Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/04—Polysiloxanes
  • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/04—Polysiloxanes
  • C08G77/06—Preparatory processes
  • C08G77/08—Preparatory processes characterised by the catalysts used
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02107—Forming insulating materials on a substrate
  • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
  • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
  • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
  • H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02107—Forming insulating materials on a substrate
  • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
  • H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
  • H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
  • H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
  • H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02107—Forming insulating materials on a substrate
  • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
  • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
  • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
  • H01L21/312—Organic layers, e.g. photoresist
  • H01L21/3121—Layers comprising organo-silicon compounds
  • H01L21/3122—Layers comprising organo-silicon compounds layers comprising polysiloxane compounds
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
  • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
  • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
  • H01L23/5329—Insulating materials
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/12—Passive devices, e.g. 2 terminal devices
  • H01L2924/1204—Optical Diode
  • H01L2924/12044—OLED

Definitions

• the present invention relates generally to siloxane-based resins, and more specifically to the synthesis of novel siloxane based resins and the low dielectric constant films formed therefrom.
• Semiconductor devices often have one or more arrays of patterned interconnect levels that serve to electrically couple the individual circuit elements thus forming an integrated circuit (IC). These interconnect levels are typically separated by an insulating or dielectric film.
• IC integrated circuit
• dielectric film typically separated by an insulating or dielectric film.
• CVD chemical vapor deposition
• PECVD plasma enhanced CVD
• dielectric films formed from siloxane based resins are becoming widely used.
• One such family of films formed from siloxane based resins are the films derived from hydrogen silsesquioxane (HSQ) resins (See, U.S. Pat. No. 3,615,272, Oct. 19, 1971, Collins et al.; and U.S. Pat. No. 4,756,977, Jul.
• HSQ hydrogen silsesquioxane
• the dielectric constant of such insulating films is an important factor where IC's with low power consumption, cross-talk, and signal delay are required. As IC dimensions continue to shrink, this factor increases in importance.
• siloxane based resin materials, and methods for making such materials, that can provide insulating films with dielectric constants below 3.0 are very desirable.
• siloxane-based resins and methods for making, to provide low dielectric constant films via standard processing techniques.
• curing processes that require an ammonia or ammonia derivative type of atmosphere (See, U.S. Pat. No. 5,145,723, Sep. 8, 1992, Ballance et al.), an ozone atmosphere (See, U.S. Pat. No. 5,336,532, Haluska et al.), or other non-standard type of semiconductor process, are avoided.
• organohydridosiloxane resins and methods for making such resins, are provided. Solutions of such organohydridosiloxane resins are employed for forming caged siloxane polymer films useful in the fabrication of a variety of microelectronic devices, particularly semiconductor integrated circuits.
• organohydridosiloxane resins of the present invention have one of the four general formulae:
• n and m are from about 8 to about 5000 and m is selected such that the organic substituent is present to about 40 Mole percent (Mol %) or greater;
• the sum of x, y and z is from about 8 to about 5000 and y is selected such that the organic substituent is present to about 40 mole percent (Mol %) or greater;
• R is selected from substituted and unsubstituted groups including normal and branched alkyl groups, cycloalkyl groups, aryl groups, and mixtures thereof;
• Polymers in accordance with the present invention have a caged structure with a polymer backbone encompassing alternate silicon and oxygen atoms.
• each backbone silicon atom is bonded to at least three backbone oxygen atoms.
• polymers of the present invention have essentially no hydroxyl or alkoxy groups bonded to backbone silicon atoms. Rather, each silicon atom, in addition to the aforementioned backbone oxygen atoms, is bonded only to hydrogen atoms and/or the ⁇ R ⁇ groups defined in Formulae 1, 2, 3 and 4.
• organohydridosiloxane resin solutions in accordance with the present invention is enhanced as compared to solutions of previously known organosiloxane resins.
• the synthesis of the organohydridosiloxane compositions of this invention include a dual phase solvent system using a catalyst.
• the starting materials encompass trichlorosilane and one or more organotrichlorosilanes, for example either an alkyl or an aryl substituted trichlorosilane.
• the methods of this invention include mixing a solution of at least one organotrihalosilane and hydridotrihalosilane to form a mixture; combining the mixture with a dual phase solvent which includes both a non-polar solvent and a polar solvent; adding a catalyst to the dual phase solvent and trihalosilane mixture, thus providing a dual phase reaction mixture; reacting the dual phase reaction mixture to produce an organohydridosiloxane; and recovering the organohydridosiloxane from the non-polar portion of the dual phase solvent system.
• additional steps may include washing the recovered organohydridosiloxane to remove any low molecular weight species, and fractionating the organohydridosiloxane product to thereby classify the product according to molecular weight.
• the catalyst is a phase transfer catalyst including, but not limited to, tetrabutylammonium chloride and benzyltrimethylammonium chloride.
• the catalyst is a solid phase catalyst, such as Amberjet 4200 or Amberlite I-6766 ion exchange resin (Rohm and Haas Company, Philadelphia, Pa.).
• the mount of organotrihalosilane monomer present is an amount sufficient to provide an as-cured dielectric film having an organic content of at least approximately 40 Mol % carbon containing substituents.
• Such dielectric films formed in accordance with the present invention advantageously provide low dielectric constants, typically less than 2.7. Additionally, dielectric films in accordance with the organohydridosiloxane compositions of this invention exhibit thermal stability permitting cure temperatures of about 425 degrees Centigrade (° C.) or greater.
• organohydridosiloxane resins of the present invention have one of the four general formulae:
• n and m are from about 8 to about 5000 and m is selected such that the organic substituent is present to about 40 Mole percent (Mol %) or greater;
• the sum of x, y and z is from about 8 to about 5000 and y is selected such that the organic substituent is present to about 40 mole percent (Mol %) or greater;
• R is selected from substituted and unsubstituted groups including normal and branched alkyl groups, cycloalkyl groups, aryl groups, and mixtures thereof;
• the substituted and unsubstituted normal and branched alkyl groups have between about 1 and 20 carbons; the substituted and unsubstituted cycloalkyl groups have between about 4 and 10 carbons and the substituted and unsubstituted aryl groups have between about 6 and 20 carbons.
• ⁇ R ⁇ is an alkyl group
• ⁇ R ⁇ includes but is not limited to methyl, chloromethyl and ethyl groups, and the normal and branched propyl, 2-chloropropyl, butyl, pentyl and hexyl groups.
• ⁇ R ⁇ is a cycloalkyl group
• ⁇ R ⁇ includes but is not limited to cyclopentyl, cyclohexyl, chlorocyclohexyl and cycloheptyl groups
• ⁇ R ⁇ is an aryl group
• ⁇ R ⁇ includes but is not limited to phenyl, naphthyl, tolyl and benzyl groups.
• the specific carbon content of any specific organohydridosiloxane resin, in accordance with this invention is a function of the mole ratio of organotrihalosilane(s) to hydridotrihalosilane starting materials employed.
• a resin in accordance with the present invention having a carbon containing substituent present in an amount of at least 40 Mol % is provided.
• embodiments in accordance with the present invention are polymers having a caged structure with a polymer backbone encompassing alternate silicon and oxygen atoms.
• each backbone silicon atom is bonded to at least three backbone oxygen atoms to form the aforementioned cage structure.
• Essentially all additional silicon bonds are only to hydrogen and the organic substituents defined in Formulae 1, 2, 3 and 4.
• polymers of the present invention have essentially no hydroxyl or alkoxy groups bonded to backbone silicon atoms and cross-linking reactions are suppressed.
• organosiloxane resins have high levels of alkoxy groups bonded to backbone silicon atoms, thus significant hydrolysis to form silanol groups is observed.
• This hydrolysis results in higher dielectric constants for the as-cured polymer films formed from these previously known resins, as well as reduced shelf life of solutions of these resins. The latter due to unwanted chain lengthening and cross-linking.
• the synthesis of the organohydridosiloxane compositions of this invention include a dual phase solvent system using a catalyst.
• the starting materials encompass trichlorosilane and one or more organotrichlorosilanes, for example organotrichlorosilanes having the substituted and unsubstituted groups defined with respect to Formulae 1 to 4, above.
• the catalyst is a phase transfer catalyst including, but not limited to, tetrabutylammonium chloride and benzyltrimethylammonium chloride.
• a phase transfer catalyst including, but not limited to, tetrabutylammonium chloride and benzyltrimethylammonium chloride.
• bromide, iodide, fluoride or hydroxide anions are employed in some embodiments in place of the previously mentioned chloride anions.
• the phase transfer catalyst is introduced into the reaction mixture and the reaction is allowed to proceed to the desired degree of polymerization.
• the catalyst is a solid phase catalyst, such as Amberjet 4200 or Amberlite I-6766 ion exchange resin (Rohm and Haas Company, Philadelphia, Pa.).
• Amberjet 4200 and Amberlite I-6766 are basic anion exchange resins.
• the resin facilitates the hydrolysis of the Si--Cl bonds of the monomer to Si--OH. The hydrolysis is followed by condensation of two Si--OH moieties to provide an Si--O--Si bond.
• a dual phase solvent system includes a continuous phase non-polar solvent and a polar solvent.
• the non-polar solvent includes, but is not limited to, any suitable aliphatic or aromatic compounds or a mixture of any or all such suitable compounds, the operational definition of "suitable” in the present context includes the functional characteristics of:
• non-polar solvents include, but are not limited to, pentane, hexane, heptane, cyclohexane, benzene, toluene, xylene, halogenated solvents such as carbon tetrachloride and mixtures thereof.
• the polar phase is immiscible with the non-polar solvent phase, and includes water, alcohols, and alcohol and water mixtures.
• the amount of alcohol present is sufficient to ensure sufficient solubility of the organotrihalosilane monomers.
• a polar solvent to non-polar solvent ratio of between about 5 percent weight to weight (% w/w) to 80% w/w is desirable and between about 9% w/w to about 40% w/w preferred.
• Exemplary alcohols and other polar solvents suitable for use in the polar phase include, but are not limited to, water, methanol, ethanol, isopropanol, glycerol, diethyl ether, tetrahydrofuran, diglyme and mixtures thereof.
• the polar solvent includes a water/alcohol mixture wherein the water is present in an amount sufficient to preferentially solubilize ionic impurities not soluble in alcohol, and/or preclude solvent extraction of product compounds that might otherwise be soluble in alcohol.
• the polar solvent phase advantageously retains the hydrochloric acid (HCl) condensation product and any metal salt or other ionic contaminants, that may be present. As essentially all ionic contaminants are retained in the polar solvent phase, the organohydridosiloxane product of this invention is of high purity and contains essentially no ionic contaminants.
• the methods of the present invention also provide for high purity organohydridosiloxane product by avoiding sources of ionic contamination.
• methods in accordance with the present invention do not employ metal catalysts or very strong inorganic acids, e.g. fuming sulfuric acid. In this manner, the extraction or leaching of metal contaminants by such strong acids or inclusion of metal catalyst residues are avoided and high purity organohydridosiloxane product obtained.
• a mixture of the organic and hydridosilanes (e.g. trichlorosilane and methyltrichlorosilane) is added to a mixture of catalyst, hydrocarbon solvent, alcohol and water.
• the mixture is filtered, the water is separated, the solution is dried and then evaporated to leave a white solid.
• This solid is slurried in hydrocarbon solvent to remove monomer and then evaporated to leave desired product that can be formulated in a suitable solvent for use as a spin-on polymer.
• the molecular weight (Mw) of the product produced can be varied between 400 and 200,000 atomic mass units (amu) depending on the reaction conditions. It has been found that materials with a Mw of between approximately 5,000 to 60,000 amu are desirable. It has also been found that materials with a Mw of between approximately 10,000 to 50,000 amu are somewhat more desirable and materials with a Mw of between approximately 20,000 to 40,000 amu are most desirable.
• Film Thickness Film thickness is measured using a calibrated Nanospec® AFT-Y CTS-102 model 010-180 Film Thickness Measurement System available from Nanometrics, Co. An average of measurements at five locations on a wafer are reported as the film thickness for each sample.
• MW Molecular Weight
• Dielectric constant is determined using the capacitance-voltage ("CV") measurement technique and employs a Hewlett-Packard Model 4061A semiconductor measurement system at a frequency of 1 MHz. This test procedure employs a metal-insulator-metal (MIM) structure with the thickness of each layer ranging from about 0.5 to 1 micron ( ⁇ m).
• CV capacitance-voltage
• MIM metal-insulator-metal
• a mixture of the organic and hydridosilanes (e.g. trichlorosilane and methyltrichlorosilane) is added to a mixture of catalyst, non-polar solvent, and polar solvent to form a reaction mixture.
• the polymerization reaction is allowed to proceed.
• the reaction mixture is filtered, the polar solvent is separated, and the solution is dried and then evaporated to leave a white solid. This solid may then be slurried in a hydrocarbon solvent to remove residual monomer, and finally evaporated to leave the desired product.
• organohydridosiloxanes are formulated in a suitable solvent for use as a spin-on-dielectric film.
• Examples 1 through 6 describe the synthesis of various methylhydridosiloxanes. These descriptions illustrate how the Mole percent of organic or carbon containing substituent, incorporated into the product resin, is controlled by adjusting the ratio of the relative amounts of starting monomers. It will be understood by one skilled in the art that the same means for controlling Mole percent of organic or carbon containing substituent in the methylhydridosiloxanes described can be employed for any other organohydridosiloxane species.
• a 6 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 5000 mL hexanes 720 mL ethanol, 65 mL water and 120 g of a 10% by weight tetrabutylammonium chloride hydrate solution in water.
• the mixture was equilibrated for 0.5 hr with stirring at 25° C.
• a mixture of trichlorosilane (377.4 g, 2.78 Mol) and methyltrichlorosilane (277.7 g, 1.86 Mol) were added to the reactor using a peristaltic pump over a period of 70 minutes. Upon completion of the silane addition, hexane was pumped through the lines for 10 minutes.
• the reaction was stirred for 2.3 hours, the ethanol/H 2 O layer was removed and then the remaining hexane solution filtered through a 3 micron ( ⁇ m) filter, followed by a 1 ⁇ m filter.
• the filtered solution was dried by flowing through a column of 4 ⁇ molecular sieves (800 g) for 2.5 h and then filtered through a 0.05 ⁇ m filter.
• the hexanes were removed using a rotary evaporator to give 111 g of a white solid product.
• the GPC of this product referenced to polystyrene standards, gave a Mw of 24,683 amu.
• a 250 mL Morton flask was fitted with a condenser and a stirrer connected to an Arrow 1750 motor. The flask was purged with N 2 and during the reaction N 2 was blown across the top of the condenser into an NaOH scrubber. 18 g of Amberjet 4200 (Cl) ion exchange resin catalyst, 20 mL of ethanol, 6.3 mL of water, and 250 mL of hexanes were added to the flask, and stirring was started. Trichlorosilane (6.7 g, 0.05 Mol) and methyltrichlorosilane (8.24 g, 0.05 mol) were combined together in an HDPE bottle.
• a 6 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 5000 mL hexanes 720 mL ethanol, 50 mL water and 120 g of a 100% by weight tetrabutylammonium chloride hydrate solution in water. This mixture was equilibrated for 0.5 hr with stirring at 25° C.
• a mixture of trichlorosilane (251.6 g, 1.85 Mol) and methyltrichlorosilane (416.5 g, 2.78 Mol) were added to the reactor using a peristaltic pump over a period of 70 minutes. Upon completion of the silane addition, hexane was pumped through the lines for 10 minutes.
• a 250 mL Morton flask was fitted with a condenser and a stirrer connected to an Arrow 1750 motor. The flask was purged with N 2 and during the reaction N 2 was blown across the top of the condenser into an NaOH scrubber. 18 g of Amberjet 4200 (Cl) ion exchange resin catalyst, 20 mL of ethanol, 6.3 mL of water, and 250 mL of hexanes were added to the flask, and stirring was started. 4.5 mL of trichlorosilane (3.8 g, 0.028 Mol) and 16.0 mL of methyltrichlorosilane (12.6 g, 0.084 Mol) were combined together in an HDPE bottle.
• a 1 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 1000 mL hexanes, 80 mL ethanol, 25 mL water and 61.3 g Amberjet 4200 catalyst. The mixture was equilibrated for 0.5 hr with stirring at 25° C. (circulating bath).
• a mixture of trichlorosilane (14.3 mL, 0.142 Mol) and methyltrichlorosilane (66.7 mL, 0.568 Mol) was added to the reactor using a peristaltic pump over a period of 35 minutes. Upon completion of the silane addition, hexane was pumped through the lines for 10 minutes.
• a 1 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 1000 mL hexanes.
• 160 mL ethanol, 50 mL water and 4.0 g tetrabutylammonium chloride were mixed until all solids were dissolved.
• This mixture was added to the hexane in the reactor and equilibrated for 0.5 hr with stirring at 25° C.
• a mixture of trichlorosilane (14.4 mL, 0.142 Mol) and methyltrichlorosilane (150 mL, 1.278 Mol) was added to the reactor using a peristaltic pump over a period of 60 minutes.
• Examples 7 through 11 describe the synthesis of mixed substituent organohydridosiloxanes. These descriptions illustrate how more than one organic substituent is incorporated into the product resin while maintaining an 80 Mol % percent of organic containing substituent. It will be understood by one skilled in the art that other mixed substituent organohydridosiloxanes can be produced using the methods illustrated herein. In addition, it will be understood that by using the methods of Examples 1 to 6, mixed substituent organohydridosiloxanes having an organic molar content of other than 80 Mol % can also be produced.
• a 6 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 2025 mL hexanes 324 mL ethanol, 28 mL water and 81 g of a 10% by weight tetrabutylammonium chloride hydrate solution in water. This mixture was equilibrated for 0.5 hr with stirring at 25° C.
• a mixture of trichlorosilane (75 g, 0.55 Mol) and methyltrichlorosilane (135 g, 0.90 Mol) and phenyltrichlorosilane (300 g, 1.42 Mol) was added to the reactor using a peristaltic pump over a period of 53 minutes.
• a 6 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 4500 mL hexanes 720 mL ethanol, 63 mL water and 180 g of a 10% by weight tetrabutylammonium chloride hydrate solution in water. This mixture was equilibrated for 0.5 hr with stirring at 25° C.
• a mixture of trichlorosilane (173 g, 1.27 Mol) and methyltrichlorosilane (606 g, 4.05 Mol) and phenyltrichlorosilane (222 g, 0.95 Mol) were added to the reactor using a peristaltic pump over a period of 80 minutes.
• a 6 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 4500 mL hexanes 750 mL ethanol, 91 mL water and 180 g of a 100 by weight tetrabutylammonium chloride hydrate solution in water. This mixture was equilibrated for 0.5 hr with stirring at 25° C.
• a mixture of trichlorosilane (173 g, 1.27 Mol) and methyltrichlorosilane (573 g, 3.83 Mol) and t-butyltrichlorosilane (245 g, 1.27 Mol) were added to the reactor using a peristaltic pump over a period of 73 minutes.
• a 6 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 4500 mL hexanes 720 mL ethanol, 63 mL water and 180 g of a 10% by weight tetrabutylammonium chloride hydrate solution in water. This mixture was equilibrated for 0.5 hr with stirring at 25° C.
• a mixture of trichlorosilane (173 g, 1.27 Mol) and methyltrichlorosilane (573 g, 3.83 Mol) and t-butyltrichlorosilane (288 g, 1.27 Mol) were added to the reactor using a peristaltic pump over a period of 70 minutes.
• a 6 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 4500 mL hexanes 720 mL ethanol, 63 mL water and 180 g of a 10% by weight tetrabutylammonium chloride hydrate solution in water. This mixture was equilibrated for 0.5 hr with stirring at 25° C.
• a mixture of trichlorosilane (173 g, 1.27 Mol) and methyltrichlorosilane (573 g, 3.83 Mol) and chloromethyltrichlorosilane (236 g, 1.27 Mol) were added to the reactor using a peristaltic pump over a period of 70 minutes.
• Examples 12 to 16 illustrate alternate methods for the synthesis of 80 Mol % methylhydridosiloxane.
• alternate catalysts, solvents and reaction times are illustrative of the methods that can be readily employed by one of ordinary skill in the art to produce organohydridosiloxanes resins in accordance with the present invention. It will be understood that these methods can be used in the synthesis of other organohydridosiloxanes having other substituents and other Mole percent of organic substituent content.
• a 1 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 1000 mL hexanes.
• 160 mL ethanol, 50 mL water and 4.0 g tetrabutylammonium chloride were mixed until all solid was dissolved.
• This mixture was added to the hexane in the reactor and equilibrated for 0.5 hr with stirring at 25° C.
