JP1564934S - - Google Patents

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Publication number
JP1564934S
JP1564934S JPD2016-4151F JP2016004151F JP1564934S JP 1564934 S JP1564934 S JP 1564934S JP 2016004151 F JP2016004151 F JP 2016004151F JP 1564934 S JP1564934 S JP 1564934S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2016-4151F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2016-4151F priority Critical patent/JP1564934S/ja
Priority to TW104305548D01F priority patent/TWD180288S/zh
Priority to US29/572,169 priority patent/USD812578S1/en
Application granted granted Critical
Publication of JP1564934S publication Critical patent/JP1564934S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2016-4151F 2016-02-26 2016-02-26 Active JP1564934S (enrdf_load_stackoverflow)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2016-4151F JP1564934S (enrdf_load_stackoverflow) 2016-02-26 2016-02-26
TW104305548D01F TWD180288S (zh) 2016-02-26 2016-04-29 電漿處理裝置用上腔室
US29/572,169 USD812578S1 (en) 2016-02-26 2016-07-26 Upper chamber for a plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2016-4151F JP1564934S (enrdf_load_stackoverflow) 2016-02-26 2016-02-26

Publications (1)

Publication Number Publication Date
JP1564934S true JP1564934S (enrdf_load_stackoverflow) 2016-12-05

Family

ID=57406451

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2016-4151F Active JP1564934S (enrdf_load_stackoverflow) 2016-02-26 2016-02-26

Country Status (3)

Country Link
US (1) USD812578S1 (enrdf_load_stackoverflow)
JP (1) JP1564934S (enrdf_load_stackoverflow)
TW (1) TWD180288S (enrdf_load_stackoverflow)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD826300S1 (en) * 2016-09-30 2018-08-21 Oerlikon Metco Ag, Wohlen Rotably mounted thermal plasma burner for thermalspraying
JP1611626S (enrdf_load_stackoverflow) * 2017-01-20 2018-08-20
USD875054S1 (en) 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD818447S1 (en) * 2017-04-28 2018-05-22 Applied Materials, Inc. Plasma feedthrough flange
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
JP1638504S (enrdf_load_stackoverflow) * 2018-12-06 2019-08-05
JP1646366S (enrdf_load_stackoverflow) * 2019-03-19 2019-11-25
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector
USD1066440S1 (en) * 2022-10-28 2025-03-11 Applied Materials, Inc. Process chamber pumping liner

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153907A (en) * 1977-05-17 1979-05-08 Vactec, Incorporated Photovoltaic cell with junction-free essentially-linear connections to its contacts
USD274836S (en) * 1982-12-02 1984-07-24 Smith Edward J Space heater assembly
US5641375A (en) * 1994-08-15 1997-06-24 Applied Materials, Inc. Plasma etching reactor with surface protection means against erosion of walls
USD404369S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Manifold cover for use in a semiconductor wafer heat processing apparatus
US6623609B2 (en) * 1999-07-12 2003-09-23 Semitool, Inc. Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
USD448729S1 (en) * 1999-12-14 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Stator of AC generator for vehicles
JP4470274B2 (ja) * 2000-04-26 2010-06-02 東京エレクトロン株式会社 熱処理装置
US20040069223A1 (en) * 2002-10-10 2004-04-15 Taiwan Semiconductor Manufacturing Co., Ltd. Wall liner and slot liner for process chamber
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
US9677188B2 (en) * 2009-06-17 2017-06-13 Novellus Systems, Inc. Electrofill vacuum plating cell
TWI502617B (zh) * 2010-07-21 2015-10-01 應用材料股份有限公司 用於調整電偏斜的方法、電漿處理裝置與襯管組件
SG11201406133WA (en) * 2012-03-28 2014-10-30 Novellus Systems Inc Methods and apparatuses for cleaning electroplating substrate holders
USD716240S1 (en) * 2013-11-07 2014-10-28 Applied Materials, Inc. Lower chamber liner
US10049862B2 (en) * 2015-04-17 2018-08-14 Lam Research Corporation Chamber with vertical support stem for symmetric conductance and RF delivery

Also Published As

Publication number Publication date
USD812578S1 (en) 2018-03-13
TWD180288S (zh) 2016-12-21

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