US20190186842A1 - Method for manufacturing heat dissipation device - Google Patents

Method for manufacturing heat dissipation device Download PDF

Info

Publication number
US20190186842A1
US20190186842A1 US16/215,648 US201816215648A US2019186842A1 US 20190186842 A1 US20190186842 A1 US 20190186842A1 US 201816215648 A US201816215648 A US 201816215648A US 2019186842 A1 US2019186842 A1 US 2019186842A1
Authority
US
United States
Prior art keywords
heat dissipation
dissipation device
layer
manufacturing
basic structural
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/215,648
Other languages
English (en)
Inventor
Kuei-feng Chiang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to US16/215,648 priority Critical patent/US20190186842A1/en
Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIANG, KUEI-FENG
Publication of US20190186842A1 publication Critical patent/US20190186842A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • F28F21/065—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material the heat-exchange apparatus employing plate-like or laminated conduits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/082—Heat exchange elements made from metals or metal alloys from steel or ferrous alloys
    • F28F21/083—Heat exchange elements made from metals or metal alloys from steel or ferrous alloys from stainless steel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/086—Heat exchange elements made from metals or metal alloys from titanium or titanium alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/087—Heat exchange elements made from metals or metal alloys from nickel or nickel alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler

Definitions

  • the present invention relates to a method for manufacturing a heat dissipation device, and more particularly, to a method for manufacturing a heat dissipation device layer by layer.
  • the currently available electronic apparatus have constantly upgraded performance, and, as a result, heat produced by the electronic elements in the electronic apparatus, particularly the electronic elements for signal processing and data computation, is much higher than that produced by the electronic elements in the conventional electronic apparatus.
  • heat dissipation devices available for removing the produced heat from the electronic elements.
  • heat pipes, heat radiators and vapor chambers are the most frequently used heat dissipation devices, because they are in direct contact with the heat-producing electronic elements to provide further enhanced heat dissipation effect and effectively prevent the electronic elements from being burned out due to overheat.
  • Vapor chamber, heat pipe, and loop heat pipe are the most commonly used heat dissipation devices, all of which internally define a vacuum-tight chamber, in which vapor-liquid circulation of a working fluid occurs with the aid of a wick structure provided in the chamber, so as to achieve a heat transfer effect.
  • either the vapor chamber or the heat pipe achieves a heat exchange effect when the working fluid in the vacuum-tight chamber evaporates and condenses alternatively. Since the use of the heat pipe or the vapor chamber is largely restricted by the space in which the vapor chamber or the heat pipe is installed, most of the currently available heat pipes and vapor chambers are manufactured to nominal sizes with limited shapes and dimensions and are therefore relatively inflexible in use.
  • the conventional vapor chamber is formed by closing two plate members to each other and sealing joints between them, so that an airtight chamber is defined in the completed vapor chamber; and the conventional heat pipe has two sealed ends to internally define an airtight chamber.
  • the airtight chamber of the vapor chamber and the heat pipe is then evacuated to produce a vacuum state therein and filled with a working fluid.
  • a defective joint sealing procedure often leads to poor air-tightness and vacuum leakage of the completed vapor chamber and heat pipe.
  • edge portions/end portions reserved on the vapor chamber/the heat pipe for forming the sealed joints of the vapor chamber and the sealed ends of the heat pipe form ineffective zones that do not provide any space for the working fluid to work to therefore cause waste of material and increased manufacturing cost.
  • wick structure such as a powder-sintered body, a woven mesh or a plurality of grooves
  • processing procedure such as sintering, welding, diffusion bonding, knurling or laser processing, must be performed on the inner wall surfaces of the airtight chamber to provide the wick structure.
  • a wick structure in the form of a woven mesh In the case of a wick structure in the form of a woven mesh, it might not be easily tightly attached to the inner wall surfaces of the airtight chamber to therefore cause the problem of poor capillary force of the wick structure. Further, since the conventional vapor chamber is a structure formed of two superimposed plate members, its design and production is subjected to many restrictions and complicated manufacturing steps.
  • a primary object of the present invention is to overcome the drawbacks of the conventional heat dissipation devices by providing a heat dissipation device that can be more flexibly designed while ensures absolute air tightness thereof.
  • a first embodiment of the heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof, and the first basic structural body and the wick structure are integral structural bodies formed layer by layer.
  • a second embodiment of the heat dissipation device includes a plurality of first basic structural bodies respectively having a wick structure formed on one side surface thereof, and the first basic structural bodies and the wick structures are structures formed layer by layer.
  • the first basic structural bodies are fixedly closed together in pairs to construct a desired heat dissipation device that internally defines an airtight chamber, and a working fluid is filled in the airtight chamber.
  • the first basic structural body and the wick structure can be formed using gold, silver, copper, aluminum, titanium, stainless steel, ceramic, non-metal materials, or any combination thereof.
  • the present invention also provides a method for manufacturing a heat dissipation device. According to a preferred embodiment of the method for manufacturing the heat dissipation device, the following steps are included:
  • the heat dissipation device according to the present invention is formed layer by layer in a special manufacturing manner, it can be more flexibly designed.
  • the flexibly designed heat dissipation device of the present invention not only solves the disadvantages in the conventional heat dissipation devices caused by the joint sealing process, but also largely reduces the procedures and time needed in manufacturing the conventional heat dissipation devices while enables firm attachment of the wick structure to the inner wall surfaces of the heat dissipation devices.
  • the present invention enables upgraded overall flexibility in designing and manufacturing a heat dissipation device.
  • FIGS. 1 a to 1 d are perspective views showing the forming of a first embodiment of a heat dissipation device according to the present invention
  • FIGS. 2 a to 2 c are perspective views showing the forming of a second embodiment of the heat dissipation device according to the present invention.
  • FIG. 2 d is an assembled sectional view of the heat dissipation device of FIGS. 2 a to 2 c;
  • FIG. 3 is an assembled perspective view of a third embodiment of the heat dissipation device according to the present invention.
  • FIG. 4 is an assembled sectional view of a fourth embodiment of the heat dissipation device according to the present invention.
  • FIGS. 5 a to 5 g are perspective views showing the forming of a fifth embodiment of the heat dissipation device according to the present invention.
  • FIGS. 6 a and 6 b are perspective views showing the forming of a sixth embodiment of the heat dissipation device according to the present invention.
  • FIGS. 7 a and 7 b are perspective views showing the forming of a seventh embodiment of the heat dissipation device according to the present invention.
  • FIG. 8 is an assembled perspective view of an eighth embodiment of the heat dissipation device according to the present invention.
  • FIG. 9 a is a perspective view of a ninth embodiment of the heat dissipation device according to the present invention.
  • FIG. 9 b is a top view of the ninth embodiment of the heat dissipation device according to the present invention.
  • FIG. 9 c is a sectional side view of a first variation of the ninth embodiment of the heat dissipation device according to the present invention.
  • FIG. 9 d is a sectional side view of a second variation of the ninth embodiment of the heat dissipation device according to the present invention.
  • FIG. 9 e is a sectional side view of a third variation of the ninth embodiment of the heat dissipation device according to the present invention.
  • FIG. 10 a is a sectional side view of a tenth embodiment of the heat dissipation device according to the present invention.
  • FIG. 10 b is another sectional side view of the tenth embodiment of the heat dissipation device according to the present invention.
