Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
  • C08G75/02—Polythioethers
  • C08G75/0204—Polyarylenethioethers
  • C08G75/0286—Chemical after-treatment
  • C08G75/029—Modification with organic compounds
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
  • C08G75/02—Polythioethers

Definitions

• the present invention relates to a polyarylene sulfide resin, a manufacturing method therefor, and a molding, in particular, a polyarylene sulfide resin obtained via a poly(arylenesulfonium salt), a manufacturing method therefor, and a molding.
• Polyarylene sulfide resins (hereinafter sometimes abbreviated as “PAS resin”), the representative of which is a polyphenylene sulfide resin (hereinafter sometimes abbreviated as “PPS resin”), are excellent in heat resistance, chemical resistance and the like and widely utilized for applications such as electric/electronic parts, automotive parts, water heater parts, fibers and films.
• PAS resin polyarylene sulfide resins
• a polyphenylene sulfide resin is conventionally manufactured by solution polymerization in which p-dichlorobenzene, and sodium sulfide, or sodium hydrosulfide and sodium hydroxide are used as raw materials to polymerize in an organic polar solvent (e.g., see Patent Literatures 1, 2).
• Polyphenylene sulfide resins which are currently commercially available are generally produced by this method.
• dichlorobenzene is used as a monomer in the method, the concentration of halogen remaining in the resin after synthesis tends to be high.
• a method for manufacturing a polyarylene sulfide resin without using dichlorobenzene as a polymerizing monomer and under moderate polymerization conditions is known a method in which a poly(arylenesulfonium salt) is utilized as the precursor.
• a solvent-soluble poly(arylenesulfonium salt) is manufactured at room temperature under acidic conditions and the obtained poly(arylenesulfonium salt) is dealkylated with a nucleophilic reagent or reductant (e.g., see Patent Literature 3).
• Patent Literature 1 U.S. Pat. No. 2,513,188
• Patent Literature 2 U.S. Pat. No. 2,583,941
• Patent Literature 3 Japanese Unexamined Patent Publication No. H5-178993
• the above method for manufacturing a polyarylene sulfide resin via a poly(arylenesulfonium salt) is excellent in terms of enabling to obtain a polyarylene sulfide resin having a relatively high molecular weight, it has a problem in that pyridine and quinoline, each of which is a nucleophilic reagent used for a dealkylating agent or dearylating agent, remain in the resin. Therefore, this may contribute to the generation of gas, for example, in processing a resin, which causes the degradation of the quality of a polyarylene sulfide resin molding, the deterioration of the working environment and the degradation of the maintainability of a metal mold.
• the present invention relates to a method for manufacturing a polyarylene sulfide resin comprising: reacting a poly(arylenesulfonium salt) having a constitutional unit represented by the following formula (1) with an aliphatic amide compound to obtain a polyarylene sulfide resin having a constitutional unit represented by the following formula (2):
• R 1 represents a direct bond, —Ar 2 —, —Ar 2 —S— or —Ar 2 —O—;
• Ar 1 and Ar 2 each represent an arylene group optionally having a functional group as a substituent;
• R 2 represents an alkyl group having 1 to 10 carbon atoms or an aryl group optionally having the alkyl group as a substituent;
• X represents an anion,
• R 1 represents a direct bond, —Ar 2 —, —Ar 2 —S— or —Ar 2 —O—; and Ar 1 and Ar 2 each represent an arylene group optionally having a functional group as a substituent.
• the present invention can sufficiently reduce the amount of a dealkylating agent or dearylating agent remaining in a resin in a method for manufacturing a polyarylene sulfide resin having a sulfide group via a poly(arylenesulfonium salt).
• the method for manufacturing a polyarylene sulfide resin according to the present embodiment includes: reacting a poly(arylenesulfonium salt) with an aliphatic amide compound to obtain a polyarylene sulfide resin.
• the aliphatic amide compound used in the present embodiment is a compound represented by the following formula (10), for example.
• R 11 , R 12 and R 13 each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; and R 11 and R 13 may be bonded together to form a cyclic structure.
• the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group and a decyl group.
