JP2006071080A - Resin integral pipe - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin integral pipe which can be saved in space and reduced in weight by simplifying a complicated pipe, and prevented from changing the temperature of the fluid circulating in passages, being not hardly affected by corrosion and degeneration of a material, etc., with the fluid circulating in the passages. <P>SOLUTION: Resin-made plates 2 are piled and bonded, the passages 5 are formed between the piled plates 2. The resin integral pipe is comprised of an external communication hole 6 to communicate from the plates 2 into the passages 5, and a groove 4 in which at least one of the plates 2 forms the passages 5. Since the part to be the passages 5 is made of resin, and a heat insulating hole 8 is provided between the passages 5, the heat transfer between adjoining passages 5 can be prevented. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a resin integrated pipe, and more specifically, is less susceptible to corrosion and material alteration by a fluid flowing through a flow path, and can simplify a complicated pipe to save space and reduce weight. The present invention relates to a resin integrated pipe that can suppress a temperature change of a fluid flowing through a flow path.

  Conventionally, pipes having different thicknesses and lengths are arranged in a complicated manner vertically and horizontally in a mechanical apparatus having many pipes for circulating a fluid, such as an air conditioner or a refrigeration apparatus. For this reason, attaching various devices and parts such as sensors and control devices to these pipes has many space restrictions, and there are problems in terms of maintenance.

  In view of this, there has been proposed a metal integrated pipe that simplifies and downsizes a plurality of pipes as a unit (see, for example, Patent Document 1). In Patent Document 1, a concave portion having a predetermined shape for forming a flow path is formed on a pair of metal plates, and the integrated pipes are manufactured by brazing and joining the metal plates.

  In another proposal, a metal first plate in which a groove serving as a flow path is formed by pressing or precision casting and a metal second plate in which a communication hole leading to a device to be attached is formed are welded. The integrated pipes are manufactured by joining them together (see Patent Document 2).

  However, in both of these proposals, a metal plate is used as the base material of the integrated piping, and the portion that becomes the flow path is made of metal. When such metal integrated pipes are used in, for example, devices and equipment used in fuel cells, chemical plants, food production lines, semiconductor production lines, etc., they are corroded by the fluid flowing through the flow paths of the integrated pipes, or have chemical effects. (For example, metal ions in the flow path portion of the piping are eluted). For this reason, it becomes unusable in a short period of time, resulting in problems such as frequent replacement of the integrated piping and changes in the fluid component flowing through the flow path. In addition, there is a problem that the weight increases.

In addition, since the metal integrated piping has a relatively high thermal conductivity, the fluid flowing through the flow path is likely to change in temperature due to the temperature outside the flow path. In particular, the flow path and the flow path are close to each other. Are provided, it becomes easy to be influenced by the temperature of the fluid flowing in the adjacent flow path. Therefore, when the fluid needs to be in a predetermined temperature range, there is a problem that the distance between the flow paths cannot be reduced and the equipment is enlarged. Therefore, there has been a demand for an integrated pipe that can flow the fluid while minimizing the influence from the outside and suppressing the temperature change.
Japanese Patent Laid-Open No. 11-759 JP 2003-74519 A

  The object of the present invention is that the fluid flowing through the flow path is not easily affected by corrosion, material deterioration, etc., and the complicated piping can be simplified to save space and weight, and the temperature change of the fluid flowing through the flow path It is providing the resin integrated piping which can suppress this.

  In order to achieve the above object, the resin integrated pipe of the present invention is a resin integrated pipe in which resin plates are laminated and joined, and a flow path is formed between the laminated plates, from the plate to the flow path. It has an external communication hole that communicates, and at least one of the plates has a groove part that forms the flow path, and a heat insulating part that insulates the inside and the outside of the flow path is provided. is there.

  According to the resin integrated pipe of the present invention, resin plates are laminated and joined, and a flow path is formed between the stacked plates, and the external communication hole communicating from the plate to the flow path is formed. And at least one of the plates has a structure that has a groove part that forms a flow path, so that the part that becomes the flow path becomes resin, and is less susceptible to corrosion or material alteration by the fluid flowing through the flow path, Can be used for a long time. Since it is made of resin, it is possible to reduce the weight.