  • FIG. 11 is a flowchart showing the steps included in a first embodiment of a method for manufacturing the heat dissipation device according to the present invention.
  • FIG. 12 is a flowchart showing the steps included in a second embodiment of the method for manufacturing the heat dissipation device according to the present invention.
  • FIG. 13 is a flowchart showing the steps included in a third embodiment of the method for manufacturing the heat dissipation device according to the present invention.
  • FIG. 14 is a flowchart showing the steps included in a fourth embodiment of the method for manufacturing the heat dissipation device according to the present invention.
  • FIG. 15 is a flowchart showing the steps included in a fifth embodiment of the method for manufacturing the heat dissipation device according to the present invention.
  • FIG. 16 is a flowchart showing the steps included in a sixth embodiment of the method for manufacturing the heat dissipation device according to the present invention.
  • FIG. 17 is a flowchart showing the steps included in a seventh embodiment of the method for manufacturing the heat dissipation device according to the present invention.
  • FIG. 18 is a flowchart showing the steps included in an eighth embodiment of the method for manufacturing the heat dissipation device according to the present invention.
  • FIG. 19 is a flowchart showing the steps included in a ninth embodiment of the method for manufacturing the heat dissipation device according to the present invention.
  • FIG. 20 is a flowchart showing the steps included in a tenth embodiment of the method for manufacturing the heat dissipation device according to the present invention.
  • FIGS. 21 a to 21 d and FIGS. 22 a to 22 d are pictorial illustrations of the steps included in the tenth embodiment of the method for manufacturing the heat dissipation device according to the present invention.
  • the present invention provides a heat dissipation device having an integral structure constructed layer by layer or part by part based on the concept of creating something from zero.
  • This type of manufacturing is implemented mainly through 3D printing, electrochemical processing, printing, thermal spraying, or any combination thereof.
  • a primary fundamental carrier or member is first formed, and other secondary structural parts or structural bodies are then sequentially formed on the primary fundamental carrier or member lay by layer to finally form an integral structure.
  • FIGS. 1 a to 1 d are perspective views showing the forming of a first embodiment of the heat dissipation device according to the present invention.
  • a member serving as the primary fundamental carrier/member is a lower plate member of a vapor chamber, which is referred to as a/the first basic structural body and generally denoted by reference numeral 1 herein.
  • the first basic structural body 1 and the wick structure 2 are structural bodies formed layer by layer.
  • the first basic structural body 1 is a structure formed layer by layer. Forming the structure layer by layer can be achieved through 3D printing, electrochemical processing, printing or thermal spraying. In the first embodiment, the first basic structural body 1 is illustratively and non-restrictively formed layer by layer through 3D printing. Further, the first basic structural body 1 can be formed of a metal material, a non-metal material, or a combination thereof. In the case of the metal material, it can be gold, silver, copper, aluminum, titanium, stainless steel, or an alloy thereof. In the case of the non-metal material, it can be plastic or ceramic. The finally formed first basic structural body 1 is shown in FIG. 1 b. Further, the first basic structural body 1 can include a grooved structure (not shown) directly formed on an inner side surface that is to serve as an inner wall surface of the vapor chamber.
  • the wick structure 2 is formed on the inner side surface of the first basic structural body 1 layer by layer, too. More specifically, the wick structure 2 can be a structural layer consisting of one single porous body or a structural layer consisting of a plurality of superimposed porous bodies achieved through any one of 3D printing electrochemical processing, printing, and thermal spraying.
  • the porous body can be a powder-sintered body, a woven mesh, a fibrous member, or a structural body combining superimposed layers of powder-sintered body, woven mesh and fibrous member.
  • a plate member for one side of the vapor chamber i.e. a lower plate member or an upper plate member of the vapor chamber
  • the titanium material for forming the first basic structural body 1 can be commercially pure titanium or a titanium alloy, both of which are characterized by the following nine advantages of high specific strength, good corrosion resistance, low elastic modulus, good heat resistance, good low-temperature performance, high biocompatibility, low heat transfer coefficient, colorful oxide film and being non-magnetic, and have been widely applied to livelihood-related industry, petrochemical industry, aerospace industry, military industry and medical industry. Up to date, there are already more than 100 types of titanium alloys that have been developed by different countries in the world, and about 40 to 50 types of these titanium alloys have already become commercialized.
  • these titanium alloys can be generally classified into three major categories, namely, alpha ( ⁇ ) alloys, alpha and beta ( ⁇ - ⁇ ) alloys, and beta ( ⁇ ) alloys.
  • alpha titanium alloys can be further classified into commercially pure titanium, alpha titanium alloys and near-alpha titanium alloys.
  • Commercially pure titanium does not contain other chemical elements but only a trace amount of oxygen, carbon, nitrogen, hydrogen and iron.
  • the oxygen in the pure titanium is an interstitial element, and the amount of oxygen contained in the pure titanium has a relatively big influence on the strength of the pure titanium.
  • the strength of titanium will increase 100 ⁇ 120 mPa (megapascal) when the content of oxygen in the titanium is increased by 0.1 wt %.
  • the commercially pure titanium can be classified into four grades, namely, Grade 1 to Grade 4.
  • the Grade 1 pure titanium has oxygen content lower than 0.18 wt % and the advantages of low strength, good ductility and good formability, and is primarily used as a material for roofing and plate-type heat exchanger.
  • the Grade 2 pure titanium has a tensile strength ranged between 350 and 450 mPa, and is the most frequently used one among the four grades of pure titanium, mainly used in the manufacture of seamed or seamless pipes and chemical tanks and containers.
  • the Grade 3 pure titanium has a strength ranged between 500 and 600 mPa and is mainly used in the manufacture of pressure chemical tanks and containers.
  • the Grade 4 pure titanium has a strength close to 700 mPa and is the strongest one of the four grades of pure titanium, and is mainly used in the manufacture of some fasteners and relatively complicate parts that have to be formed around 300° C.
  • Alpha titanium alloys contain alpha stabilizers, such as aluminum and oxygen, as well as neutral alloying elements, such as tin and zinc.
  • Alpha titanium alloys having been subjected to annealing has a single-phase alpha structure that has good structural stability, heat resistance and weldability, as well as a metal strength higher than that of industrially pure titanium.
  • alpha titanium alloys To satisfy the requirement for strength, neutral elements are added to the alpha titanium alloys to increase their strength.
  • a typical example of the strengthened alpha titanium alloys is Grade 6 titanium alloy, also known as Ti-5Al-2.5Sn, which has good fracture toughness and thermal strength at both room temperature and high temperature, and has a long-term working temperature about 500° C.
  • a low interstitial Ti-5Al-2.5Sn can be used in a low-temperature environment.
  • both the commercially pure titanium and the titanium alloys have the advantages of high specific strength, good corrosion resistance, low elastic modulus, good heat resistance, good low-temperature performance, high biocompatibility, low heat transfer coefficient, colorful oxide film and being non-magnetic.
  • different types of pure titanium or titanium alloys can be selected for manufacturing different portions of a loop heat pipe. That is, by using pure titanium and titanium alloys of different properties to replace the use of copper, aluminum or stainless steel that are conventionally used in the manufacture of loop heat pipes, it is able to advantageously largely upgrade the overall heat dissipation efficiency and structural strength of the loop heat pipes while largely reduce the overall weight thereof.
  • FIGS. 2 a to 2 c are perspective views showing the forming of a second embodiment of the heat dissipation device according to the present invention
  • FIG. 2 d is an assembled sectional view of the heat dissipation device of FIGS. 2 a to 2 c . Since the second embodiment is partially structurally similar to the first embodiment, portions of the second embodiment that are the same as the first embodiment are not repeatedly described herein.
