CN107636826A - 用于热管理的系统及其使用方法 - Google Patents
用于热管理的系统及其使用方法 Download PDFInfo
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- CN107636826A CN107636826A CN201680031515.5A CN201680031515A CN107636826A CN 107636826 A CN107636826 A CN 107636826A CN 201680031515 A CN201680031515 A CN 201680031515A CN 107636826 A CN107636826 A CN 107636826A
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Classifications
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Abstract
根据本发明,提供热分散制品、含有其的组件、其制备方法及其各种用途。在本发明的一方面,提供热分散制品。在本发明的另一方面,提供用于制备上述制品的方法。在本发明的又一方面,提供含有上述制品的组件。在本发明的又一方面,提供用于制造上述组件的方法。在又一方面,提供耗散由便携式电子装置所产生的热的方法。
Description
技术领域
本发明涉及热分散制品、含有其的组件、其制备方法及其各种用途。在一方面,本发明涉及热分散制品。在另一方面,本发明涉及用于制备根据本发明的制品的方法。在又一方面,本发明涉及含有本发明的制品的组件。在又一方面,本发明涉及用于制造本发明的组件的方法。在又一方面,本发明涉及耗散由电子装置诸如便携式电子装置所产生的热的方法。
背景技术
电子装置、尤其是便携式电子装置(例如,智能电话、iPod、平板电脑、手持医疗装置、游戏系统等)现已成为日常生活的一部分。由于对速度及附加功能的需求迅速扩大,由这些装置所产生的热显著增加。然而,由于可用于耗散热的表面积较小,这些装置越来越受到热的限制。
主动冷却通常不适用于这些装置,例如由于空间限制,涉及冷却装置的可靠性的问题、由此产生的噪音等。作为一个可能的解决方案,已提出使用相变材料(PCM)。基本上,使用具有相当高延迟(latency)的PCM,使得PCM在能够管理重度使用期间所产生的一些过量电力的温度范围内熔融;得到的熔融的PCM可在轻度使用期间再固化,从而可提供所需性能的加强。
遗憾地是,常用的PCM(例如,蜡、油等)通常具有极低导热率(约0.2W/mK);因此,这些材料往往用作绝热体。由于便携式电子装置的大小和体积限制,PCM通常直接放置在热传递通路内且与其他包装/传热组件共享空间,这在热管理设计中产生严重困境。另外,为实现基于PCM的热解决方案的优点,PCM必须能在其全部体积快速吸热,这要求PCM具有高导热性。
由于上文所述的限制,目前不存在针对诸如便携式电子装置等电子装置的实用的基于PCM的热解决方案。
发明内容
根据本发明,提供热分散制品、含有其的组件、其制备方法及其各种用途。在本发明的一方面,提供热分散制品。在本发明的另一方面,提供用于制造上述制品的方法。在本发明的又一方面,提供含有上文所述制品的组件。在本发明的又一方面,提供用于制造上文所述组件的方法。在又一方面,提供耗散由便携式电子装置所产生的热的方法。
本发明的制品包含用相变材料(PCM)浸渍的导热性低剖面(low-profile)结构,其中所述导热性低剖面结构夹在第一传导性/保护性层与第二传导性/保护性层之间。
附图说明
图1是本发明的示例性第一制品(10),所述制品包含:
第一传导性/保护性层(12)(即,“25μm Cu”),
多孔导热性低剖面结构的至少一层(14)(厚度为约100μm至最高约200μm),其用足够量的配制的相变材料(PCM)浸渍,从而基本上覆盖所述多孔导热性低剖面结构的表面和空隙(即,“150μm网+PCM”;该层可为单层或多个网层的堆叠体,其中网层中的每一个均用足够量的配制的PCM浸渍,从而基本上覆盖其表面和空隙),