• a mixture of trichlorosilane (28.6 mL, 0.284 Mol) and methyltrichlorosilane (133 mL, 1.136 Mol) were added to the reactor using a peristaltic pump over a period of 75 minutes.
• a 6 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 4500 mL hexanes 720 mL ethanol, 63 mL water and 180 g of a 10% by weight benzyltrimethylammonium chloride solution in water. This mixture was equilibrated for 0.5 hr with stirring at 25° C.
• a mixture of trichlorosilane (96 g, 0.7 Mol) and methyltrichlorosilane (471 g, 3.15 Mol) were added to the reactor using a peristaltic pump over a period of 73 minutes. Upon completion of the silane addition, hexane was pumped through the lines for 10 minutes.
• a 6 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 4500 mL hexanes 720 mL ethanol, 63 mL water and 180 g of a 10% by weight tetrabutylammonium chloride solution in water. This mixture was equilibrated for 0.5 hr with stirring at 25° C.
• a mixture of trichlorosilane (96 g, 0.7 Mol) and methyltrichlorosilane (471 g, 3.15 Mol) were added to the reactor using a peristaltic pump over a period of 73 minutes. Upon completion of the silane addition, hexane was pumped through the lines for 10 minutes.
• a 6 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 4500 mL hexanes 720 mL ethanol, 63 mL water and 180 g of a 10% by weight tetrabutylammonium chloride hydrate solution in water. This mixture was equilibrated for 0.5 hr with stirring at 25° C.
• a mixture of trichlorosilane (96 g, 0.7 Mol) and methyltrichlorosilane (471 g, 3.15 Mol) were added to the reactor using a peristaltic pump over a period of 105 minutes. Upon completion of the silane addition, hexane was pumped through the lines for 10 minutes.
• a 6 L jacketed reactor equipped with a nitrogen inlet, dry ice condenser and a mechanical stirrer was charged with 4500 mL hexanes 720 mL ethanol, 63 mL water and 180 g of a 10% by weight tetrabutylammonium chloride hydrate solution in water. This mixture was equilibrated for 0.5 hr with stirring at 25° C.
• a mixture trichlorosilane (96 g, 0.7 Mol) and methyltrichlorosilane (471 g, 3.15 Mol) were added to the reactor using a peristaltic pump over a period of 105 minutes. Upon completion of the silane addition, hexane was pumped through the lines for 10 minutes.
• Example 17 illustrates the synthesis of a control hydridosiloxane having no organic content. This resin is shown for comparison dielectric constant measurements only.
• the organohydridosiloxane resins of Examples 5, 6, 8, 9, 12, 14 and 17 were formed into a coating solution and spin-coated onto a silicon substrate to form films having a nominal thickness of 4000 ⁇ . Films of Examples 5, 6, 8 and 9 were cured at 400 degrees Centigrade (° C.), films of Examples 12 and 14 were cured at 380° C., and additional samples of films of Example 14 were cured at 425° C. and 450° C. Films of Example 17, used as controls, were cured at each of the four temperatures and are referred to as Control #1 through #4, respectively. The dielectric constants of the films for each example are shown in Table 1, below.
• the present invention provides organohydridosiloxane polymer compositions having a caged conformation polymer backbone and a carbon containing substituent content of at least approximately 40 Mol %.
• the hydrido and organic substituents are bonded directly to backbone silicon atoms in the polymer allowing for essentially no hyroxyl or alkoxy groups thereby suppressing hydrolysis and the formation of silanol moieties. In this manner, subsequent chain extension via condensation of the silanol moieties is suppressed. It is evident that the very low levels of hydroxyl and alkoxy substituents, if any, and the absence of terminal silicon alkoxy or hydroxy groups provide for stable organohydridosiloxane solutions.
• the present invention includes a novel process for making the organohydridosiloxane polymer composition of this invention and includes a dual phase solvent system, a non-participating catalyst, and trihalosilane and organotrihalosilane Co-monomers. It is evident that the amount of carbon in the composition is controllable by the relative ratios of the Co-monomers. It is also evident that the complete absence of the acidic or metal catalysts typically employed to form the previously known HSQ resins and the use of a dual phase solvent system renders the product composition of the process extremely pure and free of metal salts, and other ionic contaminants.

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