  In addition, it is possible to simplify and save space by making complicated piping into a unit, and since the groove is provided in at least one of the plates, the plate can be manufactured by various methods.

  Furthermore, when connecting the external device and the flow path through the external communication hole communicating from the plate to the flow path, the external device can be attached to one or both plates, and the degree of freedom of the layout of the external device Will also increase.

  In addition, since the heat insulating portion that insulates the inside and the outside of the flow path is provided, the fluid flowing through the flow path is hardly affected by the temperature outside the flow path, and the temperature change of the fluid can be suppressed.

  Hereinafter, the resin integrated piping of the present invention will be described based on the embodiments shown in the drawings. 1 is a plan view of the first embodiment, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is an enlarged view of a portion B in FIG.

  The resin integrated pipe 1 has a structure in which resin plates 2 are stacked and joined, and a flow path 5 is provided between the stacked plates 2a and 2b.

  In FIG. 2, the upper plate 2a has an external communication hole 6 penetrating from one surface to the other surface and a heat insulating hole 8 as an example of a heat insulating portion in a predetermined position, and has a planar shape with a substantially uniform thickness. Yes. The lower plate 2b has a groove portion 4 and a heat insulating hole 8 forming a flow path 5 having a concave shape on one surface, and has a substantially uniform thickness.

  The surface of the lower plate 2b on which the concave groove portion 4 is provided faces the upper plate 2a and is laminated and joined so as to close the groove portion 4, thereby being surrounded by the groove portion 4 and the upper plate 2a. Thus, the flow path 5 is formed.

  At this time, the external communication hole 6 at a predetermined position of the upper plate 2a and the groove 4 (that is, the flow path 5) of the lower plate 2b are joined at a position where they communicate. Moreover, it joins in the position where the heat insulation hole 8 of both plates 2a and 2b connects. The external communication hole 6 and the heat insulating hole 8 may be provided after the two plates 2a and 2b are laminated.

  On the surface of the upper plate 2a of the resin integrated pipe 1 configured in this way, as shown in FIG. 1, extended tubes 12a and 12b, which are external devices, and sensors 12c, An electromagnetic valve 12 d is mounted, these external devices 12 a to 12 d and the flow path 5 communicate with each other through the external communication hole 6, and a heat insulating hole 8 is disposed between the flow path 5 and the flow path 5. The

  Each of the plates 2a and 2b can be formed of a single layer resin, but has a two-layer structure as shown in FIG. 3, and the bonding surface side is a normal resin (non-foamed resin) S and the outer surface side is a foamed resin. P can also be used. Thereby, the part which becomes the flow path 5 becomes the normal resin S, and the part which covers the flow path 5 becomes the foamed resin P. As the foamed resin P, for example, foamed urethane, foamed polystyrene, foamed polyethylene, or the like can be used.

  In the structure of the resin integrated pipe 1, since the flow path 5 is made of resin, it is possible to prevent deterioration of the material such as corrosion and metal ion elution caused by the fluid flowing through the flow path, which is a problem in the metal pipe. . Therefore, it is possible to deal with fluids that are difficult to circulate with metal piping, can be used for a long time, and can be reduced in weight by resin.

  Examples of the resin used for the plate 2 include polyolefins such as polyethylene, polypropylene, polybutene, and polymethylpentene, and polyamides such as nylon 6, nylon 66, nylon 610, nylon 612, nylon 11, nylon 12, nylon 46, and aromatic nylon. , Polytetrafluoroethylene, trifluoroethylene-perfluoroalkyl vinyl ether copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-ethylene copolymer, polyvinylidene fluoride, polychlorotrifluoroethylene, etc. Fluororesin, Polybutylene terephthalate, Polyester such as polyethylene terephthalate, Polyvinyl chloride, Polyacetal, Polyphenylene ether, Polysulfone, Polyether Sulfone, can be used polyphenylene sulfide and the like.

