TW201704008A - 用於熱管理之系統及其使用方法 - Google Patents
用於熱管理之系統及其使用方法 Download PDFInfo
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- TW201704008A TW201704008A TW105115601A TW105115601A TW201704008A TW 201704008 A TW201704008 A TW 201704008A TW 105115601 A TW105115601 A TW 105115601A TW 105115601 A TW105115601 A TW 105115601A TW 201704008 A TW201704008 A TW 201704008A
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Classifications
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- C09K5/02—Materials undergoing a change of physical state when used
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Abstract
根據本發明,提供熱分散物件、含有其之總成、其製備方法及其各種用途。在本發明之一態樣中,提供熱分散物件。在本發明之另一態樣中,提供用於產生上文所提及物件之方法。在本發明之又一態樣中,提供含有該等上文所提及物件之總成。在本發明之又一態樣中,提供用於製造該等上文所提及總成之方法。在又一態樣中,提供耗散由可攜式電子裝置所產生熱之方法。
Description
本發明係關於熱分散物件、含有其之總成、其製備方法及其各種用途。在一態樣中,本發明係關於熱分散物件。在另一態樣中,本發明係關於用於產生本發明物件之方法。在又一態樣中,本發明係關於含有本發明物件之總成。在又一態樣中,本發明係關於用於製造本發明總成之方法。在又一態樣中,本發明係關於耗散由諸如可攜式電子裝置等電子裝置所產生熱之方法。
電子裝置、尤其可攜式電子裝置(例如,智慧型電話、iPod、平板電腦、手持醫療裝置、遊戲系統及諸如此類)現已成為日常生活之部分。由於對速度及附加功能之需求迅速擴大,由此等裝置所產生之熱顯著增加。然而,由於可用於耗散熱之較小表面積,此等裝置傾向於變得愈來愈熱受限。
主動冷卻通常不適用於此等裝置,此乃因(例如)空間限制、關於冷卻裝置之可靠性之問題、藉此產生之噪音等。作為一可能解決方案,提議使用相變材料(PCM)。基本上,使用具有相當高延遲(latency)之PCM,使得PCM在能夠管理重度使用期間所產生之一些過量電力之溫度範圍內熔融;所得熔融之PCM可在輕度使用期間再固化,藉此可提供所需性能之加強。
遺憾地,習用PCM(例如,蠟、油及諸如此類)通常具有極低導熱率(約0.2W/mK);因此,此等材料傾向於用作絕熱體。由於可攜式電子裝置之大小及體積限制,故PCM通常直接置於熱傳遞通路內且與其他包裝/傳熱組件共用空間,此在熱管理設計中產生嚴重困境。另外,為達成基於PCM之熱解決方案之優點,PCM必須能遍及其全部體積快速吸熱,此要求PCM具有高導熱性。
由於上文所提及之限制,目前不存在針對諸如可攜式電子裝置等電子裝置之實用的基於PCM之熱解決方案。
根據本發明,提供熱分散物件、含有其之總成、其製備方法及其各種用途。在本發明之一態樣中,提供熱分散物件。在本發明之另一態樣中,提供用於產生上文所提及物件之方法。在本發明之又一態樣中,提供含有上文所提及物件之總成。在本發明之又一態樣中,提供用於製造上文所提及總成之方法。在又一態樣中,提供耗散由可攜式電子裝置所產生熱之方法。
本發明物件包含經相變材料(PCM)浸漬之導熱性矮型(low-profile)結構,其中該(等)導熱性矮型結構夾在第一與第二傳導性/保護性層之間。
10‧‧‧第一物件
12‧‧‧第一傳導性/保護性層
14‧‧‧多孔導熱性矮型結構之層
16‧‧‧第一壓感黏合層
18‧‧‧第二傳導性/保護性層
19‧‧‧第二壓感黏合層
20‧‧‧第二實例性物件
22‧‧‧第一傳導性/保護性層
24‧‧‧第一壓感黏合層
26‧‧‧多孔導熱性矮型結構之層
27‧‧‧第二壓感黏合層
28‧‧‧第二傳導性/保護性層
29‧‧‧第三壓感黏合層
30‧‧‧第三實例性物件
32‧‧‧第一傳導性/保護性層
