US7108471B2 - Transporting tool for object to be tested, and object-to-be-tested transporting system - Google Patents

Transporting tool for object to be tested, and object-to-be-tested transporting system Download PDF

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Publication number
US7108471B2
US7108471B2 US10/793,188 US79318804A US7108471B2 US 7108471 B2 US7108471 B2 US 7108471B2 US 79318804 A US79318804 A US 79318804A US 7108471 B2 US7108471 B2 US 7108471B2
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Prior art keywords
tested
transporting
groove
transporting tool
wafer
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US10/793,188
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US20050005702A1 (en
Inventor
Yasuhiro Osuga
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Definitions

  • the present invention relates to a transporting tool suitably used in a probe apparatus or the like to transport an object to be tested (e.g., wafer), and a transporting system to transport the object to be tested. More specifically, the present invention relates to a transporting tool and a transporting system which can transport even a non-fixed-form object to be tested (e.g., a cracked wafer).
  • a transporting tool suitably used in a probe apparatus or the like to transport an object to be tested (e.g., wafer)
  • a transporting system to transport the object to be tested. More specifically, the present invention relates to a transporting tool and a transporting system which can transport even a non-fixed-form object to be tested (e.g., a cracked wafer).
  • the present invention can be applied to various types of apparatuses to process or test an object to be tested, e.g., a wafer itself, or a plurality of semiconductor elements or liquid crystal elements formed on the wafer.
  • FIGS. 7A and 7B show an example of the probe apparatus.
  • the probe apparatus has a loader chamber 1 from which a fixed-form wafer W′ is transported, and a prober chamber 2 where the electrical characteristics of the fixed-form wafer W′ transferred from the loader chamber 1 are tested.
  • a cassette storing portion 3 where a cassette C which stores the fixed-form wafer W′ is placed, a transporting arm (to be referred to as fork hereinafter) 4 which transports the fixed-form wafer W′ to the loader chamber 1 , and a sub chuck 5 are disposed in the loader chamber 1 .
  • the sub chuck 5 prealigns the position of the wafer with reference to its orientation flat while transporting the fixed-form wafer W′ with the fork 4 .
  • An object-to-be-tested stage table (to be referred to as a main chuck hereinafter) 6 where the prealigned fixed-form wafer W′ received from the fork 4 is to be placed, an aligning mechanism (to be referred to as an alignment mechanism hereinafter) 7 to accurately align the fixed-form wafer W′ on the main chuck 6 , and a probe card 8 having a large number of probes 8 A which come into electrical contact with the electrode pads of the fixed-form wafer W′ aligned by the alignment mechanism 7 are disposed in the prober chamber 2 .
  • the main chuck 6 has a mechanism to move in the X, Y, Z, and ⁇ directions.
  • the probe card 8 is fixed to a head plate 2 A arranged on the upper surface of the prober chamber 2 .
  • the alignment mechanism 7 has a lower CCD camera 7 A, upper CCD camera 7 B, and control device.
  • the lower CCD camera 7 A is provided to the main chuck 6 , and photographs the images of the probes 8 A of the probe card 8 from below.
  • the upper CCD camera 7 B is disposed at the center of an alignment bridge ( 7 C), and photographs the image of the fixed-form wafer W′ on the main chuck 6 from above.
  • the photographed images of the probes 8 A and fixed-form wafer W′ are displayed on a monitor screen 9 A of a display device 9 .
  • the alignment bridge 7 C moves from the deepest portion (the upper portion in FIG.
  • a target 7 E which can move forward to above the lower CCD camera 7 A and backward from it is provided to the main chuck 6 .
  • the lower CCD camera 7 A photographs the images of the needle points of the probes 8 A and obtains the heights of the needle points.
  • the optical axis of the lower CCD camera 7 A is set to coincide with the optical axis of the upper CCD camera 7 B through the target 7 E.
  • the position of the main chuck 6 at this time is used as a reference position when aligning the fixed-form wafer W′ and probes 8 A.
  • a test head T is swingably disposed in the prober chamber 2 .
  • the test head T is electrically connected to the probe card 8 through an interface (not shown).