  When the fluid flowing through the flow path 5 is a corrosive fluid such as a strong acid or strong alkali, it is preferable to use a polyolefin or a fluororesin excellent in corrosion resistance. Moreover, in the case of fluids for pure water or food / beverage applications, it is preferable to use polyolefin or fluororesin because low elution of the material components forming the flow path 5 is required.

  When the mechanical strength is insufficient with respect to the internal pressure or the like of the flow path 5, the strength can be increased by mixing a resin reinforcing material into the resin used for the plate 2. Examples of the resin reinforcing material in this case include glass fibers, carbon fibers, alumina fibers, aramid fibers, boron fibers, fibrous fillers such as PBO (poly-p-phenylenebenzobisoxazole) fibers, carbon, calcium carbonate, clay, Examples thereof include powdery fillers such as silica, flat fillers such as mica, talc and graphite, and spherical fillers such as glass balloons and shirasu balloons. When heat resistance (rigidity at high temperature) is required, the above fibrous filler is preferable.

  In addition, this structure makes it possible to unitize complicated piping, further simplifying it, saving space and reducing costs, increasing the degree of integration of piping, and shortening the flow path 5 to reduce flow. A drop in fluid pressure due to the passage 5 can also be prevented. By providing the groove 4 in at least one of the plates 2, the plate 2 can be manufactured by various methods, and the external devices 12a to 12d can be attached to one or both of the plates 2. There is also an effect that the layout of the external devices 12a to 12d becomes free.

  Furthermore, heat conduction between the adjacent flow paths 5 is hindered by the heat insulating holes 8 provided between the flow paths 5, so that the fluids flowing through the respective flow paths 5 are not easily affected by the temperature. In this embodiment, although the heat insulation hole 8 which penetrates both plates 2a and 2b is provided, it can also be set as a heat insulation groove without penetrating. In addition, the foamed resin P covering the flow path 5 insulates the inside and the outside of the flow path 5, and the temperature change of the fluid flowing through the flow path 5 due to the external environment can be suppressed.

  For example, in fuel cell piping, fluid containing water vapor close to saturation circulates in some piping, so condensation occurs when cooled by fluid or outside air flowing in adjacent piping, reducing system efficiency. And stability may be affected. With such a heat insulating structure, the flow paths 5 can be arranged more adjacent to each other, so that space saving and integration can be improved.

  Further, in the fuel cell integrated pipe, a fluid that elutes metal ions flows through the flow path 5, and weight reduction and downsizing are strongly demanded. Therefore, the resin integrated pipe 1 having the above-described structure is preferable. Can be used.

  The plate 2 can be manufactured by a general resin molding method such as injection molding, press molding, vacuum molding, pressure molding, etc., and the external communication hole 6 and the heat insulating hole 8 of the plate 2 are formed together during resin molding. It can also be formed after resin molding.

  If vacuum molding or pressure molding is used as the resin molding method, the investment in the mold can be greatly reduced, and the cost can be greatly reduced. As a result, it is possible to easily cope with small-lot and multi-product production and frequent design changes.

  In addition to the structure shown in this embodiment, the groove 4 may be provided in both plates 2a and 2b. In addition to the foamed resin P, the outer layer of the plates 2a and 2b shown in FIG. 3 is made of a spherical filler-containing resin such as a glass balloon or a shirasu balloon having a heat insulating effect, glass fiber, carbon fiber, alumina fiber, A fiber layer such as an aramid fiber, boron fiber, PBO (poly-p-phenylenebenzobisoxazole) fiber, or a vacuum air layer may be used.

  Using a foamed resin having an airtight surface thin layer formed by extruding at least one of the plates 2a and 2b, if this surface thin layer is made to be the surface of the flow channel 5, the flow resistance is small, and The resin integrated piping 1 can be manufactured at low cost.

  Further, at least one of the plates 2a and 2b can be a resin multilayer. When the resin multilayer body is formed, it may be formed into a multilayer layer at one time by extrusion molding, or the single layer body may be later formed into a multilayer body.

