CN109880583B - 一种导热有机硅粘合剂及其固化物和led元件 - Google Patents
一种导热有机硅粘合剂及其固化物和led元件 Download PDFInfo
- Publication number
- CN109880583B CN109880583B CN201910023634.1A CN201910023634A CN109880583B CN 109880583 B CN109880583 B CN 109880583B CN 201910023634 A CN201910023634 A CN 201910023634A CN 109880583 B CN109880583 B CN 109880583B
- Authority
- CN
- China
- Prior art keywords
- heat
- silicone adhesive
- conductive silicone
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 20
- 239000010703 silicon Substances 0.000 title claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 title abstract description 47
- 239000000853 adhesive Substances 0.000 title abstract description 44
- 239000013464 silicone adhesive Substances 0.000 claims abstract description 70
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 30
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 27
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 26
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000011231 conductive filler Substances 0.000 claims abstract description 23
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 11
- 229910020487 SiO3/2 Inorganic materials 0.000 claims abstract description 10
- 125000000962 organic group Chemical group 0.000 claims abstract description 10
- 239000002683 reaction inhibitor Substances 0.000 claims abstract description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 6
- 239000004593 Epoxy Substances 0.000 claims abstract description 4
- 239000002245 particle Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- -1 3- (2, 3-epoxypropoxy) propyl Chemical group 0.000 claims description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 8
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical group [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 239000000047 product Substances 0.000 description 33
- 238000000034 method Methods 0.000 description 23
- 229920000734 polysilsesquioxane polymer Polymers 0.000 description 17
- 229910020388 SiO1/2 Inorganic materials 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 238000004821 distillation Methods 0.000 description 12
- 125000003700 epoxy group Chemical group 0.000 description 11
- 229910020447 SiO2/2 Inorganic materials 0.000 description 10
- 239000012074 organic phase Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 238000009833 condensation Methods 0.000 description 8
- 230000005494 condensation Effects 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 239000007795 chemical reaction product Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 230000003301 hydrolyzing effect Effects 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 3
- 235000017557 sodium bicarbonate Nutrition 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 3
- 238000005491 wire drawing Methods 0.000 description 3
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- 238000005133 29Si NMR spectroscopy Methods 0.000 description 2
- 125000006374 C2-C10 alkenyl group Chemical group 0.000 description 2
- 125000000882 C2-C6 alkenyl group Chemical group 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000000498 ball milling Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 125000006832 (C1-C10) alkylene group Chemical group 0.000 description 1
