US20190186842A1

US20190186842A1 - Method for manufacturing heat dissipation device

Info

Publication number: US20190186842A1
Application number: US16/215,648
Authority: US
Inventors: Kuei-feng Chiang
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2017-12-13
Filing date: 2018-12-11
Publication date: 2019-06-20
Also published as: TWI697651B; US20190186840A1; US20230055030A1; DE202018107056U1; TW201928276A; CN209693320U; US11466937B2; TW201928275A; CN110012639A; TWI697650B; TWI699507B; CN109874270A; TWM577129U; CN109874269A; CN110012639B; CN109874269B; US20220412666A1; TW201928277A

Abstract

A method for manufacturing a heat dissipation device is disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed and manufactured in a more flexible manner.

Description

This application claims the priority benefit of U.S. provisional application No. 62/598,134 filed on Dec. 13, 2017.

FIELD OF THE INVENTION

The present invention relates to a method for manufacturing a heat dissipation device, and more particularly, to a method for manufacturing a heat dissipation device layer by layer.

BACKGROUND OF THE INVENTION

The currently available electronic apparatus have constantly upgraded performance, and, as a result, heat produced by the electronic elements in the electronic apparatus, particularly the electronic elements for signal processing and data computation, is much higher than that produced by the electronic elements in the conventional electronic apparatus. There are various heat dissipation devices available for removing the produced heat from the electronic elements. Among others, heat pipes, heat radiators and vapor chambers are the most frequently used heat dissipation devices, because they are in direct contact with the heat-producing electronic elements to provide further enhanced heat dissipation effect and effectively prevent the electronic elements from being burned out due to overheat.
Vapor chamber, heat pipe, and loop heat pipe are the most commonly used heat dissipation devices, all of which internally define a vacuum-tight chamber, in which vapor-liquid circulation of a working fluid occurs with the aid of a wick structure provided in the chamber, so as to achieve a heat transfer effect.
More specifically, either the vapor chamber or the heat pipe achieves a heat exchange effect when the working fluid in the vacuum-tight chamber evaporates and condenses alternatively. Since the use of the heat pipe or the vapor chamber is largely restricted by the space in which the vapor chamber or the heat pipe is installed, most of the currently available heat pipes and vapor chambers are manufactured to nominal sizes with limited shapes and dimensions and are therefore relatively inflexible in use.
However, the conventional vapor chamber is formed by closing two plate members to each other and sealing joints between them, so that an airtight chamber is defined in the completed vapor chamber; and the conventional heat pipe has two sealed ends to internally define an airtight chamber. The airtight chamber of the vapor chamber and the heat pipe is then evacuated to produce a vacuum state therein and filled with a working fluid. In the process of manufacturing the vapor chamber and the heat pipe, a defective joint sealing procedure often leads to poor air-tightness and vacuum leakage of the completed vapor chamber and heat pipe. Further, edge portions/end portions reserved on the vapor chamber/the heat pipe for forming the sealed joints of the vapor chamber and the sealed ends of the heat pipe form ineffective zones that do not provide any space for the working fluid to work to therefore cause waste of material and increased manufacturing cost.
According to the conventional vapor chamber and heat pipe manufacturing method, different apparatus must be purchased for independently producing individual structural units for forming a complete vapor chamber and a heat pipe, such as the upper and lower plate members for the vapor chamber and the outer pipe for the heat pipe. Subsequent production can be started only after these individual structural units are produced. Further, at least one wick structure, such as a powder-sintered body, a woven mesh or a plurality of grooves, is to be provided in the airtight chamber of the vapor chamber and the heat pipe. In this case, at least one processing procedure, such as sintering, welding, diffusion bonding, knurling or laser processing, must be performed on the inner wall surfaces of the airtight chamber to provide the wick structure. In the case of a wick structure in the form of a woven mesh, it might not be easily tightly attached to the inner wall surfaces of the airtight chamber to therefore cause the problem of poor capillary force of the wick structure. Further, since the conventional vapor chamber is a structure formed of two superimposed plate members, its design and production is subjected to many restrictions and complicated manufacturing steps.
In summary, in the conventional vapor chamber and heat pipe manufacturing method, individual basic structural elements must be separately manufactured and then assembled together, or must be processed before being assembled together. However, inaccurate or defective assembling or sealing of these individual basic structural elements tends to cause poor joints or leaked airtight chamber and accordingly, defective products of vapor chambers and heat pipes.
It is therefore tried by the inventor to overcome the drawbacks of conventional heat dissipation devices.

SUMMARY OF THE INVENTION

A primary object of the present invention is to overcome the drawbacks of the conventional heat dissipation devices by providing a heat dissipation device that can be more flexibly designed while ensures absolute air tightness thereof.
To achieve the above and other objects, a first embodiment of the heat dissipation device provided according to the present invention includes a first basic structural body having a wick structure formed on one side surface thereof, and the first basic structural body and the wick structure are integral structural bodies formed layer by layer.
To achieve the above and other objects, a second embodiment of the heat dissipation device provided according to the present invention includes a plurality of first basic structural bodies respectively having a wick structure formed on one side surface thereof, and the first basic structural bodies and the wick structures are structures formed layer by layer. The first basic structural bodies are fixedly closed together in pairs to construct a desired heat dissipation device that internally defines an airtight chamber, and a working fluid is filled in the airtight chamber.
The first basic structural body and the wick structure can be formed using gold, silver, copper, aluminum, titanium, stainless steel, ceramic, non-metal materials, or any combination thereof.
To achieve the above and other objects, the present invention also provides a method for manufacturing a heat dissipation device. According to a preferred embodiment of the method for manufacturing the heat dissipation device, the following steps are included:
S1: forming a first basic structural body layer by layer for constructed a desired heat dissipation device;
S2: forming a wick structure on one side surface of the first basic structural body and forming all remaining structural portions for constructing the desired heat dissipation device; and
S3: performing evacuation, working fluid filling and final sealing processes for the constructed heat dissipation device.
Since the heat dissipation device according to the present invention is formed layer by layer in a special manufacturing manner, it can be more flexibly designed. The flexibly designed heat dissipation device of the present invention not only solves the disadvantages in the conventional heat dissipation devices caused by the joint sealing process, but also largely reduces the procedures and time needed in manufacturing the conventional heat dissipation devices while enables firm attachment of the wick structure to the inner wall surfaces of the heat dissipation devices. In summary, the present invention enables upgraded overall flexibility in designing and manufacturing a heat dissipation device.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein

FIGS. 1a to 1d are perspective views showing the forming of a first embodiment of a heat dissipation device according to the present invention;

FIGS. 2a to 2c are perspective views showing the forming of a second embodiment of the heat dissipation device according to the present invention;

FIG. 2d is an assembled sectional view of the heat dissipation device of FIGS. 2a to 2 c;

