-26 Applied Materials, Inc. Plasma processing apparatus and liner assembly for tuning electrical skews
US20130292254A1 (en) * 2012-03-28 2013-11-07 Santosh Kumar Methods and apparatuses for cleaning electroplating substrate holders
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
US20160307743A1 (en) * 2015-04-17 2016-10-20 Lam Research Corporation Chamber with vertical support stem for symmetric conductance and rf delivery

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD826300S1 (en) * 2016-09-30 2018-08-21 Oerlikon Metco Ag, Wohlen Rotably mounted thermal plasma burner for thermalspraying
USD907593S1 (en) * 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus
USD818447S1 (en) * 2017-04-28 2018-05-22 Applied Materials, Inc. Plasma feedthrough flange
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD916038S1 (en) * 2019-03-19 2021-04-13 Hitachi High-Tech Corporation Grounded electrode for a plasma processing apparatus
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
USD1094319S1 (en) * 2022-02-10 2025-09-23 Hitachi High-Tech Corporation Upper chamber for a plasma processing device
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector
USD1066440S1 (en) * 2022-10-28 2025-03-11 Applied Materials, Inc. Process chamber pumping liner

Also Published As

Publication number Publication date
JP1564934S (enrdf_load_stackoverflow) 2016-12-05
TWD180288S (zh) 2016-12-21

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