  • the heat dissipation device in the second embodiment is generally denoted by reference numeral 3 , and, as shown in FIG. 2 a , is mainly manufactured using a plurality of first basic structural bodies 1 , which are formed layer by layer as described in the first embodiment. As shown in FIG. 2 b , two pieces of first basic structural bodies 1 are correspondingly closed together to construct a heat dissipation device 3 , which is shown in FIG. 2 c.
  • the heat dissipation device 3 constructed by correspondingly closing two pieces of first basic structural bodies 1 together internally defines an airtight chamber 31 , in which a wick structure 2 and a working fluid 4 are provided.
  • FIG. 3 is an assembled perspective view of a third embodiment of the heat dissipation device according to the present invention. Since the third embodiment is partially structurally similar to the second embodiment, portions of the third embodiment that are the same as the second embodiment are not repeatedly described herein.
  • the heat dissipation device in the third embodiment is different from the second one in that it is embodied as a loop heat pipe 5 .
  • a vapor chamber is a member serving as a primary fundamental carrier for forming the loop heat pipe 5 and is referred to as a/the heat dissipation device 3 herein.
  • the heat dissipation device 3 includes an outlet 32 and an inlet 33 .
  • a vapor and liquid pipe 6 is extended through a heat dissipation unit 7 and connected at two opposite ends to the outlet 32 and the inlet 33 .
  • the vapor and liquid line 6 , the heat dissipation unit 7 , and the heat dissipation device 3 are structures formed layer by layer through 3D printing. When forming the vapor and liquid line 6 layer by layer through 3D printing, different materials can be selected and used alternately.
  • FIG. 4 is an assembled sectional view of a fourth embodiment of the heat dissipation device according to the present invention. Since the fourth embodiment is partially structurally similar to the second embodiment, portions of the fourth embodiment that are the same as the second embodiment are not repeatedly described herein.
  • the heat dissipation device in the fourth embodiment is different from the second one in that it is externally provided on one side with a polymeric layer 34 .
  • the polymeric layer 34 can be formed using a natural polymer, a synthetic polymer or an inorganic polymer.
  • the natural polymer can be any one of starch, rubber and nucleic acid.
  • the synthetic polymer can be any one of polyethylene (PE), polyvinyl chloride (PVC), nylon, Dacron (polyethylene terephthalate or PET), acrylonitrile butadiene styrene (ABS), styrene-butadiene rubber (SBR), and other high-molecular polymers.
  • the inorganic polymer can be any one of quartz, asbestos, mica and graphite. These polymers can give the heat dissipation device 3 additional structural properties.
  • FIGS. 5 a to 5 g are perspective views showing the forming of a fifth embodiment of the heat dissipation device according to the present invention. Since the fifth embodiment is partially structurally similar to the first embodiment, portions of the fifth embodiment that are the same as the first embodiment are not repeatedly described herein.
  • the heat dissipation device in the fifth embodiment is different from the first one in that it is a complete heat dissipation device 3 constructed layer by layer through 3D printing, electrochemical processing, injection, printing or thermal spraying.
  • a first basic structural body 1 i.e. a lower plate member of a vapor chamber
  • FIG. 1 i.e. a lower plate member of a vapor chamber
  • a wick structure 2 is formed on one side surface of the first basic structural body 1 layer by layer through 3D printing. Finally, as shown in FIG. 5 d , an integral structure including a first basic structure body 1 and a wick structure 2 is formed.
  • any other remaining structural portion for constructing the desired heat dissipation device 3 such as an upper plate member of the vapor chamber, is formed on one side of the first basic structural body 1 over the wick structure 2 layer by layer through 3D printing. Meanwhile, an airtight chamber 31 (see FIG. 2 b ) is formed in the heat dissipation device 3 , as shown in FIG. 5 f . Finally, a complete heat dissipation device 3 is constructed, as shown in FIG. 5 g.
  • FIGS. 6 a and 6 b are perspective views showing the forming of a sixth embodiment of the heat dissipation device according to the present invention. Since the sixth embodiment is partially structurally similar to the first embodiment, portions of the sixth embodiment that are the same as the first embodiment are not repeatedly described herein.
  • the heat dissipation device in the sixth embodiment is different from the first one in that it is formed by first providing a pre-formed wick structure 2 , as shown in FIG.
  • a first basic structural body 1 such as an upper or a lower plate member of a vapor chamber
  • a heat dissipation device 3 such as a vapor chamber
  • the heat dissipation device 3 shown in FIG. 6 b can be formed layer by layer through 3D printing or electrochemical processing.
  • FIGS. 7 a and 7 b are perspective views showing the forming of a seventh embodiment of the heat dissipation device according to the present invention. Since the seventh embodiment is partially structurally similar to the first embodiment, portions of the seventh embodiment that are the same as the first embodiment are not repeatedly described herein.
  • the heat dissipation device in the seventh embodiment is different from the first one in that it is constructed by first forming a completed first basic structural body 1 and a completed wick structure 2 , as shown in FIG. 7 a , and then a bonding layer 35 is formed between the first basic structural body 1 and the wick structure 2 , as shown in FIG. 7 b .
  • the bonding layer 35 can be formed through 3D printing, electrochemical processing, thermal spraying or printing. With the bonding layer 35 , the first basic structural body 1 and the wick structure 2 are bonded to each other to form an integral body.
  • FIG. 8 is an assembled perspective view of an eighth embodiment of the heat dissipation device according to the present invention. Since the eighth embodiment is partially structurally similar to the first embodiment, portions of the eighth embodiment that are the same as the first embodiment are not repeatedly described herein.
  • the heat dissipation device in the eighth embodiment is different from the first one in that it includes a first basic structural body 1 (i.e. a lower or an upper plate member of a vapor chamber) having a wick structure 2 formed on one side surface thereof through 3D printing, electrochemical processing, injection, printing or thermal spraying.
  • a first basic structural body 1 i.e. a lower or an upper plate member of a vapor chamber
  • wick structure 2 formed on one side surface thereof through 3D printing, electrochemical processing, injection, printing or thermal spraying.
  • a frame section 8 capable of upgrading other structural properties of the first basic structural body 1 is further formed along a right and a left edge, along an upper and a lower edge, or along all four edges of the first basic structural body 1 through 3D printing, electrochemical processing, injection, printing or thermal spraying.
  • the frame section 8 can be optionally formed of other materials showing different structural properties, so that the frame section 8 can give the first basic structural body 1 enhanced heat dissipation property or increased structural strength.
  • the frame section 8 can be otherwise formed of a titanium alloy having good shape memory property, an aluminum material having good heat dissipation property, a copper material having good heat absorption property, or graphite sheet or graphene having excellent temperature evenness effect without being limited to any particular material.
  • Other materials can also be selected for forming the frame section 8 .
  • FIGS. 9 a and 9 b are perspective and top views, respectively, of a ninth embodiment of the heat dissipation device according to the present invention. Since the ninth embodiment is partially structurally similar to the fifth embodiment, portions of the ninth embodiment that are the same as the fifth embodiment are not repeatedly described herein.
  • the heat dissipation device in the ninth embodiment is different from the fifth one in that it further includes an intermediate body 9 provided in the airtight chamber 31 defined in between two pieces of first basic structural bodies 1 . In the ninth embodiment of the present invention, only the intermediate body 9 will be described.
  • the intermediate body 9 and the first basic structural bodies 1 are integral structural bodies formed layer by layer.
  • the intermediate body 9 has a first side 91 and an opposite second side 92 , and is provided with a plurality of through holes 93 and a recess structure 94 .
  • the recess structure 94 can be provided on any one or both of the first side 91 and the second side 92 .
  • the recess structure 94 is provided on the first side 91 .
  • the through holes 93 are extended through the intermediate body 9 to communicate the first side 91 with the second side 92 .