- 125000006656 (C2-C4) alkenyl group Chemical group 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- OKDJUBJTKGOTCQ-UHFFFAOYSA-N triethoxy(oxiran-2-ylmethyl)silane Chemical compound CCO[Si](OCC)(OCC)CC1CO1 OKDJUBJTKGOTCQ-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- SEAZOECJMOZWTD-UHFFFAOYSA-N trimethoxy(oxiran-2-ylmethyl)silane Chemical compound CO[Si](OC)(OC)CC1CO1 SEAZOECJMOZWTD-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (19)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910023634.1A CN109880583B (zh) | 2019-01-10 | 2019-01-10 | 一种导热有机硅粘合剂及其固化物和led元件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910023634.1A CN109880583B (zh) | 2019-01-10 | 2019-01-10 | 一种导热有机硅粘合剂及其固化物和led元件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109880583A CN109880583A (zh) | 2019-06-14 |
CN109880583B true CN109880583B (zh) | 2021-06-22 |
Family
ID=66925865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910023634.1A Active CN109880583B (zh) | 2019-01-10 | 2019-01-10 | 一种导热有机硅粘合剂及其固化物和led元件 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109880583B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110819299B (zh) * | 2019-10-30 | 2021-12-28 | 北京康美特科技股份有限公司 | 导热有机硅粘合剂 |
CN114729192B (zh) * | 2020-07-07 | 2024-04-26 | 富士高分子工业株式会社 | 导热性有机硅凝胶组合物、导热性有机硅凝胶片材及其制造方法 |
CN113969132B (zh) * | 2021-11-05 | 2023-05-16 | 南京科矽新材料科技有限公司 | 一种适用于led高速固晶用有机硅固晶胶 |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3844992A (en) * | 1973-11-16 | 1974-10-29 | Dow Corning | Wood graining tool fast cure organopolysiloxane resins |
US5530060A (en) * | 1991-06-03 | 1996-06-25 | Shin-Etsu Chemical Co., Ltd. | Silicone composition capable of yeilding a cured product having good thermal conductivity |
CN1261384A (zh) * | 1997-04-21 | 2000-07-26 | 联合讯号公司 | 高有机含量的有机氢化硅氧烷树脂 |
EP1310521A1 (en) * | 2001-09-07 | 2003-05-14 | The Goodyear Tire & Rubber Company | Rubber compounds containing a polyhedral oligomeric silsesquioxanes |
CN101070387A (zh) * | 2007-06-06 | 2007-11-14 | 北京化工大学 | 含低聚倍半硅氧烷的低介电树脂及其制备方法 |
CN101337975A (zh) * | 2007-07-03 | 2009-01-07 | 东丽纤维研究所(中国)有限公司 | 多面体倍半硅氧烷纳米线 |
US7553904B2 (en) * | 1999-08-04 | 2009-06-30 | Hybrid Plastics, Inc. | High use temperature nanocomposite resins |
CN101962528A (zh) * | 2010-09-30 | 2011-02-02 | 烟台德邦科技有限公司 | 一种低粘度高导热率的双组分灌封硅胶及其制备方法 |
CN101974227A (zh) * | 2010-05-20 | 2011-02-16 | 复旦大学 | 一种低应力环氧/有机硅/poss纳米杂化材料及其制备方法和应用 |
CN102181159A (zh) * | 2011-03-15 | 2011-09-14 | 杭州师范大学 | 一种聚倍半硅氧烷补强的led封装有机硅橡胶及其制备方法 |
CN102898999A (zh) * | 2012-11-06 | 2013-01-30 | 江苏科技大学 | 用于电加热管件的密封胶 |
CN102977613A (zh) * | 2012-12-17 | 2013-03-20 | 肇庆皓明有机硅材料有限公司 | 一种无卤阻燃硅橡胶的制备方法 |
US8440763B2 (en) * | 2005-06-09 | 2013-05-14 | L'oreal S.A. | Cosmetic composition comprising silicone particles |
CN103992645A (zh) * | 2014-04-29 | 2014-08-20 | 深圳市明粤科技有限公司 | 一种led封装用高性能有机硅固晶材料 |
CN104745142A (zh) * | 2013-12-27 | 2015-07-01 | 蓝星有机硅(上海)有限公司 | Led封装用的固化性硅橡胶组合物 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7049044B2 (en) * | 2002-12-19 | 2006-05-23 | The University Of North Carolina At Charlotte | Nanocomposite negative resists for next generation lithographies |
US20040120915A1 (en) * | 2002-12-19 | 2004-06-24 | Kaiyuan Yang | Multifunctional compositions for surface applications |
CN101503420B (zh) * | 2009-03-20 | 2011-08-31 | 北京化工大学 | 一种八环氧基笼型倍半硅氧烷及其制备方法 |
CN101508698B (zh) * | 2009-04-01 | 2011-06-22 | 北京化工大学 | 一种四环氧基笼型倍半硅氧烷及其制备方法 |
CN101591518A (zh) * | 2009-06-30 | 2009-12-02 | 西安航天三沃化学有限公司 | 一种挠性覆铜板用倍半硅氧烷改性耐高温环氧胶粘剂 |
CN107815285A (zh) * | 2016-09-13 | 2018-03-20 | 烟台德邦先进硅材料有限公司 | 一种光电耦合器元件封装硅胶 |
CN107814935B (zh) * | 2017-10-31 | 2020-11-24 | 江南大学 | 一种poss基有机-无机杂化八臂环氧树脂及其制备方法 |
-
2019
- 2019-01-10 CN CN201910023634.1A patent/CN109880583B/zh active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3844992A (en) * | 1973-11-16 | 1974-10-29 | Dow Corning | Wood graining tool fast cure organopolysiloxane resins |
