CN106653713B - A kind of dual cavity heat pipe of self-optimizing heat dissipation - Google Patents
A kind of dual cavity heat pipe of self-optimizing heat dissipation Download PDFInfo
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- CN106653713B CN106653713B CN201611207836.4A CN201611207836A CN106653713B CN 106653713 B CN106653713 B CN 106653713B CN 201611207836 A CN201611207836 A CN 201611207836A CN 106653713 B CN106653713 B CN 106653713B
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Abstract
The present invention provides a kind of dual cavity heat pipe of self-optimizing heat dissipation, which includes main chamber, secondary chamber and two-way steam cock group, and main chamber room is connect by the two-way steam cock group with the secondary chamber.The application passes through the open and close of the two-way steam cock group between two chambers, to adjust the liquid filled ratio and vapour pressure of two chambers.By adjusting the thermal power of the electric calorifie installation of the secondary chamber outer wall, steam cock is made to have different switching thresholds.Compared with general heat pipe, the application propose self-optimizing heat dissipation dual cavity heat pipe the advantages of be, can by the two-way steam cock group between dual cavity adjust heat pipe liquid filled ratio, be allowed to match with power of heat source and heat flow density, reach best radiating efficiency.And it can effectively inhibit influence of the inside heat pipe steam-limit to capillary filter core liquid reflux.Heat pipe production is simple, and process repeatability and reliability are good.
Description
Technical field
The present invention relates to technical field of heat exchange, more particularly, to a kind of dual cavity heat pipe of self-optimizing heat dissipation.
Background technique
The heat exchanger of large power semiconductor device high efficiency and heat radiation is always one of main application of modern heat transfer technology.Half
The improvement rate of conductor component reliability, the increment rate of power capacity and the microminiaturization of structure etc. all directly depend on device sheet
The degree of perfection of body thermal control.
Recently as the fast development of electronic technology and high-power semiconductor laser technology, various electronic devices and half
Conductor Laser chip package gradually develops to miniaturization, high-power direction, so that the heat flow density generated inside component is rapid
Increase, the service life of extreme influence device and reliability.
However, chip energy consumption at the same time and heat dissipation problem also show especially out, the heating power and function of semiconductor components and devices
Rate density sharply increases.The heat flow density of cpu chip is by 1 × 105W/m several years ago2Left and right surge till now 1 ×
106W/m2.If heat dissipation is bad, the excessive temperature of generation can not only reduce the job stability of chip, increase error rate, simultaneously
Also excessive thermal stress can be generated because of the excessive temperature difference between inside modules and external environment, influence electrical property, the work of chip
Working frequency, mechanical strength and reliability.
Meanwhile traditional water-cooling seriously restricts the integrated of high power semiconductor lasers and now its thermal power
Density has reached 1.5 × 106W/m2To 6.0 × 106W/m2, integrated efficient heat transfer device is more needed to its.Semiconductor device
The cooling technology of part will be the key factor for influencing microelectric technique and the development of high-power semiconductor laser technology, semiconductor element device
The reliability and its performance of part, depend greatly on whether equipment there is good thermal design to consider, and are taken
Cooling measure it is whether effective.
Heat pipe is to be currently known one of most effective heat transfer element, is had in terms of the heat dissipation problem for solving semiconductor devices
Obviously advantage.Currently, hot pipe technique is used widely in microelectronics cooling field.But every kind of heat pipe is best
Radiating efficiency only corresponds to the heat source of certain power and heat flow density, the heat transfer of heat pipe when power of heat source or heat flow density variation
Performance will receive very big influence, and this limitation limits its application.Therefore, the structure of opposite heat tube optimizes and designs tool
There is important practical significance.
The optimum working efficiency narrow of existing heat pipe is easy the shadow of heat pipe liquid filled ratio and the saturated vapor pressure limit
It rings, when power of heat source or heat flow density be not in the optimum working efficiency section of heat pipe, will lead to heat pipe heat exchanging unit
Heat conduction efficiency sharply declines, and in the very high field of the heat from heat source such as semiconductor devices, tends not to the requirement for meeting heat dissipation.
Summary of the invention
The present invention provides a kind of pair of self-optimizing heat dissipation for overcoming the above problem or at least being partially solved the above problem
Chamber heat pipe, the heat pipe compare existing general heat pipe, have broader optimum working efficiency range.