第一压敏粘合剂层(16)(即,“10μm psa/epsa”),
第二传导性/保护性层(18)(即,“25μm Cu”),及
第二压敏粘合剂层(19)(即,“10μm psa/epsa”)。
图2显示本发明的第二示例性制品(20),所述制品包含:
第一传导性/保护性层(22)(即,“25μm Cu”),
第一压敏粘合剂层(24)(即,“10μm epsa”),
三个多孔导热性低剖面结构层(26),其中各层用足够量的配制的相变材料(PCM)浸渍,从而基本上覆盖所述多孔导热性低剖面结构的表面和空隙(即,3ד50μm网+PCMI”),
第二压敏粘合剂层(27)(即,“10μm psa/epsa”),
第二传导性/保护性层(28)(即,“25μm石墨”),及
第三压敏粘合剂层(29)(即,“10μm psa/epsa”)。
图3显示本发明的第三示例性制品(30),所述制品包含:
第一传导性/保护性层(32)(即,“25μm Cu”),
第一压敏粘合剂层(34)(即,“10μm psa”),
多孔导热性低剖面结构(36),其用足够量的配制的相变材料(PCM)浸渍,从而基本上覆盖其表面和空隙(即,“225μm网与PCM”),
第二压敏粘合剂层(37)(即,“10μm psa/epsa”),
第二传导性/保护性层(38)(即,“40μm石墨”),
支持层(39)(即,“5μm PET”),及
第三压敏粘合剂层(40)(即,“10μm psa/epsa”)。
发明详述
根据本发明,提供热分散制品,其包含:
第一传导性/保护性层,
一个或多个多孔导热性低剖面结构,其用足够量的配制的相变材料(PCM)浸渍,从而基本上覆盖所述多孔导热性低剖面结构的表面和空隙,
其中所述配制的PCM包含含有与所述PCM混合的5-20重量%的胶凝剂的所述PCM,及
第二传导性/保护性层,
其中所述一个或多个多孔导热性低剖面结构夹在所述第一传导性/保护性层和第二传导性/保护性层之间,且
其中所述制品具有:
至少100J/cc的延迟,和
至少10W/mK的有效导热率。
多种传导性/保护性层预期可用于本发明中。示例性传导性/保护性层包括铜箔、铜网(例如,扩张或织造网)、铜布(例如,扩张或织造布)、泡沫铜、铝箔、铝网(例如,扩张或织造网)、铝布(例如,扩张或织造布)、泡沫铝、石墨片等。
预期可用作本发明的传导性/保护性层的示例性箔材料包括厚度在约10μm至最高约200μm范围内的材料;预期可用作本发明的传导性/保护性层的示例性网/布材料包括网尺寸在约60线/英寸至最高约200线/英寸范围内的材料;预期可用作本发明的传导性/保护性层的示例性泡沫材料包括由实心支柱(solid strut)的互连网络组成的多孔结构或开孔泡沫;与肥皂泡或啤酒泡沫一样,形成泡沫的原始气泡是相似大小的气泡的三维、完美地堆叠的阵列,其中各气泡针对最小表面积及表面能具有最大体积;且预期可用作本发明的传导性/保护性层的示例性薄片材料包括孔径在约20孔/英寸2至最高约40孔/英寸2范围内及相对密度在约3%至最高12%范围内的材料。
多种多孔导热性低剖面结构可用于本发明实践中,例如、铜网、铜布、泡沫铜、铝网、铝布、泡沫铝等。
预期可用于本发明的多孔导热性低剖面结构的厚度通常在约50μm至最高约1mm范围内。在一些实施方案中,多孔导热性低剖面结构的厚度落入150至200μm范围内。
预期可用于本发明的多孔导热性低剖面结构可进一步参考其“面积开孔率”和/或“体积开孔率”来表征。本文所用的“面积开孔率”是指接受相变材料润湿的多孔导热性低剖面结构的表面相对于不接受相变材料润湿的多孔导热性低剖面结构的表面的百分比。相似地,“体积开孔率”是指接受相变材料润湿的多孔导热性低剖面结构的内部体积的部分相对于不接受相变材料润湿的多孔导热性低剖面结构的内部体积的部分。