  • a signal from a tester is transmitted to the electrode pads of the fixed-form wafer W′ through the test head T and probes 8 A.
  • the electrical characteristics of a plurality of semiconductor elements (to be also described as chips hereinafter) formed on the fixed-form wafer W′ are tested with this signal.
  • the loader chamber 1 has a wafer storing table (to be described as an unload table hereinafter) 10 .
  • the unload table 10 can be inserted in and extracted from the front surface of the loader chamber 1 .
  • the unload table 10 is used when, e.g., testing a monitor wafer W′′.
  • a wafer may be cracked. As the cracked wafer has a diameter smaller than that of the fixed-form wafer, it cannot be stored in the cassette C or automatically extracted from the cassette C. Wafers to be tested are limited to, e.g., fixed-form wafers W′ having circular shapes or the like. Cracked wafers other than the fixed-form wafers W′ or other non-fixed-form wafers cannot be tested.
  • a non-fixed-form object to be tested can be automatically transported between an object-to-be-tested storing table and a main chuck by only storing the non-fixed-form object to be tested in the object-to-be-tested storing table.
  • a very safe transporting tool and transporting system to transport an object to be tested can be provided.
  • the object to be tested has either one of a non-fixed form (W) and fixed form (W′)
  • the transporting arm comprises a first opening ( 4 A) for evacuation on a surface ( 4 B) where the object to be tested is to be placed
  • the object-to-be-tested stage table has a third groove ( 6 A), on a surface ( 6 B) where the object to be tested is to be placed, to draw the object to be tested by vacuum suction.
  • the transporting tool comprises:
  • a first through hole ( 112 ) formed between the first surface and the second surface, which is opposite to the first surface, of the main body, one end of the first through hole being open to the first groove and the other end thereof being open to the second opening;
  • At least one second through hole ( 114 ) which connects the second and first grooves of the main body.
  • an object-to-be-tested transporting system for transporting an object to be tested (W, W′) to and from an object-to-be-tested stage table ( 6 ).
  • the object to be tested has either one of a non-fixed form (W) and fixed form (W′), and the object-to-be-tested stage table has a third groove ( 6 A), on a surface ( 6 B) where the object to be tested is to be placed, to draw the object to be tested by vacuum suction.
  • the object-to-be-tested system comprises:
  • (A1) a main body ( 11 A) having a first surface ( 11 B) to place the object to be tested thereon;
  • (A4) a first through hole ( 112 ) formed between the first surface and the second surface, which is opposite to the first surface, of the main body, one end of the first through hole being open to the first groove and the other end thereof being open to the second opening;
  • a transporting arm ( 4 ) which draws by suction, holds, and transports the transporting tool ( 11 ) where the object to be tested is placed, the transporting arm comprising a first opening ( 4 A) for evacuation on a surface ( 4 B) where the object to be tested is to be placed.
  • the transporting tool and transporting system described above preferably comprise at least one of the following items:
  • FIG. 1 is a perspective view showing the concept of a wafer transporting system according to an embodiment of the present invention
  • FIGS. 2A and 2B are views showing the wafer transporting tool shown in FIG. 1 , in which FIG. 2A is a plan view showing the upper surface of the same, and FIG. 2B is a plan view showing the lower surface of the same;
  • FIGS. 3A and 3B are views showing the relationship between the annular groove and first through holes of the wafer transporting tool shown in FIGS. 2A and 2B , in which FIG. 3A is a plan view showing the main part of the same, and FIG. 3B is a sectional view taken along the line IIIB—IIIB of FIG. 3A ;
  • FIGS. 4A and 4B are views showing an unload table in the wafer transporting system of the present invention, in which FIG. 4A is a plan view showing the upper surface of the same, and FIG. 4B is a sectional view taken along the line IVB—IVB of FIG. 4A ;
  • FIG. 5 is a plan view showing the relationship between a transporting arm and the first through holes of the wafer transporting tool shown in FIGS. 2A and 2B ;
  • FIGS. 6A and 6B are views showing an example of a probe apparatus that employs the transporting system of the present invention, in which FIG. 6A is a partially cutaway front view of the same, and FIG. 6B is a plan view showing the internal arrangement of the same; and
  • FIGS. 7A and 7B are views showing an example of a conventional probe apparatus, in which FIG. 7A is a partially cutaway front view of the same, and FIG. 7B is a plan view showing the internal arrangement of the same.