  • the recess structure 94 and the through holes 93 can be alternately arranged or not on the intermediate body 9 .
  • the recess structure 94 and the through holes 93 are alternately arranged on the intermediate body 9 .
  • the arrangement of the recess structure 94 and the through holes 93 in the ninth embodiment is only illustrative and not intended to limit the present invention in any way.
  • the recess structure 94 includes a plurality of spaced recesses 941 , which are sunken from the first side 91 toward the second side 92 .
  • the through holes 93 and the recesses 941 can be horizontally staggered in any two adjacent rows or columns, or be vertically superimposed.
  • the through holes 93 and the recesses 941 are horizontally staggered in any two adjacent rows or columns, i.e. each of the through holes 93 is located in an area between any two adjacent recesses 941 .
  • the arrangement of the recesses 94 a and the through holes 93 in the ninth embodiment is only illustrative and not intended to limit the present invention in any way.
  • At least one connecting path 942 is provided between two adjacent recesses 941 with two ends of the connecting path 942 serially connected to the recesses 941 , such that the recesses 941 are communicable with one another in both a transverse and a longitudinal direction.
  • FIG. 9 c is a sectional side view of a first variation of the ninth embodiment of the heat dissipation device according to the present invention.
  • the heat dissipation device includes a wick structure 2 provided between the first basic structural body 1 and the intermediate body 9 .
  • the wick structure 2 can be a structural layer consisting of one single porous body or a structural layer consisting of a plurality of superimposed porous bodies.
  • the porous body can be a powder-sintered body, a woven mesh, a fibrous member, or a structural body combining superimposed layers of powder-sintered body, woven mesh and fibrous member.
  • the porous body can include a plurality of grooves that are formed between mutually spaced ribs.
  • the porous body is a woven mesh.
  • the porous body in the form of a woven mesh in the ninth embodiment is only illustrative and not intended to limit the present invention in any way.
  • FIG. 9 d is a sectional side view of a second variation of the ninth embodiment of the heat dissipation device according to the present invention.
  • the intermediate body 9 further includes a plurality of supporting structures 10 , each of which is in the form of a post having two ends extended through and projected from the first side 91 and the second side 92 of the intermediate body 9 .
  • FIG. 9 e is a sectional side view of a third variation of the ninth embodiment of the heat dissipation device according to the present invention.
  • the intermediate body 9 further includes a plurality of supporting structures 10 , each of which includes a plurality of posts separately located on the first side 91 and the second side 92 of the intermediate body 9 .
  • FIGS. 10 a and 10 b are sectional side views of a tenth embodiment of the heat dissipation device according to the present invention. Since the tenth embodiment is partially structurally similar to the fifth embodiment, portions of the tenth embodiment that are the same as the fifth embodiment are not repeatedly described herein.
  • the heat dissipation device in the tenth embodiment is different from the fifth one in that it further includes at least one supporting structure 10 located in the airtight chamber 31 .
  • the supporting structure 10 has at least one end pressed against an inner wall surface of the airtight chamber 31 . Further, the supporting structure 10 is an integral structural body formed on the wick structure 2 layer by layer.
  • the supporting structure 10 in the tenth embodiment can be differently configured. As shown in FIG. 10 a , the supporting structure 10 in a first configuration thereof consists of a plurality of posts separately projected from two opposite sides of the wick structure 2 to press against inner wall surfaces of the airtight chamber 31 .
  • the supporting structure 10 in a second configuration thereof includes a single post that is extended through the wick structure 2 with two opposite ends pressed against inner wall surfaces of the airtight chamber 31 .
  • the supporting structure 10 is formed along with the first basic structural bodies 1 layer by layer to construct an integral and complete heat dissipation device. In this manner, it is able to save the manufacturing cost that is required in the conventional heat dissipation device for additional forming and processing two different elements, i.e. the first basic structural bodies 1 and the supporting structure 10 . Therefore, the heat dissipation device according to the present invention can be manufactured at less time and labor as well as reduced waste to largely lower the manufacturing cost thereof.
  • the wick structure 2 is a structural layer consisting of one single porous body or a plurality of superimposed porous bodies.
  • the porous body can be a powder-sintered body, a woven mesh, a fibrous member, or a structural body combining superimposed layers of powder-sintered body, woven mesh and fibrous member.
  • the present invention mainly provides a heat dissipation basic structural body or a heat dissipation device, such as a vapor chamber, which is constructed layer by layer to complete an integral structural body. More specifically, all the parts of the vapor chamber, including the external upper and lower plate members and the internal wick structure thereof, are sequentially formed layer by layer. Further, according to the present invention, materials of different properties are used and processed at the same time to embody a single structural body that presents more than one material property or characteristic, so that a desired heat dissipation device can be manufactured in a more flexible manner without being limited by mold design, which doubtlessly increases the entire manufacturing flexibility and reduces the manufacturing cost of the heat dissipation device.
  • the forming of an integral structural body of a desired heat dissipation device layer by layer as disclosed in the present invention breaks through the bottleneck in the conventional heat dissipation device manufacturing methods by using and processing materials of different properties, such as metal and non-metal materials, at the same time and enabling tight and flat attachment of the wick structure to the internal chamber of the heat dissipation device through easier and less complicate processing procedures.
  • the heat dissipation device having an integral structural body constructed layer by layer according to the present invention can be more easily accomplished with simplified manufacturing procedures while provides upgraded heat dissipation performance and ensures the air-tightness of the internal chamber of the heat dissipation device.
  • the heat dissipation device i.e. the vapor chamber, constructed layer by layer according to the present invention is manufactured in a vacuum environment
  • the device can not only have improved air-tightness, but also be formed without the need of performing an evacuation process. In this manner, more time and labor costs can be saved, upgraded yield rate can be achieved, and internal vacuum tightness can be ensured in the vapor chamber manufacturing process.
  • FIG. 11 is a flowchart showing the steps included in a first embodiment of a method for manufacturing a heat dissipation device according to the present invention. Please refer to FIG. 11 along with FIGS. 1 a to 1 d. As shown, the first embodiment of the method for manufacturing the heat dissipation device according to the present invention includes the following steps:
  • a first basic structural body 1 for constructing a desired heat dissipation device 3 is formed layer by layer.
  • the first basic structural body 1 can be formed using stainless steel, copper, aluminum, titanium, ceramic, a titanium alloy, commercially pure titanium, or any non-metal material.
  • the first basic structural body 1 can be otherwise formed using any combination of the above-mentioned materials without being limited to any particular material.
  • the first basic structural body 1 is a lower plate member of a vapor chamber. That is, in this first embodiment, the method for manufacturing the heat dissipation device begins from the forming of a lower plate member for a vapor chamber.
  • the first basic structural body 1 for the heat dissipation device 3 can be formed layer by layer through 3D printing, multi-material injection molding, thermal spraying, or printing.
  • the first basic structural body 1 is illustratively and non-restrictively formed layer by layer through 3D printing (see FIGS. 1 a and 1 b ), and the materials for forming the first basic structural body 1 can be in a powder form, in a half-melted form, or in a paste form, depending on the material properties of the selected materials.
  • a wick structure 2 is formed on one side surface of the first basic structural body 1 also through 3D printing (see FIGS. 1 c and 1 d ).
  • the wick structure 2 can be formed using gold, silver, nickel, copper, aluminum, stainless steel, titanium, ceramic, or any combination thereof.