预期可用于本发明的多孔导热性低剖面结构通常的面积开孔率在约40%至最高约70%的范围内;且体积开孔率在约60%至最高约95%的范围内。在一些实施方案中,预期可用于本发明的多孔导热性低剖面结构的面积开孔率通常在约50%至最高约60%范围内;在一些实施方案中,预期可用于本发明的多孔导热性低剖面结构的面积开孔率通常为约60%。在一些实施方案中,预期可用于本发明的多孔导热性低剖面结构的体积开孔率通常在约70%至最高约85%范围内;在一些实施方案中,预期可用于本发明的多孔导热性低剖面结构的面积开孔率通常为约85%。
预期可用于本发明的示例性网/布材料可表征为扩张或织造网;且预期可用于本发明的示例性泡沫材料可表征为开孔低密度泡沫。
在一些实施方案中,预期可用于本发明的多孔导热性低剖面结构包含面积开孔率在约30%至最高约60%范围内的丝网。
可通过混合5重量%至20重量%的胶凝剂与相变材料来制备预期可用于本发明的配制的PCM。在一些实施方案中,可通过混合10重量%的胶凝剂与相变材料来制备配制的PCM。
预期可用于本发明的示例性相变材料包括:
具有下式的石蜡:CnH2n+2,其中n落入约20至最高40的范围内,
具有下式的脂肪酸:CH3(CH2)2nCOOH,其具有相似熔融温度范围,
等,以及
其中任意两种或更多种的混合物。
在一些实施方案中,相变材料的熔融温度低于使用便携式电子装置的天然环境的最终平衡温度不超过约20℃。在一些实施方案中,相变材料的熔融温度低于使用便携式电子装置的天然环境的最终平衡温度不超过约15℃。在一些实施方案中,相变材料的熔融温度低于使用便携式电子装置的天然环境的最终平衡温度不超过约10℃。
预期可用于本发明的示例性胶凝剂包括聚合物蜡胶凝剂、嵌段共聚物胶凝剂、高表面积无机颜料/填料(例如,蒙脱石、硅藻土、膨胀/剥落石墨)、定形石蜡(form stableparaffin)/HDPE(高密度聚乙烯)复合物等。
预期可用于本发明的示例性嵌段共聚物胶凝剂包括JSR(JSR Corporation)Dynaron 6360B(烯烃结晶性乙烯、丁烯-烯烃结晶性嵌段共聚物(CEBC)或结晶性嵌段-(乙烯/丁烯)-结晶性嵌段共聚物(CEBC)、Kraton SBS(苯乙烯-丁烯-苯乙烯嵌段共聚物)、Kraton SEBS(苯乙烯-乙烯/丁烯-苯乙烯嵌段共聚物)等。
在一些实施方案中,本发明的制品的配制的PCM在多孔导热性低剖面结构的全部厚度上基本上均匀地胶凝化。
用于浸渍多孔导热性低剖面结构的配制的PCM的厚度通常为多孔导热性低剖面结构的厚度的1-2倍。
任选地,用于实施本发明的PCM可被包封。可实现这种包封的一种方式通过以下来进行:
使用所述配制的PCM浸渍所述多孔导热性低剖面结构,及然后
用压敏粘合剂(PSA)层将所述浸渍的多孔导热性低剖面结构与导热片层合在一起,所述压敏粘合剂(PSA)层防止PCM泄漏。
预期用于本发明的该实施方案中的导热片的厚度通常在25μm至500μm的范围内。
可选地,当导热片是石墨片时,这些构筑体(constructs)的厚度通常在25μm至70μm范围内。
为使本发明的制品从便携式电子装置有效耗散热,这些制品的延迟通常为至少100J/cc。在一些实施方案中,本发明的制品的延迟为至少240J/cc。
本发明的制品可进一步针对其有效导热率来限定。在一些实施方案中,导热率为至少10W/mK。在一些实施方案中,导热率>50W/mK。
根据本发明的另一实施方案,提供热分散组件,其包含:
厚度为5μm至20μm的第一压敏粘合剂层,
厚度在约17μm至500μm范围内的传导性基底层;
25μm至150μm的根据本发明的多孔导热性低剖面结构,
厚度为5μm至10μm的第二压敏粘合剂层,
厚度为25μm至50μm的导热性/保护性层,及
厚度为5μm至10μm的电绝缘层。
预期可用于本发明的压敏粘合剂层包括与适当增粘剂(例如,松香酯)复合的弹性体(例如,丙烯酸酯)等。PSA可由丙烯酸聚合物制造,例如具有以下组成的那些丙烯酸聚合物或可通过聚合以下来制备的那些丙烯酸聚合物:
(i)丙烯酸单体,其为下式的丙烯酸或甲基丙烯酸衍生物(例如甲基丙烯酸酯):
CH2=CH(R1)(COOR2),
其中:
R1是H或CH3且
R2是C1-20,优选C1-8烷基链,和
(ii)具有侧接反应性官能团的单体,其在本文下文中更详细阐述,且单体(ii)的量为每100g丙烯酸聚合物约0.001至约0.015当量。