• the compound represented by formula (10) functions as a so-called dealkylating agent or dearylating agent as illustrated in the following reaction formula, for example. That is, the compound can function to dealkylate or dearylate an alkyl group or aryl group bonding to the sulfur atom of a sulfonium salt for sulfidation.
• Aliphatic amide compounds have a higher water miscibility than those of aromatic amide compounds and a low compatibility with a polyarylene sulfide resin, and hence can be easily removed by washing the reaction mixture with water. Due to this, the amount of a dealkylating agent or dearylating agent remaining in a polyarylene sulfide resin can be reduced. As a result, the generation of gas can be suppressed, for example, in processing a resin, the quality of a polyarylene sulfide resin molding can be enhanced and the working environment can be improved, and in addition the maintainability of a metal mold can be enhanced.
• an aliphatic amide compound is also excellent in solubility for organic compounds having a relatively small molecular weight
• use of the aliphatic amide compound enables to easily remove an oligomer component of a polyarylene sulfide from the reaction mixture.
• the oligomer component which may contribute to the generation of gas, can be removed by the aliphatic amide compound to synergistically enhance the quality of a polyarylene sulfide resin to be obtained.
• Examples of the aliphatic amide compound which can be used include the compounds represented by the above formula (10) such as primary amide compounds such as formamide; secondary amide compounds such as ⁇ -lactam; and tertiary amide compounds such as N-methyl-2-pyrrolidone, 2-pyrrolidone, ⁇ -caprolactam, N-methyl- ⁇ -caprolactam, dimethylformamide, diethylformamide and dimethylacetamide; and additionally urea compounds such as tetramethylurea and 1,3-dimethyl-2-imidazolidinone.
• primary amide compounds such as formamide
• secondary amide compounds such as ⁇ -lactam
• tertiary amide compounds such as N-methyl-2-pyrrolidone, 2-pyrrolidone, ⁇ -caprolactam, N-methyl- ⁇ -caprolactam, dimethylformamide, diethylformamide and dimethylacetamide
• urea compounds such as tetramethylurea and 1,3-
• the aliphatic amide compound preferably includes an aliphatic tertiary amide compound in which R 12 and R 13 are each an aliphatic group, and especially, N-methyl-2-pyrrolidone is particularly preferable.
• the aliphatic amide compound not only functions as a dealkylating agent or dearylating agent, but also can be used as a reaction solvent because of being excellent in solubility for a poly(arylenesulfonium salt).
• the amount of the aliphatic amide compound to be used is not particularly limited, the lower limit is preferably in a range of 1.00 equivalent or more, more preferably in a range of 1.02 equivalents or more, and still more preferably in a range of 1.05 equivalents or more based on the total amount of a poly(arylenesulfonium salt).
• the amount of the aliphatic amide compound to be used is 1.00 equivalent or more, dealkylation or dearylation of a poly(arylenesulfonium salt) can be carried out satisfactorily.
• the upper limit is preferably 100 equivalents or less, and more preferably 10 equivalents or less.
• the reaction solvent the aliphatic amide compound may be used alone or in combination with another solvent such as toluene.
• the poly(arylenesulfonium salt) used in the present embodiment has a constitutional unit represented by the following formula (1).
• R 1 represents a direct bond, —Ar 2 —, —Ar 2 —S— or —Ar 2 —O—;
• Ar 1 and Ar 2 each represent an arylene group optionally having a functional group as a substituent;
• R 2 represents an alkyl group having 1 to 10 carbon atoms or an aryl group optionally having an alkyl group having 1 to 10 carbon atoms as a substituent;
• X ⁇ represents an anion.
• examples of X ⁇ include anions such as sulfonate, carboxylate and a halogen ion.
• Ar 1 and Ar 2 may be, for example, an arylene group such as phenylene, naphthylene and biphenylene. Although Ar 1 and Ar 2 can be the same or different, they are preferably the same.
• the mode of bonding in Ar 1 and Ar 2 is not particularly limited, but it is preferably a situation in which bonds are present at positions distant from each other in the arylene group.
• Ar 1 and Ar 2 are each a phenylene group
• a unit bonding at the p-position and a unit bonding at the m-position are preferable, and a unit bonding at the p-position is more preferably.
• Being composed of a unit bonding at the p-position is preferable in the aspect of the heat resistance and crystalline character of a resin.