  • FIG. 12 is a flowchart showing the steps included in a second embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described in detail below.
  • a pair of the first structural bodies 1 that have the wick structure 2 formed on one inner side surface thereof are correspondingly closed together and joints between them are sealed, so that an airtight chamber 31 is defined between the two closed first basic structural bodies 1 to construct a complete heat dissipation device 3 (see FIGS. 2 a to 2 d ).
  • the joint sealing can be performed through laser processing, diffusion bonding or welding.
  • step S 4 after the joints between the pair of first basic structural bodies 1 are sealed, air is evacuated from the airtight chamber 31 of the heat dissipation device 3 and a working fluid 4 is filled into the airtight chamber 31 . Finally, the heat dissipation device 3 is completely sealed.
  • FIG. 13 is a flowchart showing the steps included in a third embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described in detail below by reference to FIG. 13 along with FIGS. 6 a and 6 b.
  • a pre-formed wick structure 2 is provided (see FIG. 6 a ).
  • a first basic structural body 1 i.e. an upper or a lower plate member of a vapor chamber
  • a heat dissipation device 3 such as a vapor chamber
  • a heat dissipation device 3 in the form of a vapor chamber is constructed.
  • the material for forming the heat dissipation device 3 can be stainless steel, copper, aluminum, titanium, ceramic, or any combination thereof without being particularly limited.
  • the heat dissipation device 3 is constructed layer by layer through 3D printing, multi-material injection molding, thermal spraying, printing, or electrochemical processing.
  • the forming of the heat dissipation device 3 layer by layer is illustratively and non-restrictively achieved through 3D printing.
  • the materials for forming the heat dissipation device 3 can be in a powder form, in a half-melted form, or in a paste form, depending on the material properties of the selected materials.
  • FIG. 14 is a flowchart showing the steps included in a fourth embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described in detail below by reference to FIG. 14 along with FIG. 8 .
  • the third embodiment is different from the third one in further including the following step S 3 after the second step S 2 .
  • an additional structure capable of upgrading other structural properties of the heat dissipation device 3 is formed step by step on an outer side of the heat dissipation device 3 , for example, along a right and a left edge, along an upper and a lower edge, or along all four edges of the heat dissipation device 3 .
  • the additional structure can be integrally formed with the heat dissipation device 3 using, for example, a titanium alloy having good shape memory property, an aluminum alloy capable of providing enhanced structural strength, or a polymeric material showing good ductility.
  • the additional structure can be formed step by step through injection, electroplating, electrolysis, 3D printing, printing, or thermal spraying without being limited to any particular process.
  • FIG. 15 is a flowchart showing the steps included in a fifth embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described below by reference to FIG. 15 along with FIGS. 5 a to 5 g.
  • a first basic structural body 1 and a wick structure 2 for constructing a desired heat dissipation device 3 are formed layer by layer (see FIGS. 5 a and 5 b ).
  • the first basic structural body 1 can be formed using stainless steel, copper, aluminum, titanium, or ceramic, or any combination thereof.
  • the first basic structural body 1 can be a lower plate member of a vapor chamber.
  • the first basic structural body 1 can be formed layer by layer through 3D printing, injection, printing, or thermal spraying.
  • the first basic structural body 1 is illustratively and non-restrictively formed layer by layer through 3D printing.
  • a wick structure 2 is formed on one side surface of the first basic structural body 1 (see FIG. 5 c ) layer by layer also through 3D printing Finally, an integral structure including a first basic structure body 1 and a wick structure 2 is formed (see FIG. 5 d ).
  • all remaining structural portions for constructing the desired heat dissipation device 3 are further formed over the first basic structural body 1 layer by layer through 3D printing (see FIG. 5 e ), such that an airtight chamber 31 is formed between the first basic structural body 1 and the sequentially completed remaining structural portions (see FIGS. 2 b and 5 f ).
  • a complete heat dissipation device 3 is formed, as shown in FIG. 5 g.
  • the forming of the heat dissipation device 3 layer by layer can be completed faster through a multiple mirroring technique. That is, the heat dissipation device 3 or the first basic structural body 1 to be formed layer by layer can be divided into a left and a right part or an upper and a lower part, and the layer-by-layer forming process can be performed on these parts synchronously or asynchronously.
  • the layer-by-layer forming process can be completed within a shortened time.
  • Mirroring division of a structural body to be formed can be achieved by dividing the structural body into several symmetrical parts or asymmetrical parts.
  • the working fluid filling and final sealing processes can be performed in the second step S 2 to complete the heat dissipation device 3 , and the third step S 3 can be omitted, accordingly.
  • FIG. 16 is a flowchart showing the steps included in a sixth embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described below by reference to FIG. 16 along with FIG. 7 .
  • S 1 Providing a fundamental member (i.e. a first basic structural body) for constructing a desired heat dissipation device and providing a single body of wick structure, and placing the single body of wick structure on one side surface of the fundamental member.
  • a fundamental member i.e. a first basic structural body
  • the fundamental member refers to a first basic structural body 1 (i.e. a lower plate member for a vapor chamber).
  • the material for forming the single body of wick structure 2 can be copper, aluminum, nickel, gold, silver, titanium, stainless steel or ceramic, or any combination thereof. Further, the single body of wick structure 2 can be a powder-sintered body, a woven mesh, a fibrous member, or a plurality of grooves. In this sixth embodiment of the method for manufacturing the heat dissipation device according to the present invention, the single body of wick structure 2 is illustratively and non-restrictively shown as a powder-sintered body.
  • a bonding layer 35 is formed between joints of the wick structure 2 and the first basic structural body 1 through electrochemical processing, so that the first basic structural body 1 and the wick structure 2 are bonded together to form an integral body (see FIG. 7 ).
  • other remaining structural portions for constructing the desired heat dissipation device 3 such as the upper plate member for the vapor chamber, are formed step by step on an upper side of the first basic structural body 1 to complete the desired heat dissipation device 3 that internally defines an airtight chamber 31 .
  • step S 3 after the heat dissipation device 3 is fully constructed, air in the airtight chamber 31 defined in the heat dissipation device 3 is evacuated from and a working fluid 4 is filled into the airtight chamber 31 , all via a pre-reserved hole on the heat dissipation device 3 . Finally, the pre-reserved hole on the heat dissipation device 3 is sealed.
  • FIG. 17 is a flowchart showing the steps included in a seventh embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described in detail below by reference to FIG. 17 along with FIG. 8 .
  • a pre-formed first basic structural body 1 such as a lower plate member of a vapor chamber is provided, and a wick structure 2 is formed on an inner side surface of the first basic structural body 1 through 3D printing, electrochemical processing, injection, printing, or thermal spraying.
  • a frame section 8 capable of upgrading other structural properties of the first basic structural body 1 is further formed along a right and a left edge, along an upper and a lower edge, or along all four edges of the first basic structural body 1 through 3D printing, electrochemical processing, injection, printing, or thermal spraying.
  • the frame section 8 can be optionally formed of other materials showing different structural properties, so that the frame section 8 can give the first basic structural body 1 enhanced heat dissipation property or increased structural strength.
  • the frame section 8 can be otherwise formed of a titanium alloy having good shape memory property, an aluminum material having good heat dissipation property, or graphite sheet or graphene having excellent temperature evenness effect without being limited to any particular material.
  • Other materials can also be selected for forming the frame section 8 .
  • FIG. 18 is a flowchart showing the steps included in an eighth embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described below by reference to FIG. 18 along with FIGS. 9 a to 9 c , in which the ninth embodiment of the heat dissipation device according to the present invention is illustrated.