According to an aspect of the present invention, a kind of dual cavity heat pipe of self-optimizing heat dissipation is provided, the heat pipe include main chamber,
Secondary chamber and two-way steam cock group, main chamber room are connect by the two-way steam cock group with the secondary chamber.Heat pipe
Secondary chamber is increased on the basis of conventional heat pipe single-chamber room, unlatching and pass by the two-way steam cock group between two chambers
It closes, to adjust the liquid filled ratio and vapour pressure of two chambers.
It further, include capillary core in main chamber room, the capillary core is attached to the inner wall of main chamber room, institute
The inside for stating main chamber forms middle chamber.
Further, volume shared by the indoor capillary core of main chamber is identical as the volume of the middle chamber,
Main chamber room liquid filled ratio is 50%, so that its liquid filled ratio is close to best liquid filled ratio corresponding under various operating conditions.It is opened in heat pipe
After beginning work, air pressure changes between dual cavity, opens switch, and working medium is filled or removed in main chamber room, liquid filled ratio
For the best liquid filled ratio of correspondence.
Further, the volume of the secondary chamber is the half of the volume of the middle chamber of main chamber room.
Further, heat-barrier material is equipped between main chamber room and the secondary chamber, the heat-barrier material uses thermal conductivity
Lower material is made, to reduce the heat transfer between main chamber room and the secondary chamber.
Further, it is separated between the capillary core and the secondary chamber by the two-way steam cock component.
Further, the two-way steam cock group contains at least two steam cock.Steam cock quantity is preferably 2 to 10
It is a.
The open and close of the two-way steam cock group are by switching elastic force itself and switching the pressure between two sides primary and secondary chamber
Difference codetermines.When the steam pressure difference of main chamber room and secondary chamber, and the pressure difference value of the two is greater than the two-way steaming
When closing the switch elastic force of vapour switching group, two-way steam cock are opened, and steam flows into the small chamber of air pressure by the big chamber of air pressure.
The two-way steam cock group the capillary core evaporator section, since heat flow density is uneven or hot-fluid is close
Spend it is high and when generating steam partial and pressing through high, the corresponding steam cock of regional area is opened, other region steam cocks are still
It closes, to adjust Working fluid flow of the steam partial pressure without influencing other parts.
Further, the capillary core uses sintering structure, web structure, honeycomb structure or 3D printing structure, is not suitable for
In channel structure.
Further, in the cavity wall that main chamber room and secondary chamber are connected, the close main chamber room of the capillary core
The capillary density of side is higher than the capillary density close to the secondary chamber side, the close main chamber room one of the capillary core
The capillary gap of side is greater than the capillary gap close to the secondary chamber side.The close main chamber room side of the capillary core
The higher capillary gap of capillary density it is larger, close to the secondary chamber side the lower capillary gap of capillary density it is smaller, capillary
The magnitude range in gap is 50 mesh to 400 mesh.
Further, the side wall of the secondary chamber is connected with electric calorifie installation.By the electric calorifie installation, heat pipe can be made to adapt to not
Heat pipe is initialized after the completion with operating condition and use.
Further, the electric calorifie installation includes electric heating piece, and the electric heating piece passes through heat-conducting silicone grease or indium film and the secondary chamber
The outer wall far from the capillary core side of room well contacts, and the range of heating power is 1W-50W.Under different thermal powers
The two-way steam cock group have different threshold values, to adapt to various operating conditions.After the heat pipe work, with the secondary chamber
The electric calorifie installation of chamber outer wall heats the secondary chamber, so that working medium flows back, completes the initialization of heat pipe.
Based on the above-mentioned technical proposal, the heat pipe that the application proposes increases time chamber on the basis of conventional heat pipe single-chamber room
Room, by the open and close of the two-way steam cock group between two chambers, to adjust the liquid filled ratio and vapour pressure of two chambers.It is logical
The thermal power for adjusting the electric calorifie installation of the secondary chamber outer wall is crossed, steam cock is made to have different switching thresholds.
Compared with general heat pipe, the application propose self-optimizing heat dissipation dual cavity heat pipe the advantages of be, can pass through
The liquid filled ratio of two-way steam cock group adjustment heat pipe between dual cavity, is allowed to match with power of heat source and heat flow density, reach
Best radiating efficiency.And it can effectively inhibit influence of the inside heat pipe steam-limit to capillary filter core liquid reflux.In addition, should
Heat pipe can be used 3D printing technique and realize that the integration system of heat pipe is standby, and heat pipe production is simple, process repeatability and reliability
Well.