• the arylene group represented by Ar 1 or Ar 2 has a functional group as a substituent
• the functional group is preferably a hydroxy group, an amino group, a mercapto group, a carboxy group or a sulfo group.
• the fraction of the constitutional unit of formula (1) in which Ar 1 or Ar 2 is an arylene group having a substituent is preferably in a range of 10% by mass or less, and more preferably 5% by mass or less based on the whole poly(arylenesulfonium salt) from the viewpoint of suppressing the reduction of the crystallinity and heat resistance of a polyarylene sulfide resin.
• R 2 examples include alkyl groups having 1 to 10 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group and a decyl group; and aryl groups having a structure of phenyl, naphthyl, biphenyl or the like.
• the aryl group may have 1 to 4 substituents of an alkyl group having 1 to 10 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group and a decyl group on the aromatic ring.
• an alkyl group having 1 to 10 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group and a decyl group on the aromatic ring.
• a poly(arylenesulfonium salt) having the constitutional unit represented by formula (1) can be obtained, for example, by using a method in which an aromatic sulfoxide is polymerized in the presence of an acid.
• the aromatic sulfoxide includes compounds represented by the following formula (20), for example.
• the positions of substitution of the two substituents are not particularly limited, it is preferable that the two positions of substitution be as distant as possible from each other in the molecule.
• the preferable position of substitution is p-position.
• R 2 and Ar 1 have the same definitions as those in formula (1);
• R 3 represents a hydrogen atom, Ar 3 —, Ar 3 —S— or Ar 3 —O—; and
• Ar 3 represents an aryl group optionally having a functional group as a substituent.
• examples of Ar 3 include aryl groups having a structure of phenyl, naphthyl, biphenyl or the like, and the aryl group may have at least one functional group selected from a hydroxy group, an amino group, a mercapto group, a carboxy group and a sulfo group as a substituent.
• Examples of the compound represented by formula (20) which can be used include methylphenyl sulfoxide and methyl-4-(phenylthio)phenyl sulfoxide. Among these compounds, methyl-4-(phenylthio)phenyl sulfoxide is preferable.
• One of the aromatic sulfoxides may be used singly, or two or more thereof may be used in combination.
• both an organic acid and an inorganic acid can be used.
• both an organic acid and an inorganic acid can be used.
• the acid examples include non-oxoacids such as hydrochloric acid, hydrobromic acid, hydrocyanic acid and tetrafluoroboric acid; inorganic oxoacids such as sulfuric acid, phosphoric acid, perchloric acid, bromic acid, nitric acid, carbonic acid, boric acid, molybdic acid, isopoly acid and heteropoly acid; partial salts or partial esters of sulfuric acid such as sodium hydrogen sulfate, sodium dihydrogen phosphate, proton-remaining heteropoly acid salts, monomethyl sulfate and trifluoromethane sulfate; mono- or polycarboxylic acids such as formic acid, acetic acid, propionic acid, butanoic acid, succinic acid, benzoic acid and phthalic acid; halogen-substituted carboxylic acids such as monochloroacetic acid, dichloroacetic acid, trichloroacetic acid, monofluoroace
• a dehydrating agent may be used in combination because this reaction is a dehydration reaction.
• the dehydrating agent include phosphoanhydrides such as phosphorous oxide and phosphorous pentoxide; sulfonic anhydrides such as benzenesulfonic anhydride, methanesulfonic anhydride, trifluoromethanesulfonic anhydride and p-toluenesulfonic anhydride; carboxylic anhydrides such as acetic anhydride, fluoroacetic anhydride and trifluoroacetic anhydride; anhydrous magnesium sulfate, zeolite, silica gel and calcium chloride.
• These dehydrating agents may be used singly or in combinations of two or more thereof.
• a solvent can be appropriately used in synthesizing a poly(arylenesulfonium salt).
• the solvent include alcohol solvents such as methanol, ethanol, propanol and isopropyl alcohol; ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone; nitrile solvents such as acetonitrile; halogen-containing solvents such as methylene chloride and chloroform; saturated hydrocarbon solvents such as n-hexane, cyclohexane, n-heptane and cycloheptane; amide solvents such as dimethylacetamide and N-methyl-2-pyrrolidone; sulfur-containing solvents such as sulfolane and DMSO; and ether solvents such as tetrahydrofuran and dioxane. These solvents may be used singly or in combinations of two or more thereof.