  • first step S 1 in this eighth embodiment is similar to the first step S 1 in the first and the second embodiment of the method for manufacturing the heat dissipation device according to the present invention, it is not repeatedly described herein.
  • an intermediate body 9 is formed on one side surface of the first basic structural body 1 (see FIGS. 9 a and 9 b ).
  • the intermediate body 9 can be similarly formed through 3D printing, and the material for forming the intermediate body 9 can be copper, aluminum, stainless steel, titanium, or ceramic, or any combination thereof.
  • the heat dissipation device can be otherwise constructed layer by layer through electrochemical processing.
  • the electrochemical processing can be electroplating, electroless plating, electroforming, or electrolysis.
  • the material selected for using in the electrochemical processing can be copper, aluminum, nickel, titanium or ceramic, or any combination thereof.
  • the wick structure 2 can be otherwise formed through a chemical vapor deposition process or a physical vapor deposition process and is then subjected to pickling to form a porous wick structure 2 .
  • the wick structure 2 can be formed using gold, silver, copper, aluminum, stainless steel or titanium, or any combination thereof. And, the wick structure 2 can be in the form of a mesh structure, a plurality of grooves, or a porous structure.
  • electroforming it applies the same electrochemical principle as that being applied by general metal electroplating, i.e. a process of electrodeposition, which uses an externally supplied electric energy to cause a mixed solution containing metal ions and other additives to produce an electrochemical oxidation-reduction reaction on surfaces of a cathode and an anode, so that a desired metal is deposited on a prototype.
  • metal cations in a solution are driven by an externally supplied electric energy to move toward the cathode, and a metal coating is deposited on surfaces of a workpiece through a reduction reaction. Therefore, in the commonly used electroplating and precision electroforming processes, an object to be plated or a prototype is used as the cathode.
  • the heat dissipation device 3 after the heat dissipation device 3 is formed, it is used as a cathode in the electroplating or the electroforming process and a desired metal is deposited on the cathode at positions where the wick structure 2 is to be formed.
  • a frame member is first provided for using in the electroforming or the electroplating process.
  • the frame member is removed from the deposited metal material to obtain the workpiece so formed.
  • the frame member for this purpose has a configuration generally the same as the upper and the lower plate member of a vapor chamber to be formed.
  • the metal material is molded and attached to the surfaces of the frame member.
  • the steps included in the above-described embodiments of the method for manufacturing the heat dissipation device according to the present invention can be optionally performed in a vacuum environment.
  • the step of evacuating air from the airtight chamber 31 of the heat dissipation device 3 can be omitted.
  • FIG. 19 is a flowchart showing the steps included in a ninth embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described below by reference to FIG. 19 along with FIGS. 21 a to 21 d and 22 a to 22 d.
  • the fundamental member refers to a first basic structural body 1 , which can be a lower or an upper plate member of a vapor chamber.
  • electrochemical processing is used to form a wick structure 2 on a selected side surface of the first basic structural body 1 , which is a lower plate member of the vapor chamber in this ninth embodiment.
  • all remaining structural portions for constructing the desired heat dissipation device 3 such as an upper plate member of the vapor chamber, are formed at the same time, so as to complete the desired heat dissipation device 3 that internally defines an airtight chamber 31 (not shown).
  • the electrochemical processing can be electroplating, electroless plating, electroforming, or electrolysis.
  • the material selected for forming the wick structure 2 through electrochemical processing can be copper, aluminum, nickel, titanium or ceramic, or any combination thereof.
  • a modeling frame is first disposed on a location at where the electrochemical processing is to be performed, so that the wick structure 2 is formed in areas that are not covered by the modeling frame.
  • the modeling frame can be a solid frame, a piece of sticker, or a thin layer formed through printing, and is used to cover areas that are not to be provided with the wick structure 2 . When the deposition of the wick structure 2 is completed, the modeling frame is removed.
  • the heat dissipation device 3 is fully constructed, that is, after a lower and an upper plate member are closed together to provide a vapor chamber, air in an airtight chamber 31 defined in the heat dissipation device 3 is evacuated from and a working fluid 4 is filled into the airtight chamber 31 , all via a pre-reserved hole on the heat dissipation device 3 . Finally, the pre-reserved hole on the heat dissipation device 3 is sealed.
  • the heat dissipation device 3 constructed layer by layer according to the present invention is an integral structure, the process of sealing joints can be saved to largely reduce the manufacturing cost and yield loss while avoid the problem of air leakage from the vacuum-tight heat dissipation device 3 .
  • FIG. 20 is a flowchart showing the steps included in a tenth embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described below.
  • a first basic structural body 1 and a wick structure 2 for constructing a desired heat dissipation device 3 are formed layer by layer through electrochemical processing.
  • the first basic structural body 1 can be formed using stainless steel, copper, aluminum or titanium, or any combination thereof.
  • the first basic structural body 1 can be a lower or an upper plate member of a vapor chamber, or an integral body of a vapor chamber.
  • the electrochemical processing can be electroplating, electroless plating, electroforming or electrolysis.
  • the wick structure 2 can be formed using copper, aluminum, stainless steel or titanium, or any combination thereof.
  • the wick structure 2 can be in the form of a mesh structure, a plurality of grooves, or a porous structure.
  • the second step S 2 after the first basic structural body 1 (which is a lower plate member of a vapor chamber in this embodiment) and the wick structure 2 are formed, other remaining structural portions for completing the desired heat dissipation device 3 , such as an upper plate member of the vapor chamber, are formed step by step on an upper side of the first basic structural body 1 through electrochemical processing to complete the desired heat dissipation device 3 .
  • the heat dissipation device 3 is fully constructed, air in the airtight chamber 31 defined in the heat dissipation device 3 is evacuated from and a working fluid 4 is filled into the airtight chamber 31 . Finally, the heat dissipation device 3 is fully sealed.
  • All the steps included in the above-mentioned embodiments of the method for manufacturing the heat dissipation device according to the present invention can be optionally performed in a vacuum environment.
  • the step of evacuating air from the airtight chamber 31 of the heat dissipation device 3 can be omitted.
  • the method for manufacturing the heat dissipation device With the method for manufacturing the heat dissipation device according to the present invention, different types of materials can be freely selected for use at the same time to manufacture an integrally formed heat dissipation device. In this manner, the flexibility in selecting materials for forming the heat dissipation device is increased. Further, the use of materials of different properties or characteristics allows the manufacturing of heat dissipation devices of different structural properties or characteristics.
  • a heat dissipation device having a flexible, shape-changeable structural body can be obtained by forming it using a flexible material; or, a heat dissipation device having a structural body that is elastically deformable under an external force and elastically restorable when the external force is removed can be obtained by forming it using a material having good shape memory property, such as a titanium alloy. Therefore, the present invention not only enables increased flexibility in the design and manufacturing of the structural body of the heat dissipation device, but also avoids unnecessary processing procedures (such as cutting), pollution caused by welding, and increased cost due to waste disposal.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US16/215,648 2017-12-13 2018-12-11 Method for manufacturing heat dissipation device Abandoned US20190186842A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/215,648 US20190186842A1 (en) 2017-12-13 2018-12-11 Method for manufacturing heat dissipation device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762598134P 2017-12-13 2017-12-13
US16/215,648 US20190186842A1 (en) 2017-12-13 2018-12-11 Method for manufacturing heat dissipation device

