US9589809B2 - Method of depositing tungsten layer with improved adhesion and filling behavior - Google Patents

Method of depositing tungsten layer with improved adhesion and filling behavior Download PDF

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US9589809B2
US9589809B2 US14/744,835 US201514744835A US9589809B2 US 9589809 B2 US9589809 B2 US 9589809B2 US 201514744835 A US201514744835 A US 201514744835A US 9589809 B2 US9589809 B2 US 9589809B2
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layer
gas
base
sih
reactive
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US20150287606A1 (en
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Qiang Xu
Chao Zhao
Jun Luo
Guilei Wang
Tao Yang
Junfeng Li
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Institute of Microelectronics of CAS
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H—ELECTRICITY
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
    • H01L21/28562—Selective deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/08—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal halides
    • C23C16/14—Deposition of only one other metal element
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C23C16/45525—Atomic layer deposition [ALD]
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/28079—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a single metal, e.g. Ta, W, Mo, Al
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/28088—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a composite, e.g. TiN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/32051—Deposition of metallic or metal-silicide layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L21/76876—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for deposition from the gas phase, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66545—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate

Definitions

  • the disclosed technology relates to semiconductor manufacturing, and particularly to a method of depositing a tungsten (W) layer on a substrate with improved adhesion and filling behavior.
  • CMOS complementary metal oxide semiconductor
  • gate oxide thickness approaches atomic distances. Due to the tunneling effect, increased gate leakage current, reduced reliability and the like become significant problems.
  • the conventional gate dielectric material of SiO 2 cannot meet the requirement for further scaling of CMOS devices. Beyond 45 nm node process technology, it may be necessary to replace SiO 2 with gate dielectrics with a high dielectric constant (high-K).
  • high-K high dielectric constant
  • conventional polysilicon gates may not be compatible with high-K material, leading to problems including increased threshold voltage (V t ), and significant interfacial reaction during annealing. Replacing polysilicon gates with metal gates may reduce gate depletion and boron penetration which are inherent to polysilicon gates.
  • High-K gates may be fabricated with either gate-first processes or gate-last processes.
  • Gate-first processes are similar to conventional SiO 2 /polysilicon gate processes. In gate-first processes, gate dielectrics and metal gates are formed prior to forming drain and source regions. In contrast, in gate-last processes, sacrificial gates, sacrificial gate dielectric layers, source and drain regions, and interlayer dielectric layers are formed first. Then, sacrificial gates are removed and gates are re-formed.
  • Gate-first processes may anneal the source and drain at high temperatures that adversely impact some gate materials. As a result, the choice of gate materials is constrained for CMOS devices fabricated using these processes.
  • An advantage of gate-last processes is that the gate material need not undergo annealing at high temperature. As a result, a greater variety of materials can be used to fabricate CMOS gates with gate-last processes. Companies can employ gate-last processes to develop and manufacture CMOS devices with small feature sizes, such as 45 nm or less.
  • Aluminum (Al) or tungsten (W) may be utilized for the gate electrode in gate-last processes. Intel reported a chip process of 45 nm utilizing AI as the material for the gate electrode. Since a planarization process follows the process of filling the metal electrode, and it is difficult to control the planarization process for aluminum in large-scale production, tungsten (W) may be a candidate gate material.
  • filling the gate material is implemented after removing the sacrificial gate, and thus the requirement for the filling behavior of the gate material is strict. Further, beyond 22 nm node process technology, the space for gate filling becomes smaller. As a result, conventional chemical vapor deposition (CVD) method may not meet the requirements for filling tungsten. Instead, atomic layer deposition (ALD) manufactured by a B 2 H 6 source may be used to meet sheet resistance and filling behavior requirements for tungsten for metal gates.
  • ALD atomic layer deposition
  • the B2H6 base ALD W film since the B2H6 base ALD W film has poor adhesion, it may crack in the subsequent metal planarization process and to delaminate from a barrier layer of TiN, which adversely impacts yield.
  • the disclosed technology includes a method of depositing a tungsten (W) layer on a substrate with improved adhesion and filling behavior.
  • One aspect of the disclosed technology is a method of depositing a tungsten (W) layer.
  • the method includes preprocessing a substrate by depositing a SiH 4 base W film on a surface of a substrate to preprocess the substrate.
  • the method includes depositing a B 2 H 6 base W layer on the preprocessed surface.