FIG. 3 is an assembled perspective view of a third embodiment of the heat dissipation device according to the present invention;

FIG. 4 is an assembled sectional view of a fourth embodiment of the heat dissipation device according to the present invention;

FIGS. 5a to 5g are perspective views showing the forming of a fifth embodiment of the heat dissipation device according to the present invention;

FIGS. 6a and 6b are perspective views showing the forming of a sixth embodiment of the heat dissipation device according to the present invention;

FIGS. 7a and 7b are perspective views showing the forming of a seventh embodiment of the heat dissipation device according to the present invention;

FIG. 8 is an assembled perspective view of an eighth embodiment of the heat dissipation device according to the present invention;

FIG. 9a is a perspective view of a ninth embodiment of the heat dissipation device according to the present invention;

FIG. 9b is a top view of the ninth embodiment of the heat dissipation device according to the present invention;

FIG. 9c is a sectional side view of a first variation of the ninth embodiment of the heat dissipation device according to the present invention;

FIG. 9d is a sectional side view of a second variation of the ninth embodiment of the heat dissipation device according to the present invention;

FIG. 9e is a sectional side view of a third variation of the ninth embodiment of the heat dissipation device according to the present invention;

FIG. 10a is a sectional side view of a tenth embodiment of the heat dissipation device according to the present invention;

FIG. 10b is another sectional side view of the tenth embodiment of the heat dissipation device according to the present invention;

FIG. 11 is a flowchart showing the steps included in a first embodiment of a method for manufacturing the heat dissipation device according to the present invention;

FIG. 12 is a flowchart showing the steps included in a second embodiment of the method for manufacturing the heat dissipation device according to the present invention;

FIG. 13 is a flowchart showing the steps included in a third embodiment of the method for manufacturing the heat dissipation device according to the present invention;

FIG. 14 is a flowchart showing the steps included in a fourth embodiment of the method for manufacturing the heat dissipation device according to the present invention;

FIG. 15 is a flowchart showing the steps included in a fifth embodiment of the method for manufacturing the heat dissipation device according to the present invention;

FIG. 16 is a flowchart showing the steps included in a sixth embodiment of the method for manufacturing the heat dissipation device according to the present invention;

FIG. 17 is a flowchart showing the steps included in a seventh embodiment of the method for manufacturing the heat dissipation device according to the present invention;

FIG. 18 is a flowchart showing the steps included in an eighth embodiment of the method for manufacturing the heat dissipation device according to the present invention;

FIG. 19 is a flowchart showing the steps included in a ninth embodiment of the method for manufacturing the heat dissipation device according to the present invention;

FIG. 20 is a flowchart showing the steps included in a tenth embodiment of the method for manufacturing the heat dissipation device according to the present invention; and