34‧‧‧第一壓感黏合層
36‧‧‧多孔導熱性矮型結構
37‧‧‧第二壓感黏合層
38‧‧‧第二傳導性/保護性層
39‧‧‧支撐層
40‧‧‧第三壓感黏合層
圖1係本發明之實例性第一物件(10),該物件包含:第一傳導性/保護性層(12)(即,「25μm Cu」),多孔導熱性矮型結構之至少一層(14)(具有約100μm至最高約200μm之厚度),其經足夠量之經調配之相變材料(PCM)浸漬以使得實質上覆蓋該多孔導熱性矮型結構之表面及空隙(即,「150μm網+PCM」;此層可係單層或複數個網層之堆疊,其中網層中之每一者均經足夠量之經調配之PCM浸漬以使得實質上覆蓋其表面及空隙),
第一壓感黏合層(16)(即,「10μm psa/epsa」),第二傳導性/保護性層(18)(即,「25μm Cu」)及第二壓感黏合層(19)(即,「10μm psa/epsa」)。
圖2顯示本發明之第二實例性物件(20),該物件包含:第一傳導性/保護性層(22)(即,「25μm Cu」),第一壓感黏合層(24)(即,「10μm epsa」),3個多孔導熱性矮型結構層(26),其中各層經足夠量之經調配之相變材料(PCM)浸漬以使得實質上覆蓋該多孔導熱性矮型結構之表面及空隙(即,3×「50μm網+PCMI」),第二壓感黏合層(27)(即,「10μm psa/epsa」),第二傳導性/保護性層(28)(即,「25μm石墨」)及第三壓感黏合層(29)(即,「10μm psa/epsa」)。
圖3顯示本發明之第三實例性物件(30),該物件包含:第一傳導性/保護性層(32)(即,「25μm Cu」),第一壓感黏合層(34)(即,「10μm psa」),多孔導熱性矮型結構(36),其經足夠量之經調配之相變材料(PCM)浸漬以使得實質上覆蓋其表面及空隙(即,「225μm網與PCM」),第二壓感黏合層(37)(即,「10μm psa/epsa」),第二傳導性/保護性層(38)(即,「40μm石墨」),支撐層(39)(即,「5μm PET」)及第三壓感黏合層(40)(即,「10μm psa/epsa」)。
根據本發明,提供熱分散物件,其包含:第一傳導性/保護性層,一或多個多孔導熱性矮型結構,其經足夠量之經調配之相變材
料(PCM)浸漬以使得實質上覆蓋該多孔導熱性矮型結構之表面及空隙,其中該經調配之PCM包含含有與該PCM混合之5-20重量%之膠凝劑之該PCM,及第二傳導性/保護性層,其中該(等)一或多個多孔導熱性矮型結構夾在該等第一與第二傳導性/保護性層之間,且其中該物件具有:至少100J/cc之延遲及至少10W/mK之有效導熱率。
多種傳導性/保護性層預期可用於本文。實例性傳導性/保護性層包括銅箔、銅網(例如,擴張或織造網)、銅布(例如,擴張或織造布)、銅發泡體、鋁箔、鋁網(例如,擴張或織造網)、鋁布(例如,擴張或織造布)、鋁發泡體、石墨薄片及諸如此類。
預期可用作本文傳導性/保護性層之實例性箔材料包括具有在約10μm至最高約200μm範圍內厚度之材料;預期可用作本文之傳導性/保護性層之實例性網/布材料包括具有在約60線/英吋至最高約200線/英吋範圍內之網大小之材料;預期可用作本文傳導性/保護性層之實例性發泡體材料包括由實心支柱之互連網絡組成之多孔結構或開孔發泡體;與肥皂泡或啤酒泡沫一樣,形成發泡體之原始氣泡係類似大小之氣泡之三維、較佳堆疊陣列,其中各氣泡針對最小表面積及表面能具有最大體積;且預期可用作本文傳導性/保護性層之實例性薄片材料包括具有在約20孔/英吋2至最高約40孔/英吋2範圍內之孔徑及在約3%至最高12%範圍內之相對密度之材料。
多種多孔導熱性矮型結構可用於本發明實踐中,例如、銅網、銅布、銅發泡體、鋁網、鋁布、鋁發泡體及諸如此類。
預期可用於本文之多孔導熱性矮型結構通常具有約50μm至最高約1mm範圍內之厚度。在一些實施例中,多孔導熱性矮型結構之厚度落入150至200μm範圍內。
預期可用於本文之多孔導熱性矮型結構可進一步參考其「面積開孔率」及/或「體積開孔率」來表徵。如本文所用之「面積開孔率」係指接受相變材料潤濕之多孔導熱性矮型結構之表面相對於不接受相變材料潤濕之多孔導熱性矮型結構之表面之百分比。類似地,「體積開孔率」係指接受相變材料潤濕之多孔導熱性矮型結構之內部體積之部分相對於不接受相變材料潤濕之多孔導熱性矮型結構之內部體積之部分。