对于聚合方法,组分(i)和(ii)的单体(如果合适)通过自由基聚合转化为丙烯酸聚合物。根据D.Satas,“Handbook of Pressure Sensitive Adhesive Technology”,vanNostrand,NY(1989),选择单体,从而得到的聚合物可用于制备PSA。
用作单体混合物(i)的组分的丙烯酸酯和/或甲基丙烯酸酯的实例包括丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸乙酯、甲基丙烯酸甲酯、丙烯酸正丁酯、甲基丙烯酸正丁酯、丙烯酸正戊酯、丙烯酸正己酯、丙烯酸正庚酯及丙烯酸正辛酯、丙烯酸正壬酯、甲基丙烯酸月桂酯、丙烯酸环己酯,及支化(甲基)丙烯酸异构体,例如丙烯酸异丁酯、甲基丙烯酸异丁酯、甲基丙烯酸正丁酯、丙烯酸2-乙基己酯、甲基丙烯酸十八烷基酯及丙烯酸异辛酯。
示例性丙烯酸单体混合物(i)的Tg值小于0℃,且重均分子量为约10,000g/mol至约2,000,000g/mol,例如在50,000g/mol与1,000,000g/mol之间,且理想地在100,000g/mol与700,000g/mol之间。混合物(i)可以为单一单体,前提是其均聚物Tg小于0℃。
适当单体(ii)的实例是能够为粘合剂膜提供生坯强度(green strength)的那些,包括脂环族环氧化物单体M100和A400(Daicel)、氧杂环丁烷单体OXE-10(可自KowaCompany购得)、甲基丙烯酸二环戊二烯酯环氧化物(CD535,可自Sartomer Co.,Exton,PA购得),及4-乙烯基-1-环己烯-1,2-环氧化物(可自Dow购得)。
丙烯酸聚合物能够进行UV后阳离子活化反应并因此为粘合剂膜提供高温保持强度(high temperature holding strength)。示例性丙烯酸聚合物是具有以下组成的那些或可通过聚合以下来制备的那些:
(i)丙烯酸单体,其为下式的丙烯酸或甲基丙烯酸衍生物:
CH2=CH(R1)(COOR2),
其中R1是H或CH3且
R2是C1-20烷基链,和
(ii)具有选自(1)脂环族环氧化物、氧杂环丁烷、二苯甲酮或其混合物和(2)单取代的环氧乙烷二者的侧接反应性官能团的组合的单体。
单体(ii)的量是每100g丙烯酸聚合物约0.001至约0.015当量。丙烯酸聚合物基本上不含多(甲基)丙烯酸酯、多元醇或OH官能团且聚合之后聚合物仍保持基本上为直链。在某些实施方案中,单体(ii)的量为每100g丙烯酸聚合物约0.002至约0.01当量。
所制备的丙烯酸聚合物的重均分子量(Mw)通常为10,000g/mol至2,000,000g/mol,例如在50,000g/mol与1,000,000g/mol之间,如在100,000g/mol与700,000g/mol之间。Mw通过凝胶渗透色谱或基质辅助激光解吸/离子化质谱来测定。
用作单体(ii)的单取代的环氧乙烷的实例包括甲基丙烯酸缩水甘油酯、1,2-环氧-5-己烯、4-羟丁基丙烯酸酯缩水甘油醚、脂环族环氧化物单体M100和A400、OXE-10、CD535环氧化物及4-乙烯基-1-环己烯-1,2-环氧化物。
PSA也可包含各种其他添加剂,例如增塑剂、增粘剂及填料,它们都是常规用于PSA的制备中。作为要添加的增塑剂,低分子量丙烯酸聚合物、邻苯二甲酸酯、苯甲酸酯、已二酸酯或增塑剂树脂只是几个可能。作为要添加的增粘剂或增粘树脂,可使用文献中所阐述的任何已知增粘树脂。非限制性实例包括蒎烯树脂、茚树脂及其歧化的、氢化的、聚合的及酯化的衍生物及盐;脂族和芳族烃树脂、萜树脂、萜-酚树脂、C5树脂、C9树脂及其他烃树脂。可使用这些或其他树脂的任何理想组合以根据所需的最终性质来调节所得粘合剂的性质。
PSA可进一步与一种或多种添加剂(例如,老化抑制剂、抗氧化剂、光稳定剂、复合剂和/或加速剂)共混。
预期可用于本发明的导热性基底层包括铜箔、铜网、铜布、泡沫铜、铝箔、铝网、铝布、泡沫铝等。
根据本发明的又一实施方案,提供制备上述组件的方法,所述方法包括:
(i)堆叠并层合:
第一压敏粘合剂层,
导热性基底层,
包含用配制的相变材料(PCM)浸渍的导热性低剖面结构的第一制品,
第二压敏粘合剂层,
保护性层,和/或
电绝缘层,和
(ii)向得到的堆叠体施加足够的力和温度以获得稳定粘合的组件。
根据本发明的另一实施方案,提供热分散组件,其包含:
厚度为5μm至20μm的第一压敏粘合剂层,
厚度在约17μm至500μm范围内的传导性基底层;
25μm至150μm的本发明的第一多孔导热性低剖面结构,
厚度为5μm至10μm的第二压敏粘合剂层,
25μm至150μm的本发明的第二多孔导热性低剖面结构,
厚度为25μm至50μm的导热性/保护性层,及
厚度为5μm至10μm的电绝缘层。
根据本发明的又一实施方案,提供制备上述组件的方法,所述方法包括:
(i)堆叠并层合:
第一压敏粘合剂层,
导热性基底层,
包含用配制的相变材料(PCM)浸渍的导热性低剖面结构的第一制品,第二压敏粘合剂层,
包含用配制的相变材料(PCM)浸渍的导热性低剖面结构的第二制品,保护性层,和/或
电绝缘层,和
(ii)向得到的堆叠体施加足够的力和温度以获得稳定粘合的组件。
根据本发明的另一实施方案,提供热分散组件,其包含:
厚度为5μm至20μm的第一压敏粘合剂层,
厚度在约17μm至500μm范围内的传导性基底层;
25μm至150μm的本发明的第一多孔导热性低剖面结构,
厚度为5μm至10μm的第二压敏粘合剂层,
25μm至150μm的本发明的第二多孔导热性低剖面结构,
厚度为5μm至10μm的第三压敏粘合剂层,
25μm至150μm的本发明的第三多孔导热性低剖面结构,
厚度为25μm至50μm的导热性/保护性层,及
厚度为5μm至10μm的电绝缘层。
根据本发明的又一实施方案,提供制备上述组件的方法,所述方法包括:
(i)堆叠并层合:
第一压敏粘合剂层,
导热性基底层,
包含用配制的相变材料(PCM)浸渍的导热性低剖面结构的第一制品,第二压敏粘合剂层,
包含用配制的相变材料(PCM)浸渍的导热性低剖面结构的第二制品,第三压敏粘合剂层,
包含用配制的相变材料(PCM)浸渍的导热性低剖面结构的第三制品,保护性层,和/或
电绝缘层,和
(ii)向得到的堆叠体施加足够的力和温度以获得稳定粘合的组件。
根据本发明的又一实施方案,提供制备如本文所述制品的方法,所述方法包括用足够量的熔融形式的配制的相变材料(PCM)浸渍多孔导热性低剖面结构,从而基本上润湿所述多孔导热性低剖面结构。
在一些实施方案中,配制的相变材料包含含有与所述PCM混合的约5-20重量%范围内的胶凝剂的PCM。
根据本发明的又一实施方案,提供用于耗散由紧凑型电子装置所产生的热的方法,所述方法包括使所述装置与本文所述的制品接触。
通过以下非限制性实例来阐释本发明的各个方面。实施例是出于阐释性目的且并非对本发明的任何实践进行限制。应理解,可作出各种变化形式及修改形式而不背离本发明的主旨及范围。本领域技术人员易于了解如何合成或在商购获得本文所述的试剂和组分。
实施例1
将本发明的基于PCM的热系统的性能性质与具有相当的传热能力但没有PCM的常用热管理系统的性能性质相比较。
结果显示,基于PCM的系统显著降低传送期间的结点温度(junctiontemperature),这可能由于PCM的热储存效应。
实施例2
将本发明的示例性基于PCM的热系统与两种具有低得多的熔融温度的PCM(使得其PCM在极低温度范围内释放其延迟)的常用基于PCM的溶液相比较。
结果显示,对于除去由便携式电子装置所产生的热,本发明的热耗散制品优于常用的基于PCM的溶液。
除了本文所显示及所阐述的那些,本发明的各种修改形式对于本领域技术人员来说是明显的。这些修改形式也落入随附权利要求的范围内。
本说明书中所提及的专利及公开指示本领域技术人员的水平。这些专利及公开以引用方式并入本文中,其并入程度如同每个申请或公开明确地且个别地以引用方式并入本文中。
前文描述阐释了本发明的具体实施方案,但不用于限制本发明的实践。随附权利要求(包括其所有等效形式)用于限定本发明的范围。
Claims (25)