• Conditions for the reaction of the poly(arylenesulfonium salt) according to the present embodiment with the aliphatic amide compound can be appropriately adjusted so as to allow dealkylation or dearylation to proceed suitably.
• the reaction temperature is preferably in a range of 40 to 250° C., and more preferably in a range of 70 to 220° C.
• the amount of a dealkylating agent or dearylating agent remaining in a polyarylene sulfide resin is preferably in a range of 1000 ppm or less, more preferably in a range of 700 ppm or less, and still more preferably in a range of 100 ppm or less based on the mass of the resin including a polyarylene sulfide resin and other components such as a dealkylating agent or dearylating agent.
• a polyarylene sulfide resin obtained by the manufacturing method according to the present embodiment can be distinguished from a polyarylene sulfide resin manufactured by another method on the basis of the types and contents of mixed components such as a dealkylating agent or dearylating agent.
• the method for manufacturing a polyarylene sulfide resin according to the present embodiment may further include washing a polyarylene sulfide resin with water, a water-soluble solvent or a mixture solvent thereof. By including such a washing step, it is possible to reliably reduce the amount of a remaining dealkylating agent or dearylating agent contained in a polyarylene sulfide resin to be obtained.
• the solvent used in the washing step is, although not particularly limited, preferably one which dissolves an unreacted material therein.
• the solvent include water; acidic aqueous solutions such as an aqueous solution of hydrochloric acid, an aqueous solution of acetic acid, an aqueous solution of oxalic acid and an aqueous solution of nitric acid; aromatic hydrocarbon solvents such as toluene and xylene; alcohol solvents such as methanol, ethanol, propanol and isopropyl alcohol; amide solvents such as dimethylacetamide and N-methyl-2-pyrrolidone; saturated hydrocarbon solvents such as n-hexane, cyclohexane, n-heptane and cycloheptane; ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone; and halogen-containing solvents such as dichloromethane and chloroform.
• R 1 and Ar 1 have the same definitions as those in formula (1).
• the glass transition temperature of a polyarylene sulfide resin obtained by the manufacturing method according to the present embodiment is preferably in a range of 70 to 110° C., and more preferably in a range of 80 to 95° C.
• the glass transition temperature of a resin refers to a value measured with a DSC instrument.
• the melting point of the polyarylene sulfide resin obtained by using the manufacturing method according to the present embodiment is preferably in a range of 260 to 300° C., and more preferably 270 to 290° C.
• the melting point of a resin refers to a value measured with a DSC instrument.
• the polyarylene sulfide resin obtained by the manufacturing method according to the present embodiment can be combined with another component for utilizing as a polyarylene sulfide resin composition.
• another component for utilizing as a polyarylene sulfide resin composition for example, an inorganic filler can be used as the other component, and a resin other than the polyarylene sulfide resin selected from a thermoplastic resin, an elastomer and a cross-linkable resin or the like can also be used.
• the inorganic filler examples include powdered fillers such as carbon black, calcium carbonate, silica and titanium oxide; platy fillers such as talk and mica; granular fillers such as a glass bead, a silica bead and a glass balloon; fibrous fillers such as a glass fiber, a carbon fiber and a wollastonite fiber; and a glass flake. These inorganic fillers can be used singly or in combinations of two or more thereof. By formulating an inorganic filler, a composition having a high stiffness and a high thermal stability can be obtained.
• the polyarylene sulfide resin composition particularly preferably contains at least one inorganic filler selected from the group consisting of a glass fiber, a carbon fiber, carbon black and calcium carbonate.
• the content of an inorganic filler is preferably in a range of 1 to 300 parts by mass, more preferably in a range of 5 to 200 parts by mass, and still more preferably in a range of 15 to 150 parts by mass based on 100 parts by mass of the polyarylene sulfide resin.
• the content of an inorganic filler being within such a range can result in more excellent effect in terms of retaining the mechanical strength of a molding.
• the polyarylene sulfide resin composition may contain a resin other than the polyarylene sulfide resin selected from a thermoplastic resin, an elastomer and a cross-linkable resin. These resins can also be formulated in the resin composition together with an inorganic filler.