預期可用於本文之多孔導熱性矮型結構通常具有約40%至最高約70%範圍內之面積開孔率;及約60%至最高約95%範圍內之體積開孔率。在一些實施例中,預期可用於本文之多孔導熱性矮型結構通常具有約50%至最高約60%範圍內之面積開孔率;在一些實施例中,預期可用於本文之多孔導熱性矮型結構通常具有約60%之面積開孔率。在一些實施例中,預期可用於本文之多孔導熱性矮型結構通常具有約70%至最高約85%範圍內之體積開孔率;在一些實施例中,預期可用於本文之多孔導熱性矮型結構通常具有約85%之面積開孔率。
預期可用於本文之實例性網/布材料可表徵為擴張或織造網;且預期可用於本文之實例性發泡體材料可表徵為開孔低密度發泡體。
在一些實施例中,預期可用於本文之多孔導熱性矮型結構包含具有約30%至最高約60%範圍內之面積開孔率之絲網。
可藉由混合5重量%至20重量%之膠凝劑與相變材料來製備預期可用於本文之經調配PCM。在一些實施例中,可藉由混合10重量%之膠凝劑與相變材料來製備經調配PCM。
預期可用於本文之實例性相變材料包括:
具有下式之石蠟:CnH2n+2,其中n落入約20至最高40範圍內,具有下式之脂肪酸:CH3(CH2)2nCOOH,其具有相似熔融溫度範圍
及諸如此類,以及其任兩者或更多者之混合物。
在一些實施例中,相變材料具有低於使用可攜式電子裝置之天然環境之最終平衡溫度不超過約20℃之熔融溫度。在一些實施例中,相變材料具有低於使用可攜式電子裝置之天然環境之最終平衡溫度不超過約15℃之熔融溫度。在一些實施例中,相變材料具有低於使用可攜式電子裝置之天然環境之最終平衡溫度不超過約10℃之熔融溫度。
預期可用於本文之實例性膠凝劑包括聚合蠟膠凝劑、嵌段共聚物膠凝劑、高表面積無機顏料/填充劑(例如,蒙脫石、矽藻土、膨脹/剝落石墨)、定形石蠟/HDPE(高密度聚乙烯)複合物及諸如此類。
預期可用於本文之實例性嵌段共聚物膠凝劑包括JSR(JSR Corporation)Dynaron 6360B(烯烴結晶性乙烯、丁烯-烯烴結晶性嵌段共聚物(CEBC)或結晶性嵌段-(乙烯/丁烯)-結晶性嵌段共聚物(CEBC)、Kraton SBS(苯乙烯-丁烯-苯乙烯嵌段共聚物)、Kraton SEBS(苯乙烯-乙烯/丁烯-苯乙烯嵌段共聚物)及諸如此類。
在一些實施例中,本發明物件之經調配之PCM遍及多孔導熱性矮型結構之厚度實質上均勻膠凝化。
用於浸漬多孔導熱性矮型結構之經調配之PCM之厚度通常係多孔導熱性矮型結構之厚度之1-2倍。
視情況,用於本發明實踐之PCM可經囊封。可達成此囊封之一種方式係藉由以下來進行:使用該經調配之PCM浸漬該多孔導熱性矮型結構,及然後將該經浸漬之多孔導熱性矮型結構經由壓感黏合(PSA)層與導熱
薄片層壓在一起,此防止PCM洩漏。
預期用於本發明之此實施例中之導熱薄片通常具有25μm至500μm範圍內之厚度。
或者,當導熱薄片係石墨薄片時,此等構築體通常具有25μm至70μm範圍內之厚度。
為使本發明物件自可攜式電子裝置有效耗散熱,此等物件將通常具有至少100J/cc之延遲。在一些實施例中,本發明物件將具有至少240J/cc之延遲。
本發明物件可進一步關於其有效導熱率來定義。在一些實施例中,導熱率係至少10W/mK。在一些實施例中,導熱率係>50W/mK。
根據本發明之另一實施例,提供熱分散總成,其包含:5μm至20μm厚度之第一壓感黏合層,具有約17μm至500μm範圍內厚度之傳導性基底層;25μm至150μm之本發明多孔導熱性矮型結構,5μm至10μm厚度之第二壓感黏合層,25μm至50μm厚度之導熱性/保護性層及5μm至10μm厚度之電絕緣層。
預期可用於本文之壓感黏合層包括與適宜增黏劑(例如,松香酯)複合之彈性體(例如,丙烯酸酯)及諸如此類。PSA可自丙烯酸聚合物製造,例如具有以下組成之彼等丙烯酸聚合物或可藉由聚合以下來製備之彼等丙烯酸聚合物:(i)丙烯酸單體,其為下式之丙烯酸或甲基丙烯酸衍生物(例如甲基丙烯酸酯):CH2=CH(R1)(COOR2),其中:
R1係H或CH3且R2係C1-20、較佳C1-8烷基鏈及(ii)具有側接反應性官能基之單體,其在本文下文中更詳細闡述,且單體(ii)之量係每100g丙烯酸聚合物約0.001至約0.015當量。
對於聚合製程,組份(i)及(ii)之單體(若適當)藉由自由基聚合轉化為丙烯酸聚合物。根據D.Satas,「Handbook of Pressure Sensitive Adhesive Technology」,van Nostrand,NY(1989),單體係經選擇使得所得聚合物可用於製備PSA。
用作單體混合物(i)之組份之丙烯酸酯及/或甲基丙烯酸酯之實例包括丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸乙酯、甲基丙烯酸甲酯、丙烯酸正丁酯、甲基丙烯酸正丁酯、丙烯酸正戊酯、丙烯酸正己酯、丙烯酸正庚酯及丙烯酸正辛酯、丙烯酸正壬酯、甲基丙烯酸月桂酯、丙烯酸環己酯及具支鏈(甲基)丙烯酸異構物,例如丙烯酸異丁酯、甲基丙烯酸異丁酯、甲基丙烯酸正丁酯、丙烯酸2-乙基己酯、甲基丙烯酸十八酯及丙烯酸異辛酯。
實例性丙烯酸單體混合物(i)具有小於0℃之Tg值及約10,000g/mol至約2,000,000g/mol、例如介於50,000g/mol與1,000,000g/mol之間且期望地介於100,000g/mol與700,000g/mol之間之重量平均分子量。混合物(i)可係單一單體,前提係其具有小於0℃之均聚物Tg。
適宜單體(ii)之實例係能夠為黏合膜提供生坯強度之彼等,包括環脂肪族環氧化物單體M100及A400(Daicel)、氧雜環丁烷單體OXE-10(可自Kowa Company購得)、甲基丙烯酸二環戊二烯酯環氧化物(CD535,可自Sartomer Co.,Exton,PA購得)及4-乙烯基-1-環己烯-1,2-環氧化物(可自Dow購得)。
丙烯酸聚合物能夠經歷UV後陽離子活化反應且因此為黏合膜提供高溫度保持強度。實例性丙烯酸聚合物係具有以下組成之彼等或可
藉由聚合以下來製備之彼等:(i)丙烯酸單體,其為下式之丙烯酸或甲基丙烯酸衍生物:CH2=CH(R1)(COOR2),其中R1係H或CH3且R2係C1-20烷基鏈及(ii)具有選自(1)環脂肪族環氧化物、氧雜環丁烷、二苯甲酮或其混合物及(2)單取代之環氧乙烷二者之側接反應性官能基之組合之單體。
單體(ii)之量係每100g丙烯酸聚合物約0.001至約0.015當量。丙烯酸聚合物基本上不含多(甲基)丙烯酸酯、多元醇或OH官能基且聚合之後聚合物仍保持實質上直鏈。在某些實施例中,單體(ii)之量係每100g丙烯酸聚合物約0.002至約0.01當量。
所製備丙烯酸聚合物通常具有10,000g/mol至2,000,000g/mol、例如介於50,000g/mol與1,000,000g/mol之間、如介於100,000g/mol與700,000g/mol之間之重量平均分子量(Mw)。Mw係藉由凝膠滲透層析或基質輔助雷射脫附/離子化質譜來測定。
用作單體(ii)之單取代之環氧乙烷之實例包括甲基丙烯酸縮水甘油酯、1,2-環氧-5-己烯、丙烯酸4-羥丁基縮水甘油醚、環脂肪族環氧單體M100及A400、OXE-10、CD535環氧化物及4-乙烯基-1-環己烯-1,2-環氧化物。
PSA亦可包含各種其他添加劑,例如塑化劑、增黏劑及填充劑,其中之所有均習用於PSA製備中。作為欲添加之塑化劑,低分子量丙烯酸聚合物、鄰苯二甲酸酯、苯甲酸酯、已二酸酯或塑化劑樹脂僅係幾個可能。作為欲添加之增黏劑或增黏樹脂,可使用文獻中所闡述之任何已知增黏樹脂。非限制性實例包括蒎烯樹脂、茚樹脂及其經歧
化、經氫化、經聚合及經酯化之衍生物及鹽;脂肪族及芳香族烴樹脂、萜樹脂、萜-酚樹脂、C5樹脂、C9樹脂及其他烴樹脂。可使用該等或其他樹脂之任何期望組合以根據期望最終性質來調節所得黏合劑之性質。
PSA可進一步與一或多種添加劑(例如,防老劑、抗氧化劑、光穩定劑、複合劑及/或加速劑)摻和。
預期可用於本文之導熱性基底層包括銅箔、銅網、銅布、銅發泡體、鋁箔、鋁網、鋁布、鋁發泡體及諸如此類。
根據本發明之又一實施例,提供製備上述總成之方法,該方法包含:(i)堆疊並層壓:第一壓感黏合層,導熱性基底層,包含用經調配相變材料(PCM)浸漬之導熱性矮型結構之第一物件,第二壓感黏合層,保護性層及/或電絕緣層,及(ii)將足夠力及溫度施加至所得堆疊以獲得穩定黏合之總成。
根據本發明之另一實施例,提供熱分散總成,其包含:5μm至20μm厚度之第一壓感黏合層,具有約17μm至500μm範圍內厚度之傳導性基底層;25μm至150μm之本發明之第一多孔導熱性矮型結構,5μm至10μm厚度之第二壓感黏合層,25μm至150μm之本發明之第二多孔導熱性矮型結構,25μm至50μm厚度之導熱性/保護性層,及
5μm至10μm厚度之電絕緣層。
根據本發明之又一實施例,提供製備上述總成之方法,該方法包含:(i)堆疊並層壓:第一壓感黏合層,導熱性基底層,包含用經調配相變材料(PCM)浸漬之導熱性矮型結構之第一物件,第二壓感黏合層,包含用經調配相變材料(PCM)浸漬之導熱性矮型結構之第二物件,保護性層,及/或電絕緣層,及(ii)將足夠力及溫度施加至所得堆疊以獲得穩定黏合之總成。
根據本發明之另一實施例,提供熱分散總成,其包含:5μm至20μm厚度之第一壓感黏合層,具有約17μm至500μm範圍內厚度之傳導性基底層;25μm至150μm之本發明之第一多孔導熱性矮型結構,5μm至10μm厚度之第二壓感黏合層,25μm至150μm之本發明之第二多孔導熱性矮型結構,5μm至10μm厚度之第三壓感黏合層,25μm至150μm之本發明之第三多孔導熱性矮型結構,25μm至50μm厚度之導熱性/保護性層,及5μm至10μm厚度之電絕緣層。
根據本發明之又一實施例,提供製備上述總成之方法,該等方法包含:
(i)堆疊並層壓:第一壓感黏合層,導熱性基底層,包含用經調配相變材料(PCM)浸漬之導熱性矮型結構之第一物件,第二壓感黏合層,包含用經調配相變材料(PCM)浸漬之導熱性矮型結構之第二物件,第三壓感黏合層,包含用經調配相變材料(PCM)浸漬之導熱性矮型結構之第三物件,保護性層,及/或電絕緣層,及(ii)將足夠力及溫度施加至所得堆疊以獲得穩定黏合之總成。
根據本發明之又一實施例,提供製備如本文所述物件之方法,該等方法包含用足夠量之經調配之相變材料(PCM)之熔融形式浸漬多孔導熱性矮型結構以使得實質上潤濕該多孔導熱性矮型結構。
在一些實施例中,經調配之相變材料包含含有與該PCM混合之約5-20重量%範圍內膠凝劑之PCM。
根據本發明之又一實施例,提供用於耗散由緊湊型電子裝置所產生熱之方法,該方法包含使該裝置與如本文所述物件接觸。
藉由以下非限制性實例來闡釋本發明之各個態樣。該等實例係出於闡釋性目的且並非對本發明之任一實踐進行限制。將理解,可作出各種變化形式及修改形式而不背離本發明之精神及範圍。熟習此項技術者易於瞭解如何合成或在商業上獲得本文所述之試劑及組份。
將本發明之基於PCM之熱系統之性能性質與具有可比較的傳熱能力而沒有PCM之習用熱管理系統相比較。
結果展示基於PCM之系統在傳送期間顯著降低接面溫度,此可能由於PCM之熱儲存效應。
將本發明之實例性基於PCM之熱系統與兩種具有熔融溫度顯著較低之PCM(使得其PCM在極低溫度範圍內釋放其延遲)之習用基於PCM之溶液相比較。
結果展示對於由可攜式電子裝置所產生熱之移除,本發明熱耗散物件優於習用基於PCM之溶液。
除本文所顯示及所闡述之彼等外,熟習此項技術者根據上述描述將明瞭本發明之各種修改形式。此等修改形式亦意欲落入隨附申請專利範圍之範圍內。
本說明書中所提及之專利及公開案指示熟習本發明所屬領域技術者之水準。該等專利及公開案係以引用方式併入本文中,其併入程度如同每一個別申請案或公開案明確地且個別地以引用方式併入本文中一般。
前文描述闡釋本發明之具體實施例,但不意欲在實踐本發明時進行限制。以下申請專利範圍(包括其所有等效形式)意欲界定本發明之範圍。
10‧‧‧第一物件
12‧‧‧第一傳導性/保護性層
14‧‧‧多孔導熱性矮型結構之層
16‧‧‧第一壓感黏合層
18‧‧‧第二傳導性/保護性層
19‧‧‧第二壓感黏合層
Claims (25)
- 一種熱分散物件,其包含:第一傳導性/保護性層,一或多個多孔導熱性矮型(low-profile)結構,其經足夠量之經調配相變材料(PCM)浸漬以使得實質上覆蓋該多孔導熱性矮型結構之表面及空隙,其中該經調配之PCM包含含有與該PCM混合之5至20重量%之膠凝劑之該PCM,及第二傳導性/保護性層,其中該(等)一或多個多孔導熱性矮型結構夾在該等第一與第二傳導性/保護性層之間,且其中該物件具有至少100J/cc之延遲,及至少10W/mK之有效導熱率。
- 如請求項1之物件,其中該多孔導熱性矮型結構包含銅網、銅布、銅發泡體、鋁網、鋁布或鋁發泡體。
- 如請求項2之物件,其中該多孔導熱性矮型結構係絲網。
- 如請求項2之物件,其中該多孔導熱性矮型結構之厚度落入約50μm至最高約1mm範圍內。
- 如請求項2之物件,其中該經調配之PCM之厚度係該多孔導熱性矮型結構之厚度之1至2倍。
- 如請求項1之物件,其中該多孔導熱性矮型結構具有約40%至最高約70%範圍內之面積開孔率及約60%至最高約95%範圍內之體積開孔率。
- 如請求項1之物件,其中該經調配之PCM係藉由混合5重量%至20 重量%之膠凝劑與選自以下之相變材料來製備:石蠟(CnH2n+2),其中n落入約20至最高40範圍內,或具有類似熔融溫度範圍之脂肪酸(CH3(CH2)2nCOOH),或其任兩者或更多者之混合物。
- 如請求項7之物件,其中該經調配之PCM遍及該(等)多孔導熱性矮型結構之厚度實質上均勻膠凝化。
- 如請求項1之物件,其中該PCM經囊封。