FIGS. 21a to 21d and FIGS. 22a to 22d are pictorial illustrations of the steps included in the tenth embodiment of the method for manufacturing the heat dissipation device according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will now be described with some preferred embodiments thereof and by reference to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
The present invention provides a heat dissipation device having an integral structure constructed layer by layer or part by part based on the concept of creating something from zero. This type of manufacturing is implemented mainly through 3D printing, electrochemical processing, printing, thermal spraying, or any combination thereof. For this purpose, a primary fundamental carrier or member is first formed, and other secondary structural parts or structural bodies are then sequentially formed on the primary fundamental carrier or member lay by layer to finally form an integral structure.
Please refer to FIGS. 1a to 1 d, which are perspective views showing the forming of a first embodiment of the heat dissipation device according to the present invention. In the first embodiment, a member serving as the primary fundamental carrier/member is a lower plate member of a vapor chamber, which is referred to as a/the first basic structural body and generally denoted by reference numeral 1 herein. There is a wick structure 2 formed on one side surface of the first basic structural body 1. The first basic structural body 1 and the wick structure 2 are structural bodies formed layer by layer.
Please refer to FIG. 1 a. The first basic structural body 1 is a structure formed layer by layer. Forming the structure layer by layer can be achieved through 3D printing, electrochemical processing, printing or thermal spraying. In the first embodiment, the first basic structural body 1 is illustratively and non-restrictively formed layer by layer through 3D printing. Further, the first basic structural body 1 can be formed of a metal material, a non-metal material, or a combination thereof. In the case of the metal material, it can be gold, silver, copper, aluminum, titanium, stainless steel, or an alloy thereof. In the case of the non-metal material, it can be plastic or ceramic. The finally formed first basic structural body 1 is shown in FIG. 1 b. Further, the first basic structural body 1 can include a grooved structure (not shown) directly formed on an inner side surface that is to serve as an inner wall surface of the vapor chamber.
Please refer to FIG. 1 c. The wick structure 2 is formed on the inner side surface of the first basic structural body 1 layer by layer, too. More specifically, the wick structure 2 can be a structural layer consisting of one single porous body or a structural layer consisting of a plurality of superimposed porous bodies achieved through any one of 3D printing electrochemical processing, printing, and thermal spraying. The porous body can be a powder-sintered body, a woven mesh, a fibrous member, or a structural body combining superimposed layers of powder-sintered body, woven mesh and fibrous member.
Please refer to FIG. 1 d. After forming the first basic structural body 1 layer by layer and then forming the wick structure 2 on the first basic structural body 1 also layer by layer, a plate member for one side of the vapor chamber (i.e. a lower plate member or an upper plate member of the vapor chamber) is finally formed.
The titanium material for forming the first basic structural body 1 can be commercially pure titanium or a titanium alloy, both of which are characterized by the following nine advantages of high specific strength, good corrosion resistance, low elastic modulus, good heat resistance, good low-temperature performance, high biocompatibility, low heat transfer coefficient, colorful oxide film and being non-magnetic, and have been widely applied to livelihood-related industry, petrochemical industry, aerospace industry, military industry and medical industry. Up to date, there are already more than 100 types of titanium alloys that have been developed by different countries in the world, and about 40 to 50 types of these titanium alloys have already become commercialized. According to other chemical elements contained therein, these titanium alloys can be generally classified into three major categories, namely, alpha (α) alloys, alpha and beta (α-β) alloys, and beta (β) alloys. According to the types and contents of different chemical elements contained therein, alpha titanium alloys can be further classified into commercially pure titanium, alpha titanium alloys and near-alpha titanium alloys. Commercially pure titanium does not contain other chemical elements but only a trace amount of oxygen, carbon, nitrogen, hydrogen and iron. The oxygen in the pure titanium is an interstitial element, and the amount of oxygen contained in the pure titanium has a relatively big influence on the strength of the pure titanium. Generally speaking, the strength of titanium will increase 100˜120 mPa (megapascal) when the content of oxygen in the titanium is increased by 0.1 wt %. According to the oxygen content thereof, the commercially pure titanium can be classified into four grades, namely, Grade 1 to Grade 4. The Grade 1 pure titanium has oxygen content lower than 0.18 wt % and the advantages of low strength, good ductility and good formability, and is primarily used as a material for roofing and plate-type heat exchanger. The Grade 2 pure titanium has a tensile strength ranged between 350 and 450 mPa, and is the most frequently used one among the four grades of pure titanium, mainly used in the manufacture of seamed or seamless pipes and chemical tanks and containers. The Grade 3 pure titanium has a strength ranged between 500 and 600 mPa and is mainly used in the manufacture of pressure chemical tanks and containers. The Grade 4 pure titanium has a strength close to 700 mPa and is the strongest one of the four grades of pure titanium, and is mainly used in the manufacture of some fasteners and relatively complicate parts that have to be formed around 300° C. Alpha titanium alloys contain alpha stabilizers, such as aluminum and oxygen, as well as neutral alloying elements, such as tin and zinc. Alpha titanium alloys having been subjected to annealing has a single-phase alpha structure that has good structural stability, heat resistance and weldability, as well as a metal strength higher than that of industrially pure titanium. To satisfy the requirement for strength, neutral elements are added to the alpha titanium alloys to increase their strength. A typical example of the strengthened alpha titanium alloys is Grade 6 titanium alloy, also known as Ti-5Al-2.5Sn, which has good fracture toughness and thermal strength at both room temperature and high temperature, and has a long-term working temperature about 500° C. Further, a low interstitial Ti-5Al-2.5Sn can be used in a low-temperature environment. As having been mentioned above, both the commercially pure titanium and the titanium alloys have the advantages of high specific strength, good corrosion resistance, low elastic modulus, good heat resistance, good low-temperature performance, high biocompatibility, low heat transfer coefficient, colorful oxide film and being non-magnetic. Therefore, different types of pure titanium or titanium alloys can be selected for manufacturing different portions of a loop heat pipe. That is, by using pure titanium and titanium alloys of different properties to replace the use of copper, aluminum or stainless steel that are conventionally used in the manufacture of loop heat pipes, it is able to advantageously largely upgrade the overall heat dissipation efficiency and structural strength of the loop heat pipes while largely reduce the overall weight thereof.
Please refer to FIGS. 2a to 2c , which are perspective views showing the forming of a second embodiment of the heat dissipation device according to the present invention; and to FIG. 2d , which is an assembled sectional view of the heat dissipation device of FIGS. 2a to 2c . Since the second embodiment is partially structurally similar to the first embodiment, portions of the second embodiment that are the same as the first embodiment are not repeatedly described herein.
The heat dissipation device in the second embodiment is generally denoted by reference numeral 3, and, as shown in FIG. 2a , is mainly manufactured using a plurality of first basic structural bodies 1, which are formed layer by layer as described in the first embodiment. As shown in FIG. 2b , two pieces of first basic structural bodies 1 are correspondingly closed together to construct a heat dissipation device 3, which is shown in FIG. 2 c.
The heat dissipation device 3 constructed by correspondingly closing two pieces of first basic structural bodies 1 together internally defines an airtight chamber 31, in which a wick structure 2 and a working fluid 4 are provided.
Please refer to FIG. 3, which is an assembled perspective view of a third embodiment of the heat dissipation device according to the present invention. Since the third embodiment is partially structurally similar to the second embodiment, portions of the third embodiment that are the same as the second embodiment are not repeatedly described herein. The heat dissipation device in the third embodiment is different from the second one in that it is embodied as a loop heat pipe 5. In the third embodiment, a vapor chamber is a member serving as a primary fundamental carrier for forming the loop heat pipe 5 and is referred to as a/the heat dissipation device 3 herein. The heat dissipation device 3 includes an outlet 32 and an inlet 33. A vapor and liquid pipe 6 is extended through a heat dissipation unit 7 and connected at two opposite ends to the outlet 32 and the inlet 33. The vapor and liquid line 6, the heat dissipation unit 7, and the heat dissipation device 3 are structures formed layer by layer through 3D printing. When forming the vapor and liquid line 6 layer by layer through 3D printing, different materials can be selected and used alternately.
Please refer to FIG. 4, which is an assembled sectional view of a fourth embodiment of the heat dissipation device according to the present invention. Since the fourth embodiment is partially structurally similar to the second embodiment, portions of the fourth embodiment that are the same as the second embodiment are not repeatedly described herein. The heat dissipation device in the fourth embodiment is different from the second one in that it is externally provided on one side with a polymeric layer 34. The polymeric layer 34 can be formed using a natural polymer, a synthetic polymer or an inorganic polymer. The natural polymer can be any one of starch, rubber and nucleic acid. The synthetic polymer can be any one of polyethylene (PE), polyvinyl chloride (PVC), nylon, Dacron (polyethylene terephthalate or PET), acrylonitrile butadiene styrene (ABS), styrene-butadiene rubber (SBR), and other high-molecular polymers. The inorganic polymer can be any one of quartz, asbestos, mica and graphite. These polymers can give the heat dissipation device 3 additional structural properties.
Please refer to FIGS. 5a to 5g , which are perspective views showing the forming of a fifth embodiment of the heat dissipation device according to the present invention. Since the fifth embodiment is partially structurally similar to the first embodiment, portions of the fifth embodiment that are the same as the first embodiment are not repeatedly described herein. The heat dissipation device in the fifth embodiment is different from the first one in that it is a complete heat dissipation device 3 constructed layer by layer through 3D printing, electrochemical processing, injection, printing or thermal spraying. As shown in FIGS. 5a and 5b , a first basic structural body 1 (i.e. a lower plate member of a vapor chamber) is first formed through 3D printing. Then, as shown in FIG. 5c , a wick structure 2 is formed on one side surface of the first basic structural body 1 layer by layer through 3D printing. Finally, as shown in FIG. 5d , an integral structure including a first basic structure body 1 and a wick structure 2 is formed.
Please refer to FIG. 5e . Thereafter, any other remaining structural portion for constructing the desired heat dissipation device 3, such as an upper plate member of the vapor chamber, is formed on one side of the first basic structural body 1 over the wick structure 2 layer by layer through 3D printing. Meanwhile, an airtight chamber 31 (see FIG. 2b ) is formed in the heat dissipation device 3, as shown in FIG. 5f . Finally, a complete heat dissipation device 3 is constructed, as shown in FIG. 5 g.
Please refer to FIGS. 6a and 6b , which are perspective views showing the forming of a sixth embodiment of the heat dissipation device according to the present invention. Since the sixth embodiment is partially structurally similar to the first embodiment, portions of the sixth embodiment that are the same as the first embodiment are not repeatedly described herein. The heat dissipation device in the sixth embodiment is different from the first one in that it is formed by first providing a pre-formed wick structure 2, as shown in FIG. 6a , and then forming layer by layer a first basic structural body 1 (such as an upper or a lower plate member of a vapor chamber) on at least one side of the wick structure 2, or forming a heat dissipation device 3 (such as a vapor chamber) on outer sides of the wick structure 2, as shown in FIG. 6b . The heat dissipation device 3 shown in FIG. 6b can be formed layer by layer through 3D printing or electrochemical processing.
Please refer to FIGS. 7a and 7b , which are perspective views showing the forming of a seventh embodiment of the heat dissipation device according to the present invention. Since the seventh embodiment is partially structurally similar to the first embodiment, portions of the seventh embodiment that are the same as the first embodiment are not repeatedly described herein. The heat dissipation device in the seventh embodiment is different from the first one in that it is constructed by first forming a completed first basic structural body 1 and a completed wick structure 2, as shown in FIG. 7a , and then a bonding layer 35 is formed between the first basic structural body 1 and the wick structure 2, as shown in FIG. 7b . The bonding layer 35 can be formed through 3D printing, electrochemical processing, thermal spraying or printing. With the bonding layer 35, the first basic structural body 1 and the wick structure 2 are bonded to each other to form an integral body.
Please refer to FIG. 8, which is an assembled perspective view of an eighth embodiment of the heat dissipation device according to the present invention. Since the eighth embodiment is partially structurally similar to the first embodiment, portions of the eighth embodiment that are the same as the first embodiment are not repeatedly described herein. The heat dissipation device in the eighth embodiment is different from the first one in that it includes a first basic structural body 1 (i.e. a lower or an upper plate member of a vapor chamber) having a wick structure 2 formed on one side surface thereof through 3D printing, electrochemical processing, injection, printing or thermal spraying. Thereafter, a frame section 8 capable of upgrading other structural properties of the first basic structural body 1 is further formed along a right and a left edge, along an upper and a lower edge, or along all four edges of the first basic structural body 1 through 3D printing, electrochemical processing, injection, printing or thermal spraying.
The frame section 8 can be optionally formed of other materials showing different structural properties, so that the frame section 8 can give the first basic structural body 1 enhanced heat dissipation property or increased structural strength. For example, the frame section 8 can be otherwise formed of a titanium alloy having good shape memory property, an aluminum material having good heat dissipation property, a copper material having good heat absorption property, or graphite sheet or graphene having excellent temperature evenness effect without being limited to any particular material. Other materials can also be selected for forming the frame section 8.
Please refer to FIGS. 9a and 9b , which are perspective and top views, respectively, of a ninth embodiment of the heat dissipation device according to the present invention. Since the ninth embodiment is partially structurally similar to the fifth embodiment, portions of the ninth embodiment that are the same as the fifth embodiment are not repeatedly described herein. The heat dissipation device in the ninth embodiment is different from the fifth one in that it further includes an intermediate body 9 provided in the airtight chamber 31 defined in between two pieces of first basic structural bodies 1. In the ninth embodiment of the present invention, only the intermediate body 9 will be described. The intermediate body 9 and the first basic structural bodies 1 are integral structural bodies formed layer by layer.
The intermediate body 9 has a first side 91 and an opposite second side 92, and is provided with a plurality of through holes 93 and a recess structure 94. The recess structure 94 can be provided on any one or both of the first side 91 and the second side 92. In the illustrated ninth embodiment, the recess structure 94 is provided on the first side 91. The through holes 93 are extended through the intermediate body 9 to communicate the first side 91 with the second side 92. The recess structure 94 and the through holes 93 can be alternately arranged or not on the intermediate body 9. In the illustrated ninth embodiment, the recess structure 94 and the through holes 93 are alternately arranged on the intermediate body 9. However, it is understood the arrangement of the recess structure 94 and the through holes 93 in the ninth embodiment is only illustrative and not intended to limit the present invention in any way.
As can be seen in FIG. 9b , the recess structure 94 includes a plurality of spaced recesses 941, which are sunken from the first side 91 toward the second side 92. The through holes 93 and the recesses 941 can be horizontally staggered in any two adjacent rows or columns, or be vertically superimposed. In the illustrated ninth embodiment, the through holes 93 and the recesses 941 are horizontally staggered in any two adjacent rows or columns, i.e. each of the through holes 93 is located in an area between any two adjacent recesses 941. However, it is understood the arrangement of the recesses 94 a and the through holes 93 in the ninth embodiment is only illustrative and not intended to limit the present invention in any way. At least one connecting path 942 is provided between two adjacent recesses 941 with two ends of the connecting path 942 serially connected to the recesses 941, such that the recesses 941 are communicable with one another in both a transverse and a longitudinal direction.
Please refer to FIG. 9c , which is a sectional side view of a first variation of the ninth embodiment of the heat dissipation device according to the present invention. As shown, in this first variation, the heat dissipation device includes a wick structure 2 provided between the first basic structural body 1 and the intermediate body 9. The wick structure 2 can be a structural layer consisting of one single porous body or a structural layer consisting of a plurality of superimposed porous bodies. The porous body can be a powder-sintered body, a woven mesh, a fibrous member, or a structural body combining superimposed layers of powder-sintered body, woven mesh and fibrous member. Alternatively, the porous body can include a plurality of grooves that are formed between mutually spaced ribs. In the illustrated first variation of the ninth embodiment, the porous body is a woven mesh. However, it is understood the porous body in the form of a woven mesh in the ninth embodiment is only illustrative and not intended to limit the present invention in any way.
Please refer to FIG. 9d , which is a sectional side view of a second variation of the ninth embodiment of the heat dissipation device according to the present invention. As shown, in this second variation, the intermediate body 9 further includes a plurality of supporting structures 10, each of which is in the form of a post having two ends extended through and projected from the first side 91 and the second side 92 of the intermediate body 9.
Please refer to FIG. 9e , which is a sectional side view of a third variation of the ninth embodiment of the heat dissipation device according to the present invention. As shown, in this third variation, the intermediate body 9 further includes a plurality of supporting structures 10, each of which includes a plurality of posts separately located on the first side 91 and the second side 92 of the intermediate body 9.
Please refer to FIGS. 10a and 10b , which are sectional side views of a tenth embodiment of the heat dissipation device according to the present invention. Since the tenth embodiment is partially structurally similar to the fifth embodiment, portions of the tenth embodiment that are the same as the fifth embodiment are not repeatedly described herein. The heat dissipation device in the tenth embodiment is different from the fifth one in that it further includes at least one supporting structure 10 located in the airtight chamber 31. The supporting structure 10 has at least one end pressed against an inner wall surface of the airtight chamber 31. Further, the supporting structure 10 is an integral structural body formed on the wick structure 2 layer by layer.
The supporting structure 10 in the tenth embodiment can be differently configured. As shown in FIG. 10a , the supporting structure 10 in a first configuration thereof consists of a plurality of posts separately projected from two opposite sides of the wick structure 2 to press against inner wall surfaces of the airtight chamber 31.
As shown in FIG. 10b , the supporting structure 10 in a second configuration thereof includes a single post that is extended through the wick structure 2 with two opposite ends pressed against inner wall surfaces of the airtight chamber 31.
In either configuration, the supporting structure 10 is formed along with the first basic structural bodies 1 layer by layer to construct an integral and complete heat dissipation device. In this manner, it is able to save the manufacturing cost that is required in the conventional heat dissipation device for additional forming and processing two different elements, i.e. the first basic structural bodies 1 and the supporting structure 10. Therefore, the heat dissipation device according to the present invention can be manufactured at less time and labor as well as reduced waste to largely lower the manufacturing cost thereof.
For the wick structure 2, the first basic structural body 1 and the supporting structure 10 that are not particularly described in some of the above-mentioned embodiments, they can be made of gold, silver, copper, aluminum, titanium, stainless steel, ceramic, plastic, or any combination thereof. In the present invention, the wick structure 2 is a structural layer consisting of one single porous body or a plurality of superimposed porous bodies. The porous body can be a powder-sintered body, a woven mesh, a fibrous member, or a structural body combining superimposed layers of powder-sintered body, woven mesh and fibrous member.
In summary, the present invention mainly provides a heat dissipation basic structural body or a heat dissipation device, such as a vapor chamber, which is constructed layer by layer to complete an integral structural body. More specifically, all the parts of the vapor chamber, including the external upper and lower plate members and the internal wick structure thereof, are sequentially formed layer by layer. Further, according to the present invention, materials of different properties are used and processed at the same time to embody a single structural body that presents more than one material property or characteristic, so that a desired heat dissipation device can be manufactured in a more flexible manner without being limited by mold design, which doubtlessly increases the entire manufacturing flexibility and reduces the manufacturing cost of the heat dissipation device.
The forming of an integral structural body of a desired heat dissipation device layer by layer as disclosed in the present invention breaks through the bottleneck in the conventional heat dissipation device manufacturing methods by using and processing materials of different properties, such as metal and non-metal materials, at the same time and enabling tight and flat attachment of the wick structure to the internal chamber of the heat dissipation device through easier and less complicate processing procedures. The heat dissipation device having an integral structural body constructed layer by layer according to the present invention can be more easily accomplished with simplified manufacturing procedures while provides upgraded heat dissipation performance and ensures the air-tightness of the internal chamber of the heat dissipation device.
In the case the heat dissipation device, i.e. the vapor chamber, constructed layer by layer according to the present invention is manufactured in a vacuum environment, the device can not only have improved air-tightness, but also be formed without the need of performing an evacuation process. In this manner, more time and labor costs can be saved, upgraded yield rate can be achieved, and internal vacuum tightness can be ensured in the vapor chamber manufacturing process.
FIG. 11 is a flowchart showing the steps included in a first embodiment of a method for manufacturing a heat dissipation device according to the present invention. Please refer to FIG. 11 along with FIGS. 1a to 1 d. As shown, the first embodiment of the method for manufacturing the heat dissipation device according to the present invention includes the following steps:
S1: Forming a first basic structural body layer by layer for constructing a desired heat dissipation device.
More specifically, in the first step S1, a first basic structural body 1 for constructing a desired heat dissipation device 3 is formed layer by layer. The first basic structural body 1 can be formed using stainless steel, copper, aluminum, titanium, ceramic, a titanium alloy, commercially pure titanium, or any non-metal material. Of course, the first basic structural body 1 can be otherwise formed using any combination of the above-mentioned materials without being limited to any particular material. In the first embodiment of the method for manufacturing the heat dissipation device according to the present invention, the first basic structural body 1 is a lower plate member of a vapor chamber. That is, in this first embodiment, the method for manufacturing the heat dissipation device begins from the forming of a lower plate member for a vapor chamber.
The first basic structural body 1 for the heat dissipation device 3 can be formed layer by layer through 3D printing, multi-material injection molding, thermal spraying, or printing. In this first embodiment, the first basic structural body 1 is illustratively and non-restrictively formed layer by layer through 3D printing (see FIGS. 1a and 1b ), and the materials for forming the first basic structural body 1 can be in a powder form, in a half-melted form, or in a paste form, depending on the material properties of the selected materials.
S2: Forming a wick structure on one side surface of the first basic structural body.
More specifically, in the second step S2, a wick structure 2 is formed on one side surface of the first basic structural body 1 also through 3D printing (see FIGS. 1c and 1d ). The wick structure 2 can be formed using gold, silver, nickel, copper, aluminum, stainless steel, titanium, ceramic, or any combination thereof.
Please refer to FIG. 12, which is a flowchart showing the steps included in a second embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described in detail below.
S1: Forming a first basic structural body layer by layer for constructing a desired heat dissipation device.
S2: Forming a wick structure on one side surface of the first basic structural body.
Since the above two steps S1 and S2 are the same as those in the first embodiment of the method for manufacturing the heat dissipation device according to the present invention, they are not repeatedly described herein. The second embodiment is different from the first one in further including the following steps S3 and S4.
S3: Correspondingly closing together a pair of the completed first basic structural bodies that have the wick structure formed on one inner side surface thereof and sealing joints between the two first basic structural bodies to construct the desired heat dissipation device that has an airtight chamber defined therein.
More specifically, in the third step S3, a pair of the first structural bodies 1 that have the wick structure 2 formed on one inner side surface thereof are correspondingly closed together and joints between them are sealed, so that an airtight chamber 31 is defined between the two closed first basic structural bodies 1 to construct a complete heat dissipation device 3 (see FIGS. 2a to 2d ). The joint sealing can be performed through laser processing, diffusion bonding or welding.
S4: Performing evacuation, working fluid filling and final sealing processes for the heat dissipation device constructed in S3.
More specifically, in the fourth step S4, after the joints between the pair of first basic structural bodies 1 are sealed, air is evacuated from the airtight chamber 31 of the heat dissipation device 3 and a working fluid 4 is filled into the airtight chamber 31. Finally, the heat dissipation device 3 is completely sealed.
FIG. 13 is a flowchart showing the steps included in a third embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described in detail below by reference to FIG. 13 along with FIGS. 6a and 6 b.
S1: Providing a wick structure and forming layer by layer a desired heat dissipation device outside the wick structure, so that the heat dissipation device has an airtight chamber defined therein.
More specifically, in the first step S1, a pre-formed wick structure 2 is provided (see FIG. 6a ). Then, a first basic structural body 1 (i.e. an upper or a lower plate member of a vapor chamber) is formed on at least one side of the wick structure 2 layer by layer, or a heat dissipation device 3 (such as a vapor chamber) is externally formed on outer sides of the wick structure 2 (see FIG. 6b ). In this third embodiment, a heat dissipation device 3 in the form of a vapor chamber is constructed. The material for forming the heat dissipation device 3 can be stainless steel, copper, aluminum, titanium, ceramic, or any combination thereof without being particularly limited.
According to the present invention, the heat dissipation device 3 is constructed layer by layer through 3D printing, multi-material injection molding, thermal spraying, printing, or electrochemical processing. In this third embodiment, the forming of the heat dissipation device 3 layer by layer is illustratively and non-restrictively achieved through 3D printing. Further, the materials for forming the heat dissipation device 3 can be in a powder form, in a half-melted form, or in a paste form, depending on the material properties of the selected materials.
S2: Performing evacuation, working fluid filling and final sealing processes for the heat dissipation device constructed in S1.
More specifically, in the second step S2, after the heat dissipation device 3 is fully constructed, air in an airtight chamber 31 defined in the heat dissipation device 3 is evacuated from and a working fluid 4 is filled into the airtight chamber 31, all via a pre-reserved hole on the heat dissipation device 3. Finally, the pre-reserved hole on the heat dissipation device 3 is sealed.
FIG. 14 is a flowchart showing the steps included in a fourth embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described in detail below by reference to FIG. 14 along with FIG. 8.
S1: Providing a wick structure and forming layer by layer a desired heat dissipation device outside the wick structure, so that the heat dissipation device has an airtight chamber defined therein.
S2: Performing evacuation, working fluid filling and final sealing processes for the heat dissipation device constructed in S1.
Since the above steps S1 and S2 are the same as those in the third embodiment of the method for manufacturing the heat dissipation device according to the present invention, they are not repeatedly described herein. The third embodiment is different from the third one in further including the following step S3 after the second step S2.
S3: Forming an additional structure step by step on an outer side of the heat dissipation device using a material the same as or different from that of the heat dissipation device.
More specifically, in the third step S3, an additional structure capable of upgrading other structural properties of the heat dissipation device 3 is formed step by step on an outer side of the heat dissipation device 3, for example, along a right and a left edge, along an upper and a lower edge, or along all four edges of the heat dissipation device 3. The additional structure can be integrally formed with the heat dissipation device 3 using, for example, a titanium alloy having good shape memory property, an aluminum alloy capable of providing enhanced structural strength, or a polymeric material showing good ductility. And, the additional structure can be formed step by step through injection, electroplating, electrolysis, 3D printing, printing, or thermal spraying without being limited to any particular process.
Please refer to FIG. 15, which is a flowchart showing the steps included in a fifth embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described below by reference to FIG. 15 along with FIGS. 5a to 5 g.
S1: Forming a first basic structural body and a wick structure layer by layer for constructing a desired heat dissipation device.
More specifically, in the first step S1, a first basic structural body 1 and a wick structure 2 for constructing a desired heat dissipation device 3 are formed layer by layer (see FIGS. 5a and 5b ). The first basic structural body 1 can be formed using stainless steel, copper, aluminum, titanium, or ceramic, or any combination thereof. The first basic structural body 1 can be a lower plate member of a vapor chamber. The first basic structural body 1 can be formed layer by layer through 3D printing, injection, printing, or thermal spraying. In this fifth embodiment, the first basic structural body 1 is illustratively and non-restrictively formed layer by layer through 3D printing.
Then, a wick structure 2 is formed on one side surface of the first basic structural body 1 (see FIG. 5c ) layer by layer also through 3D printing Finally, an integral structure including a first basic structure body 1 and a wick structure 2 is formed (see FIG. 5d ).
S2: Forming step by step all remaining structural portions for constructing the desired heat dissipation device.
More specifically, in the second step S2, all remaining structural portions for constructing the desired heat dissipation device 3, such as an upper plate member of the vapor chamber, are further formed over the first basic structural body 1 layer by layer through 3D printing (see FIG. 5e ), such that an airtight chamber 31 is formed between the first basic structural body 1 and the sequentially completed remaining structural portions (see FIGS. 2b and 5f ). Finally, a complete heat dissipation device 3 is formed, as shown in FIG. 5 g.
In the fifth embodiment of the method for manufacturing the heat dissipation device according to the present invention, the forming of the heat dissipation device 3 layer by layer can be completed faster through a multiple mirroring technique. That is, the heat dissipation device 3 or the first basic structural body 1 to be formed layer by layer can be divided into a left and a right part or an upper and a lower part, and the layer-by-layer forming process can be performed on these parts synchronously or asynchronously. By dividing the heat dissipation device 3 or the first basic structural body 1 to be formed into several equally divided parts and performing the layer-by-layer forming on these equally divided parts from one direction, two directions or multiple directions, the layer-by-layer forming process can be completed within a shortened time. Mirroring division of a structural body to be formed can be achieved by dividing the structural body into several symmetrical parts or asymmetrical parts. By performing the layer-by-layer forming process on multiple mirroring parts of the structural body to be formed, the time required by the entire manufacturing process can be shortened to reduce time and labor costs.
S3: Performing evacuation, working fluid filling and final sealing processes for the heat dissipation device constructed in S2.
More specifically, in the third step S3, after the heat dissipation device 3 is fully constructed, air in an airtight chamber 31 defined in the heat dissipation device 3 is evacuated and a working fluid 4 is filled into the airtight chamber 31. Finally, the heat dissipation device 3 is completely sealed.
In the case the fifth embodiment of the method for manufacturing the heat dissipation device according to the present invention is performed in a vacuum environment, the working fluid filling and final sealing processes can be performed in the second step S2 to complete the heat dissipation device 3, and the third step S3 can be omitted, accordingly.
FIG. 16 is a flowchart showing the steps included in a sixth embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described below by reference to FIG. 16 along with FIG. 7.
S1: Providing a fundamental member (i.e. a first basic structural body) for constructing a desired heat dissipation device and providing a single body of wick structure, and placing the single body of wick structure on one side surface of the fundamental member.
More specifically, in the first step S1, a fundamental member for constructing a desired heat dissipation device 3 is provided. In this sixth embodiment of the method for manufacturing the heat dissipation device according to the present invention, the fundamental member refers to a first basic structural body 1 (i.e. a lower plate member for a vapor chamber).
The material for forming the single body of wick structure 2 can be copper, aluminum, nickel, gold, silver, titanium, stainless steel or ceramic, or any combination thereof. Further, the single body of wick structure 2 can be a powder-sintered body, a woven mesh, a fibrous member, or a plurality of grooves. In this sixth embodiment of the method for manufacturing the heat dissipation device according to the present invention, the single body of wick structure 2 is illustratively and non-restrictively shown as a powder-sintered body.
S2: Forming a bonding layer to bond the single body of wick structure and the first basic structural body together to obtain an integral body; and then forming step by step all remaining structural portions for constructing the desired heat dissipation device.
More specifically, in the second step S2, after the single body of wick structure 2 is placed on one side surface of the first basic structural body 1, a bonding layer 35 is formed between joints of the wick structure 2 and the first basic structural body 1 through electrochemical processing, so that the first basic structural body 1 and the wick structure 2 are bonded together to form an integral body (see FIG. 7). Thereafter, other remaining structural portions for constructing the desired heat dissipation device 3, such as the upper plate member for the vapor chamber, are formed step by step on an upper side of the first basic structural body 1 to complete the desired heat dissipation device 3 that internally defines an airtight chamber 31.
S3: Performing evacuation, working fluid filling and final sealing processes for the heat dissipation device constructed in S2.
More specifically, in the third step S3, after the heat dissipation device 3 is fully constructed, air in the airtight chamber 31 defined in the heat dissipation device 3 is evacuated from and a working fluid 4 is filled into the airtight chamber 31, all via a pre-reserved hole on the heat dissipation device 3. Finally, the pre-reserved hole on the heat dissipation device 3 is sealed.
FIG. 17 is a flowchart showing the steps included in a seventh embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described in detail below by reference to FIG. 17 along with FIG. 8.
S1: Providing a first basic structural body for constructing a desired heat dissipation device and then forming a wick structure on one side surface of the first basic structural body.
More specifically, in the first step S1, a pre-formed first basic structural body 1 such as a lower plate member of a vapor chamber is provided, and a wick structure 2 is formed on an inner side surface of the first basic structural body 1 through 3D printing, electrochemical processing, injection, printing, or thermal spraying.
S2: Forming a frame section at other areas outside the first basic structural body.
More specifically, in the second step S2, a frame section 8 capable of upgrading other structural properties of the first basic structural body 1 is further formed along a right and a left edge, along an upper and a lower edge, or along all four edges of the first basic structural body 1 through 3D printing, electrochemical processing, injection, printing, or thermal spraying.
The frame section 8 can be optionally formed of other materials showing different structural properties, so that the frame section 8 can give the first basic structural body 1 enhanced heat dissipation property or increased structural strength. For example, the frame section 8 can be otherwise formed of a titanium alloy having good shape memory property, an aluminum material having good heat dissipation property, or graphite sheet or graphene having excellent temperature evenness effect without being limited to any particular material. Other materials can also be selected for forming the frame section 8.
Please refer to FIG. 18, which is a flowchart showing the steps included in an eighth embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described below by reference to FIG. 18 along with FIGS. 9a to 9c , in which the ninth embodiment of the heat dissipation device according to the present invention is illustrated.
S1: Forming a first basic structural body layer by layer for constructing a desired heat dissipation device.
Since the first step S1 in this eighth embodiment is similar to the first step S1 in the first and the second embodiment of the method for manufacturing the heat dissipation device according to the present invention, it is not repeatedly described herein.
S2: Forming an intermediate body on one side surface of the first basic structural body.
More specifically, in the second step S2, an intermediate body 9 is formed on one side surface of the first basic structural body 1 (see FIGS. 9a and 9b ). The intermediate body 9 can be similarly formed through 3D printing, and the material for forming the intermediate body 9 can be copper, aluminum, stainless steel, titanium, or ceramic, or any combination thereof.
S3: Forming step by step all remaining structural portions for constructing the desired heat dissipation device that has an airtight chamber defined therein.
S4: Performing evacuation, working fluid filling and final sealing processes for the heat dissipation device constructed in S3.
In the eighth embodiment of the method for manufacturing the heat dissipation device according to the present invention, the heat dissipation device can be otherwise constructed layer by layer through electrochemical processing. The electrochemical processing can be electroplating, electroless plating, electroforming, or electrolysis.
The material selected for using in the electrochemical processing can be copper, aluminum, nickel, titanium or ceramic, or any combination thereof.
In the above-mentioned embodiments of the method for manufacturing the heat dissipation device according to the present invention, the wick structure 2 can be otherwise formed through a chemical vapor deposition process or a physical vapor deposition process and is then subjected to pickling to form a porous wick structure 2.
The wick structure 2 can be formed using gold, silver, copper, aluminum, stainless steel or titanium, or any combination thereof. And, the wick structure 2 can be in the form of a mesh structure, a plurality of grooves, or a porous structure.
In the case of electroforming, it applies the same electrochemical principle as that being applied by general metal electroplating, i.e. a process of electrodeposition, which uses an externally supplied electric energy to cause a mixed solution containing metal ions and other additives to produce an electrochemical oxidation-reduction reaction on surfaces of a cathode and an anode, so that a desired metal is deposited on a prototype. In an electrochemical reaction, metal cations in a solution are driven by an externally supplied electric energy to move toward the cathode, and a metal coating is deposited on surfaces of a workpiece through a reduction reaction. Therefore, in the commonly used electroplating and precision electroforming processes, an object to be plated or a prototype is used as the cathode. According to the present invention, after the heat dissipation device 3 is formed, it is used as a cathode in the electroplating or the electroforming process and a desired metal is deposited on the cathode at positions where the wick structure 2 is to be formed.
In electroplating and electroforming, they apply the same principle to deposit a metal material on a specially designed female mold. Various metal materials can be selected for use in these electrochemical processes. When the deposited metal material reaches a desired thickness, the deposited metal material is separated from the female mold to provide an electroformed workpiece. According to the method of the present invention, a frame member is first provided for using in the electroforming or the electroplating process. When the electroforming or the electroplating process is completed, the frame member is removed from the deposited metal material to obtain the workpiece so formed. In the present invention, the frame member for this purpose has a configuration generally the same as the upper and the lower plate member of a vapor chamber to be formed. In the electroplating or the electroforming process, the metal material is molded and attached to the surfaces of the frame member.
The steps included in the above-described embodiments of the method for manufacturing the heat dissipation device according to the present invention can be optionally performed in a vacuum environment. In the case of performing the method of the present invention in a vacuum environment, the step of evacuating air from the airtight chamber 31 of the heat dissipation device 3 can be omitted.
Please refer to FIG. 19, which is a flowchart showing the steps included in a ninth embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described below by reference to FIG. 19 along with FIGS. 21a to 21d and 22a to 22 d.
S1: Providing a fundamental member (i.e. a first basic structural body) for constructing a desired heat dissipation device.
More specifically, in the first step S1, a fundamental member for forming a desired heat dissipation device 3 is provided. In this ninth embodiment of the method for manufacturing the heat dissipation device according to the present invention, the fundamental member refers to a first basic structural body 1, which can be a lower or an upper plate member of a vapor chamber.
S2: Forming a wick structure on one side surface of the first basic structural body and forming all remaining structural portions for constructing the desired heat dissipation heat through electrochemical processing.
More specifically, in the second step S2, electrochemical processing is used to form a wick structure 2 on a selected side surface of the first basic structural body 1, which is a lower plate member of the vapor chamber in this ninth embodiment. Thereafter, all remaining structural portions for constructing the desired heat dissipation device 3, such as an upper plate member of the vapor chamber, are formed at the same time, so as to complete the desired heat dissipation device 3 that internally defines an airtight chamber 31 (not shown).
The electrochemical processing can be electroplating, electroless plating, electroforming, or electrolysis. The material selected for forming the wick structure 2 through electrochemical processing can be copper, aluminum, nickel, titanium or ceramic, or any combination thereof. In the case of using electrochemical processing to form the wick structure 2 of the heat dissipation device 3 of the present invention, a modeling frame is first disposed on a location at where the electrochemical processing is to be performed, so that the wick structure 2 is formed in areas that are not covered by the modeling frame. The modeling frame can be a solid frame, a piece of sticker, or a thin layer formed through printing, and is used to cover areas that are not to be provided with the wick structure 2. When the deposition of the wick structure 2 is completed, the modeling frame is removed.
S3: Performing evacuation, working fluid filling and final sealing processes for the heat dissipation device constructed in S2.
More specifically, in the third step S3, after the heat dissipation device 3 is fully constructed, that is, after a lower and an upper plate member are closed together to provide a vapor chamber, air in an airtight chamber 31 defined in the heat dissipation device 3 is evacuated from and a working fluid 4 is filled into the airtight chamber 31, all via a pre-reserved hole on the heat dissipation device 3. Finally, the pre-reserved hole on the heat dissipation device 3 is sealed. Since the heat dissipation device 3 constructed layer by layer according to the present invention is an integral structure, the process of sealing joints can be saved to largely reduce the manufacturing cost and yield loss while avoid the problem of air leakage from the vacuum-tight heat dissipation device 3.
In addition, in the case the steps included in the ninth embodiment of the method for manufacturing the heat dissipation device according to the present invention are performed in a vacuum environment, the process of evacuation can be omitted, accordingly.
Please refer to FIG. 20, which is a flowchart showing the steps included in a tenth embodiment of the method for manufacturing the heat dissipation device according to the present invention. These steps are described below.
S1: Forming a first basic structural body and a wick structure layer by layer through electrochemical processing for constructing a heat dissipation device.
More specifically, in the first step S1, a first basic structural body 1 and a wick structure 2 for constructing a desired heat dissipation device 3 are formed layer by layer through electrochemical processing. The first basic structural body 1 can be formed using stainless steel, copper, aluminum or titanium, or any combination thereof. The first basic structural body 1 can be a lower or an upper plate member of a vapor chamber, or an integral body of a vapor chamber. The electrochemical processing can be electroplating, electroless plating, electroforming or electrolysis.
The wick structure 2 can be formed using copper, aluminum, stainless steel or titanium, or any combination thereof. The wick structure 2 can be in the form of a mesh structure, a plurality of grooves, or a porous structure.
S2: Forming step by step all remaining structural portions for constructing the desired heat dissipation device.
More specifically, in the second step S2, after the first basic structural body 1 (which is a lower plate member of a vapor chamber in this embodiment) and the wick structure 2 are formed, other remaining structural portions for completing the desired heat dissipation device 3, such as an upper plate member of the vapor chamber, are formed step by step on an upper side of the first basic structural body 1 through electrochemical processing to complete the desired heat dissipation device 3.
S3: Performing evacuation, working fluid filling and final sealing processes for the heat dissipation device constructed in S2.
More specifically, in the third step S3, after the heat dissipation device 3 is fully constructed, air in the airtight chamber 31 defined in the heat dissipation device 3 is evacuated from and a working fluid 4 is filled into the airtight chamber 31. Finally, the heat dissipation device 3 is fully sealed.
All the steps included in the above-mentioned embodiments of the method for manufacturing the heat dissipation device according to the present invention can be optionally performed in a vacuum environment. In the case of performing the method of the present invention in a vacuum environment, the step of evacuating air from the airtight chamber 31 of the heat dissipation device 3 can be omitted.
With the method for manufacturing the heat dissipation device according to the present invention, different types of materials can be freely selected for use at the same time to manufacture an integrally formed heat dissipation device. In this manner, the flexibility in selecting materials for forming the heat dissipation device is increased. Further, the use of materials of different properties or characteristics allows the manufacturing of heat dissipation devices of different structural properties or characteristics. For example, a heat dissipation device having a flexible, shape-changeable structural body can be obtained by forming it using a flexible material; or, a heat dissipation device having a structural body that is elastically deformable under an external force and elastically restorable when the external force is removed can be obtained by forming it using a material having good shape memory property, such as a titanium alloy. Therefore, the present invention not only enables increased flexibility in the design and manufacturing of the structural body of the heat dissipation device, but also avoids unnecessary processing procedures (such as cutting), pollution caused by welding, and increased cost due to waste disposal.
The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims

What is claimed is:

1. A method for manufacturing a heat dissipation device, comprising the following steps:

forming a first basic structural body layer by layer for constructing a heat dissipation device;

forming a wick structure on one side surface of the first basic structural body and forming all remaining structural portions for constructing the heat dissipation device; and

performing evacuation, working fluid filling and final sealing processes for the constructed heat dissipation device.

2. The method for manufacturing the heat dissipation device as claimed in claim 1, wherein the first basic structural body is formed using a material selected from the group consisting of stainless steel, copper, aluminum, titanium, ceramic, titanium alloys, commercially pure titanium, and non-metal materials.

3. The method for manufacturing the heat dissipation device as claimed in claim 1, wherein the first basic structural body for constructing the heat dissipation device is formed layer by layer through a manner selected from the group consisting of 3D printing, multi-material injection molding, thermal spraying, printing, and electrochemical processing.

4. The method for manufacturing the heat dissipation device as claimed in claim 1, wherein the first basic structural body is formed layer by layer using materials in a form selected from the group consisting of a powder form, a half-melted form, or a paste form.

5. The method for manufacturing the heat dissipation device as claimed in claim 1, wherein the wick structure is formed using a material selected from the group consisting of copper, aluminum, nickel, gold, silver, titanium, stainless steel, ceramic, and any combination thereof.

6. The method for manufacturing the heat dissipation device as claimed in claim 1, wherein the wick structure is in a form selected from the group consisting of a powder-sintered body, a woven mesh, a fibrous member, and a plurality of grooves.

7. The method for manufacturing the heat dissipation device as claimed in claim 3, wherein the electrochemical processing is selected from the group consisting of electroplating, electroless plating, electroforming, and electrolysis.

8. The method for manufacturing the heat dissipation device as claimed in claim 7, wherein the electrochemical processing is performed using a material selected from the group consisting of copper, aluminum, nickel, gold, silver, and ceramic.