  • the SiH 4 base W film is several atom layers thick.
  • the method includes depositing the SiH 4 base W film and the B 2 H 6 base W layer in a single atomic layer deposition (ALD) process.
  • the single atomic layer deposition (ALD) process may include a reactive source gas soak operation.
  • the single atomic layer deposition (ALD) process may include a reactive source gas introduction operation.
  • the single atomic layer deposition (ALD) process may include a main deposition operation.
  • forming the SiH 4 base W film may include introducing SiH 4 gas to a reactive cavity during the reactive source gas soak operation. In an embodiment, forming the SiH 4 base W film may include introducing a SiH 4 gas and a WF 6 gas to the reactive cavity during the reactive source gas introduction operation. In an embodiment, the reactive source gas introduction operation may include alternately introducing SiH 4 gas and WF 6 gas into the reactive cavity for several cycles. In an embodiment, the number of cycles is 2-10.
  • depositing the B 2 H 6 base W layer may include alternately introducing B 2 H 6 gas and WF 6 gas into the reactive cavity for a number of cycles during the main deposition operation.
  • the number of the cycles may depend on a thickness of the tungsten layer to be deposited.
  • the substrate may comprise a gate trench formed by a gate-last process, and the W film and the W layer may fill into the gate trench to function as a gate electrode.
  • the substrate prior to depositing the B 2 H 6 base W layer, the substrate is preprocessed by the SiH 4 gas so as to form the SiH 4 base W film several atom layers thick for improved filling behavior of the B 2 H 6 base W layer and improved adhesion by incorporating the SiH 4 base W film.
  • the deposition of the B 2 H 6 base W layer and that of the SiH 4 base W film may be implemented in a single ALD process. Thus, the yield can be increased and the window for filling may be extended.
  • FIG. 1 is a flowchart illustrating a method of depositing a W layer in an embodiment of the disclosed technology.
  • FIG. 2 is a flowchart of an atomic layer deposition (ALD) process in an embodiment of the disclosed technology.
  • ALD atomic layer deposition
  • FIG. 3A is a cross sectional view of a W layer manufactured according to an embodiment of the disclosed technology.
  • FIG. 3B is a top view, corresponding to the cross sectional view in FIG. 3A , of a W layer manufactured according to an embodiment of the disclosed technology.
  • FIG. 4A is a cross sectional view of a B 2 H 6 base W layer manufactured according to a conventional method.
  • FIG. 4B is a top view, corresponding to the cross sectional view in FIG. 4A , of a B 2 H 6 base W layer manufactured according to a conventional method.
  • FIG. 1 shows a flowchart of a method of depositing a W layer (tungsten layer) according to an embodiment of the disclosed technology.
  • method 100 preprocesses a surface where a tungsten (W) layer is to be deposited by depositing a SiH 4 base W film on a surface of a substrate.
  • such a surface may comprise a surface of a substrate on which a device may be formed.
  • the substrate may comprise various suitable substrates, such as a bulk semiconductor substrate, a semiconductor on insulator (SOI) substrate, and so on.
  • SOI semiconductor on insulator
  • the bulk silicon substrate is taken as an example, but the disclosed technology is not limited thereto.
  • a device, or a part of a device, manufactured by a gate-last process is formed on the substrate.
  • a device may be manufactured as follows.
  • a sacrificial gate stack including a sacrificial gate dielectric layer (for example, SiO 2 ) and a sacrificial gate conductor (for example, polysilicon) may be formed on the substrate.
  • Halo implantation and extension implantation may be performed with the sacrificial gate stack as a mask.
  • a gate spacer of, for example, nitride may be formed on sidewalls of the sacrificial gate stack, and source/drain (S/D) implantation may be performed with the gate spacer and the sacrificial gate stack as a mask.
  • a thermal treatment may be performed to activate implanted ions.
  • an interlayer dielectric layer of, for example, oxide may be deposited on the substrate, and a planarization process such as chemical mechanical polishing (CMP) may be performed on the interlayer dielectric layer.
  • CMP chemical mechanical polishing
  • the planarization process may stop on the gate spacer so as to expose the sacrificial gate stack.
  • the sacrificial gate stack may be selectively removed so as to leave a gate trench at an inner side of the gate spacer.
  • an actual gate stack may be filled into the gate trench, for example, including a high-K gate dielectric layer of, for example, HfO 2 , and a metal gate conductor of, for example, W.
  • the method 100 may be applied for filling a W layer into the gate trench.
  • the gate-last process is not limited to the above implementation as those skilled in the art may conceive various ways to implement the gate-last process. Furthermore, although it is illustrated by filling a W layer into the gate trench as a an example, the technique of the disclosed technology may be applied to any other application which needs to deposit a W layer, such as filling a W layer into a limited space such as a trench or hole.
  • the preprocessing includes introducing a SiH 4 gas into a reactive cavity where the surface to be processed; for example, where the substrate carrying this surface is located.
  • the preprocessing may be incorporated into an atomic layer deposition (ALD) process.
  • the reactive cavity may be a place where the ALD is to be performed.
  • Such preprocessing may lead to a W film of several (for example, less than 10) atom layers on the surface.
  • the SiH 4 base W film helps to improve the adherence of the body of a W layer to be deposited subsequently (to, for example, an underlying TiN barrier layer).
  • method 100 deposits a B 2 H 6 base W layer on the preprocessed surface.
  • the method 100 may comprise an operation 120 of further depositing a B 2 H 6 base W layer on the surface (in particular, on the SiH 4 base W film).
  • the B 2 H 6 base W layer may be deposited by alternately introducing a B 2 H 6 gas and a WF 6 gas to the reactive cavity, and such a deposition may be by ALD. Since the growth rate for the B 2 H 6 base W layer is relatively slow (for example, about 3.1 ⁇ /cycle), the filling behavior is good.
  • FIG. 2 is a flowchart of an atomic layer deposition (ALD) process 200 .
  • ALD atomic layer deposition
  • process 200 positions a wafer to be processed into a reactive cavity.
  • process 200 introduces an inert gas such as Ar to the reactive cavity to keep a certain degree of vacuum within the reactive cavity.
  • method 200 conducts a check to ensure that the process smoothly goes on to check whether the wafer is reliably fixed (for example, by vacuum suction) to a reactive base.
  • method 200 After the preparing operations of wafer placement 202 , gas introduction 204 , and vacuum suction check 206 , formal deposition may be started.
  • method 200 conducts a reactive source gas soak operation 208 , in which a reactive source gas is introduced to the reactive cavity.
  • method 200 conducts a purging operation, in which an inert gas removes the extra reactive source gas adsorbed on the surface of the wafer.
  • method 200 conducts a reactive source gas introduction, in which reactive source gases are introduced into the reactive cavity.
  • method 200 performs a main deposition operation, in which reactive gases may be alternately introduced into the reactive cavity (for example, in case of depositing a B 2 H 6 base W layer, a B 2 H 6 gas and a WF 6 gas may be alternately introduced).
  • the reactive gases react within the reactive cavity to generate a thin film with a desired composition.
  • an inert gas may be used for purging to remove the extra reactive gases.
  • method 200 conducts a purging operation in which an inert gas takes away the extra reactive gases in the reactive cavity.
  • method 200 conducts a wafer pick-up operation, in which the wafer with the deposited thin film is removed from the reactive cavity.
  • the B 2 H 6 gas is usually introduced in the reactive source gas soak operation 208 and the B 2 H 6 gas and the WF 6 gas are introduced in the reactive source gas introduction operation 212 .
  • the SiH 4 gas may be introduced in the operation 208 and the SiH 4 gas and the WF 6 gas may be introduced in the reactive source gas introduction of block 212 .
  • Such operations of reactive source gas soak in block 208 and reactive source gas introduction in block 210 may lead to preprocessing on the surface and forming a SiH 4 base W film.
  • the SiH 4 gas and the WF 6 gas may be alternately introduced.
  • the SiH 4 gas when the SiH 4 gas is being introduced, the SiH 4 gas may be adsorbed to the surface of the wafer.
  • WF 6 when the WF 6 is being introduced, WF 6 may react with SiH 4 adsorbed to the surface of the wafer so as to form a W film on the surface of the wafer.
  • an inert gas may be used for purging to remove the extra reactive gases so that only a single layer or several layers of atoms are absorbed to the surface of the wafer.
  • the reaction occurred on the surface of the wafer may be controlled in unit of an atom layer.
  • the above mentioned operations may constitute a cycle.
  • the SiH 4 gas and the WF 6 gas may be alternately introduced for several (for example, 2-10) cycles to form a SiH 4 base W film with a thickness of several atom layers.
  • the B 2 H 6 gas and the WF 6 gas may be alternately introduced. Every time the B 2 H 6 and WF 6 gases are introduced, an inert gas may be used for purging. A number of cycles (for example, 250 cycles) may be performed to deposit a B 2 H 6 base W layer with a desired thickness. The number of the cycles of the main deposition operation mainly depends on the thickness of the W layer to be deposited.
  • FIG. 3A is a cross sectional view of a W layer manufactured according to an embodiment of the disclosed technology.
  • FIG. 3B is a top view, corresponding to the cross sectional view in FIG. 3A , of a W layer manufactured according to an embodiment of the disclosed technology.
  • FIG. 4A is a cross sectional view of a B 2 H 6 base W layer manufactured according to a conventional method.
  • FIG. 4B is a top view, corresponding to the cross sectional view in FIG. 4A , of a B 2 H 6 base W layer manufactured according to a conventional method. It can be seen by comparing FIG. 3A and FIG. 4A that the W layer according to the embodiment of the disclosed technology keeps good filling into the gate trench, and it can be seen by comparing FIG. 3B and FIG. 4B that the W layer according to the embodiment of the disclosed technology has better adhesion (fewer cracks).
  • the resultant W layer has better adhesion and a good filling behavior, and applying it to a 22 nm metal gate electrode may improve the yield and may extend the process window for filling.

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CN114958036B (zh) * 2022-06-30 2023-12-01 丰田自动车株式会社 一种珠光颜料及其制备方法

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US20150287606A1 (en) 2015-10-08
EP3093874A4 (en) 2017-11-08

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