Publications (1)

Publication Number Publication Date
US20190186842A1 true US20190186842A1 (en) 2019-06-20

Family

ID=64951721

Family Applications (4)

Application Number Title Priority Date Filing Date
US16/215,648 Abandoned US20190186842A1 (en) 2017-12-13 2018-12-11 Method for manufacturing heat dissipation device
US16/215,645 Active 2039-08-14 US11466937B2 (en) 2017-12-13 2018-12-11 Basic structural body for constructing heat dissipation device and heat dissipation device
US17/897,205 Abandoned US20230055030A1 (en) 2017-12-13 2022-08-28 Basic structural body for constructing heat dissipation device and heat dissipation device
US17/897,208 Abandoned US20220412666A1 (en) 2017-12-13 2022-08-28 Basic structural body for constructing heat dissipation device and heat dissipation device

Family Applications After (3)

Application Number Title Priority Date Filing Date
US16/215,645 Active 2039-08-14 US11466937B2 (en) 2017-12-13 2018-12-11 Basic structural body for constructing heat dissipation device and heat dissipation device
US17/897,205 Abandoned US20230055030A1 (en) 2017-12-13 2022-08-28 Basic structural body for constructing heat dissipation device and heat dissipation device
US17/897,208 Abandoned US20220412666A1 (en) 2017-12-13 2022-08-28 Basic structural body for constructing heat dissipation device and heat dissipation device

Country Status (4)

Country Link
US (4) US20190186842A1 (zh)
CN (4) CN209693320U (zh)
DE (1) DE202018107056U1 (zh)
TW (4) TWI697650B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210125894A1 (en) * 2019-10-29 2021-04-29 Abb Schweiz Ag Two-phase heat transfer device for heat dissipation
US20210129392A1 (en) * 2019-11-05 2021-05-06 GM Global Technology Operations LLC Enthalpy-driven self-hardening process at the polymeric/metal layer interface with an interdiffusion process
US11060799B1 (en) * 2020-03-24 2021-07-13 Taiwan Microloops Corp. Vapor chamber structure
US11306980B2 (en) * 2020-09-08 2022-04-19 Inventec (Pudong) Technology Corporation Heat sink and thermal dissipation system
WO2024040339A1 (en) * 2022-08-22 2024-02-29 Simon Fraser University Heat spreader

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI697650B (zh) 2017-12-13 2020-07-01 奇鋐科技股份有限公司 散熱裝置製造方法
EP3620070B1 (en) * 2018-08-22 2024-01-24 Shenzhen Innokin Technology Co., Ltd. Three-dimensional structure heating unit and e-liquid guiding unit for atomizer of e-cigarette and manufacturing method thereof
CN110243213A (zh) * 2019-06-24 2019-09-17 华东理工大学 一种复合结构的平板吸液芯及其制造方法
CN110440621A (zh) * 2019-07-12 2019-11-12 华为技术有限公司 均热板和其制造方法及电子设备
CN110769647B (zh) * 2019-10-22 2020-10-27 东莞领杰金属精密制造科技有限公司 一种均热板的制造方法
CN112788911A (zh) * 2019-11-08 2021-05-11 中兴通讯股份有限公司 一种散热器和电路板散热结构
TWI819157B (zh) * 2019-11-29 2023-10-21 秦文隆 超薄型均溫板及其製造方法
CN113133270A (zh) * 2020-01-14 2021-07-16 航天海鹰(哈尔滨)钛业有限公司 一种基于异形扩散焊水冷板的密闭空间强制散热系统
WO2021172479A1 (ja) * 2020-02-26 2021-09-02 京セラ株式会社 放熱部材
CN112082413A (zh) * 2020-08-03 2020-12-15 东莞领杰金属精密制造科技有限公司 一种超薄均温板及其加工方法
CN113714752A (zh) * 2020-09-29 2021-11-30 中国科学院长春光学精密机械与物理研究所 一种均温板的制造方法及均温板
CN112536572A (zh) * 2020-11-25 2021-03-23 东莞仁海科技股份有限公司 一种用于散热器的冷喷毛细结构均温板制造工艺
CN112589387B (zh) * 2020-11-30 2022-07-01 瑞声科技（南京）有限公司 均温板加工方法及均温板
TWI807232B (zh) * 2020-12-01 2023-07-01 奇鋐科技股份有限公司 均溫板結構
CN112484545A (zh) * 2020-12-01 2021-03-12 奇鋐科技股份有限公司 薄型两相流装置
US11732974B2 (en) 2021-01-06 2023-08-22 Asia Vital Components Co., Ltd. Thin-type two-phase fluid device
US20220214116A1 (en) 2021-01-06 2022-07-07 Asia Vital Components Co., Ltd Vapor chamber structure
TWI809346B (zh) * 2021-01-07 2023-07-21 大陸商深圳興奇宏科技有限公司 可撓性散熱裝置
US11815315B2 (en) 2021-02-18 2023-11-14 Asia Vital Components (China) Co., Ltd. Flexible heat dissipation device
CN115279112A (zh) * 2021-04-29 2022-11-01 华为技术有限公司 一种散热器和电子设备
CN113782504A (zh) * 2021-09-08 2021-12-10 中国矿业大学 一种集成散热器的功率模块简化封装结构及制作方法
CN114234690B (zh) * 2021-12-29 2022-10-28 大连理工大学 高分子聚合物吸液芯及高分子聚合物吸液芯环路热管
TWI830611B (zh) * 2023-03-01 2024-01-21 薩摩亞商塔普林克科技有限公司 整合式散熱模組結構