- 如請求項9之物件,其中:該多孔導熱性矮型結構經該經調配之PCM浸漬,且然後該經浸漬之多孔導熱性矮型結構與導熱薄片經由壓感黏合(PSA)層層壓在一起,此防止該PCM洩漏。
- 如請求項10之物件,其中該導熱薄片係銅箔、銅網、銅布、銅發泡體、鋁箔、鋁網、鋁布、鋁發泡體或石墨薄片。
- 如請求項11之物件,其中該導熱薄片具有25μm至500μm範圍內之厚度。
- 如請求項11之物件,其中該導熱薄片係具有25μm至70μm範圍內厚度之石墨薄片。
- 如請求項1之物件,其中該物件具有至少100J/cc之延遲。
- 如請求項1之物件,其中該物件具有至少10W/mK之有效導熱率。
- 一種熱分散總成,其包含:5μm至20μm厚度之第一壓感黏合層,具有約17μm至500μm範圍內厚度之傳導性基底層;25μm至150μm之經足夠量之經調配相變材料(PCM)浸漬之多孔導熱性矮型結構,5μm至10μm厚度之第二壓感黏合層, 25μm至50μm厚度之導熱性/保護性層,及5μm至10μm厚度之電絕緣層。
- 一種熱分散總成,其包含:5μm至20μm厚度之第一壓感黏合層,具有約17μm至500μm範圍內厚度之傳導性基底層;25μm至150μm之經足夠量之經調配相變材料(PCM)浸漬之第一多孔導熱性矮型結構,5μm至10μm厚度之第二壓感黏合層,25μm至150μm之經足夠量之經調配相變材料(PCM)浸漬之第二多孔導熱性矮型結構,25μm至50μm厚度之導熱性/保護性層,及5μm至10μm厚度之電絕緣層。
- 一種熱分散總成,其包含:5μm至20μm厚度之第一壓感黏合層,具有約17μm至500μm範圍內厚度之傳導性基底層;25μm至150μm之經足夠量之經調配相變材料(PCM)浸漬之第一多孔導熱性矮型結構,5μm至10μm厚度之第二壓感黏合層,25μm至150μm之經足夠量之經調配相變材料(PCM)浸漬之第二多孔導熱性矮型結構,5μm至10μm厚度之第三壓感黏合層,25μm至150μm之經足夠量之經調配相變材料(PCM)浸漬之第三多孔導熱性矮型結構,25μm至50μm厚度之導熱性/保護性層,及5μm至10μm厚度之電絕緣層。
- 一種製備如請求項1之物件之方法,該方法包含用足夠量之經調 配相變材料(PCM)之熔融形式浸漬多孔導熱性矮型結構以使得實質上潤濕該多孔導熱性矮型結構。
- 如請求項19之方法,其中該經調配之相變材料包含含有與該PCM混合之5重量%至20重量%之膠凝劑之該PCM。
- 一種製備如請求項16之總成之方法,該方法包含:(i)堆疊並層壓:第一壓感黏合層,導熱性基底層,包含用經調配相變材料(PCM)浸漬之導熱性矮型結構之第一物件,第二壓感黏合層,保護性層,及/或電絕緣層,及(ii)將足夠力及溫度施加至所得堆疊以獲得穩定黏合之總成。
- 一種製備如請求項17之總成之方法,該方法包含:(i)堆疊並層壓:第一壓感黏合層,導熱性基底層,包含用經調配相變材料(PCM)浸漬之導熱性矮型結構之第一物件,第二壓感黏合層,包含用經調配相變材料(PCM)浸漬之導熱性矮型結構之第二物件,保護性層,及/或電絕緣層,及(ii)將足夠力及溫度施加至所得堆疊以獲得穩定黏合之總成。
- 一種製備如請求項18之總成之方法,該方法包含:(i)堆疊並層壓:第一壓感黏合層,導熱性基底層,包含用經調配相變材料(PCM)浸漬之導熱性矮型結構之第一物件,第二壓感黏合層,包含用經調配相變材料(PCM)浸漬之導熱性矮型結構之第二物件,第三壓感黏合層,包含用經調配相變材料(PCM)浸漬之導熱性矮型結構之第三物件,保護性層,及/或電絕緣層,及(ii)將足夠力及溫度施加至所得堆疊以獲得穩定黏合之總成。
- 一種用於耗散由緊湊型電子裝置所產生熱之方法,該方法包含使該裝置與如請求項1之物件接觸。
- 一種用於耗散由緊湊型電子裝置所產生熱之方法,該方法包含使該裝置與如請求項16之總成接觸。
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JP (1) | JP2018518393A (zh) |
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CN (1) | CN107636826A (zh) |
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Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0716444A4 (en) * | 1993-09-03 | 1996-12-18 | Sekuto Kagaku Kk | RADIATION PLATE AND COOLING METHOD USING THE SAME |
JPH10151997A (ja) * | 1996-11-22 | 1998-06-09 | Matsushita Electric Works Ltd | 車 輛 |
BR9809649A (pt) * | 1997-05-21 | 2000-07-11 | Schuemann Sasol Gmbh & Co Kg | Corpo de calor latente |
US6037032A (en) | 1997-09-02 | 2000-03-14 | Lockheed Martin Energy Research Corp. | Pitch-based carbon foam heat sink with phase change material |
US6097602A (en) | 1998-06-23 | 2000-08-01 | Marian, Inc. | Integrated circuit package heat sink attachment |
US6686003B2 (en) * | 1998-11-13 | 2004-02-03 | Fireking International, Inc. | High performance fire-protection containers |
US6888722B2 (en) | 1999-12-30 | 2005-05-03 | Intel Corporation | Thermal design for minimizing interface in a multi-site thermal contact condition |
GB0008897D0 (en) * | 2000-04-12 | 2000-05-31 | Cheiros Technology Ltd | Improvements relating to heat transfer |
US6523608B1 (en) | 2000-07-31 | 2003-02-25 | Intel Corporation | Thermal interface material on a mesh carrier |
WO2002083440A2 (en) | 2001-04-17 | 2002-10-24 | Barbara Pause | Thermal control of automotive interiors with phase change material |
US6621702B2 (en) * | 2002-01-25 | 2003-09-16 | Lockheed Martin Corporation | Method and apparatus for absorbing thermal energy |
US6926955B2 (en) | 2002-02-08 | 2005-08-09 | Intel Corporation | Phase change material containing fusible particles as thermally conductive filler |
US7141310B2 (en) * | 2002-04-17 | 2006-11-28 | Ceramics Process Systems Corporation | Metal matrix composite structure and method |
US7106777B2 (en) | 2003-01-07 | 2006-09-12 | The Boeing Company | Phase-change heat exchanger |
WO2006033281A1 (ja) * | 2004-09-24 | 2006-03-30 | Kabushiki Kaisha Toshiba | 超音波プローブ |
CN101115817B (zh) * | 2004-12-09 | 2013-09-18 | 纳幕尔杜邦公司 | 用于热量管理的相变材料(pcm)组合物 |
JP5140302B2 (ja) * | 2007-03-29 | 2013-02-06 | ポリマテック株式会社 | 熱伝導性シート |