Detailed description of the invention
Fig. 1 is the schematic diagram according to the dual cavity heat pipe structure of the embodiment of the present invention；
Fig. 2 is the schematic diagram according to the capillary core of the embodiment of the present invention；
Fig. 3 is the partial enlarged view according to the capillary core of the embodiment of the present invention.
Marked in the figure: 1. main chamber, 2. secondary chambers, 3. two-way steam cock groups, 4. electric calorifie installations, 5. capillary cores, 6.
Capillary gap, 7. heat sources.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiments of the present invention will be described in further detail.Implement below
Example is not intended to limit the scope of the invention for illustrating the present invention.
In one embodiment according to the application, with reference to Fig. 1, a kind of dual cavity heat pipe of self-optimizing heat dissipation is provided, it should
Heat pipe includes main chamber 1, secondary chamber 2 and two-way steam cock group 3, main chamber room 1 by the two-way steam cock group 3 with
The secondary chamber 2 connects.Heat pipe increases secondary chamber 2 on the basis of conventional heat pipe single-chamber room, by double between two chambers
Open and close to steam cock group 3, to adjust the liquid filled ratio and vapour pressure of two chambers.
It include capillary core 5 in main chamber room 1, the capillary core 5 is attached to the inner wall of main chamber room 1, described
The inside of main chamber 1 forms middle chamber.
Volume shared by the capillary core 5 in main chamber room 1 is identical as the volume of the middle chamber, the master
1 liquid filled ratio of chamber is 50%.Make its liquid filled ratio close to best liquid filled ratio corresponding under various operating conditions.It starts to work in heat pipe
Afterwards, air pressure changes between dual cavity, opens switch, and working medium is filled or removed in main chamber room 1, and liquid filled ratio is to correspond to
Best liquid filled ratio.
The volume of the secondary chamber 2 is the half of the volume of the middle chamber of main chamber room 1.
Heat-barrier material is equipped between main chamber room 1 and the secondary chamber 2, the heat-barrier material is lower using thermal conductivity
Material is made, to reduce the heat transfer between main chamber room 1 and the secondary chamber 2.
It is separated between the capillary core 5 and the secondary chamber 2 by the two-way steam cock group 3.
The two-way steam cock group 3 contains at least two steam cock.Steam cock quantity is preferably 2 to 10.
The open and close of the two-way steam cock group 3 are by switching between elastic force itself and switch two sides primary and secondary chamber 2
Pressure difference codetermines.When the steam pressure of main chamber room 1 and secondary chamber 2 difference, and the pressure difference value of the two is greater than described pair
To steam cock group 3 when closing the switch elastic force, two-way steam cock is opened, and steam is small by the big chamber inflow air pressure of air pressure
Chamber.
The two-way steam cock group 3 the capillary core 5 evaporator section, since heat flow density is uneven or hot-fluid
Density is excessively high and when generating steam partial and pressing through high, the corresponding steam cock of regional area is opened, other region steam cocks are still
It so closes, to adjust Working fluid flow of the steam partial pressure without influencing other parts.
Sintering structure, web structure, honeycomb structure or 3D printing structure can be used in the capillary core 5, is not suitable for slot
Road structure.
The capillary density of close 1 side of main chamber room of the capillary core 5 is higher than close to 2 side of secondary chamber
The capillary gap 6 of capillary density, close 1 side of main chamber room of the capillary core 5 is greater than close to 2 side of secondary chamber
Capillary gap 6.The capillary density of close 1 side of main chamber room of the capillary core 5 is higher, capillary gap is larger, leans on
The capillary density of nearly 2 side of secondary chamber is lower, capillary gap is smaller, and the magnitude range of capillary gap 6 is 50 mesh to 400
Mesh.
The side wall of the secondary chamber 2 is connected with electric calorifie installation 4.By the electric calorifie installation 4, heat pipe can be made to adapt to different works
Heat pipe is initialized after the completion of condition and use.
The electric calorifie installation 4 includes electric heating piece, and the electric heating piece is remote with the secondary chamber 2 by heat-conducting silicone grease or indium film
Outer wall from 5 side of capillary core well contacts, and the range of heating power is 1W-50W.It is described under different thermal powers
Two-way steam cock group 3 has different threshold values, to adapt to various operating conditions.After the heat pipe work, with outside the secondary chamber 2
The electric calorifie installation 4 of wall heats the secondary chamber 2, so that working medium flows back, completes the initialization of heat pipe.