US5530060A (en) * | 1991-06-03 | 1996-06-25 | Shin-Etsu Chemical Co., Ltd. | Silicone composition capable of yeilding a cured product having good thermal conductivity |
CN1261384A (zh) * | 1997-04-21 | 2000-07-26 | 联合讯号公司 | 高有机含量的有机氢化硅氧烷树脂 |
US7553904B2 (en) * | 1999-08-04 | 2009-06-30 | Hybrid Plastics, Inc. | High use temperature nanocomposite resins |
EP1310521A1 (en) * | 2001-09-07 | 2003-05-14 | The Goodyear Tire & Rubber Company | Rubber compounds containing a polyhedral oligomeric silsesquioxanes |
US8440763B2 (en) * | 2005-06-09 | 2013-05-14 | L'oreal S.A. | Cosmetic composition comprising silicone particles |
CN101070387A (zh) * | 2007-06-06 | 2007-11-14 | 北京化工大学 | 含低聚倍半硅氧烷的低介电树脂及其制备方法 |
CN101337975A (zh) * | 2007-07-03 | 2009-01-07 | 东丽纤维研究所(中国)有限公司 | 多面体倍半硅氧烷纳米线 |
CN101974227A (zh) * | 2010-05-20 | 2011-02-16 | 复旦大学 | 一种低应力环氧/有机硅/poss纳米杂化材料及其制备方法和应用 |
CN101962528A (zh) * | 2010-09-30 | 2011-02-02 | 烟台德邦科技有限公司 | 一种低粘度高导热率的双组分灌封硅胶及其制备方法 |
CN102181159A (zh) * | 2011-03-15 | 2011-09-14 | 杭州师范大学 | 一种聚倍半硅氧烷补强的led封装有机硅橡胶及其制备方法 |
CN102898999A (zh) * | 2012-11-06 | 2013-01-30 | 江苏科技大学 | 用于电加热管件的密封胶 |
CN102977613A (zh) * | 2012-12-17 | 2013-03-20 | 肇庆皓明有机硅材料有限公司 | 一种无卤阻燃硅橡胶的制备方法 |
CN104745142A (zh) * | 2013-12-27 | 2015-07-01 | 蓝星有机硅(上海)有限公司 | Led封装用的固化性硅橡胶组合物 |
CN103992645A (zh) * | 2014-04-29 | 2014-08-20 | 深圳市明粤科技有限公司 | 一种led封装用高性能有机硅固晶材料 |
Non-Patent Citations (2)
Title |
---|
POSS related polymer nanocomposites;Shiao-Wei Kuo 等;《Progress in Polymer Science》;20110525;第36卷(第12期);第1649-1696页 * |
官能化POSS的制备及其在聚合物改性中的应用进展;王笑鸽 等;《应用化工》;20181231;第47卷(第12期);第2771-2776页 * |
Also Published As
Publication number | Publication date |
---|---|
CN109880583A (zh) | 2019-06-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI415899B (zh) | 減少矽氧橡膠固化產物表面黏著性的方法,密封半導體的液態矽氧橡膠組成物,經矽氧橡膠密封的半導體元件及生產半導體元件的方法 | |
CN109880583B (zh) | 一种导热有机硅粘合剂及其固化物和led元件 | |
JP6084808B2 (ja) | オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置 | |
KR102317298B1 (ko) | 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물 | |
WO2006077667A1 (ja) | 発光素子封止用シリコーン組成物及び発光装置 | |
WO2015194158A1 (ja) | ホットメルト性シリコーンおよび硬化性ホットメルト組成物 | |
JP2011219597A (ja) | シリコーン樹脂シート | |
JP6355210B2 (ja) | 半導体装置および半導体素子封止用硬化性シリコーン組成物 | |
JP5971178B2 (ja) | 太陽電池モジュール用シリコーン封止材及び太陽電池モジュール | |
WO2016035285A1 (ja) | 硬化性シリコーン組成物、硬化性ホットメルトシリコーン、および光デバイス | |
KR20200055031A (ko) | 충전제를 포함하는 실리콘 조성물 | |
JP2010013503A (ja) | 硬化性樹脂組成物およびオプトデバイス | |
WO2018062009A1 (ja) | 硬化性シリコーン組成物、その硬化物、および光半導体装置 | |
TWI612080B (zh) | 封裝材料用透明樹脂以及包含該樹脂之封裝材料與電子元件 | |
JPWO2020138409A1 (ja) | 硬化性シリコーン組成物、その硬化物、およびその製造方法 | |
TW201431960A (zh) | 可硬化性聚矽氧組合物、其硬化製品及光半導體裝置 | |
JP6884458B2 (ja) | 硬化性オルガノポリシロキサン組成物および半導体装置 | |
TWI644986B (zh) | 硬化性樹脂組成物 | |
KR20150105636A (ko) | 반도체칩 접착용 실리콘 고무 조성물 | |
TW202104441A (zh) | 熱熔性固化性有機矽組成物、密封劑、膜及光半導體元件 | |
CN110819299B (zh) | 导热有机硅粘合剂 | |
JP7220718B2 (ja) | 硬化性シリコーン組成物、その硬化物、および光半導体デバイス | |
CN107541075B (zh) | 热熔型有机聚硅氧烷组合物、荧光体片材及半导体器件 | |
EP3771731A1 (en) | A curable hotmelt silicone composition, encapsulant, film and optical semiconductor device | |
JP2020033407A (ja) | 付加硬化型シリコーン組成物及び半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A thermally conductive silicone adhesive and its cured product and LED components Effective date of registration: 20220831 Granted publication date: 20210622 Pledgee: Zhongguancun Branch of Bank of Beijing Co.,Ltd. Pledgor: BEIJING KMT TECHNOLOGY Co.,Ltd. Registration number: Y2022990000543 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231121 Granted publication date: 20210622 Pledgee: Zhongguancun Branch of Bank of Beijing Co.,Ltd. Pledgor: BEIJING KMT TECHNOLOGY Co.,Ltd. Registration number: Y2022990000543 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |