TWI809346B - Flexible heat dissipation device - Google Patents
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- TWI809346B TWI809346B TW110100621A TW110100621A TWI809346B TW I809346 B TWI809346 B TW I809346B TW 110100621 A TW110100621 A TW 110100621A TW 110100621 A TW110100621 A TW 110100621A TW I809346 B TWI809346 B TW I809346B
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本發明有關於一種可撓性散熱裝置,尤指一種可達到彎折效果及可吸收管路的橋接力的可撓性散熱裝置。 The invention relates to a flexible heat dissipation device, in particular to a flexible heat dissipation device capable of achieving bending effect and absorbing bridging force of pipelines.
隨著中央處理器等電子元件功率的不斷提高,散熱問題越來越受到人們的重視。而迴路熱管由於其高效的熱傳導性能而被作為一種有效的傳熱元件應用於散熱領域中。 With the continuous improvement of the power of electronic components such as central processing units, the problem of heat dissipation has been paid more and more attention by people. The loop heat pipe is used as an effective heat transfer element in the field of heat dissipation due to its efficient heat conduction performance.
通常,目前一般迴路熱管包括一蒸發部、一冷凝部、以及設於蒸發部與冷凝部之間一蒸氣管及一液體管。所述蒸氣管及液體管將所述蒸發部與冷凝部連接成一迴路,該迴路內填充有純水。該蒸發部與一發熱元件(如中央處理器或圖形處理器)相連接。當該迴路熱管的蒸發部吸收該發熱元件上熱量而受熱時,其內的純水吸收熱量蒸發膨脹成氣態,經由該蒸氣管流向該迴路熱管的冷凝部,並於該冷凝部放熱冷凝收縮成液態,冷凝後的工作介質經由該液體管返回至蒸發部,而完成一循環,如此純水反復蒸發、冷凝,不斷地吸熱、放熱,從而達到熱交換的目的。但由於電子裝置(如伺服器或通訊機箱)內主機板上的發熱元件周圍都佈設有複數電子元件(如電容、電晶體、電阻、電感),且該發熱元件與周圍其他電子元件之間會高低差,使該迴路熱管的蒸氣管與液體管必須事先設計來 閃躲繞過該主機板上的複數電子元件,才能讓蒸氣管與液體管及冷凝部有空間擺放,以導致迴路熱管無法適用在各種規格或型號主機板上,及因蒸氣管與液體管為了閃躲繞過複數電子元件的關係會造成成本提高的問題。另外,該蒸發器貼設在該發熱元件上的外表面的平面度與冷凝部組裝固在一固定平台的外表面的平面度不是在同一水平面上,且該蒸發部與冷凝部之間是透過不可撓(不可彎折)非柔性金屬(透過直銅管焊接)材質的蒸氣管與液體管這些管路連接且管路距離又長的關係,以導致該蒸發部與冷凝部在組裝上的平面度是難以控制,若是將蒸發器與冷凝部分別硬組裝在兩位置(即發熱元件與固定平台)的平面度不相同時,會造成前述管路產生的橋接力對該蒸發部與冷凝部拉扯而使該蒸發部與發熱元件相接觸表面無法完好相平貼接觸,及該冷凝部也與該固定平台相接觸表面無法完好相平貼接觸的問題。 Generally, the current common loop heat pipe includes an evaporating part, a condensing part, and a vapor pipe and a liquid pipe arranged between the evaporating part and the condensing part. The steam pipe and the liquid pipe connect the evaporation part and the condensation part to form a circuit, and the circuit is filled with pure water. The evaporating part is connected with a heating element (such as a central processing unit or a graphics processing unit). When the evaporating part of the loop heat pipe absorbs heat from the heating element and is heated, the pure water in it absorbs the heat and evaporates and expands into a gaseous state, flows through the steam pipe to the condensation part of the loop heat pipe, and releases heat in the condensation part, condenses and shrinks into a gaseous state. In liquid state, the condensed working medium returns to the evaporation part through the liquid pipe to complete a cycle. In this way, the pure water evaporates and condenses repeatedly, absorbing and releasing heat continuously, so as to achieve the purpose of heat exchange. However, since the heating element on the motherboard in the electronic device (such as a server or a communication box) is surrounded by a plurality of electronic components (such as capacitors, transistors, resistors, inductors), and there will be a gap between the heating element and other surrounding electronic components. The height difference makes the steam pipe and liquid pipe of the heat pipe of this circuit must be designed in advance Dodging and bypassing the multiple electronic components on the main board can allow space for the steam pipe, liquid pipe and condensing part to be placed, so that the loop heat pipe cannot be applied to various specifications or models of main boards, and because the steam pipe and the liquid pipe are for Dodging bypassing the relationship of a plurality of electronic components poses a problem of cost increase. In addition, the flatness of the outer surface of the evaporator attached to the heating element is not on the same level as the flatness of the outer surface of the condensing part assembled on a fixed platform, and the evaporating part and the condensing part are connected through Inflexible (non-bendable) non-flexible metal (welded through straight copper pipes) steam pipes and liquid pipes are connected to these pipes and the distance between the pipes is long, so that the evaporating part and the condensing part are assembled on a plane The degree is difficult to control. If the evaporator and the condensing part are hard-assembled at two positions (that is, the heating element and the fixed platform) have different flatness, it will cause the bridging force generated by the aforementioned pipeline to pull the evaporating part and the condensing part. However, the contact surface of the evaporating part and the heating element cannot be in good contact with each other, and the contact surface of the condensing part with the fixed platform cannot be in perfect contact with each other.
本發明之一目的在提供一種可達到彎折及可吸收管路的橋接力的可撓性散熱裝置。 An object of the present invention is to provide a flexible heat dissipation device capable of bending and absorbing bridging force of pipelines.
本發明之另一目的在提供一種在組裝上可讓一蒸發器與一發熱元件彼此接觸表面能完好相平貼接觸,及一冷凝器與一電子裝置內的一構件彼此接觸表面能完好相平貼接觸的可撓性散熱裝置。 Another object of the present invention is to provide an assembly that allows an evaporator and a heating element to be in perfect flat contact with each other, and a condenser and a member in an electronic device to have a perfectly flat contact surface. Flexible heat sink with sticky contact.
本發明之另一目的在提供一種利用一蒸氣管與一液體管中任一者或兩者設置有至少一波紋段,藉由該波紋段之設置可作任意角度或方向彎曲變形,令該蒸氣管與冷凝管能對應蒸發器、冷凝器、發熱元件及構件作組裝、對位與調整高低段差的可撓性散熱裝置。 Another object of the present invention is to provide a method that utilizes either or both of a steam pipe and a liquid pipe to be provided with at least one corrugated section. By setting the corrugated section, it can be bent and deformed at any angle or direction, so that the vapor Tubes and condensing tubes are flexible heat dissipation devices that can be assembled, aligned and adjusted for height differences corresponding to evaporators, condensers, heating elements and components.
為達上述目的,本發明係提供一種可撓性散熱裝置,包括一蒸發器、一蒸氣管、一冷凝器及一液體管,該蒸發器具有至少一蒸氣腔室、一液體入口及一蒸氣出口,該蒸氣腔室容置有至少一毛細結構及一工作流體,該液體入口及該蒸氣出口分別連通該蒸氣腔室,該蒸氣管的一端連通該蒸氣出口,該蒸氣管的另一端連通該冷凝器,該液體管的兩端分別連通該蒸發器與該冷凝器,令該蒸發器、蒸氣管、冷凝器及該液體管形成該工作流體的迴路,至少一波紋段設置在該蒸氣管及該液體管其中任一者或兩者,該波紋段具有複數波紋,該複數波紋的高度、寬度及間距之其一以上係彼此相同或不相同。 To achieve the above object, the present invention provides a flexible cooling device, comprising an evaporator, a vapor pipe, a condenser and a liquid pipe, the evaporator has at least one vapor chamber, a liquid inlet and a vapor outlet , the vapor chamber accommodates at least one capillary structure and a working fluid, the liquid inlet and the vapor outlet respectively communicate with the vapor chamber, one end of the vapor pipe communicates with the vapor outlet, and the other end of the vapor pipe communicates with the condensation The two ends of the liquid pipe are respectively connected to the evaporator and the condenser, so that the evaporator, the steam pipe, the condenser and the liquid pipe form a circuit of the working fluid, and at least one corrugated section is arranged between the vapor pipe and the For either or both of the liquid pipes, the corrugated section has a plurality of corrugations, and one or more of the height, width and spacing of the plurality of corrugations are the same or different from each other.