• thermoplastic resin to be formulated in the polyarylene sulfide resin composition examples include polyester, polyamide, polyimide, polyetherimide, polycarbonate, polyphenylene ether, polysulfone, polyether sulfone, polyether ether ketone, polyether ketone, polyethylene, polypropylene, polytetrafluoroethylene, polydifluoroethylene, polystyrene, ABS resins, silicone resins and liquid crystal polymers (e.g., liquid crystal polyester). These thermoplastic resins can be used singly or in combinations of two or more thereof.
• Polyamide is a polymer having an amide bond (—NHCO—).
• the polyamide resin include (i) polymers obtained by polycondensation of a diamine and a dicarboxylic acid; (ii) polymers obtained by polycondensation of an aminocarboxylic acid; and (iii) polymers obtained by ring-opening polymerization of a lactam.
• Examples of the diamine to obtain polyamide include aliphatic diamines, aromatic diamines and alicyclic diamines.
• As the aliphatic diamine linear or branched diamines having 3 to 18 carbon atoms are preferable.
• Examples of a suitable aliphatic diamine include 1,3-trimethylenediamine, 1,4-tetramethylenediamine, 1,5-pentamethylenediamine, 1,6-hexamethylenediamine, 1,7-heptamethylenediamine, 1,8-octamethylenediamine, 2-methyl-1,8-octanediamine, 1,9-nonamethylenediamine, 1,10-decamethylenediamine, 1,11-undecamethylenediamine, 1,12-dodecamethylenediamine, 1,13-tridecamethylenediamine, 1,14-tetradecamethylenediamine, 1,15-pentadecamethylenediamine, 1,16-hexadecamethylenediamine, 1,17-heptadecamethylene
• aromatic diamine diamines having a phenylene group and having 6 to 27 carbon atoms are preferable.
• a suitable aromatic diamine include o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, m-xylylenediamine, p-xylylenediamine, 3,4-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 4,4′-diaminodiphenylmethane, 3,3′-diaminodiphenyl sulfone, 4,4′-diaminodiphenyl sulfone, 4,4′-diaminodiphenyl sulfide, 4,4′-di(m-aminophenoxy)diphenyl sulfone, 4,4′-di(p-aminophenoxy)diphenyl sulfone, benzidine, 3,3′-ddi
• alicyclic diamine diamines having a cyclohexylene group and having 4 to 15 carbon atoms are preferable.
• suitable alicyclic diamine include 4,4′-diamino-dicyclohexylenemethane, 4,4′-diamino-dicyclohexylenepropane, 4,4′-diamino-3,3′-dimethyl-dicyclohexylenemethane, 1,4-diaminocyclohexane and piperazine. These can be used singly or in combinations of two or more thereof.
• Examples of the dicarboxylic acid to obtain polyamide include aliphatic dicarboxylic acids, aromatic dicarboxylic acids and alicyclic dicarboxylic acids.
• aliphatic dicarboxylic acid saturated or unsaturated dicarboxylic acids having 2 to 18 carbon atoms are preferable.
• suitable aliphatic dicarboxylic acid include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, brassylic acid, tetradecanedioic acid, pentadecanedioic acid, octadecanedioic acid, maleic acid and fumaric acid. These can be used singly or in combinations of two or more thereof.
• aromatic dicarboxylic acids having a phenylene group and having 8 to 15 carbon atoms are preferable.
• suitable aromatic dicarboxylic acid include isophthalic acid, terephthalic acid, methylterephthalic acid, biphenyl-2,2′-dicarboxylic acid, biphenyl-4,4′-dicarboxylic acid, diphenylmethane-4,4′-dicarboxylic acid, diphenyl ether-4,4′-dicarboxylic acid, diphenyl sulfone-4,4′-dicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid and 1,4-naphthalenedicarboxylic acid. These can be used singly or in combinations of two or more thereof.
• polycarboxylic acids such as trimellitic acid, trimesic acid and pyromellitic acid can also be used within a range
• aminocarboxylic acids having 4 to 18 carbon atoms are preferable.
• suitable aminocarboxylic acid include 4-aminobutyric acid, 6-aminohexanoic acid, 7-aminoheptanoic acid, 8-aminooctanoic acid, 9-aminononanoic acid, 10-aminodecanoic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, 14-aminotetradecanoic acid, 16-aminohexadecanoic acid and 18-aminooctadecanoic acid. These can be used singly or in combinations of two or more thereof.
• lactam to obtain polyamide examples include ⁇ -caprolactam, ⁇ -laurolactam, ⁇ -enantholactam and ⁇ -capryllactam. These can be used singly or in combinations of two or more thereof.
• Examples of a preferable combination of the raw materials for polyamide include s-caprolactam (nylon 6), 1,6-hexamethylenediamine/adipic acid (nylon 6,6), 1,4-tetramethylenediamine/adipic acid (nylon 4,6), 1,6-hexamethylenediamine/terephthalic acid, 1,6-hexamethylenediamine/terephthalic acid/ ⁇ -caprolactam, 1,6-hexamethylenediamine/terephthalic acid/adipic acid, 1,9-nonamethylenediamine/terephthalic acid, 1,9-nonamethylenediamine/terephthalic acid/s-caprolactam, 1,9-nonamethylenediamine/1,6-hexamethylenediamine/terephthalic acid/adipic acid and m-xylylenediamine/adipic acid.
• a polyamide resin obtained from 1,4-tetramethylenediamine/adipic acid (nylon 4,6), 1,6-hexamethylenediamine/terephthalic acid/ ⁇ -caprolactam, 1,6-hexamethylenediamine/terephthalic acid/adipic acid, 1,9-nonamethylenediamine/terephthalic acid, 1,9-nonamethylenediamine/terephthalic acid/s-caprolactam or 1,9-nonamethylenediamine/1,6-hexamethylenediamine/terephthalic acid/adipic acid.
• 1,4-tetramethylenediamine/adipic acid nylon 4,6
• 1,6-hexamethylenediamine/terephthalic acid/ ⁇ -caprolactam 1,6-hexamethylenediamine/terephthalic acid/adipic acid
• 1,9-nonamethylenediamine/terephthalic acid 1,9-nonamethylenediamine/terephthalic acid/s-caprolact
• the content of the thermoplastic resin is preferably in a range of 1 to 300 parts by mass, more preferably in a range of 3 to 100 parts by mass and still more preferably in a range of 5 to 45 parts by mass based on 100 parts by mass of the polyarylene sulfide resin. Due to the content of the thermoplastic resin other than the polyarylene sulfide resin being within such a range, an effect of the further enhancement of heat resistance, chemical resistance and mechanical properties can be obtained.
• thermoplastic elastomer As the elastomer to be formulated in the polyarylene sulfide resin composition, a thermoplastic elastomer is often used.
• the thermoplastic elastomer include polyolefin elastomers, fluorine-based elastomers and silicone elastomers. Note that, in the present specification, thermoplastic elastomers are classified into not the thermoplastic resin, but an elastomer.
• the elastomer in particular, the thermoplastic elastomer
• the elastomer preferably has a functional group which can react with the functional group of the polyarylene sulfide resin.
• the functional group include an epoxy group, an amino group, a hydroxyl group, a carboxy group, a mercapto group, an isocyanate group, an oxazoline group and a group represented by the formula: R 4 (CO)O(CO)— or R 4 (CO)O— (wherein R 4 represents an alkyl group having 1 to 8 carbon atoms).
• a thermoplastic elastomer having the functional group can be obtained, for example, by copolymerization of an ⁇ -olefin and a vinyl-polymerizable compound having the functional group.
• Examples of the ⁇ -olefin include ⁇ -olefins having 2 to 8 carbon atoms such as ethylene, propylene and butene-1.
• Examples of the vinyl-polymerizable compound having the functional group include ⁇ , ⁇ -unsaturated carboxylic acids and alkyl esters thereof such as (meth)acrylic acid and (meth)acrylate; maleic acid, fumaric acid, itaconic acid and other ⁇ , ⁇ -unsaturated dicarboxylic acids having 4 to 10 carbon atoms and derivatives (mono- or diesters and acid anhydrides thereof) thereof; and glycidyl (meth)acrylate.