CN201107006Y (zh) * | 2007-09-28 | 2008-08-27 | 北京航空航天大学 | 泡沫铜-相变材料储能构件及采用它的温控装置 |
US8739525B2 (en) * | 2009-05-08 | 2014-06-03 | GM Global Technology Operations LLC | Thermally-active material assemblies including phase change materials |
DE102011120963B4 (de) * | 2010-12-17 | 2013-07-18 | GM Global Technology Operations LLC (n.d. Ges. d. Staates Delaware) | Anordnungen mit thermisch aktivem Material, die Phasenänderungsmaterialien umfassen, und Verfahren zur Verwendung derselben |
JP6140159B2 (ja) * | 2011-08-15 | 2017-05-31 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 大量保護輸送およびコールドチェーン用途の通気性製品 |
FR2979885B1 (fr) * | 2011-09-14 | 2013-10-04 | Hutchinson | Structure de carrosserie de vehicule automobile electrique ou hybride, ce vehicule et procede de controle/ modification de la temperature de son habitacle. |
WO2013172994A1 (en) * | 2012-05-16 | 2013-11-21 | Henkel Corporation | Thermally insulative composition and electronic devices assembled therewith |
CN102827587A (zh) | 2012-09-18 | 2012-12-19 | 中国科学院上海硅酸盐研究所 | 相变储能材料/石墨烯/多孔陶瓷复合热管理材料及其制备方法和应用 |
US9223363B2 (en) * | 2013-03-16 | 2015-12-29 | Henkel IP & Holding GmbH | Electronic devices assembled with heat absorbing and/or thermally insulating composition |
JP2014220371A (ja) * | 2013-05-08 | 2014-11-20 | 富士通株式会社 | 放熱部材および電子機器 |
CN104617350B (zh) * | 2015-01-04 | 2016-08-31 | 华中科技大学 | 一种基于包芯结构复合相变储热层的动力电池冷却系统 |
US10377000B2 (en) * | 2015-08-26 | 2019-08-13 | Apple Inc. | Heat dissipation case and methods for navigating heat from an electronic device |
FR3046021B1 (fr) * | 2015-12-17 | 2017-12-22 | Commissariat Energie Atomique | Dispositif composite d'absorption thermique et methode d'obtention |
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US20180068924A1 (en) | 2018-03-08 |
WO2016196279A2 (en) | 2016-12-08 |
JP2018518393A (ja) | 2018-07-12 |
KR20180014722A (ko) | 2018-02-09 |
WO2016196279A3 (en) | 2017-01-12 |
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