  As the structure of this resin multilayer body, in addition to a structure in which the side to be joined that becomes the flow path 5 is a normal resin layer that is not foamed and a foamed resin layer is provided on the outer side, the type of resin and the expansion ratio are set. Multiple layers can also be formed by the changed foamed resin layer. At least heat insulation can be improved by providing a foamed resin layer in the multilayer body.

  Further, when the mechanical strength is insufficient with respect to the internal pressure of the flow path 5, a resin layer having a higher elastic modulus and yield stress than the resin layer is provided outside the resin layer on the side to be joined that becomes the flow path 5. You may do it.

  As a method for producing the foamed resin, a general chemical foaming, physical foaming, or a method using a supercritical fluid such as CO 2 can be employed.

  A second embodiment will be described with reference to FIGS. 4 is a plan view of the resin integrated pipe of the second embodiment, FIG. 5 is a cross-sectional view taken along the line CC in FIG. 4, and FIG. 6 is an enlarged view of a portion D in FIG. The resin integrated pipe 1 has a structure in which both sides of a resin partition plate 3 are laminated and bonded with a resin plate 2 and flow paths 5 are provided on both surfaces of the partition plate 3.

  In FIG. 5, the upper plate 2a has a groove portion 4 forming a channel 5 having a concave shape on one surface, an external communication hole 6 penetrating from one surface to the other surface, and a heat insulating hole 8 at predetermined positions. The thickness is almost uniform. Then, as shown in an enlarged view in FIG. 6, the joining side is a normal resin (non-foamed resin) S and the outside is a foamed resin P. The partition plate 3 has a flat plate shape with a substantially uniform thickness, and has a through-hole 7 penetrating from one surface to the other surface, an external communication hole 6 and a heat insulating hole 8 at predetermined positions. The lower plate 2b has a groove portion 4 that forms a channel 5 having a concave shape on one surface and a heat insulating hole 8 at predetermined positions, and has a substantially uniform thickness. Then, as shown in an enlarged view in FIG. 6, the joining side is a normal resin (non-foamed resin) S and the outside is a foamed resin P.

  When the detailed assembly state is shown in FIG. 7, each plate 2 a, 2 b is bonded to both surfaces of the partition plate 3 so as to close the groove portion 4 with the surface on which the concave groove portion 4 is provided facing the partition plate 3. Thus, the channel 5 is formed by the groove 4 and the partition plate 3 as shown in FIG.

  The upper plate 2a and the partition plate 3 include a through hole 7 at a predetermined position of the partition plate 3, a groove portion 4 (that is, a flow path 5) at a predetermined position of the upper plate 2a, and the external communication holes 6. The heat insulating holes 8 are joined at a communicating position. The lower plate 2b and the partition plate 3 include a through hole 7 at a predetermined position of the partition plate 3, a groove portion 4 (that is, a flow path 5) at a predetermined position of the lower plate 2b, and a heat insulating hole 8. The two are joined at a communicating position.

  As shown in FIG. 4, the tubes 12a and 12b, the sensor 12c, and the solenoid valve 12d are mounted on the surface of the upper plate 2a of the resin integrated pipe 1 configured as described above at the position of the external communication hole 6. The external devices 12 a to 12 d and the flow path 5 are communicated with each other through the external communication hole 6.

  The resin integrated pipe 1 having this structure can employ the resin, resin molding method, foamed resin manufacturing method, and resin laminate structure shown in the first embodiment. The resin molding method is blow molding. It is possible to efficiently manufacture the resin integrated pipe 1 having excellent heat insulation, and an example thereof will be described with reference to FIG.

  At the time of blow molding, the partition plate 3 is placed between a pair of molds 10, a double structure in which the inner peripheral side is a normal resin (non-foamed resin) S and the outer side is a foamed resin P. The parison 11 is extruded from above and inserted in the longitudinal direction so as to divide the inside of the parison 11 in half. The parison 11 with the partition plate 3 inserted therein is clamped with the molds 10 arranged on both sides, the top and bottom of the parison 11 are closed, and then air is supplied to both sides of the partition plate 3 inside the parison 11. Infuse. As a result, the parison 11 swells and is pressed against the inner surface of the mold 10, and the parison 11 and the partition plate 3 form the resin integrated pipe 1 having a vertical cross-sectional shape as shown in FIG. 6 is manufactured in a state where it is not yet formed. When the same kind of thermoplastic resin is used as the resin S on the inner peripheral side and the resin of the partition plate 3, strong bonding can be easily performed.

  After the resin integrated pipe 1 is cooled, it is removed from the mold, and external communication holes 6 and heat insulating holes 8 are provided. When providing the through-hole 7 which connects the flow paths 5, the through-hole 7 is provided in the partition plate 3 in advance, and then blow molding is performed.

  According to this method, in addition to the same effects as those of the first embodiment, the resin having a foamed resin layer that can form the flow path 5 and join the partition plate 3 and the plate 2 at the same time, and is excellent in heat insulation efficiently. The integrated piping 1 can be manufactured. Further, the plate 2 having a substantially uniform thickness can be easily manufactured, and further weight reduction and cost reduction can be achieved.

  The resin integrated pipe 1 of the present invention is not limited to a fuel cell, but is used in a chemical plant, a food production line, a semiconductor production line, etc. that need to circulate a fluid having a large chemical influence such as corrosion on metal. It can be used for various devices and devices.

It is a top view which shows 1st Embodiment of the resin integrated piping of this invention (state with which the external device is mounted | worn). It is AA sectional drawing of FIG. FIG. 3 is an enlarged view around a portion B in FIG. 2. It is a top view which shows 2nd Embodiment of the resin integrated piping of this invention (state with which the external device is mounted | worn). It is CC sectional drawing of FIG. FIG. 6 is an enlarged view around a portion D in FIG. 5. FIG. 5 is an assembly diagram illustrating an example of a component configuration and assembly of the resin integrated pipe in FIG. 4. It is explanatory drawing which shows an example of the manufacturing method of resin integrated piping of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin integrated piping 2, 2a, 2b Plate 3 Partition plate 4 Groove part 5 Channel 6 External communication hole 7 Through hole 8 Heat insulation hole 10 Mold 11 Parison 12a, 12b Extension tube 12c Sensor, 12d Electromagnetic valve P Foaming resin S Normal Resin (non-foamed resin)

Claims (6)

  A resin integrated pipe in which resin plates are laminated and joined, and a flow path is formed between the laminated plates, the resin integrated pipe having an external communication hole communicating with the flow path from the plate, and at least one of the plates However, it has a groove part which forms the above-mentioned channel, and provided a heat insulation part which insulates the inside and outside of the above-mentioned channel. Resin integrated piping characterized by things.   The resin integrated piping according to claim 1, wherein the heat insulating portion is a heat insulating hole or a heat insulating groove provided in the plate.   2. The resin integrated pipe according to claim 1, wherein the heat insulating portion is any one of a foamed resin layer, a spherical filler-containing resin layer, a fiber layer, or a vacuum air layer that covers all or part of the flow path.   The resin integrated piping according to claim 3, wherein the foamed resin layer is any one of urethane foam, polystyrene foam, and polyethylene foam.   A resin integrated pipe in which resin plates are laminated and joined, and a flow path is formed between the laminated plates, the resin integrated pipe having an external communication hole communicating with the flow path from the plate, and at least one of the plates Is a foamed resin having a groove portion that forms the flow path and at least one of the plates having an airtight surface thin layer, and the surface thin layer is the surface of the flow path. Resin integrated piping. A resin integrated pipe in which resin plates are laminated and joined, and a flow path is formed between the laminated plates, the resin integrated pipe having an external communication hole communicating with the flow path from the plate, and at least one of the plates However, it has a groove part which forms the said flow path, and at least one of the said plates is a resin multilayer body, This resin multilayer body contains a foamed resin layer, The resin integrated piping characterized by the above-mentioned.

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