• ethylene-propylene copolymers and ethylene-butene copolymers having at least one functional group selected from the group consisting of an epoxy group, a carboxy group and a group represented by the formula: R 4 (CO)O(CO)— or R 4 (CO)O— (wherein R 4 represents an alkyl group having 1 to 8 carbon atoms) are preferable in terms of enhancing the toughness and impact resistance.
• the content of the elastomer which varies depending on the type or application and therefore cannot be defined sweepingly, is for example, preferably in a range of 1 to 300 parts by mass, more preferably in a range of 3 to 100 parts by mass, and still more preferably in a range of 5 to 45 parts by mass based on 100 parts by mass of the polyarylene sulfide resin.
• the content of the elastomer being within such a range can result in an even more excellent effect in terms of ensuring the heat resistance and toughness of a molding.
• the cross-linkable resin to be formulated in the polyarylene sulfide resin composition has two or more cross-linkable functional groups.
• the cross-linkable functional group include an epoxy group, a phenolic hydroxyl group, an amino group, an amide group, a carboxy group, an acid anhydride group and an isocyanate group.
• the cross-linkable resin include epoxy resins, phenol resins and urethane resins.
• aromatic epoxy resins are preferable.
• the aromatic epoxy resin may have a halogen group, a hydroxyl group or the like.
• suitable aromatic epoxy resin include a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, a biphenyl type epoxy resin, a tetramethylbiphenyl type epoxy resin, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a bisphenol A novolac type epoxy resin, a triphenylmethane type epoxy resin, a tetraphenylethane type epoxy resin, a dicyclopentadiene-phenol addition reaction type epoxy resin, a phenol aralkyl type epoxy resin, a naphthol novolac type epoxy resin, a naphthol aralkyl type epoxy resin, a naphthol-phenol-cocondensed novolac type epoxy resin, a naphthol-cresol-cocondensed novolac type epoxy resin,
• aromatic epoxy resins can be used singly or in combinations of two or more thereof.
• a novolac type epoxy resin is preferable, and a cresol novolac type epoxy resin is more preferable in terms of an excellent compatibility with other resin components in particular.
• the content of the cross-linkable resin is preferably in a range of 1 to 300 parts by mass, more preferably 3 to 100 parts by mass, and still more preferably 5 to 30 parts by mass based on 100 parts by mass of the polyarylene sulfide resin.
• the content of the cross-linkable resin being within such a range can result in a much more significant effect of enhancing the stiffness and heat resistance of a molding.
• the polyarylene sulfide resin composition can contain a silane compound having a functional group.
• the silane compound include silane coupling agents such as ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropyltriethoxysilane, ⁇ -(3,4-epoxycyclohexyl)ethyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane and ⁇ -glycidoxypropylmethyl dimethoxysilane.
• the content of the silane compound is, for example, in a range of 0.01 to 10 parts by mass, and preferably in a range of 0.1 to 5 parts by mass based on 100 parts by mass of the polyarylene sulfide resin.
• the content of the silane compound being within such a range can result in an effect of enhancing the compatibility of the polyarylene sulfide resin with other components.
• the polyarylene sulfide resin composition may contain a release agent, a colorant, a thermal stabilizer, an ultraviolet stabilizer, a foaming agent, a rust inhibitor, a flame retardant and a lubricant, and an additive other than them.
• the content of the additive is, for example, in a range of 1 to 10 parts by mass based on 100 parts by mass of the polyarylene sulfide resin.
• the polyarylene sulfide resin composition can be obtained in a form of a pelletized compound or the like by a method in which the polyarylene sulfide resin (a reaction product of melt polymerization) and other components are melt-kneaded.
• the temperature in melt-kneading is, for example, in a range of 250 to 350° C.
• the duration in melt-kneading is, for example, 5 to 30 seconds.
• Melt-kneading can be carried out by using a twin-screw extruder or the like.
• the polyarylene sulfide resin composition can be processed, alone or in combination with other materials, into a molding excellent in heat resistance, molding processability, dimensional stability or the like by various melt processing methods such as injection molding, extrusion molding, compression molding and blow molding.
• the polyarylene sulfide resin obtained by using the manufacturing method according to the present embodiment or a resin composition containing it, which enables to sufficiently reduce the amount of a remaining dealkylating agent or dearylating agent, the oligomer component of the polyarylene sulfide resin or the like, enables to manufacture a high-quality molding easily because the generation of a gas in heating is small.
• the polyarylene sulfide resin obtained by the manufacturing method according to the present invention or a resin composition containing the resin possesses various performances such as heat resistance and dimensional stability, which the polyarylene sulfide resin has by nature, and are therefore widely useful for materials for various molding such as injection molding or compression molding for electric/electronic parts such as a connector, a printed substrate and a sealed molding, automotive parts such as a lamp reflector and various electrical component parts, interior decoration materials for various buildings, an airplane, an automobile and the like or precision parts such OA equipment parts, camera parts and clock parts, extrusion molding for a composite, a sheet, a pipe or the like, or pultrusion molding; or materials for a fiber or a film, for example.
• various molding such as injection molding or compression molding for electric/electronic parts such as a connector, a printed substrate and a sealed molding, automotive parts such as a lamp reflector and various electrical component parts, interior decoration materials for various buildings, an airplane, an automobile and the like or precision parts such
• methanesulfonic acid manufactured by Wako Pure Chemical Industries, Ltd., Wako special grade 60%
• perchloric acid manufactured by Wako Pure Chemical Industries, Ltd., Wako 1st grade
• bromine manufactured by Wako Pure Chemical Industries, Ltd., JIS special grade
• trifluoromethanesulfonic acid manufactured by Wako Pure Chemical Industries, Ltd., Wako special grade
• Measurements were performed to 40 to 350° C. under a nitrogen flow of 50 mL/min under temperature elevation conditions of 20° C./min to determine respective glass transition temperatures and melting points with the DSC instrument Pyris Diamond manufactured by PerkinElmer Co., Ltd.
• the amount of a dealkylating agent or dearylating agent remaining in a polyarylene sulfide resin was measured with a GCMS-QP2010 manufactured by Shimadzu Corporation.
• the magnesium sulfate was filtered out by filtration and the filtrate was concentrated with a rotary evaporator to remove the solvent.
• the obtained liquid was dried under a reduced pressure for 20 hours to afford 55.5 [g] (yield 83%) of methyl-4-(phenylthio)phenyl sulfide.
• Yield 83%) of methyl-4-(phenylthio)phenyl sulfide As a result of 1 H-NMR measurement, it was confirmed that the target product was synthesized.
• a small amount of the obtained target product was collected for analysis, and after being ion-exchanged with an excessive amount of methanesulfonic acid, dissolved in deuterated DMSO, which was subjected to 1 H-NMR measurement and as a result it was confirmed that the target product was synthesized.
• the obtained solid was dried under a reduced pressure to afford 1.0 [g] (yield 90%) of polyphenylene sulfide.
• the obtained solid was subjected to a thermal analysis and as a result the glass transition temperature (Tg) was 92° C. and the melting point was 278° C., from which it was confirmed that a polyphenylene sulfide resin (PPS resin) was produced.
• Tg glass transition temperature
• PPS resin polyphenylene sulfide resin
• the amount of remaining N-methyl-2-pyrrolidone of the obtained PPS resin was checked by using GC-MS, and as a result it was confirmed to be 80 [ppm].
• Example 2 In the same way as in Example 1 except that the dealkylating agent or dearylating agent was changed to 0.8 [mL] (1.5 equivalents) of N-methyl-2-pyrrolidone and 5 [mL] of toluene was further added as a solvent, 0.91 [g] (yield 80%) of a polyphenylene sulfide was obtained.
• the obtained solid was subjected to a thermal analysis and as a result the glass transition temperature (Tg) was 92° C. and the melting point was 278° C., from which it was confirmed that a PPS resin was produced.
• the amount of remaining N-methyl-2-pyrrolidone of the obtained PPS resin was checked by using GC-MS, and as a result it was confirmed to be 10 [ppm] or less.
• Example 1 Example 2
• Example 1 Example 1
• Example 1 Example 1
• Example 1 Example 1
• Example 1 Example 1
• Example 2 Example 1
• Example 1 Dealkylating NMP 157 10 1.5 157 — — agent or Pyridine — — — — 157 — dearylating Quinoline — — — — — — 157 agent [eq.]

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