  • the present invention can be applied to various types of apparatus to process or test an object to be tested, e.g., a wafer itself, or a plurality of semiconductor elements or liquid crystal elements on the wafer.
  • a transporting tool to transport a wafer and a transporting system which transports the wafer can be suitably used in the probe apparatus.
  • This probe apparatus can be basically formed in the same manner as the probe apparatus shown in FIGS. 7A and 7B .
  • the transporting tool and transporting system according to this embodiment will be described with reference to FIGS. 7A and 7B as well.
  • a main body 11 A of a transporting tool 11 can be formed of, e.g., a ceramic flat plate.
  • the transporting tool 11 with a non-fixed-form wafer (e.g., in FIG. 1 , a cracked wafer from which a portion indicated by a cracked line is missing) W being placed on it, is transported between an object-to-be-tested stage table (to be referred to as a main chuck hereinafter) 6 and unload table 10 through a transporting arm (to be referred to as fork hereinafter) 4 .
  • a transporting arm to be referred to as fork hereinafter
  • the transporting tool (to be referred to as the wafer transporting tool hereinafter) 11 with the non-fixed-form wafer (to be also referred to as the cracked wafer hereinafter) W being placed on it, is placed on the unload table 10 .
  • the fork 4 move the transporting tool carrying the cracked wafer W from the unload table 10 onto the main chuck 6 .
  • the main chuck 6 moves in the X, Y, and Z directions, so that the cracked wafer W on the transporting tool 11 can be tested.
  • the fork 4 transport the transporting tool 11 together with the cracked wafer W from the main chuck 6 to the unload table 10 .
  • the fork 4 and main chuck 6 are connected to a vacuum pump through pipes 4 C and 6 C, respectively.
  • the fork 4 have at least one first opening 4 A in their upper surface.
  • the first opening 4 A can be connected to an exhaust device (vacuum pump) through an exhaust channel ( 4 C).
  • the upper surface of the main chuck 6 can have a plurality of annular third grooves 6 A to draw the wafer W or transporting tool 11 by vacuum suction.
  • the third grooves 6 A are connected to the exhaust device (vacuum pump) through an exhaust channel ( 6 C).
  • the transporting tool 11 can be formed of a ceramic member having a shape larger than that of a fixed-form wafer (e.g., a complete wafer) W′.
  • the transporting tool 11 has a first groove 111 formed at substantially the center of its first surface 11 B, first through holes 112 , and second grooves 113 and second through holes 114 formed in its second surface 11 C.
  • first through holes 112 One end of each first through hole 112 is connected to a second opening 112 A, and the other end thereof is open to the first groove 111 .
  • the second through holes 114 allow the first and second grooves 111 and 113 to communicate with each other.
  • the first groove 111 has a plurality of (six in this embodiment) annular grooves 111 A formed concentrically (e.g., with concentric shapes), and first connection grooves 111 B which connect the annular grooves 111 A to each other.
  • the first connection grooves 111 B shown in FIG. 2A connect the four outer annular grooves.
  • the annular grooves 111 A can be formed in such a region that can reliably draw even a non-fixed-form wafer W having a comparatively small area due to its missing portion.
  • the minimum size of the cracked wafer W can be determined in advance.
  • the size of the cracked wafer W should be sufficient for covering the annular grooves 111 A.
  • the first connection grooves 111 B can extend in the radial direction, and can be formed equidistantly from each other in the circumferential direction.
  • the first through holes 112 can include eight holes consisting of pairs. Since the through holes 112 consist of pairs, evacuation from the through holes 112 can be performed smoothly.
  • the four pairs of through holes 112 can be so arranged as to interpose four intersections, i.e., the third annular groove 111 counted from the outer side and the first connection grooves 111 B.
  • FIGS. 3A and 3B show the relationship among the annular grooves 111 A, first connection grooves 111 B, and first through holes 112 in enlargement.
  • the positions of the first through holes 112 correspond to the openings 4 A of the fork 4 .
  • the first through holes 112 are located in the first openings 4 A of the fork 4 , so that the interior of the first groove 111 is evacuated through the first through holes 112 .
  • the first groove 111 can have second connection grooves 111 C which connect the five outer annular grooves 111 A to each other. As shown in FIG. 2A , the two second connection grooves 111 C can extend in the radial direction at positions where they do not overlap the first connection grooves 111 B. The second connection grooves 111 can be so formed as to be located on one straight line.
  • the second grooves 113 can be formed in the other sides of the second connection grooves 111 C. As shown in FIG. 1 , the second grooves 113 can be formed such that, when the transporting tool 11 is placed on the main chuck 6 , they may intersect the plurality of annular third grooves 6 A formed in the upper surface of the main chuck 6 .
  • the second through holes 114 can be formed at the intersections of the second connection grooves 111 C and five outer annular grooves 11 A.
  • the first groove 111 can be evacuated through the second grooves 113 and second through holes 114 .
  • four alignment lines 115 which determine the direction of the cracked wafer W can be formed on the first surface 11 B of the wafer transporting tool 11 .
  • the four alignment lines 115 extend from a position slightly outside the annular grooves 111 A to the outer circumference of the wafer transporting tool 11 radially, and intersect each other at the center of the annular grooves 11 A.
  • One of the four alignment lines 115 perpendicularly intersects the center of an orientation flat 116 .
  • the non-fixed-form wafer W is placed on the wafer transporting tool 11 such that its orientation flat 0 perpendicularly intersects the alignment line 115 .
  • the non-fixed-form wafer W lacks its orientation flat 0 , it is placed on the wafer transporting tool 11 such that the direction of the scrub line of the cracked wafer W is aligned with the direction of the corresponding alignment line 115 .
  • the transporting tool 11 can be made of a ceramic material into a wafer shape, as described above.
  • the entire surface of the transporting tool can be covered with a material having good conductivity, e.g., gold or a gold alloy. This covering process can be performed by, e.g., a metal deposition process.
  • the ceramic-made transporting tool 11 can cope with high-temperature testing of the non-fixed-form wafer W. When the entire surface of the wafer transporting tool 11 is covered with a conductive material, the non-fixed-form wafer W during testing can be set at ground potential.
  • the unload table 10 can have a substantially rectangular shape, as shown in FIG. 4A .
  • Positioning arrows 101 corresponding to the alignment lines 115 of the wafer transporting tool 11 can be arranged on the surface of the unload table 10 .
  • the arrows as the alignment means can be arranged at two positions spaced apart from each other by 180° in the circumferential direction. Accordingly, even when a sub chuck 5 (see FIGS. 7A and 7B ) is not used, if the alignment lines 115 of the transporting tool 11 are aligned with the arrows 101 , the direction of the transporting tool 11 and accordingly the direction of the non-fixed-form wafer W can be aligned by only placing the transporting tool 11 on the unload table 10 . At this time, the orientation flat 116 of the transporting tool 11 coincides with the position of “FLAT” engraved on the unload table 10 .
  • a circular disk-like wafer stage portion 102 is formed at the center of the unload table 10 .
  • the wafer stage portion 102 can have a plurality of wafer supports 102 A which form steps and have different diameters.
  • the respective wafer supports 102 A support the peripheral portions of the wafer transporting tool 11 and of the fixed-form wafer.
  • An arm entering portion 102 B is formed at the center of the wafer stage portion 102 in the back-and-forth direction, as indicated by an alternate long and short dashed line in FIGS. 4A and 4B .
  • the fork 4 enter and retreat from the arm entering portion 102 B.
  • the bottom surface of the arm entering portion 102 B is lower than the lowest wafer support 102 A.
  • the wafer transporting tool 11 is supported by the wafer support 102 A indicated by hatched lines.
  • the wafer transporting system of this embodiment can have the unload table 10 which can move forward and backward in a loader chamber 1 , the fork 4 which transport the transporting tool 11 and non-fixed-form wafer W placed inside the unload table 10 , and the main chuck 606 which places thereon the transporting tool 11 and cracked wafer W transported from the fork 4 .
  • the main chuck 6 draws and holds the transporting tool 11 and cracked wafer W simultaneously by vacuum suction.
  • the unload table 10 is pulled out from the front surface of the loader chamber 1 .
  • the wafer transporting tool 11 is placed on the wafer supports 102 A of the wafer stage portion 102 of the unload table 10 .
  • the alignment lines 115 of the wafer transporting tool 11 are aligned with the arrows 101 of the wafer stage portion 102 .
  • the cracked wafer W is placed on the wafer transporting tool 11 .
  • the orientation flat 0 of the cracked wafer W is set to perpendicularly intersect the corresponding alignment line 115 of the wafer transporting tool 11 .
  • the scrub line of the cracked wafer W is aligned with the direction of the corresponding alignment line 115 .
  • the unload table 10 is stored in the loader chamber.
  • the probe apparatus is driven through a control device.
  • the fork 4 enter the arm entering portion 102 B of the unload table 10 , and move upward slightly, as shown in FIGS. 4A and 4B .
  • the wafer transporting tool 11 is placed on the fork 4 .
  • the openings 4 A of the fork 4 coincide with the first through holes 112 of the wafer transporting tool 11 , as shown in, e.g., FIG. 5 .
  • the alignment lines 115 are arranged with a shift of 90° from each other in the circumferential direction.
  • the openings 4 A of the fork 4 and the first through holes 112 coincide, as indicated by an alternate long and short dashed line in FIG. 5 .
  • the exhaust device is driven under the control of the control device.
  • the interior of the first groove 111 is evacuated through the openings 4 A of the fork 4 and the first through holes 112 , so that the cracked wafer W and wafer transporting tool 11 are drawn by suction and fixed on the fork 4 .
  • the fork 4 move backward from the unload table 10 .
  • the fork 4 change their direction by 90°, and enter the prober chamber 2 .
  • the main chuck 6 in the prober chamber 2 is preferably ready to receive the cracked wafer W.
  • elevating pins (not shown) of the main chuck 6 move upward, and simultaneously evacuation of the fork 4 is stopped.
  • the elevating pins lift the wafer transporting tool 11 off the fork 4
  • the fork 4 move backward from the prober chamber 2 .
  • the wafer transporting tool 11 is placed on the main chuck 6 .
  • the second grooves 113 of the transporting tool 11 intersect the third grooves 6 A of the main chuck 6 .
  • the control device actuates the exhaust device of the main chuck 6 , thus evacuating the third grooves 6 A.
  • the interior of the first groove 111 is pressure-reduced through the second through holes 114 of the transporting tool 11 , and the cracked wafer W and wafer transporting tool 11 are drawn by suction and fixed on the main chuck 6 .
  • the main chuck 6 moves to the probe center, and an alignment mechanism 7 is actuated.
  • An alignment bridge 7 C moves forward to the probe center.
  • An upper CCD camera 7 B photographs the image of the cracked wafer W, automatically recognizes the state of arrays of the semiconductor elements in the cracked wafer W, and grasps the test target of the semiconductor elements.
  • the main chuck 6 moves in the X and Y directions to cause the electrodes of the respective semiconductor elements inside the cracked wafer W to come into contact with the corresponding electrodes of the probe card, so that the electrical characteristics of the semiconductor elements are tested sequentially.
  • the main chuck 6 moves to a transfer position for the cracked wafer W.
  • the exhaust device of the main chuck 6 stops, and the elevating pins move upward to lift the wafer transporting tool 11 off the main chuck 6 .
  • the fork 4 move forward to a space between the main chuck 6 and the lifted wafer transporting tool 11 .
  • the exhaust device of the fork 4 is driven, and the elevating pins move downward.
  • the fork 4 receive the cracked wafer W together with the wafer transporting tool 11 , and move along a path opposite to the path for test start, to return the cracked wafer W together with the wafer transporting tool 11 to the unload table 10 .
  • the series of tests is ended.
  • the transporting tool 11 is placed on the unload table 10 , and the cracked wafer W is placed on the transporting tool 11 . Then, the transporting tool 11 together with the cracked wafer W inside the unload table 10 can be automatically transported to the main chuck through the fork 4 and main chuck 6 .
  • the fork 4 can return the wafer transporting tool 11 and cracked wafer W from the main chuck 6 to the unload table 10 automatically.
  • the cracked wafer W need not be placed on the main chuck 6 manually by opening the prober chamber 2 .
  • the cracked wafer W need not be recovered from the main chuck 6 manually, so that safety in the test can be ensured.
  • the first groove 111 can have the six concentric annular grooves 111 A and the first connection grooves 111 B which connect the annular grooves 111 A.
  • all the annular grooves 111 A and first connection grooves 111 B can be evacuated reliably by only evacuating them through the fork 4 and first through holes 112 , so that the wafer transporting tool 11 and cracked wafer W can be drawn by suction and fixed on the fork 4 reliably.
  • the first groove 111 has the second connection grooves 111 C which connect the second through holes 114 to each other.
  • all the annular grooves 111 A and first and second connection grooves 111 B can be evacuated reliably by only evacuating the second through holes 114 through the main chuck 6 , so that both the wafer transporting tool 11 and the cracked wafer W can be drawn by suction and fixed on the main chuck 6 reliably.
  • the alignment lines 115 which determine the direction of the cracked wafer W are formed on the surface of the transporting tool 11 , and the arrows 101 corresponding to the alignment lines 115 are formed on the surface of the unload table 10 .
  • the wafer transporting tool 11 and cracked wafer W can be prealigned.
  • a non-fixed-form wafer such as a cracked wafer can be automatically transported between the wafer storing table and main chuck (test stage) by only storing it in the wafer storing table.
  • a transporting tool to transport a wafer, and transporting system, which can test a non-fixed-form wafer reliably and safely, can be provided.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
US10/793,188 2001-09-06 2004-03-05 Transporting tool for object to be tested, and object-to-be-tested transporting system Expired - Lifetime US7108471B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001271059A JP4846943B2 (ja) 2001-09-06 2001-09-06 ウエハ搬送具及びウエハ搬送システム
JP2001-271059 2001-09-06
PCT/JP2002/008474 WO2003023845A1 (fr) 2001-09-06 2002-08-22 Porte-specimen, et dispositif de transfert correspondant

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US7108471B2 true US7108471B2 (en) 2006-09-19

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EP (1) EP1429379A4 (ja)
JP (1) JP4846943B2 (ja)
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Cited By (6)

* Cited by examiner, † Cited by third party
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US10626038B1 (en) * 2011-05-27 2020-04-21 Pittsburgh Glass Works, Llc Multi-stage glass pressing systems and methods
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TWI664130B (zh) * 2016-01-29 2019-07-01 旺矽科技股份有限公司 晶圓匣
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US8281674B2 (en) * 2005-08-26 2012-10-09 Camtek Ltd. Wafer inspection system and a method for translating wafers [PD]
US20130115030A1 (en) * 2005-08-26 2013-05-09 Camtek Ltd. Wafer inspection system and a method for translating wafers
US8573077B2 (en) * 2005-08-26 2013-11-05 Camtek Ltd. Wafer inspection system and a method for translating wafers
US20090250202A1 (en) * 2005-10-17 2009-10-08 Markus Eibl Hybrid Chuck
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US20110073776A1 (en) * 2009-09-30 2011-03-31 Kyocera Corporation Attraction member, and attraction device and charged particle beam apparatus using the same
US8698099B2 (en) * 2009-09-30 2014-04-15 Kyocera Corporation Attraction member, and attraction device and charged particle beam apparatus using the same
US10626038B1 (en) * 2011-05-27 2020-04-21 Pittsburgh Glass Works, Llc Multi-stage glass pressing systems and methods
US11688623B2 (en) 2019-08-21 2023-06-27 Samsung Electronics Co., Ltd. Wafer inspection apparatuses

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US20050005702A1 (en) 2005-01-13
WO2003023845A1 (fr) 2003-03-20

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