1.热分散制品,其包含:
第一传导性/保护性层,
一个或多个多孔导热性低剖面结构,其用足够量的配制的相变材料(PCM)浸渍,从而基本上覆盖所述多孔导热性低剖面结构的表面和空隙,
其中所述配制的PCM包含含有与所述PCM混合的5至20重量%的
胶凝剂的所述PCM,及第二传导性/保护性层,
其中所述一个或多个多孔导热性低剖面结构夹在所述第一传导性/保护性层和第二传导性/保护性层之间,且
其中所述制品具有
至少100J/cc的延迟,和
至少10W/mK的有效导热率。
2.根据权利要求1所述的制品,其中所述多孔导热性低剖面结构包含铜网、铜布、泡沫铜、铝网、铝布或泡沫铝。
3.根据权利要求2所述的制品,其中所述多孔导热性低剖面结构是丝网。
4.根据权利要求2所述的制品,其中所述多孔导热性低剖面结构的厚度落入约50μm至最高约1mm范围内。
5.根据权利要求2所述的制品,其中所述配制的PCM的厚度是所述多孔导热性低剖面结构的厚度的1至2倍。
6.根据权利要求1所述的制品,其中所述多孔导热性低剖面结构的面积开孔率在约40%至最高约70%的范围内,且体积开孔率在约60%至最高约95%的范围内。
7.根据权利要求1所述的制品,其中通过混合5重量%至20重量%的胶凝剂与选自以下的相变材料来制备所述配制的PCM:
石蜡(CnH2n+2),其中n落入约20至最高40的范围内,或
具有相似熔融温度范围的脂肪酸(CH3(CH2)2nCOOH),或
其中任意两种或更多种的混合物。
8.根据权利要求7所述的制品,其中所述配制的PCM在所述多孔导热性低剖面结构的全部厚度上基本上均匀地胶凝化。
9.根据权利要求1所述的制品,其中所述PCM被包封。
10.根据权利要求9所述的制品,其中:
用所述配制的PCM浸渍所述多孔导热性低剖面结构,且然后
用压敏粘合剂(PSA)层将所述浸渍的多孔导热性低剖面结构与导热片层合在一起,所述压敏粘合剂(PSA)层防止PCM泄漏。
11.根据权利要求10所述的制品,其中所述导热片是铜箔、铜网、铜布、泡沫铜、铝箔、铝网、铝布、泡沫铝或石墨片。
12.根据权利要求11所述的制品,其中所述导热片的厚度在25μm至500μm的范围内。
13.根据权利要求11所述的制品,其中所述导热片是厚度在25μm至70μm范围内的石墨片。
14.根据权利要求1所述的制品,其中所述制品的延迟为至少100J/cc。
15.根据权利要求1所述的制品,其中所述制品的有效导热率为至少10W/mK。
16.热分散组件,其包含:
厚度为5μm至20μm的第一压敏粘合剂层,
厚度在约17μm至500μm范围内的传导性基底层;
25μm至150μm的用足够量的配制的相变材料(PCM)浸渍的多孔导热性低剖面结构,
厚度为5μm至10μm的第二压敏粘合剂层,
厚度为25μm至50μm的导热性/保护性层,及
厚度为5μm至10μm的电绝缘层。
17.热分散组件,其包含:
厚度为5μm至20μm的第一压敏粘合剂层,
厚度在约17μm至500μm范围内的传导性基底层;
25μm至150μm的用足够量的配制的相变材料(PCM)浸渍的第一多孔导热性低剖面结构,
厚度为5μm至10μm的第二压敏粘合剂层,
25μm至150μm的用足够量的配制的相变材料(PCM)浸渍的第二多孔导热性低剖面结构,
厚度为25μm至50μm的导热性/保护性层,及
厚度为5μm至10μm的电绝缘层。
18.热分散组件,其包含:
厚度为5μm至20μm的第一压敏粘合剂层,
厚度在约17μm至500μm范围内的传导性基底层;
25μm至150μm的用足够量的配制的相变材料(PCM)浸渍的第一多孔导热性低剖面结构,
厚度为5μm至10μm的第二压敏粘合剂层,
25μm至150μm的用足够量的配制的相变材料(PCM)浸渍的第二多孔导热性低剖面结构,
厚度为5μm至10μm的第三压敏粘合剂层,
25μm至150μm的用足够量的配制的相变材料(PCM)浸渍的第三多孔导热性低剖面结构,
厚度为25μm至50μm的导热性/保护性层,及
厚度为5μm至10μm的电绝缘层。
19.制备根据权利要求1所述的制品的方法,所述方法包括用足够量的熔融形式的配制的相变材料(PCM)浸渍多孔导热性低剖面结构,从而基本上润湿所述多孔导热性低剖面结构。
20.根据权利要求19所述的方法,其中所述配制的相变材料包含含有与所述PCM混合的5重量%至20重量%的胶凝剂的所述PCM。
21.制备根据权利要求16所述的组件的方法,所述方法包括:
(i)堆叠并层合:
第一压敏粘合剂层,
导热性基底层,
包含用配制的相变材料(PCM)浸渍的导热性低剖面结构的第一制品,
第二压敏粘合剂层,
保护性层,和/或
电绝缘层,和
(ii)向得到的堆叠体施加足够的力和温度以获得稳定粘合的组件。
22.制备根据权利要求17所述的组件的方法,所述方法包括:
(i)堆叠并层合:
第一压敏粘合剂层,
导热性基底层,
包含用配制的相变材料(PCM)浸渍的导热性低剖面结构的第一制品,
第二压敏粘合剂层,
包含用配制的相变材料(PCM)浸渍的导热性低剖面结构的第二制品,
保护性层,和/或
电绝缘层,和
(ii)向得到的堆叠体施加足够的力和温度以获得稳定粘合的组件。
23.制备根据权利要求18所述的组件的方法,所述方法包括:
(i)堆叠并层合:
第一压敏粘合剂层,
导热性基底层,
包含用配制的相变材料(PCM)浸渍的导热性低剖面结构的第一制品,
第二压敏粘合剂层,
包含用配制的相变材料(PCM)浸渍的导热性低剖面结构的第二制品,
第三压敏粘合剂层,
包含用配制的相变材料(PCM)浸渍的导热性低剖面结构的第三制品,
保护性层,和/或
电绝缘层,和
(ii)向得到的堆叠体施加足够的力和温度以获得稳定粘合的组件。
24.用于耗散由紧凑型电子装置所产生的热的方法,所述方法包括使所述装置与根据权利要求1所述的制品接触。
25.用于耗散由紧凑型电子装置所产生的热的方法,所述方法包括使所述装置与根据权利要求16所述的组件接触。
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- 2016-05-27 JP JP2017561915A patent/JP2018518393A/ja active Pending
- 2016-05-27 KR KR1020177035084A patent/KR20180014722A/ko unknown
- 2016-05-27 CN CN201680031515.5A patent/CN107636826A/zh active Pending
- 2016-05-27 WO PCT/US2016/034618 patent/WO2016196279A2/en active Application Filing
- 2016-05-27 EP EP16804113.5A patent/EP3304588A4/en not_active Withdrawn
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2017
- 2017-11-13 US US15/811,185 patent/US10121725B2/en not_active Expired - Fee Related
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KR20180014722A (ko) | 2018-02-09 |
EP3304588A2 (en) | 2018-04-11 |
EP3304588A4 (en) | 2019-01-09 |
JP2018518393A (ja) | 2018-07-12 |
TW201704008A (zh) | 2017-02-01 |
WO2016196279A2 (en) | 2016-12-08 |
WO2016196279A3 (en) | 2017-01-12 |
US10121725B2 (en) | 2018-11-06 |
US20180068924A1 (en) | 2018-03-08 |
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