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7550217B2 (en) * 2003-06-09 2009-06-23 Saint-Gobain Ceramics & Plastics, Inc. Stack supported solid oxide fuel cell
TW200537067A (en) * 2004-05-12 2005-11-16 Ind Tech Res Inst Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device
CN100420912C (zh) * 2005-06-08 2008-09-24 财团法人工业技术研究院 热传组件的复合式毛细结构
CN100413064C (zh) * 2005-07-22 2008-08-20 富准精密工业(深圳)有限公司 气密性腔体散热结构及其制造方法
US8534348B2 (en) * 2005-09-01 2013-09-17 Molex Incorporated Heat pipe and method for manufacturing same
CN101348910A (zh) * 2007-07-19 2009-01-21 纬创资通股份有限公司 使用高温粉体喷枪来产生均热板的毛细结构的制作方法
CN101354222A (zh) * 2007-07-25 2009-01-28 贸晖科技股份有限公司 均温板及其交错式毛细结构以及二者的制造方法
CN101354221A (zh) * 2007-07-25 2009-01-28 贸晖科技股份有限公司 均温板及其毛细结构以及二者的制造方法
CN101472450A (zh) * 2007-12-29 2009-07-01 私立淡江大学 可增强支撑强度与毛细作用的均热装置
CN101520286B (zh) * 2008-02-27 2011-05-11 贸晖科技股份有限公司 均温板内部的支撑体、制法及均温板
CN101655328A (zh) * 2008-08-19 2010-02-24 何昆耀 平板式回路热导装置及其制造方法
CN101762194B (zh) * 2008-12-24 2012-09-19 富准精密工业(深圳)有限公司 蒸发器及应用该蒸发器的回路式热管
TWI427256B (zh) * 2009-02-13 2014-02-21 Foxconn Tech Co Ltd 熱管及其毛細結構之製作方法
CN101995182A (zh) * 2009-08-11 2011-03-30 和硕联合科技股份有限公司 均温板及其制造方法
CN102019543B (zh) * 2009-09-18 2012-10-03 和硕联合科技股份有限公司 均温板及其制作方法
CN102131368B (zh) * 2010-01-20 2013-09-25 和硕联合科技股份有限公司 均温板及其制造方法
TW201127266A (en) * 2010-01-20 2011-08-01 Pegatron Corp Vapor chamber and manufacturing method thereof
CN102378547B (zh) * 2010-08-18 2015-07-15 中国科学院研究生院 均热板
TWM399977U (en) * 2010-10-15 2011-03-11 ming-lang You Structural improvement structure for vapor chamber
CN102693949A (zh) * 2011-03-22 2012-09-26 富准精密工业(深圳)有限公司 均温板
CN103846366A (zh) * 2012-11-30 2014-06-11 象水国际股份有限公司 均温板及其制造方法
CN104053335B (zh) * 2013-03-13 2020-08-25 联想(北京)有限公司 一种电子设备的散热装置
US9835383B1 (en) * 2013-03-15 2017-12-05 Hrl Laboratories, Llc Planar heat pipe with architected core and vapor tolerant arterial wick
TWI582365B (zh) * 2013-12-27 2017-05-11 奇鋐科技股份有限公司 散熱裝置
US10660236B2 (en) * 2014-04-08 2020-05-19 General Electric Company Systems and methods for using additive manufacturing for thermal management
TWM498304U (zh) * 2014-11-25 2015-04-01 Cooler Master Co Ltd 具有液、汽分離之迴路型熱管結構
TWI582367B (zh) * 2015-04-01 2017-05-11 A hot plate and a method for manufacturing the same
TWI563238B (en) * 2015-04-16 2016-12-21 Celsia Technologies Taiwan Inc Manufacturing method of phase change type heat sink
US10392686B2 (en) * 2015-09-29 2019-08-27 Nippon Steel Corporation Mg-containing Zn alloy coated steel
US20170122672A1 (en) * 2015-10-28 2017-05-04 Taiwan Microloops Corp. Vapor chamber and manufacturing method thereof
US10096537B1 (en) * 2015-12-31 2018-10-09 Microfabrica Inc. Thermal management systems, methods for making, and methods for using
TWI639806B (zh) * 2016-02-05 2018-11-01 業強科技股份有限公司 導熱裝置及其製造方法
CN106052444B (zh) * 2016-07-13 2017-11-14 桂林电子科技大学 一种平板热管阵列式散热器
US10746475B2 (en) * 2016-08-01 2020-08-18 California Institute Of Technology Multi-phase thermal control apparatus, evaporators and methods of manufacture thereof
CN206100771U (zh) * 2016-10-12 2017-04-12 惠州市讯硕科技有限公司 一种散热均温板
CN106653713B (zh) * 2016-12-23 2019-06-14 北京工业大学 一种自优化散热的双腔室热管
CN107371322A (zh) * 2017-07-25 2017-11-21 维沃移动通信有限公司 一种补强板的制作方法、补强板及电子设备
TWI697650B (zh) 2017-12-13 2020-07-01 奇鋐科技股份有限公司 散熱裝置製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210125894A1 (en) * 2019-10-29 2021-04-29 Abb Schweiz Ag Two-phase heat transfer device for heat dissipation
US20210129392A1 (en) * 2019-11-05 2021-05-06 GM Global Technology Operations LLC Enthalpy-driven self-hardening process at the polymeric/metal layer interface with an interdiffusion process
US11701802B2 (en) * 2019-11-05 2023-07-18 GM Global Technology Operations LLC Enthalpy-driven self-hardening process at the polymeric/metal layer interface with an interdiffusion process
US11060799B1 (en) * 2020-03-24 2021-07-13 Taiwan Microloops Corp. Vapor chamber structure
US11306980B2 (en) * 2020-09-08 2022-04-19 Inventec (Pudong) Technology Corporation Heat sink and thermal dissipation system
WO2024040339A1 (en) * 2022-08-22 2024-02-29 Simon Fraser University Heat spreader

Also Published As

Publication number Publication date
TWI697650B (zh) 2020-07-01
TWI699507B (zh) 2020-07-21
US20230055030A1 (en) 2023-02-23
US11466937B2 (en) 2022-10-11
TW201928277A (zh) 2019-07-16
DE202018107056U1 (de) 2018-12-17
CN109874269B (zh) 2021-01-08
TW201928275A (zh) 2019-07-16
CN109874270A (zh) 2019-06-11
CN110012639A (zh) 2019-07-12
TWI697651B (zh) 2020-07-01
US20220412666A1 (en) 2022-12-29
TWM577129U (zh) 2019-04-21
US20190186840A1 (en) 2019-06-20
TW201928276A (zh) 2019-07-16
CN109874269A (zh) 2019-06-11
CN110012639B (zh) 2022-08-12
CN209693320U (zh) 2019-11-26

Similar Documents

Publication Publication Date Title
US20190186842A1 (en) Method for manufacturing heat dissipation device
US7770631B2 (en) Method for manufacturing supporting body within an isothermal plate and product of the same
JP2006331897A (ja) 電池ケース用包材及び電池用ケース
JP2008288117A (ja) 電池ケース用包材及び電池用ケース
JP5164786B2 (ja) 電池ケース用包材及び電池用ケース
US11404756B2 (en) Pouch film and secondary battery including the same
ES8204345A1 (es) Procedimiento de fabricacion de laminas compuestas de metal y plastico,para la fabricacion de envases ligeros
CN104798238B (zh) 燃料电池堆
CN108075052A (zh) 具有优良成形性的电池袋
JP6639891B2 (ja) ヒートパイプ及びヒートパイプの製造方法
US20190204020A1 (en) Manufacturing method of heat dissipation device
CN110064834B (zh) 一种实现铝合金板材局部扩散连接的方法
JP2021034705A (ja) 金属板、金属樹脂複合体、半導体デバイス及び、金属板の製造方法
JP4690804B2 (ja) フッ素樹脂製箱型中空容器及びその製造方法
CN109899519A (zh) 一种双层波纹石墨复合垫片
KR102607308B1 (ko) 내부식성이 향상된 다중 파이프의 제조방법
US11219940B2 (en) Manufacturing method of middle member structure
TWI694234B (zh) 中間件結構製造方法
CN102809315A (zh) 薄型热管结构及其制造方法
US8475973B2 (en) Mechanically joined bipolar plates and method therefor
JP5293345B2 (ja) 金属缶胴の製造方法
TWM504821U (zh) 電沉積設備及其固持裝置
JP2013065565A (ja) 電池ケース用包材及び電池用ケース
JP2021115797A (ja) 接合体の製造方法及び接合体
JP2006071080A (ja) 樹脂集積配管

Legal Events

Date Code Title Description
AS Assignment

Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHIANG, KUEI-FENG;REEL/FRAME:047766/0664

Effective date: 20181207

STPP Information on status: patent application and granting procedure in general

Free format text: APPLICATION DISPATCHED FROM PREEXAM, NOT YET DOCKETED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION