US8691368B2 - Thermally conductive sheet and method of manufacturing the same - Google Patents

Thermally conductive sheet and method of manufacturing the same Download PDF

Info

Publication number
US8691368B2
US8691368B2 US12/079,399 US7939908A US8691368B2 US 8691368 B2 US8691368 B2 US 8691368B2 US 7939908 A US7939908 A US 7939908A US 8691368 B2 US8691368 B2 US 8691368B2
Authority
US
United States
Prior art keywords
layer
polymer layer
heat
sheet
thermally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US12/079,399
Other languages
English (en)
Other versions
US20080241488A1 (en
Inventor
Mitsuru Ohta
Motoki Ozawa
Yoshiaki Okabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polymatech Co Ltd
Sekisui Polymatech Co Ltd
Original Assignee
Polymatech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polymatech Co Ltd filed Critical Polymatech Co Ltd
Assigned to POLYMATECH CO., LTD. reassignment POLYMATECH CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OHTA, MITSURU, OKABAYASHI, YOSHIAKI, OZAWA, MOTOKI
Publication of US20080241488A1 publication Critical patent/US20080241488A1/en
Assigned to PT ESTABLISHMENT PREPARATION CO., LTD. reassignment PT ESTABLISHMENT PREPARATION CO., LTD. AGREEMENT Assignors: POLYMATECH CO., LTD
Assigned to Polymatech Japan Co., Ltd. reassignment Polymatech Japan Co., Ltd. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: PT ESTABLISHMENT PREPARATION CO., LTD.
Application granted granted Critical
Publication of US8691368B2 publication Critical patent/US8691368B2/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29499—Shape or distribution of the fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24826—Spot bonds connect components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

Definitions

  • the present invention relates to a thermally conductive sheet used to release heat generated by semiconductor devices and various types of electronic parts which are heat emitting bodies and a method of manufacturing the same.
  • Thermally conductive sheets, thermally conductive grease, thermally conductive adhesives, phase change members having thermal conductivity and the like are inserted between heat emitting bodies mounted on circuit boards for conventional electronics and heat discharging bodies in order to release heat generated by the heat emitting bodies.
  • heat emitting bodies include semiconductor devices and electronic parts.
  • heat discharging bodies include heat sinks and cooling fans.
  • the power consumption and amount of heat emission of electronic parts have increased as the functions and performance of electronics have increased.
  • the space within the housing of electronics for arranging members, such as circuit boards has been becoming smaller as the scale and the thickness of electronics have been reduced.
  • thermal diffusion sheets formed of graphite or a metal material are used in order to effectively diffuse heat generated by a heat emitting body within the limited space inside the housing.
  • a thermal diffusion sheet having excellent properties in terms of thermal diffusion has been required.
  • the thermal diffusion sheet makes direct contact with a heat emitting body, the thermal diffusion sheet does not stick to the shape of the contour of the heat emitting body, due to the high rigidity of the graphite or metal material that forms the thermal diffusion sheet. Therefore, the thermal diffusion sheet cannot make sufficiently close contact with the heat emitting body, and thus, excellent properties in terms of thermal diffusion cannot be gained.
  • thermally conductive sheets where a flexible thermally conductive polymer layer is layered on at least one side of a thermal diffusion layer formed of, for example, graphite, in order to gain excellent properties in terms of thermal diffusion.
  • a thermal diffusion layer formed of, for example, graphite.
  • Various functions are required, in addition to the above described properties in terms of thermal diffusion, for thermally conductive sheets, depending on where they are used.
  • the thermally conductive sheets described in the above described gazettes do not meet these requirements.
  • An object of the present invention is to provide a thermally conductive sheet which is more appropriate for use in applications where heat release from heat emitting bodies is required.
  • the present invention also relates to a method of manufacturing the thermally conductive sheet.
  • a thermally conductive sheet includes a thermally conductive polymer layer formed of a thermally conductive polymer composition, an adhesive layer provided on an outer surface of the thermally conductive polymer layer, and a functional layer provided on the adhesive layer.
  • the thermally conductive polymer composition contains a polymer matrix and a thermally conductive filler.
  • the coefficient of static friction of the thermally conductive polymer layer is 1.0 or lower.
  • the adhesive layer and the thermally conductive polymer layer each have an outer shape and the outer shape of the adhesive layer is smaller than the outer shape of the thermally conductive polymer layer.
  • a method for manufacturing a thermally conductive sheet includes: forming a thermally conductive polymer layer of a thermally conductive polymer composition containing a polymer matrix and a thermally conductive filler in which the coefficient of static friction of the thermally conductive polymer layer is 1.0 or lower and the thermally conductive polymer layer includes an outer shape; providing an adhesive layer on an outer surface of the thermally conductive polymer layer in which the adhesive layer has an outer shape smaller than the outer shape of the thermally conductive polymer layer; and providing a functional layer on the adhesive layer.
  • FIG. 1A is a plane diagram showing a first embodiment of a thermally conductive sheet in accordance with the present invention
  • FIG. 1B is a cross sectional diagram along line 1 B- 1 B of FIG. 1A ;
  • FIG. 1C is an enlarged cross sectional diagram showing a polymer layer
  • FIG. 2 is a cross sectional diagram showing the step of manufacturing a thermally conductive sheet
  • FIG. 3A is a cross sectional diagram showing the attachment of a thermally conductive sheet to a heat emitting body
  • FIG. 3B is an enlarged cross sectional diagram showing a thermally conductive polymer layer and a heat discharging body
  • FIG. 3C is an enlarged cross sectional diagram showing a thermally conductive polymer layer and a thermal diffusion layer
  • FIG. 4A is a cross sectional diagram showing the thermally conductive sheet according to a second embodiment
  • FIG. 4B is a cross sectional diagram along line 4 B- 4 B of FIG. 4A ;
  • FIG. 4C is an enlarged cross sectional diagram showing a polymer layer
  • FIG. 5 is a cross sectional diagram showing the attachment of a thermally conductive sheet to a heat emitting body
  • FIG. 6A is a cross sectional diagram showing the thermally conductive sheet according to a third embodiment
  • FIG. 6B is a cross sectional diagram along line 6 B- 6 B of FIG. 6A ;
  • FIG. 6C is an enlarged cross sectional diagram showing a polymer layer
  • FIG. 7A is a plane diagram showing the thermally conductive sheet according to the fourth embodiment.
  • FIG. 7B is a cross sectional diagram along line 7 B- 7 B of FIG. 7A ;
  • FIG. 8A is a plane diagram showing another example of the thermally conductive sheet
  • FIG. 8B is a cross sectional diagram along line 8 B- 8 B of FIG. 8A ;
  • FIGS. 9A to 9J are plane diagrams showing an adhesive layer and other examples thereof in accordance with examples of the invention.
  • FIG. 10 is a schematic diagram illustrating a method for measuring the value of the thermal resistance in the polymer layer
  • FIG. 11 is a schematic diagram illustrating a method for measuring the coefficient of static friction in the polymer layer
  • FIG. 12 is a schematic diagram illustrating a method for measuring the adhesiveness of the polymer layer
  • FIG. 13A is a photograph showing the temperature distribution in the test piece according to Example 1-a.
  • FIG. 13B is a photograph showing the temperature distribution in the test piece according to Comparative Example 1-a.
  • the thermally conductive sheet 11 comprises a thermally conductive polymer layer 12 formed of a thermally conductive polymer composition, an adhesive layer 13 formed on the outer surface 12 a of the thermally conductive polymer layer 12 , and a thermal diffusion layer 14 , which is a functional layer formed on the adhesive layer 13 .
  • the layers are in the order of: thermal diffusion layer 14 , adhesive layer 13 , thermally conductive polymer layer 12 , from the bottom.
  • the thermally conductive sheet 11 is simply referred to as sheet 11
  • the thermally conductive polymer composition is simply referred to as composition
  • the thermally conductive polymer layer 12 is simply referred to as polymer layer 12 .
  • the sheet 11 is inserted between a heat emitting body and a heat discharging body, for example, for use, so that heat is discharged from the hot heat emitting body and the heat emitting body is cooled.
  • the sheet 11 is provided with a cooling function and is easy to handle.
  • the cooling function is an index for ease of cooling a hot heat emitting body, and based on the thermal conductivity of the polymer layer 12 and the properties of the thermal diffusion layer 14 in terms of thermal diffusion. That is to say, the cooling function is based on the thermal conductivity of the polymer layer 12 , the value of the thermal resistance of the polymer layer 12 , the adhesion between the heat emitting body or heat discharging body and the polymer layer 12 , as well as that between the thermal diffusion layer 14 and the polymer layer 12 , and the properties of the thermal diffusion layer 14 in terms of thermal diffusion.
  • the ease of handling is an index for the ease of handling when the sheet 11 is carried and the like, and mainly based on the adhesiveness of the polymer layer 12 .
  • the smaller the adhesiveness of the polymer layer 12 the easier the sheet 11 is to handle when carried, and thus, the ease of handling is high.
  • the composition contains a polymer matrix and a thermally conductive filler.
  • the polymer matrix holds the thermally conductive filler within the polymer layer 12 .
  • the polymer matrix is selected in accordance with the performance required for the polymer layer 12 , for example mechanical strength, hardness, durability, resistance to heat, and electrical properties. Specific examples of the polymer matrix include silicone resin.
  • the thermally conductive filler increases the thermal conductivity of the polymer layer 12 so that the cooling function of the sheet 11 increases.
  • the form of the thermally conductive filler include fiber, particle, and plate forms.
  • at least part of the thermally conductive filler is in fiber form.
  • a thermally conductive filler in fiber form that is to say, a sheet 11 containing a filler in fiber form
  • the filler in fiber form include carbon fibers and poly(p-phenylenebenzobisoxazole) precursor carbon fibers (PBO carbon fibers).
  • materials for thermally conductive fillers having a form other than fiber form, that is to say, fillers in non-fiber form include aluminum oxide and aluminum hydroxide.
  • the thermally conductive filler content in the composition is preferable for the thermally conductive filler content in the composition to be 90 mass % or less.
  • the thermally conductive filler content exceeds 90 mass %, the polymer layer 12 becomes fragile, because the flexibility of the polymer layer 12 is low, and at the same time, there is a risk that the polymer layer 12 may not stick to the shape of the contour of the heat emitting body and the heat discharging body as much.
  • the composition may contain a plasticizer for adjusting the hardness of, for example, the polymer layer 12 , and a stabilizer for enhancing the durability, in addition to the above described components.
  • the polymer layer 12 is in quadrilateral form and accelerates thermal conduction from the heat emitting body to the heat discharging body so that the hot heat emitting body is cooled.
  • the polymer layer 12 is provided with a polymer matrix 15 and a thermally conductive filler 16 .
  • the thermally conductive filler 16 according to the present embodiment has a thermally conductive filler 16 in fiber form, that is to say, filler in fiber form 16 a and a thermally conductive filler 16 in particle form, that is to say, a filler in particle form 16 b .
  • the filler in fiber form 16 a is oriented in one direction. In the polymer layer 12 shown in FIGS.
  • the filler in fiber form 16 a is oriented in the direction of the thickness of the polymer layer 12 . Therefore, the value of the thermal conductivity of the polymer layer 12 in the direction of the thickness is equal to the value gained by multiplying the value of the thermal conductivity in the direction of the width by two to several hundred.
  • the end portions of the filler in fiber form 16 a extend in the direction of the width of the polymer layer 12 and are exposed on pairs of facing outer surfaces 12 a.
  • the adhesiveness of the polymer layer 12 is very small, and therefore, the adhesiveness of the polymer layer 12 can be indicated using the coefficient of static friction of the polymer layer 12 . That is to say, in the case where the coefficient of static friction of the polymer layer 12 is low, the adhesiveness of the polymer layer 12 is low, while in the case where the coefficient of static friction of the polymer layer 12 is high, the adhesiveness of the polymer layer 12 is high.
  • the coefficient of static friction of the polymer layer 12 is 1.0 or lower, preferably 0.3 or lower. In the case where the coefficient of static friction of the polymer layer 12 exceeds 1.0, it becomes difficult to attach the sheet 11 to the heat emitting body, for example, due to excessively high adhesiveness of the polymer layer 12 .
  • the lower limit for the coefficient of static friction of the polymer layer 12 is not particularly limited, and the smaller the coefficient of static friction of the polymer layer 12 is, the easier it is to attach the sheet 11 to the heat emitting body, for example.
  • the coefficient of static friction of the polymer layer 12 is 1.0 or lower, the polymer layer 12 is not sticky when the outer surfaces 12 a of the polymer 12 are touched with the fingers, and thus, the polymer layer 12 does not adhere to the thermal diffusion layer 14 through its own adhesiveness.
  • the thickness of the polymer layer 12 is preferably 0.03 mm to 0.5 mm. In the case where the thickness of the polymer layer 12 is less than 0.03 mm, the manufacture of the polymer layer 12 becomes difficult. In the case where the thickness of the polymer layer 12 exceeds 0.5 mm, it takes time for the heat to conduct from the heat emitting body to the heat discharging body, and there is a risk that the cooling function of the sheet 11 may deteriorate. Polymer layers 12 having a thickness of 0.5 mm or less easily become flexible, due to the material.
  • the hardness of the polymer layer 12 as measured in accordance with the type E of JIS K 6253, which is a Japanese Industrial Standard (ISO 7619-1, which is an international standard), is 5 to 80, for example.
  • the hardness of the polymer layer 12 is less than 5
  • the polymer layer 12 is too flexible, and therefore, the ease of handling of the sheet 11 deteriorates.
  • the hardness of the polymer layer 12 exceeds 80, the adhesion between the polymer layer 12 and the heat emitting body or heat discharging body decreases, and there is a risk that the cooling function of the sheet 11 may deteriorate.
  • the outer shape of the adhesive layer 13 is smaller than the outer shape of the polymer layer 12 , and in multi-dot form throughout the entirety of the outer surfaces 12 a of the polymer layer 12 .
  • the adhesive layer 13 holds the polymer layer 12 and the thermal diffusion layer 14 together through the adhesive layer 13 .
  • the material for the adhesive layer 13 include acryl based, silicone based, urethane based, vinyl based and synthetic rubber based gluing agents and adhesives.
  • the adhesive layer 13 is formed through application of a material for forming the adhesive layer 13 to the polymer layer 12 .
  • the adhesive layer 13 may be formed of an adhesive tape where the above described adhesive is applied to a polymer film, which has the same effects.
  • the polymer layer 12 easily adheres to the thermal diffusion layer 14 , and therefore, it is preferable for the material for the adhesive layer 13 to have flexibility.
  • the ratio of the area occupied by the adhesive layer 13 to the entirety of the outer surfaces 12 a on the outer surfaces 12 a to which the adhesive layer 13 of the polymer layer 12 is attached is preferably 30% or less.
  • the thermal conductivity of the adhesive layer 13 and the properties of the adhesive layer 13 in terms of thermal diffusion are poor in comparison with the thermal conductivity of the polymer layer 12 and the properties of the thermal diffusion layer 14 in terms of thermal diffusion. Therefore, when the ratio of the area occupied by the adhesive layer 13 exceeds 30%, there is a risk that the cooling function of the sheet 11 may deteriorate excessively.
  • the thickness of the adhesive layer 13 is preferably 50 ⁇ m or less. In the case where the thickness of the adhesive layer 13 exceeds 50 ⁇ m, the difference between the outer surface of the polymer layer 12 and the surface of the adhesive layer 13 becomes great due to the thickness of the adhesive layer 13 . Therefore, there is a risk that the adhesion between the polymer layer 12 and the thermal diffusion layer 14 may decrease, and the value of the thermal contact resistance of the sheet 11 may become high when the sheet 11 is attached to a heat emitting body, for example. As described above, the thermal conductivity of the adhesive layer 13 is poor in comparison with the thermal conductivity of the polymer layer 12 .
  • the lower limit for the thickness of the adhesive layer 13 is not particularly limited, and the thinner the adhesive layer 13 , the higher the adhesion between the polymer layer 12 and the thermal diffusion layer 14 becomes, and the lower the ratio of the adhesive layer 13 in the direction of the thermal conductance in the sheet 11 becomes. Thus, the lower the value of the thermal contact resistance of the sheet 11 becomes.
  • the thermal diffusion layer 14 is in quadrilateral form and allows heat to diffuse from the hot heat emitting body, and thus, prevents heat from accumulating within the heat emitting body and in the vicinity of the heat emitting body, so that the cooling function of the sheet 11 improves.
  • the thermal diffusion layer 14 is formed of a graphite sheet or a sheet made of a metal, for example. Specific examples of the material for the sheet made of a metal include copper and aluminum.
  • the thermal diffusion layer 14 allows heat to diffuse in the direction parallel to the surface, due to the quality of the material, and releases diffused heat to the outside from the peripheral and the surface of the thermal diffusion layer 14 . Therefore, the thermal diffusion layer 14 is preferably formed of a graphite sheet.
  • Graphite sheets usually have high thermal conductivity in the direction parallel to the surface, in comparison with the thermal conductivity in the direction of the thickness.
  • the thermal conductivity in the direction parallel to the surface of the graphite sheet is 100 W/m ⁇ K to 800 W/m ⁇ K.
  • the graphite sheet allows heat to diffuse in such a manner as to be conveyed more quickly in the direction parallel to the surface than in the direction of the thickness.
  • the outer shape of the thermal diffusion layer 14 is larger than the outer shape of the polymer layer 12 , and the peripheral portion 14 a of the thermal diffusion layer 14 is exposed.
  • the thickness of the thermal diffusion layer 14 is preferably 10 ⁇ m to 150 ⁇ m. In the case where the thickness of the thermal diffusion layer 14 is less than 10 ⁇ m, the thermal diffusion layer 14 is fragile and easily damaged, and the thermal capacity of the thermal diffusion layer 14 is excessively small, and therefore there is a risk that the cooling function of the sheet 11 may not improve sufficiently. In the case where the thickness of the thermal diffusion layer 14 exceeds 150 ⁇ m, there is a risk that the efficiency of thermal conduction from the heat emitting body to the heat discharging body may decrease, due to the excessive thickness of the thermal diffusion layer 14 .
  • the sheet 11 is manufactured through a preparation step of preparing a composition, an orientation step of orienting the filler in fiber form 16 a , a formation step of forming a polymer layer 12 , an exposure step of exposing the filler in fiber form 16 a , and a laminating step of laminating an adhesive layer 13 and a thermal diffusion layer 14 on the polymer layer 12 in this order.
  • the appropriate components described above are mixed, so that a composition is prepared.
  • a die for example, is filled with the composition, and after that, the filler in fiber form 16 a is oriented.
  • a method for orienting the filler in fiber form 16 a a method for applying a magnetic field in the composition using a magnetic field generating apparatus and a method for applying vibration in the composition using a vibration apparatus can be used, and a method for applying both a magnetic field and vibration to the composition is preferable, because the filler in fiber form 16 a is easily oriented. At this time, the magnetic field and vibration are applied to the filler in fiber form 16 a via the composition.
  • the polymer matrix 15 is hardened or solidified within the die in such a state that the orientation of the filler in fiber form 16 a is maintained, and thus, a polymer layer 12 in predetermined form is formed.
  • the filler in fiber form 16 a in the polymer layer 12 after the formation step is not exposed from the outer surface 12 a of the polymer layer 12 .
  • a blade in mesh form for example, is pressed against the outer surface 12 a of the polymer layer 12 , and after that, is slid over the outer surface 12 a , and thus, the polymer matrix 15 is removed from the outer surface 12 a , so that the filler in fiber form 16 a is exposed from the outer surface 12 a .
  • a material for forming an adhesive layer 13 is applied in a predetermined location on the outer surface 12 a of the polymer layer 12 in accordance with a well-known method, and thus, the adhesive layer 13 is layered in multi-dot form on the outer surface 12 a of the polymer layer 12 .
  • a thermal diffusion layer 14 is layered on the adhesive layer 13 .
  • the sheet 11 When the sheet 11 is attached to the heat emitting body and the heat discharging body, as shown in FIG. 3A , the sheet 11 is placed on top of the heat emitting body 22 (for example an electronic device) provided on a substrate 21 , for example. At this time, the thermal diffusion layer 14 faces the heat emitting body 22 .
  • the bottom of the heat emitting body 22 is covered with an electrically insulating layer 23 , and terminals 24 for connecting the heat emitting body 22 to an electrical circuit, not shown, on the substrate 21 are provided between the substrate 21 and the electrically insulating layer 23 .
  • the heat discharging body 25 is placed on top of the sheet 11 , and after that, a load is applied from the heat discharging body 25 to the heat emitting body 22 so that the sheet 11 makes close contact with the heat emitting body 22 and the heat discharging body 25 , and thus, the sheet 11 is sandwiched between the heat emitting body 22 and the heat discharging body 25 .
  • the end portions of the filler in fiber form 16 a exposed from the outer surface of the polymer layer 12 are pressed into the polymer layer 12 as a result of the above described load.
  • the polymer matrix 15 soaks out from between the exposed filler in fiber form 16 a as a result of the above described load.
  • the above described exposed filler in fiber form 16 a is relatively immersed in the polymer matrix 15 within the polymer layer 12 , so that the adhesiveness of the polymer layer 12 increases. Furthermore, the polymer layer 12 makes close contact with the thermal diffusion layer 14 and the heat discharging layer 25 without creating a gap between the thermal diffusion layer 14 and the discharging body 25 .
  • the value of the load applied to the heat discharging body 25 is, for example, 4.9 N.
  • the sheet 11 according to the present embodiment comprises a polymer layer 12 and a thermal diffusion layer 14 layered on top of the polymer layer 12 via an adhesive layer 13 . Therefore, the sheet 11 allows heat from the heat emitting body 22 to diffuse through the thermal diffusion layer 14 , and accelerates thermal conduction from the heat emitting body 22 to the heat discharging body 25 through the polymer layer 12 , and thus, an excellent cooling function can be gained.
  • the coefficient of static friction of the polymer layer 12 is set to 1.0 or lower, and the polymer layer 12 and the thermal diffusion layer 14 are integrally formed using the adhesive layer 13 . Therefore, the adhesiveness of the polymer layer 12 decreases, so that ease of handling of the sheet 11 can be increased and the thermal diffusion layer 14 can be attached to the polymer layer 12 having low adhesiveness without fail.
  • the outer shape of the adhesive layer 13 is smaller than the outer shape of the polymer layer 12 , and the adhesive layer 13 according to the present embodiment is in multi-dot form throughout the entirety of the outer surface 12 a of the polymer layer 12 . Therefore, the cooling function of the sheet 11 can be prevented from deteriorating, due to the adhesive layer 13 , in comparison with the case where the adhesive layer 13 is formed on the entirety of the outer surface 12 a of the polymer layer 12 .
  • the ratio of the area occupied by the adhesive layer 13 to the entirety of the outer surface 12 a can be set to 30% or lower on the outer surface 12 a of the polymer layer 12 , where the adhesive layer 13 is provided, and thus, the cooling function of the sheet 11 can be prevented from deteriorating due to the adhesive layer 13 without fail.
  • the adhesive layer 13 is formed in only part of the peripheral portion of the polymer layer 12 , for example, there is a risk that a thin and flexible polymer layer 12 may bend toward the thermal diffusion layer 14 or outward in portions where the adhesive layer is not formed. In this case, attachment of the sheet to the heat emitting body 22 , for example, becomes difficult.
  • the adhesive layer 13 is formed uniformly throughout the entirety of the polymer layer 12 , and therefore, the thin and flexible polymer layer 12 can be prevented from bending.
  • the thickness of the adhesive layer 13 is set to 50 ⁇ m or less, the value of the thermal contact resistance of the sheet 11 can be decreased, so that the cooling function of the sheet 11 increases.
  • the peripheral portion 14 a of the thermal diffusion layer 14 is exposed. Therefore, heat can easily diffuse from the peripheral portion 14 a.
  • the thickness of the thermal diffusion layer 14 is set to 10 ⁇ m to 150 ⁇ m, and thus, the cooling function of the sheet 11 can be increased sufficiently.
  • the sheet 11 comprises a polymer layer 12 , an adhesive layer 13 and a conductive layer 17 , which is a functional layer formed on top of the adhesive layer 13 .
  • the layers are in the order of: conductive layer 17 , adhesive layer 13 , polymer layer 12 , from the bottom.
  • the sheet 11 is inserted between a heat emitting body and a heat discharging body, for example, for use, and accelerates heat conduction from the heat emitting body to the heat discharging body.
  • the sheet 11 has high thermal conductivity and a high conductivity, and is easy to handle.
  • the thermal conductivity is an indicator for ease of thermal conductance from the heat emitting body 22 to the heat discharging body 25 , and depends mainly on the thermal conductivity and the thermal resistivity of the polymer layer 12 , as well as the adhesion between the heat discharging body 25 and the polymer layer 12 , as well as that between the conductive layer 17 and the polymer layer 12 .
  • the higher the thermal conductivity of the polymer layer 12 is, the smaller the value of the thermal resistance is, and the higher the adhesion between the heat discharging body 25 and the polymer layer 12 , as well as that between the conductive layer 17 and the polymer layer 12 , is, the higher thermal conductivity the sheet 11 has.
  • the conductivity is an index for the ease with which a current flows from the heat emitting body 22 to the heat discharging body 25 having a high conductivity, and mainly depends on the material for the conductive layer 17 .
  • the ease of handling is an indicator for the ease of handling when the sheet 11 is carried, and mainly depends on the adhesiveness of the polymer layer 12 .
  • the sheet 11 becomes easier to handle when carried as the adhesiveness of the polymer layer 12 becomes smaller.
  • the conductive layer 17 allows a current to flow from the heat emitting body 22 to the heat discharging body 25 having a high conductivity, and thus, prevents electrostatic discharge (ESD) due to charging of the heat emitting body 22 .
  • the conductive layer 17 is formed of a sheet having a high conductivity, for example a sheet made of a metal, and a conductive resin sheet or a conductive sheet. Specific examples of the material for the sheet made of a metal include copper and aluminum.
  • the conductive resin sheet is provided with, for example, a thermoplastic resin or a thermosetting resin and conductive particles dispersed therein.
  • the conductive sheet is formed by coating the thermoplastic resin sheet, for example, with a metal layer.
  • the outer shape of the conductive layer 17 is in quadrilateral plate form and is larger than the outer shape of the polymer layer 12 , and the peripheral portion 17 a of the conductive layer 17 is exposed.
  • the thickness of the conductive layer 17 is preferably 20 ⁇ m or less, more preferably 2 ⁇ m to 14 ⁇ m. In the case where the thickness of the conductive layer 17 exceeds 20 ⁇ m, there is a risk that the efficiency of thermal conduction from the heat emitting body 22 to the heat discharging body 25 may decrease, due to the excessive thickness of the conductive layer 17 . In the case where the thickness of the conductive layer is less than 2 ⁇ m, the strength of the conductive layer 17 is low, and therefore, there is a risk that the conductive layer 17 may be broken when the sheet 11 is used (when compressed).
  • the sheet 11 is manufactured through the preparation step of preparing a composition, the orientation step of orienting the filler in fiber form 16 a , the formation step of forming a polymer layer 12 , the exposure step of exposing the filler in fiber form 16 a , and the laminating step of laminating an adhesive layer 13 and a conductive layer 17 on the polymer layer 12 in this order.
  • the laminating step the conductive layer 17 is layered on the adhesive layer 13 after the adhesive layer 13 is layered on the outer surface 12 a of the polymer layer 12 .
  • the sheet 11 When the sheet 11 is attached to the heat emitting body 22 and the heat discharging body 25 , as shown in FIG. 5 , the sheet 11 is mounted on the heat emitting body 22 (for example an electric device) provided on a substrate 21 , for example. At this time, the conductive layer 17 faces the heat emitting body 22 . Subsequently, the heat discharging body 25 having a high conductivity is mounted on the sheet 11 , and after that, a load is applied from the heat discharging body 25 to the heat emitting body 22 so that the sheet 11 makes contact with the heat emitting body 22 and the heat discharging body 25 , and thus, the sheet 11 is sandwiched between the heat emitting body 22 and the heat discharging body 25 . In addition, the peripheral portion 17 a of the conductive layer 17 makes contact with the heat discharging body 25 .
  • the sheet 11 comprises a polymer layer 12 and a conductive layer 17 , which is layered on top of the polymer layer 12 via the adhesive layer 13 . Therefore, the sheet 11 accelerates heat conduction from the heat emitting body 22 to the heat discharging body 25 through the polymer layer 12 , and thus, excellent thermal conductivity can be gained, and the conductive layer 17 can prevent a problem from arising with the heat emitting body 22 due to ESD.
  • the thickness of the conductive layer 17 is set to 20 ⁇ m or less, and thus, the thermal conductivity of the sheet 11 can be prevented from decreasing due to the conductive layer 17 , of which the thermal conductivity is lower than that of the polymer layer 12 .
  • the peripheral portion 17 a of the conductive layer 17 is exposed. Therefore, the conductive layer 17 can be easily made to make contact with the heat discharging body 25 when the sheet 11 is attached to the heat emitting body 22 and the heat discharging body 25 .
  • the sheet 11 comprises a polymer layer 12 , an adhesive layer 13 , and an electrically insulating film 18 , which is a functional layer formed on the adhesive layer 13 .
  • the layers are in the order of: electrically insulating layer 18 , adhesive layer 13 , polymer layer 12 , from the bottom.
  • the sheet 11 is inserted between a heat emitting body 22 and a heat discharging body 25 , for example, for use, and accelerates heat conduction from the heat emitting body 22 to the heat discharging body 25 .
  • the sheet 11 has a high thermal conductivity and high electrical insulation, and is easy to handle.
  • the thermal conductivity is an indicator for the ease of thermal conductance from the heat emitting body 22 to the heat discharging body 25 , and mainly on the basis of the thermal conductivity and the thermal resistivity of the polymer layer 12 , and the adhesion between the heat discharging body 25 and the polymer layer 12 , as well as that between the electrically insulating layer 18 and the polymer layer 12 .
  • the electrical insulation is an indicator for the ease with which the flow of a current from the heat emitting body is blocked, and mainly on the basis of the material for the electrically insulating layer 18 .
  • the case of handling is an indicator for the case of handling when the sheet 11 is carried, and mainly depends on the adhesiveness of the polymer layer 12 . The lower the adhesiveness of the polymer layer 12 is, the easier the sheet 11 is to handle when carried, and thus, the sheet 11 is easy to handle.
  • the electrically insulating layer 18 is located between the heat emitting body 22 and the polymer layer 12 , and blocks the flow of a current from the heat emitting body 22 to the polymer layer 12 when the sheet 11 is attached to a heat emitting body 22 , for example.
  • the material for the electrically insulating layer 18 include thermoplastic resins, thermosetting resins and mixtures of these.
  • thermoplastic resins include polyethylene based resins, polypropylene based resins, polyacrylate based resins, polystyrene based resins, polyester based resins and polyurethane based resins.
  • thermosetting resins include silicone based resins, phenol based resins, epoxy based resins, melamine based resins and polyurethane based resins.
  • the outer shape of the electrically insulating layer 18 has the same size as the outer shape of the polymer layer 12 .
  • the thickness of the electrically insulating layer is preferably 12 ⁇ m or less, more preferably 2 ⁇ m to 12 ⁇ m. In the case where the thickness of the electrically insulating layer 18 exceeds 12 ⁇ m, there is a risk that the efficiency of thermal conduction from the heat emitting body 22 to the heat discharging body 25 may decrease, due to the excessive thickness of the electrically insulating layer 18 .
  • the thickness of the electrically insulating layer 18 is less than 2 ⁇ m, the strength of the electrically insulating layer 18 is low, and there is a risk that the electrically insulating layer 18 may be damaged when the sheet 11 is used (when compressed).
  • the sheet 11 is manufactured through the preparation step of preparing a composition, the orientation step of orienting the filler in fiber form 16 a in one direction, the formation step of forming a polymer layer 12 , the exposure step of exposing the filler in fiber form 16 a and the laminating step of laminating an adhesive layer 13 and an electrically insulating layer 18 on the polymer layer 12 in this order.
  • an adhesive layer 13 is layered on top of the outer surface 12 a of the polymer layer 12 , and after that, the electrically insulating layer 18 is layered on top of the adhesive layer 13 .
  • the sheet 11 When the sheet 11 is attached to the heat emitting body 22 and the heat discharging body 25 , the sheet 11 is placed on top of the heat emitting body 22 (for example an electronic device) provided on a substrate 21 , for example. At this time, the electrically insulating layer 18 faces the heat emitting body 22 . Subsequently, the heat discharging body 25 is mounted on the sheet 11 , and after that, a load is applied toward the heat emitting body 22 from the heat discharging body 25 so that the sheet 11 makes close contact with the heat emitting body 22 and the heat discharging body 25 , and thus, the sheet 11 is sandwiched between the heat emitting body 22 and the heat discharging body 25 .
  • the heat emitting body 22 for example an electronic device
  • the sheet 11 according to the present embodiment comprises a polymer layer 12 and an electrically insulating layer 18 layered on top of the polymer layer 12 via an adhesive layer 13 . Therefore, the sheet 11 accelerates thermal conduction from the heat emitting body 22 to the heat discharging body 25 through the polymer layer 12 , and thus, can provide excellent conductivity.
  • the thickness of the electrically insulating layer 18 is set to 12 ⁇ m or less, and thus, the thermal conductivity of the sheet 11 can be prevented from becoming low due to the electrically insulating layer 18 , of which the thermal conductivity is low in comparison with the polymer layer 12 .
  • the sheet 11 according to the present embodiment is provided with a polymer layer 12 , an adhesive layer 13 and a functional layer 19 formed on the adhesive layer 13 .
  • the functional layer 19 according to the present embodiment is formed of two layers, that is, a thermal diffusion layer 14 formed on the adhesive layer 13 and a conductive layer 17 formed on the thermal diffusion layer 14 .
  • the layers are in the order of: conductive layer 17 , thermal diffusion layer 14 , adhesive layer 13 , polymer layer 12 , from the bottom.
  • the sheet 11 is inserted between a heat emitting body 22 and a heat discharging body 25 , for example, for use, and accelerates thermal conduction from the heat emitting body 22 to the heat discharging body 25 .
  • the sheet 11 has a cooling function and electrical conductance, and is easy to handle.
  • the cooling function is an indicator for the ease with which the hot heat emitting body 22 is cooled, and based on the thermal conductivity of the polymer layer 12 and the properties of the thermal diffusion layer 14 in terms of thermal diffusion. That is to say, the cooling function is based on the thermal conductivity of the polymer layer 12 , the value of the thermal resistance of the polymer layer 12 , the adhesion between the heat discharging body 25 and the polymer layer 12 , as well as that between the thermal diffusion layer 14 and the polymer layer 12 , and the properties of the thermal diffusion layer 14 in terms of thermal diffusion.
  • the electrical conductance is an indicator for the ease with which a current flows from the heat emitting body 22 to the heat discharging body 25 having electrical conductance, and mainly based on the material of the conductive layer 17 .
  • the ease of handling is an indicator for the ease with which the sheet 11 can be handled when carried, and mainly based on the adhesiveness of the polymer layer 12 . The lower the adhesiveness of the polymer layer 12 , the easier the sheet 11 is to be handled when carried, and higher the handling ability of the sheet 11 .
  • the conductive layer 17 according to the present embodiment is formed in band form, and the two end portions of the conductive layer 17 are exposed from the thermal diffusion layer 14 .
  • the sheet 11 is manufactured through the preparation step of preparing a composition, the orientation step of orienting the filler in fiber form 16 a in one direction, the formation step of forming the polymer layer 12 , the exposure step of exposing the filler in fiber form 16 a and the laminating step of laminating the adhesive layer 13 , the thermal diffusion layer 14 and the conductive layer 17 on the polymer layer 12 in this order.
  • the adhesive layer 13 is layered on top of the outer surface 12 a of the polymer layer 12 , and after that, the thermal diffusion layer 14 and the conductive layer 17 are layered on the adhesive layer 13 in this order.
  • the sheet 11 When the sheet 11 is attached to the heat emitting body 22 and the heat discharging body 25 , the sheet 11 is mounted on the heat emitting body 22 (for example an electronic device) provided on the substrate 21 , for example. At this time, the conductive layer 17 faces the heat emitting body 22 . Subsequently, the heat discharging body 25 having electrical conductance is mounted on the sheet 11 , and after that, a load is applied toward the heat emitting body 22 from the heat discharging body 25 so that the sheet 11 makes close contact with the heat emitting body 22 and the heat discharging body 25 , and thus, the sheet 11 is sandwiched between the heat emitting body 22 and the heat discharging body 25 . In addition, the two end portions of the conductive layer 17 are made to make contact with the heat discharging body 25 .
  • the sheet 11 according to the present embodiment comprises the polymer layer 12 , the thermal diffusion layer 14 layered on top of the polymer layer 12 via the adhesive layer 13 , and the conductive layer 17 . Therefore, the sheet 11 allows heat from the heat emitting body 22 to diffuse through the thermal diffusion layer 14 and accelerates thermal conductance from the heat emitting body 22 to the heat discharging body 25 through the polymer layer 12 , and thus, can provide an excellent cooling function. Furthermore, the sheet 11 can allow the conductive layer 17 to prevent a problem from arising with the heat emitting body 22 due to ESD.
  • the two end portions of the conductive layer 17 are exposed. Therefore, the conductive layer 17 can be easily made to make contact with the heat discharging body 25 when the sheet 11 is attached to the heat emitting body 22 and the heat discharging body 25 .
  • the form of the polymer layer 12 , the thermal diffusion layer 14 , the conductive layer 17 and the electrically insulating layer 18 is not particularly limited, and these may be in a form other than quadrilateral plate form, for example, in disc form.
  • a viscous layer may be formed on the outer surface of a layer which is located on the outside, from among the layers forming the sheet 11 .
  • a viscous layer 26 in band form may be formed on the outer surface which does not face the adhesive layer 13 , between the pair of outer surfaces of the thermal diffusion layer 14 .
  • Specific examples of the material for the viscous layer 26 include the above described gluing agents. In this case, the viscous layer 26 is made to face the heat emitting body 22 while positioning the sheet 11 when the sheet 11 is attached to the heat emitting body 22 , for example.
  • the portion of the polymer layer 12 which corresponds to the viscous layer 26 is pressed toward the heat emitting body 22 with the fingertips, for example.
  • the viscous layer 26 becomes pasted to the heat emitting body 22 , due to its viscosity, and shifting of the sheet position can be prevented. Therefore, the sheet can be easily attached to the heat emitting body 22 .
  • an adhesive layer 13 in disc form may be formed in the four corners of the polymer layer 12 , or as shown in FIG. 9H , the adhesive layer 13 in band form may be formed in a peripheral portion of the polymer layer 12 .
  • the width of the adhesive layer 13 in square annular form may be changed appropriately.
  • the adhesive layer 13 may be formed in the center portion of the polymer layer 12 , it is preferable for it to be formed in the peripheral portion of the polymer layer 12 , and it is more preferable for it to be formed in annular form in the entire peripheral portion of the polymer layer 12 .
  • the amount of heat emitted from the center portion of the heat emitting body 22 is usually greater than the amount of heat emitted from the peripheral portion of the heat emitting body 22 , and therefore, the temperature of the center portion of the heat emitting body 22 is high in comparison with the peripheral portion.
  • the value of the thermal contact resistance in the peripheral portion of the polymer layer 12 attached to the heat emitting body 22 becomes high in comparison with the value of the thermal contact resistance in the center portion of the polymer layer 12 . Therefore, the center portion of the polymer layer 12 , of which the value of the thermal contact resistance is low in comparison with the peripheral portion, corresponds to the center portion of the heat emitting body 22 , of which the temperature is high in comparison with the peripheral portion, and thus, the thermal conductivity of the sheet 11 can be increased in comparison with the case where the adhesive layer 13 is formed in the center portion of the polymer layer 12 . Furthermore, the adhesive layer 13 is formed in annular form in the entire peripheral portion of the polymer layer 12 , and thus, the thin and flexible polymer layer 12 can be prevented from bending, as in the case where the adhesive layer 13 is formed in multi-dot form.
  • the peripheral portion of the polymer layer 12 is a region between the peripheral of the polymer layer 12 and 3 ⁇ 5 of the distance from the peripheral of the polymer layer 12 to the center.
  • the peripheral portion of the polymer layer 12 is in quadrilateral annular form with a width of 24 mm.
  • the peripheral portion of the polymer layer 12 is in annular form with a width of 12 mm.
  • the end portions of the filler in fiber form 16 a may not be exposed from the outer surfaces 12 a of the polymer layer 12 .
  • the filler in fiber form 16 a may not be oriented in one direction.
  • the sheet 11 may further comprise the functional layer of another embodiment. That is to say, the functional layer that forms the sheet 11 may have a number of layers having different working effects. In this case, a number of layers that form the functional layer may be formed only on one outer surface 12 a of the pair of outer surfaces 12 a of the polymer layer 12 , or the adhesive layer 13 may be formed on each outer surface 12 a of the polymer layer 12 , so that the adhesive layers are independently formed on the respective outer surfaces 12 a of the polymer layer 12 . In the case where the functional layer is formed of a number of layers, it is preferable for each layer to be thin, in order to prevent the value of the thermal contact resistance of the sheet from becoming high due to the thickness of the functional layer.
  • the heat discharging body 25 may be omitted.
  • the peripheral portion 17 a of the conductive layer 17 is connected to a member having electrical conductance, for example the housing, in the second embodiment.
  • heat can be released from the surface of the polymer layer 12 .
  • the outer shape of the thermal diffusion layer 14 may be the same as the outer shape of the polymer layer 12 , or smaller than the outer shape of the polymer layer 12 .
  • the sheet 11 may be placed on the heat emitting body 22 in such a manner that the polymer layer 12 faces the heat emitting body 22 when the sheet 11 is attached to the heat emitting body 22 , for example.
  • the heat discharging body 25 may not have electrical conductance.
  • the peripheral portion 17 a of the conductive layer 17 is connected to a member having electrical conductance, for example the housing.
  • Example 1-a in the preparation step, carbon fibers, which are the filler in fiber form 16 a , and alumina (aluminum oxide) in spherical form, which is the filler in particle form 16 b , were mixed into addition type liquid silicone (hereinafter referred to as liquid silicone gel), which is the polymer matrix 15 , so that a composition was prepared.
  • liquid silicone gel solidified into a gel form after hardening.
  • Table 1 shows the amount of each component mixed in.
  • the unit for the blending quantity of each component in is mass parts.
  • the viscosity of the liquid silicone gel at 25° C. was 400 mPa ⁇ s, and the specific weight of the liquid silicone gel was 1.0.
  • the average fiber diameter of the carbon fibers was 10 ⁇ m, and the average fiber length of the carbon fibers was 160 ⁇ m.
  • the average particle diameter of the alumina in spherical form was 3.2 ⁇ m.
  • the composition was stirred until the carbon fibers and alumina in spherical form were uniformly dispersed, and after that, bubbles were removed from the composition.
  • the viscosity of the composition at 25° C. was measured using a rotation viscometer, and after that, the die was filled with the composition.
  • Table 1 shows the results of measurement for the viscosity.
  • a superconductive magnet was used to apply a magnetic field having a magnetic flux density of 100,000 Gauss to the composition, and at the same time, compressed air was used to apply vibration with a frequency of 3.0 Hz and amplitude of 10 mm to the composition via the die, and thus, the carbon fibers were oriented in the direction of the thickness of the polymer layer.
  • the composition was heated at 120° C. for 90 minutes so that the liquid silicone gel hardened and the polymer layer 12 was obtained.
  • a rotational cutter was used to remove a hardened silicone having a thickness of 5 ⁇ m from the paired outer surfaces 12 a of the polymer layer 12 , and thus, the carbon fibers were exposed.
  • the thickness of the polymer layer 12 was 0.3 mm after the exposure step.
  • a silicone based adhesive was applied over the entirety of the outer surfaces 12 a of the polymer layer 12 in multi-dot form, and thus, the adhesive layer 13 in multi-dot form (thickness: 30 ⁇ m, diameter of each dot: 1.5 mm, interval between each dot: 7 mm) was formed.
  • the thermal diffusion layer 14 made of a graphite sheet (thickness: 130 ⁇ m, made by GrafTech International Ltd.) was layered on top of the polymer layer 12 via the adhesive layer 13 , so that the sheet 11 was gained.
  • the sheet 11 was obtained in the same manner as in Example 1-a, except that the thickness of the adhesive layer 13 was changed to 50 ⁇ m.
  • the sheet 11 was obtained in the same manner as in Example 1-a, except that the thickness of the adhesive layer 13 was changed to 60 ⁇ m.
  • the sheet 11 was obtained in the same manner as in Example 1-a, except that an adhesive layer 13 (thickness: 30 ⁇ m, length of sides: 10 mm) was formed in the four corners of the polymer layer 12 .
  • the sheet 11 was obtained in the same manner as in Example 1-a, except that the adhesive layer 13 (thickness: 30 ⁇ m, length of sides: 12 mm) was formed in the four corners of the polymer layer 12 .
  • the sheet 11 was obtained in the same manner as in Example 1-a, except that the adhesive layer 13 (thickness: 30 ⁇ m, length of sides: 5 mm) was formed in the four corners of the polymer layer 12 .
  • Examples 2-a to 2-f PBO carbon fibers were used as a filler in fiber form, and at the same time, the amount of each component mixed in was changed as shown in Table 1, and furthermore, the silicone was removed in the exposure step, through polishing using a mesh made of metal.
  • the polymer layer 12 was gained in the same manner as in Examples 1-a to 1-f.
  • the outer surfaces 12 a of the polymer layer 12 were observed through an electron microscope after the exposure step, it was confirmed that the PBO carbon fibers were exposed.
  • the thus gained polymer layer 12 was cut into quadrilateral plate form (length of sides: 40 mm).
  • the adhesive layer 13 was formed and the thermal diffusion layer 14 was layered on top of this, and thus, the sheet 11 was obtained.
  • Example 2-a the adhesive layer 13 was formed in the same manner as in Example 1-a
  • Example 2-b the adhesive layer 13 was formed in the same manner as in Example 1-b.
  • Example 3-a as shown in Table 4, the sheet 11 was gained in the same manner as in Example 1-a.
  • Example 3-b as shown in Table 4, the sheet 11 was obtained in the same manner as in Example 3-a, except that the thickness of the thermal diffusion layer 14 was changed to 80 ⁇ m.
  • Example 3-c the sheet 11 was obtained in the same manner as in Example 3-a except that the thickness of the thermal diffusion layer 14 was changed to 250 ⁇ m.
  • Example 3-d the sheet 11 was gained in the same manner as in Example 3-a, except that the thickness of the thermal diffusion layer 14 was changed to 375 ⁇ m.
  • Comparative Example 1-a a sheet was gained in the same manner as in Example 1-a, except that there was no adhesive layer 13 and thermal diffusion layer 14 .
  • Comparative Example 1-b a sheet was obtained in the same manner as in Example 1-a, except that the adhesive layer 13 was formed throughout the entirety of the outer surface 12 a of the polymer layer 12 .
  • Comparative Example 2-a a sheet was obtained in the same manner as in Example 2-a, except that there was no adhesive layer 13 and thermal diffusion layer 14 .
  • Comparative Example 2-b a sheet was obtained in the same manner as in Example 2-a, except that the adhesive layer 13 was formed throughout the entirety of the outer surface 12 a of the polymer layer 12 .
  • Test pieces in disc form (diameter: 10 mm, thickness: 0.3 mm) were obtained from the polymer layer 12 in each example, and after that, the thermal conductivity of the test pieces was measured in accordance with a laser flash method.
  • the test piece 27 made of the sheet in each example or comparative example and the heat discharging body 25 made of a metal were mounted on top of the heat emitting body 22 formed on a substrate 21 in this order, and a weight 28 of 10 kg was placed on the heat discharging body 25 , so that a load of 6.1 ⁇ 10 4 Pa was applied to the test piece 27 . Then, this was left for 10 minutes in such a state that the heat emitting body 22 was emitting heat, and after that, the temperature T 1 of the outer surface on the heat emitting body 22 side and the temperature T 2 of the outer surface on the heat discharging body 25 side in the test piece 27 were measured using the measuring machine 28 a .
  • the value of the thermal resistance of the test piece 27 was calculated using the following formula (1).
  • the heat emitting body 22 is usually an electronic part, such as a CPU, and a heater of which the amount of heat emitted is 100 W was used as the heat emitting body 22 in the present test, in order to simplify and expedite the evaluation of the performance of the sheet.
  • the value of the above described load indicates the size of the load usually applied to the sheet when the sheet is attached to an electronic part.
  • Value of thermal resistance (° C./ W ) ( T 1 (° C.) ⁇ T 2 (° C.))/amount of heat emitted ( W ) (1) Coefficient of Static Friction
  • a test piece 30 made of the polymer layer in each example was placed on the horizontal table 29 , and after that, the sliding piece 31 and the weight 28 of 120 g (columnar form, with a diameter of 28 mm and height of 25 mm) were placed on this test piece 30 in this order.
  • the push-pull gauge 33 (CPU gauge M-9500, made by Aikoh Engineering Co., Ltd.).
  • the push-pull gauge 33 was pulled in the direction parallel to the outer surface of the test piece 30 at a speed of 100 mm/min.
  • the static frictional force Fs (N) between the test piece and the sliding piece 31 when the push-pull gauge 33 is pulled was measured.
  • the coefficient of static friction was calculated using the following formula (2).
  • the measurement of the static frictional force Fs and the calculation of the coefficient of static friction were repeated five times for the polymer layer 12 in each example and comparative example, and the average value for these values of the coefficient of static friction was taken to be the coefficient of static friction of the polymer layer 12 .
  • two types of sliding pieces 31 a PET film (Lumirror S10, made by Toray Industries Inc., thickness: 75 ⁇ m) and an aluminum foil tape (Scotch Brand Tape 433 HD, made by Sumitomo 3M Limited) were used.
  • the aluminum foil tape was placed on the test piece 30 so that the aluminum foil surface of the tape faced the test piece 30 .
  • Coefficient of static friction Fs ( N )/ Fp ( N ) (2)
  • the adhesiveness of the polymer layer 12 in each example and comparative example was measured in accordance with JIS Z 0237. Concretely, as shown in FIG. 12 , the film 34 was secured to the surface of the horizontal table 29 , and after that, the test piece 30 in each example comparative example was placed on top of this. Then, one end of the test piece 30 was fixed to the load cell 35 of the tensile test machine. Then, the load when the test piece 30 is pulled and peeled along a line perpendicular to the horizontal table 29 at a speed of 300 mm/min was measured. Here, the measurement of the load for the test piece in each example comparative example was repeated five times, and the average value of these measured values was taken to be the adhesiveness of the polymer layer 12 .
  • the film 34 two types of film were used: a PET film (Lumirror S10, made by Toray Industries Inc., thickness: 75 ⁇ m) and an aluminum foil tape (Scotch Brand Tape 433 HD, made by Sumitomo 3M Limited).
  • the aluminum foil tape was secured to the horizontal table 29 so that the aluminum foil surface of the tape faced the test piece 30 .
  • the column “adhesiveness (for aluminum) (N/25 mm)” in Table 1 indicates the results of measurement for the adhesiveness in the case where the aluminum foil tape was used, while the column “adhesiveness (for PET) (N/25 mm)” indicates the results of measurement for the adhesiveness in the case where the PET film was used. In these columns, “-” indicates that the adhesiveness was too small to be measured in accordance with the above describe method.
  • the test piece 27 made of the sheet in each example comparative example was placed in the center of a ceramic heater (heat source) having sides of 10 mm, so that the polymer layer 12 made contact with the ceramic heater, and after that, the temperature of the test piece 27 was measured using a thermoviewer.
  • the voltage applied to the ceramic heater was set to 10 V.
  • Tables 2 to 4 In the column “properties in terms of thermal diffusion” in Tables 2 to 4, “o” indicates that the heat from the heat source diffused throughout approximately the entirety of the test piece 27 , and “x” indicates that the heat from the heat source was concentrated in a portion of the test piece 27 .
  • FIG. 13A shows the results of measurement for the temperature of the test piece 27 in Example 1-a
  • FIG. 13B shows the results of measurement for the temperature of the test piece 27 in Comparative Example 1-a.
  • Example 2 Liquid silicone (amount mixed in) 100 100 Carbon fibers 120 120 Average fiber length ( ⁇ m) 160 200 Alumina 475 500 Viscosity (25° C., 1.0 rpm) mPa ⁇ s 600,000 1,100,000 Magnetic field Yes Yes Vibration Frequency: 3.0 Hz Frequency: 3.0 Hz Amplitude: 10 mm Amplitude: 10 mm Exposure step Yes Yes Filler in fiber form in crosswise direction (%) 70 70 Ease of handling ⁇ ⁇ Thermal conductivity (W/m ⁇ K) 30 50 Coefficient of static friction (for aluminum) 0.134 0.129 Coefficient of static friction (for PET) 0.170 0.166 Adhesiveness (for aluminum) (N/25 mm) — — Adhesiveness (for PET) (N/25 mm) — — —
  • the value of the thermal resistance for the sheets 11 according to Examples 1-a and 2-a were each lower than the value of the thermal resistance for the sheets 11 according to Examples 1-c and 2-c. That is to say, the thickness of the adhesive layers 13 in Examples 1-c and 2-c was as great as 60 ⁇ m, and therefore, the value of the thermal contact resistance was higher than for the sheets 11 in Examples 1-a and 2-a.
  • the value of the thermal resistance for the sheets 11 in Examples 1-d and 2-d were each lower than the value of the thermal resistance for the sheets 11 in Examples 1-f and 2-f.
  • the ratio of the area of the polymer layer 12 occupied by the adhesive layer 13 to the area of the entirety of one outer surface 12 a to which the adhesive layer 13 is attached was high in Examples 1-d and 2-d in comparison with Examples 1-f and 2-f, respectively.
  • the adhesive layer 13 is formed in the peripheral portion of the polymer layer 12 , and thus, it was found that the value of the thermal contact resistance of the sheet 11 can be decreased in comparison with the case where the adhesive layer 13 is formed in the center portion of the polymer layer 12 .
  • Comparative Examples 1-a and 2-a there was no thermal diffusion layer 14 , and therefore, the properties in terms of thermal diffusion received a low evaluation.
  • the adhesive layer 13 was formed throughout the entirety of the polymer layer 12 , and therefore, the value of the thermal contact resistance for the sheet became high.
  • heat did not diffuse in Comparative Example 1-a, and the temperature in the center portion was 200° C. or higher.
  • Example 4-a as shown in Table 5, the sheet 11 was obtained in the same manner as in Example 3-a, except that the thermal diffusion layer 14 was changed to the conductive layer 17 made of an aluminum foil (thickness: 12 ⁇ m).
  • Example 4-b as shown in Table 5, the sheet 11 was obtained in the same manner as in Example 4-a, except that the aluminum foil was changed to a copper foil (thickness: 8 ⁇ m).
  • Example 4-c as shown in Table 5, the sheet 11 was obtained in the same manner as in Example 4-a, except that the aluminum foil was changed to a copper foil (thickness: 12 ⁇ m).
  • Example 4-d as shown in Table 5, the sheet 11 was obtained in the same manner as in Example 4-a, except that the aluminum foil was changed to a copper foil (thickness: 18 ⁇ m).
  • the volume resistivity ( ⁇ cm) of the conductive layer 17 in the sheet 11 was measured using a resistivity meter (MCP-T500, made by Dia Instruments Co., Ltd.) in accordance with JIS K 7194.
  • the sheet 11 in each example had excellent thermal conductivity and electrical conductivity.
  • the sheet 11 in each example had a low adhesiveness on the polymer layer 12 , and thus, was very easy to handle.
  • Example 5-a as shown in Table 6, the sheet 11 was obtained in the same manner as in Example 3-a, except that the thermal diffusion layer 14 was changed to the electrically insulating layer 18 made of a PET film (thickness: 5 ⁇ m).
  • Example 5-b as shown in Table 6, the sheet 11 was obtained in the same manner as in Example 3-a, except that the PET film was changed to a polyolefin film (thickness: 12 ⁇ m).
  • Example 5-c as shown in Table 6, the sheet 11 was obtained in the same manner as in Example 3-a, except that the PET film was changed to a PVC film (thickness: 5 ⁇ m).
  • Comparative Example 5-a as shown in Table 6, a sheet was obtained in the same manner as in Example 5-a, except that the adhesive layer 13 (thickness: 10 ⁇ m) was formed throughout the entirety of the outer surface of the polymer layer 12 .
  • the dielectric breakdown voltage (kV) of the sheet was measured using a withstand voltage testing machine (TOS8650, made by Kikusui Electronics Corporation) in accordance with JIS C 2110 (IEC 243, which is an international standard).
  • TOS8650 made by Kikusui Electronics Corporation
  • JIS C 2110 IEC 243, which is an international standard.
  • the dielectric breakdown voltage indicates the voltage when a current flows through an electrical insulating sample when the sample is sandwiched between two electrodes and then the voltage is gradually increased to such a point that the current increases dramatically and a portion of the sample is melted and carbonized, or a hole is created.
  • the sheet 11 in each example had excellent thermal conductivity and electrical insulating properties.
  • the sheet 11 in each example had a low adhesiveness for the polymer layer 12 , and thus, was very easy to handle.
  • the adhesive layer 13 is formed throughout the entirety of the polymer layer 12 , and therefore, the value of the thermal resistance became high.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Surface Heating Bodies (AREA)
US12/079,399 2007-03-29 2008-03-26 Thermally conductive sheet and method of manufacturing the same Active 2031-12-30 US8691368B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007089859A JP5140302B2 (ja) 2007-03-29 2007-03-29 熱伝導性シート
JP2007-089859 2007-03-29

Publications (2)

Publication Number Publication Date
US20080241488A1 US20080241488A1 (en) 2008-10-02
US8691368B2 true US8691368B2 (en) 2014-04-08

Family

ID=39540773

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/079,399 Active 2031-12-30 US8691368B2 (en) 2007-03-29 2008-03-26 Thermally conductive sheet and method of manufacturing the same

Country Status (6)

Country Link
US (1) US8691368B2 (zh)
EP (1) EP1976005B1 (zh)
JP (1) JP5140302B2 (zh)
KR (1) KR100990693B1 (zh)
CN (1) CN101309576B (zh)
TW (1) TWI384937B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120218713A1 (en) * 2008-11-14 2012-08-30 Fujitsu Limited Heat radiation material, electronic device and method of manufacturing electronic device
US20130134574A1 (en) * 2011-11-25 2013-05-30 Fujitsu Semiconductor Limited Semiconductor device and method for fabricating the same

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100031501A1 (en) * 2008-08-08 2010-02-11 Napra Co., Ltd. Method for filling through hole or non-through hole formed on board with filler
CN101989583B (zh) * 2009-08-05 2013-04-24 清华大学 散热结构及使用该散热结构的散热系统
KR101130087B1 (ko) * 2010-01-18 2012-03-28 수퍼나노텍(주) 열전도패드 및 그 제조방법
JP5088396B2 (ja) * 2010-05-20 2012-12-05 株式会社村田製作所 Ｅｓｄ保護デバイス及びその製造方法
JP2012023335A (ja) * 2010-06-17 2012-02-02 Sony Chemical & Information Device Corp 熱伝導性シート及びその製造方法
TWI610407B (zh) * 2010-06-17 2018-01-01 Dexerials Corp 導熱片及其製造方法
JP2012046723A (ja) * 2010-07-30 2012-03-08 Nitto Denko Corp アプリケーションテープ
DE112011103795B4 (de) * 2010-11-17 2018-03-22 Lg Hausys, Ltd. Wärmeabführungsfilm sowie Batterieanordnung, Batteriemodul und Außengehäuse mit Wärmeabführungs- und Wärmeabstrahlungsfunktionen
JP5788760B2 (ja) * 2011-10-19 2015-10-07 日東電工株式会社 熱伝導性シート、ｌｅｄ実装用基板およびｌｅｄモジュール
CN102651961B (zh) * 2012-05-29 2016-02-03 安顿雷纳(上海)纤维材料科技有限公司 一种导热散热界面材料及其制造方法
TWI464250B (zh) * 2012-12-22 2014-12-11 Ind Tech Res Inst 具熱擴散片之電子裝置
KR101473708B1 (ko) * 2013-02-21 2014-12-19 엠케이전자 주식회사 두께 방향으로 우수한 열전도 특성을 갖는 방열판의 제조방법과 이 방법에 의해 제조된 방열판
JP6186933B2 (ja) * 2013-06-21 2017-08-30 富士通株式会社 接合シート及びその製造方法、並びに放熱機構及びその製造方法
US9353245B2 (en) 2014-08-18 2016-05-31 3M Innovative Properties Company Thermally conductive clay
KR20160070243A (ko) * 2014-12-09 2016-06-20 (주)엘지하우시스 방열시트
ES2914973T3 (es) 2015-03-05 2022-06-20 Henkel Ag & Co Kgaa Adhesivo termoconductor
CN106158666A (zh) * 2015-04-02 2016-11-23 明安国际企业股份有限公司 高导热组件的制作方法
TW201704008A (zh) * 2015-05-29 2017-02-01 漢高智慧財產控股公司 用於熱管理之系統及其使用方法
CN107851623B (zh) * 2015-06-25 2021-04-16 积水保力马科技株式会社 导热片
JP6501075B2 (ja) 2016-02-24 2019-04-17 パナソニックＩｐマネジメント株式会社 樹脂構造体とその構造体を用いた電子部品及び電子機器
CN106584965B (zh) * 2016-12-23 2018-08-31 北京航空航天大学 一种高导热碳纤维复合材料及其制备方法和应用
US10834854B2 (en) 2017-02-28 2020-11-10 Northeastern University Methods for the manufacture of thermal interfaces, thermal interfaces, and articles comprising the same
ES2956260T3 (es) 2018-06-22 2023-12-18 Sekisui Polymatech Co Ltd Lámina térmicamente conductora
CN112715059B (zh) * 2018-09-26 2024-09-06 积水保力马科技株式会社 导热片
JP6862601B1 (ja) * 2019-12-27 2021-04-21 デクセリアルズ株式会社 熱伝導性シート及びその製造方法、熱伝導性シートの実装方法
JP6817408B1 (ja) * 2019-12-27 2021-01-20 デクセリアルズ株式会社 熱伝導性シート及びその製造方法、熱伝導性シートの実装方法
KR20220030259A (ko) * 2020-05-15 2022-03-10 데쿠세리아루즈 가부시키가이샤 열전도성 시트 및 열전도성 시트의 제조 방법
CN114007370A (zh) * 2020-07-27 2022-02-01 杜邦电子公司 用于电子设备的散热器

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0453764A1 (en) 1990-04-27 1991-10-30 International Business Machines Corporation Thermal joint
TW345667B (en) 1996-09-09 1998-11-21 Tokiin Corp High thermal conductivity composite magnetic substance
JP2001110965A (ja) 1999-10-07 2001-04-20 Fujikura Ltd 高熱伝導性粘着シート
JP2001294676A (ja) * 2000-04-13 2001-10-23 Jsr Corp 熱伝導性シート、熱伝導性シートの製造方法および熱伝導性シートを用いた放熱構造
US6311769B1 (en) * 1999-11-08 2001-11-06 Space Systems/Loral, Inc. Thermal interface materials using thermally conductive fiber and polymer matrix materials
JP2002305271A (ja) 2001-04-06 2002-10-18 Shin Etsu Chem Co Ltd 電子部品の放熱構造体及びそれに用いる放熱シート
JP2003168882A (ja) 2001-11-30 2003-06-13 Sony Corp 熱伝導性シート
US20030129352A1 (en) * 2001-12-27 2003-07-10 Kouya Takahashi Method for cooling electronic components and thermally conductive sheet for use therewith
US20030207128A1 (en) * 2000-04-10 2003-11-06 Tomoaki Uchiya Thermally conductive sheet
JP2004243650A (ja) 2003-02-13 2004-09-02 Suzuki Sogyo Co Ltd 熱伝導性シート
TW200508283A (en) 2003-08-01 2005-03-01 Byeong-Yeon Choi Heat discharging system using silicone rubber
JP2005057088A (ja) 2003-08-05 2005-03-03 Agilent Technol Inc 多層構造の熱伝導部材、および、それを用いた電子機器
TW200520674A (en) 2003-11-12 2005-06-16 Polymatech Co Ltd Thermally conductive body and method of manufacturing the same
US20070001292A1 (en) 2005-06-30 2007-01-04 Polymatech Co., Ltd. Heat radiation member and production method for the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6517744B1 (en) * 1999-11-16 2003-02-11 Jsr Corporation Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure
JP2005060594A (ja) * 2003-08-18 2005-03-10 Polymatech Co Ltd 粘着層付熱伝導性シート
KR20050019232A (ko) * 2003-08-18 2005-03-03 자화전자 주식회사 방열시트 및 그 제조방법
JP4225945B2 (ja) * 2004-05-17 2009-02-18 富士高分子工業株式会社 熱伝導性シート

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0453764A1 (en) 1990-04-27 1991-10-30 International Business Machines Corporation Thermal joint
TW345667B (en) 1996-09-09 1998-11-21 Tokiin Corp High thermal conductivity composite magnetic substance
JP2001110965A (ja) 1999-10-07 2001-04-20 Fujikura Ltd 高熱伝導性粘着シート
US6311769B1 (en) * 1999-11-08 2001-11-06 Space Systems/Loral, Inc. Thermal interface materials using thermally conductive fiber and polymer matrix materials
US20030207128A1 (en) * 2000-04-10 2003-11-06 Tomoaki Uchiya Thermally conductive sheet
JP2001294676A (ja) * 2000-04-13 2001-10-23 Jsr Corp 熱伝導性シート、熱伝導性シートの製造方法および熱伝導性シートを用いた放熱構造
JP2002305271A (ja) 2001-04-06 2002-10-18 Shin Etsu Chem Co Ltd 電子部品の放熱構造体及びそれに用いる放熱シート
JP2003168882A (ja) 2001-11-30 2003-06-13 Sony Corp 熱伝導性シート
US20030129352A1 (en) * 2001-12-27 2003-07-10 Kouya Takahashi Method for cooling electronic components and thermally conductive sheet for use therewith
JP2004243650A (ja) 2003-02-13 2004-09-02 Suzuki Sogyo Co Ltd 熱伝導性シート
TW200508283A (en) 2003-08-01 2005-03-01 Byeong-Yeon Choi Heat discharging system using silicone rubber
JP2005057088A (ja) 2003-08-05 2005-03-03 Agilent Technol Inc 多層構造の熱伝導部材、および、それを用いた電子機器
TW200520674A (en) 2003-11-12 2005-06-16 Polymatech Co Ltd Thermally conductive body and method of manufacturing the same
US20070001292A1 (en) 2005-06-30 2007-01-04 Polymatech Co., Ltd. Heat radiation member and production method for the same
JP2007012911A (ja) 2005-06-30 2007-01-18 Polymatech Co Ltd 放熱部品及びその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Machine Translation of JP 20011294676. *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120218713A1 (en) * 2008-11-14 2012-08-30 Fujitsu Limited Heat radiation material, electronic device and method of manufacturing electronic device
US8958207B2 (en) * 2008-11-14 2015-02-17 Fujitsu Limited Heat radiation material, electronic device and method of manufacturing electronic device
US20130134574A1 (en) * 2011-11-25 2013-05-30 Fujitsu Semiconductor Limited Semiconductor device and method for fabricating the same

Also Published As

Publication number Publication date
EP1976005A2 (en) 2008-10-01
TW200913864A (en) 2009-03-16
US20080241488A1 (en) 2008-10-02
CN101309576B (zh) 2013-04-03
JP2008251747A (ja) 2008-10-16
JP5140302B2 (ja) 2013-02-06
EP1976005B1 (en) 2011-06-15
CN101309576A (zh) 2008-11-19
KR20080088531A (ko) 2008-10-02
EP1976005A3 (en) 2009-10-28
TWI384937B (zh) 2013-02-01
KR100990693B1 (ko) 2010-10-29

Similar Documents

Publication Publication Date Title
US8691368B2 (en) Thermally conductive sheet and method of manufacturing the same
US9961809B1 (en) Heat radiation sheet and method for manufacturing of the same
CN106796926B (zh) 导热片、导热片的制造方法、放热部件和半导体装置
CN101277601B (zh) 积层体
JP6064898B2 (ja) 絶縁熱伝導シートの製造方法
JP4814680B2 (ja) 熱伝導性シート及び熱伝導性シート包装体
TW201535807A (zh) 熱傳導性接著片、其製造方法及使用此的電子裝置
KR102012762B1 (ko) 전자파 차폐 및 방열복합시트 및 이의 제조방법
EP3671827A1 (en) Composite member
EP2944670B1 (en) Inorganic filler-containing epoxy resin cured product and laminate including the same
US20190390926A1 (en) Heat-dissipating sheet
JP3599634B2 (ja) イオン注入機用静電チャック
JP7232996B2 (ja) 電子部品搭載基板および電子機器
CN112805825B (zh) 带剥离片的绝缘散热片
CN109207084B (zh) 电磁波屏蔽及散热复合片及其制备方法
KR102012275B1 (ko) 전자파 차폐 및 방열복합시트 및 이의 제조방법
KR101920706B1 (ko) 절연성 방열 무기재 테이프 및 이의 제조방법
KR101874959B1 (ko) 방열 그래핀 시트 및 이의 제조방법
KR20190016417A (ko) 열전도 시트 및 그 제조방법
KR20010085173A (ko) 열전도성 부재
KR20230023525A (ko) 열전도성 인터페이스 점착시트
KR102068493B1 (ko) 열확산 시트 및 그 제조방법
KR102261555B1 (ko) 전자파 차폐와 방열을 위한 복합시트 및 이를 포함하는 디스플레이 장치
KR102502563B1 (ko) 저주파 안테나용 방열 시트, 이의 제조방법 및 이를 포함하는 전자기기
JP2010056467A (ja) 搬送用治具

Legal Events

Date Code Title Description
AS Assignment

Owner name: POLYMATECH CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:OHTA, MITSURU;OZAWA, MOTOKI;OKABAYASHI, YOSHIAKI;REEL/FRAME:020981/0138

Effective date: 20080318

AS Assignment

Owner name: POLYMATECH JAPAN CO., LTD., JAPAN

Free format text: CHANGE OF NAME;ASSIGNOR:PT ESTABLISHMENT PREPARATION CO., LTD.;REEL/FRAME:032265/0582

Effective date: 20121228

Owner name: PT ESTABLISHMENT PREPARATION CO., LTD., JAPAN

Free format text: AGREEMENT;ASSIGNOR:POLYMATECH CO., LTD;REEL/FRAME:032264/0877

Effective date: 20121228

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551)

Year of fee payment: 4

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 8