本發明係另提供一種撓性散熱裝置,包括一蒸發器、至少一波紋段及一汽液迴流管,該蒸發器具有一蒸氣腔室、一液體入口及一蒸氣出口,該蒸氣腔室容置有一毛細結構及一工作流體,該液體入口及該蒸氣出口分別連通該蒸氣腔室,該汽液迴流管設有一蒸氣段與一液體段,該蒸氣段與該液體段的一端分別連通該蒸氣出口與該液體入口,該蒸氣段的另一端向外一體延伸連接至該液體段的另一端之間形成一冷凝段,該冷凝段外部設置有一冷凝元件,至少一波紋段係設置在該蒸氣段及液體段中任一者或兩者,且該波紋段具有複數波紋,該複數波紋的寬度、高度及間距之其一以上係彼此相同或不相同。 The present invention further provides a flexible heat dissipation device, which includes an evaporator, at least one corrugated section and a vapor-liquid return pipe, the evaporator has a vapor chamber, a liquid inlet and a vapor outlet, and the vapor chamber accommodates a capillary structure and a working fluid, the liquid inlet and the steam outlet are connected to the steam chamber respectively, the vapor-liquid return pipe is provided with a steam section and a liquid section, and one end of the steam section and the liquid section is respectively connected to the steam outlet and the The liquid inlet, the other end of the steam section is integrally extended outward and connected to the other end of the liquid section to form a condensation section, and a condensation element is arranged outside the condensation section, and at least one corrugated section is arranged on the vapor section and the liquid section Either or both, and the corrugated section has a plurality of corrugations, and more than one of the width, height and spacing of the plurality of corrugations is the same or different from each other.
上述該液體管設有一管體毛細結構,該管體毛細結構設置於該液體管的內表面。 The above-mentioned liquid pipe is provided with a capillary structure of the pipe body, and the capillary structure of the pipe body is arranged on the inner surface of the liquid pipe.
透過本發明上述各實施例的設計,使得可達到彎折(彎曲)及可吸收管路的橋接力的效果,且還能適用在各種電子裝置(如伺服器、電腦或通訊機箱)內的電路板上高度落差不同的電子元件使用,以有效讓蒸發器可緊密貼合發熱元件的效果。 Through the design of the above-mentioned embodiments of the present invention, the effect of bending (bending) and absorbing the bridging force of the pipeline can be achieved, and it can also be applied to circuits in various electronic devices (such as servers, computers or communication boxes). Electronic components with different heights on the board are used to effectively make the evaporator closely fit the heating element.
1:可撓性散熱裝置 1: Flexible cooling device
11:蒸發器 11: Evaporator
111:殼體 111: shell
112:蒸氣通道 112: steam channel
113:蒸氣腔室 113: Vapor chamber
114:毛細結構 114: capillary structure
115:液體入口 115: Liquid inlet
116:蒸氣出口 116: steam outlet
12:蒸氣管 12: Steam pipe
124、144:外表面 124, 144: outer surface
125、145:內表面 125, 145: inner surface
13:冷凝器 13: Condenser
131:蒸氣入口 131: steam inlet
132:液體出口 132: liquid outlet
133:汽液混合通道 133: Vapor-liquid mixing channel
134:散熱鰭片 134: cooling fins
14:液體管 14: Liquid pipe
15:平直段 15: straight section
16:波紋段 16: corrugated section
161:波紋 161: Ripple
1611:波紋頂端 1611: corrugated top
1612:波紋底端 1612: Corrugated bottom
181:間距 181: Spacing
2:汽液迴流管 2: Vapor-liquid return pipe
21:蒸氣段 21: steam section
22:液體段 22: Liquid section
23:冷凝段 23: Condensation section
X:高度 X: height
Y:寬度 Y: width
3:冷凝元件 3: Condensing element
4:電路板 4: Circuit board
41:電子元件 41: Electronic components
42:發熱元件 42: heating element
第1A圖為本發明之第一實施例之可撓性散熱裝置的立體組合示意圖。 FIG. 1A is a three-dimensional assembly diagram of the flexible heat dissipation device according to the first embodiment of the present invention.