The heat source operating condition being arranged on the outside of main chamber room 1 works under standard condition, and the electrothermal module of the secondary chamber 2 exists
It works under corresponding power.When pressure balance in main chamber room 1 and secondary chamber 2, the two-way steam cock group 3 is closed.Work
Matter is recycled in main chamber 1 as the evaporation ends where heat source to condensation end, completes heat transmission, heat pipe each section length is by reality
Working condition determines.
The electric calorifie installation 4 heats the secondary chamber 2, and the pressure difference for adjusting main chamber room 1 and secondary chamber 2 is designing
Range only needs little heat i.e. and can reach cavity pressure balance since secondary chamber 2 is relatively independent, therefore increases heat and dissipate to system
Heat affecting is little.
After the power of the heat source 7 in the outside of main chamber room 1 changes, corresponding 4 power of electric calorifie installation changes therewith
Becoming, steam pressure is different between two chambers and difference is greater than when closing the switch elastic force, and the two-way steam cock group 3 is opened,
Steam flows into the small chamber of air pressure by the big chamber of air pressure, to change 1 liquid filled ratio of main chamber, improves heat transfer efficiency, completes excellent
Change.
Below with a concrete example for, for design conditions be 30W heat source flat-plate heat pipe, 1 liquid filled ratio of main chamber
50%.Capillary gap 6 is from 50 mesh to 400 mesh.Tube body condensation end is 25 degrees Celsius of TEC temperature control, and 4 power of electric calorifie installation is
5W, two-way steam cock group 3 is closed at this time, and Working fluid phase changing and flowing are only limitted in main chamber 1.
When heat source 7 changes, when power is reduced to 20W, since this opposite 1 liquid filled ratio of state main chamber is excessively high, liquid is excessive
So that thermal response speed reduces, working medium boiling threshold value is increased, and 5 suction of capillary core is reduced, and leads to adopting heat pipes for heat transfer inefficiency.This
When reduce the power of the electric calorifie installation 4, working medium enters secondary chamber 2 by main chamber 1, liquid filled ratio decline, thermal response in main chamber 1
It improves, the thermal efficiency of heat pipe improves, and completes the self-optimizing of heat pipe.And when power of heat source is increased to 40W, intracavitary boiling reaction adds
Play, liquid filled ratio decline, capillary core 5 cannot sufficiently infiltrate.The power of the electric calorifie installation 4 is improved at this time, and working medium is by secondary chamber
Room 2 enters main chamber 1, and liquid filled ratio increases in main chamber 1, and boiling phase change efficiency increases, and the thermal efficiency of heat pipe improves, and completes heat pipe
Self-optimizing.
When 7 heat flow density of heat source when the outside of main chamber 1 is uneven, in evaporator section, local heat flux density is excessively high, or
Due to being vortexed between capillary gap, the local vapour pressure limit is caused to be formed, the vapour pressure limit can seriously affect the phase transformation of heat pipe, shape
It is carried secretly at drop, hinders the capillary resorption of working medium.The two-way steam cock group 3 is correspondingly formed the region of steam-limit, steam
Pressure is uneven, and the switch of this part is opened, and steam enters secondary chamber 2, to adjust steam partial pressure without influencing other parts
Working fluid flow, complete optimization.
A kind of capillary core 5 suitable for the heat pipe as shown in Figures 2 and 3, is made of honeycomb structure.In the master
In the cavity wall that chamber 1 and secondary chamber 2 are connected, capillary density of the capillary core 5 close to 1 side of main chamber room is higher, hair
Areolar 6 is larger, and the capillary density close to 2 side of secondary chamber is lower, capillary gap is smaller, and capillary gap 6 is by 50 mesh to 400
Mesh.The capillary core 5 of the form not only adapts to run under various working, and main chamber room 1 and secondary chamber 2 are isolated, and
And after two-way steam cock group 3 opening, is conducive to reinforce liquid refrigerant exchange under small pressure difference, improves working efficiency.
Finally, the present processes are only preferable embodiment, it is not intended to limit the scope of the present invention.It is all
Within the spirit and principles in the present invention, any modification, equivalent replacement, improvement and so on should be included in protection of the invention
Within the scope of.
In specification of the invention, numerous specific details are set forth.It is to be appreciated, however, that the embodiment of the present invention can be with
It practices without these specific details.In some instances, well known method, structure and skill is not been shown in detail
Art, so as not to obscure the understanding of this specification.
Claims (9)
1. a kind of dual cavity heat pipe of self-optimizing heat dissipation, which is characterized in that including main chamber, secondary chamber and two-way steam cock
Group, main chamber room are connect by the two-way steam cock group with the secondary chamber；It include capillary core in main chamber room,
The capillary core is attached to the inner wall of main chamber room, and the inside of main chamber room forms middle chamber；
Wherein, the two-way steam cock group the capillary core evaporator section, when main chamber room and the secondary chamber
Steam pressure is different, and the pressure difference value of main chamber room and the secondary chamber is closed greater than the switch of the two-way steam cock group
When closing elastic force, the two-way steam cock group is opened.
2. a kind of dual cavity heat pipe of self-optimizing heat dissipation according to claim 1, which is characterized in that main chamber is indoor
Volume shared by the capillary core is identical as the volume of the middle chamber, and main chamber room liquid filled ratio is 50%.
3. a kind of dual cavity heat pipe of self-optimizing heat dissipation according to claim 2, which is characterized in that the body of the secondary chamber
Product is the half of the volume of the middle chamber of main chamber room.
4. a kind of dual cavity heat pipe of self-optimizing heat dissipation according to claim 1, which is characterized in that main chamber room and institute
It states and is equipped with heat-barrier material between secondary chamber.
5. a kind of dual cavity heat pipe of self-optimizing heat dissipation according to claim 1, which is characterized in that the capillary core with
It is separated between the secondary chamber by the two-way steam cock component, the two-way steam cock group contains at least two steam
Switch.
6. a kind of dual cavity heat pipe of self-optimizing heat dissipation according to claim 1, which is characterized in that the capillary core is adopted
With one of sintering structure, web structure, honeycomb structure or 3D printing structure.
7. a kind of dual cavity heat pipe of self-optimizing heat dissipation according to claim 1, which is characterized in that in main chamber room and
In the cavity wall of secondary chamber linking, the capillary density of the close main chamber room side of the capillary core is higher than close to the secondary chamber
The capillary gap of the capillary density of room side, the close main chamber room side of the capillary core is greater than close to the secondary chamber
The capillary gap of side.
8. a kind of dual cavity heat pipe of self-optimizing heat dissipation according to claim 1, which is characterized in that the side of the secondary chamber
Wall is connected with electric calorifie installation.
9. a kind of dual cavity heat pipe of self-optimizing heat dissipation according to claim 8, which is characterized in that the electric calorifie installation packet
Include electric heating piece, the outer wall far from the capillary core side that the electric heating piece passes through heat-conducting silicone grease or indium film and the secondary chamber
Contact, the range of heating power are 1W-50W.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611207836.4A CN106653713B (en) | 2016-12-23 | 2016-12-23 | A kind of dual cavity heat pipe of self-optimizing heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611207836.4A CN106653713B (en) | 2016-12-23 | 2016-12-23 | A kind of dual cavity heat pipe of self-optimizing heat dissipation |
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| CN106653713A CN106653713A (en) | 2017-05-10 |
| CN106653713B true CN106653713B (en) | 2019-06-14 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI697650B (en) * | 2017-12-13 | 2020-07-01 | 奇鋐科技股份有限公司 | Heat dissipation device manufacturing method |
| US10849217B2 (en) * | 2018-07-02 | 2020-11-24 | Aptiv Technologies Limited | Electrical-circuit assembly with heat-sink |
| US11121058B2 (en) | 2019-07-24 | 2021-09-14 | Aptiv Technologies Limited | Liquid cooled module with device heat spreader |
| CN110621144B (en) * | 2019-09-29 | 2022-04-15 | 维沃移动通信有限公司 | Heat dissipation assembly and electronic equipment |
| CN110940211B (en) * | 2019-11-14 | 2021-05-28 | 东华大学 | Method and device for improving thermal efficiency of rechargeable liquid filling rate-variable heat pipe |
| US11382205B2 (en) | 2020-09-16 | 2022-07-05 | Aptiv Technologies Limited | Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly |
| WO2022146226A1 (en) | 2020-12-30 | 2022-07-07 | Razer (Asia-Pacific) Pte. Ltd. | Vapor chamber having a reservoir |
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| CN101989585A (en) * | 2009-07-30 | 2011-03-23 | 台湾积体电路制造股份有限公司 | Microelectronic package |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101989585A (en) * | 2009-07-30 | 2011-03-23 | 台湾积体电路制造股份有限公司 | Microelectronic package |
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