第1B圖為本發明之第一實施例之可撓性散熱裝置的剖面示意圖。 FIG. 1B is a schematic cross-sectional view of the flexible heat sink according to the first embodiment of the present invention.
第1C圖為本發明之圖1B的蒸氣管與液體管的剖面局部放大示意圖。 Fig. 1C is a partially enlarged schematic diagram of the section of the steam pipe and the liquid pipe in Fig. 1B of the present invention.
第1D圖為本發明之圖1B的波紋段的剖面局部放大示意圖。 Fig. 1D is a partially enlarged cross-sectional schematic diagram of the corrugated section in Fig. 1B of the present invention.
第2圖為本發明之第一實施例之可撓性散熱裝置應於電子裝置的實施示意圖。 Fig. 2 is a schematic diagram of the implementation of the flexible heat dissipation device of the first embodiment of the present invention in an electronic device.
第3圖為本發明之第一實施例之一可行實施例之立體組合示意圖。 Fig. 3 is a three-dimensional assembly schematic diagram of a possible embodiment of the first embodiment of the present invention.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above-mentioned purpose of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings.
本發明提供一種可撓性散熱裝置,請參閱第1A至3圖式,該可撓性散熱裝置1可為如一環路熱管(或稱迴路熱管;LHP)或兩相熱虹吸迴路系統(LTS),該可撓性散熱裝置1包括一蒸發器11、一蒸氣管12、一冷凝器13、至少一波紋段16及一液體管14,該蒸發器11係與一電子裝置(如伺服器、電腦或通訊機箱)內的一電路板4(如主機板)具有的一發熱元件42(如中央處理器或圖形處理器)相緊密貼設,且該電路板4更包含複數高度不同的電子元件41(如電容、電阻、電感或電晶體)係設置在該發熱元件42的周圍。該蒸發器11設有一殼體111、至少一蒸氣腔室113、一液體入口115及一蒸氣出口116,該殼體111為金屬材質(如不銹鋼、鈦、鋁、銅或其他金屬)所製成,且該殼體111內壁界定出該至少一蒸氣腔室113,該蒸氣腔室113容置有至少一毛細結構114及一工作流體,該毛細結構114為多孔狀結構,其可為燒結粉末、細微溝槽、編織網目、纖維或辮條體或上述任一組合的複合式毛細結構,且毛細結構114於本實施例以編織網目做說明,但不侷限於此。該
工作流體為如純水、甲醇、蒸餾水或其混合物,進而利用該工作流體汽液相變化機制來達成熱量傳遞。
The present invention provides a flexible heat sink, please refer to Figures 1A to 3, the
該液體入口115及蒸氣出口116於此實施是分別開設在該殼體111的同一側邊上,且該液體入口115位於該蒸氣出口116的上方,但不侷限於此,於本發明實際實施時,該液體入口115與蒸氣出口116也可分別設置在該殼體111的相對側邊上。且該液體入口115與蒸氣出口116係分別連通該蒸氣腔室113,該殼體111內的蒸氣腔室113與對應該蒸氣出口116之間界定有一蒸氣通道112,該蒸氣通道112係連通該蒸氣出口116與該蒸氣管12的一端,以使該工作流體蒸發後產生的蒸氣由該蒸氣通道112通過該蒸氣出口116進入到該蒸氣管12內。
The
該蒸氣管12與該液體管14為金屬材質(如不銹鋼、鈦、鋁、銅或其他金屬)所製成,該蒸氣管12的一端係連接至該殼體111的蒸氣出口116,使該蒸氣管12的一端連通該蒸氣出口116及蒸氣腔室113,該蒸氣管12的另一端連通該冷凝器13,該冷凝器13係與該電子裝置內的一構件(如風扇框架或散熱固定平台)相接設,該冷凝器13(可為一冷排或水排)於本實施例表示具有一蒸氣入口131、一液體出口132、一汽液混合通道133及複數散熱鰭片134,該汽液混合通道133係從該蒸氣入口131朝上方的該液體出口132方向延伸連接該液體出口132且相連通,該複數散熱鰭片134間隔設置在該冷凝器13的頂部外表面上,該蒸氣管12的另一端連接至該蒸氣入口131且相連通。並該液體管14的一端與另一端分別連接至該液體出口132及該液體入口115且相連通,令該液體管14的兩端分別連通該蒸發器11與該冷凝器13,使得該蒸發器11、蒸氣管12、冷凝器13及液體管14形成該工作流體流動的迴路。所以當該蒸發器11吸收到該發熱元件42上的熱量時,該蒸發器11內的工作流體受熱蒸發後產生的蒸氣的工作流體,然後透過壓
力差推動該蒸氣通道112內的蒸氣的工作流體經該蒸氣出口116通過該蒸氣管12流動經過該蒸氣入口131至該冷凝器13的汽液混合通道133內,經過該冷凝器13與該複數散熱鰭片134吸收蒸氣的工作流體的熱量而冷凝後轉變為液體的工作流體,使液體的工作流體經該液體出口132通過該液體管14內的光滑內表面145回流經該液體入口115進入到該蒸發器11的蒸氣腔室113內進行下一循環。其中該蒸氣管12與液體管14分別與蒸發器11和冷凝器13之間的連接方式可為焊接、嵌接或黏接方式。
The
至少一波紋段16設置在該蒸氣管12及該液體管14其中任一者或兩者,於本實施例中係選擇分別在該蒸氣管12和液體管14上設置該波紋段16,該波紋段16之兩端係分別連接有一平直段15,該波紋段16具有複數波紋161,該複數波紋161可間隔或連續設置,並該複數波紋161為多個凹凸交錯或多個波峰波谷交錯呈現的結構,且由於該波紋段16本身具有可彎折、對向凹折(呈U形狀)、伸縮彈性佳及可吸震的功效。在一可行實施例,該波紋段16可設置在該蒸氣管12或液體管14上。
At least one
在本實施例中該蒸氣管12的和該液體管14至少其一其管徑內表面可為一光滑內表面,或管徑內表面設置管體毛細結構者。
In this embodiment, at least one of the inner surface of the
另外,該複數波紋161的高度X、寬度Y及間距181之其一以上者係彼此相同或不相同,其中該複數波紋161的間距181可等距或非等距設置。每一波紋161具有一波紋頂端1611及一波紋底端1612,該波紋底端1612位於鄰近該蒸氣管12和液體管14各自的一外表面124、144(即與該外表面124、144在同一水平面或高於/低於外表面124、144的一水平面),該波紋頂端1611係凸出在該蒸氣管12和液體管14
各自的外表面124、144。並該波紋161的高度X是界定在該波紋頂端1611與該波紋底端1612之間。
In addition, one or more of the height X, width Y, and pitch 181 of the plurality of
參閱各圖,複數波紋161的高度X係彼此為相同或不相同,如該複數波紋161的高度X係從該波紋段161的兩側向中間由高逐漸變低,也就是在波紋段16中間的波紋161高度較矮,在波紋段16兩側的波紋161的高度X逐漸變高。由於位於波紋段16的中間部位的波紋161比本身兩側的波紋161的高度X較矮,使該波紋段16的彎曲內側的該複數波紋161不會干涉,使得可達到任意角度或方向彎折(彎曲)或對折的效果及改善彎曲角度受限問題,且還能配合各種電路板4及電路板4上高度落差不同的電子元件41上使用。
Referring to each figure, the height X of the complex number of
在一可行實施例中,參閱第3圖,輔以參閱第1C、1D圖,主要是將上述實施例的液體管14與蒸氣管12改成為單一迴路管的兩端係連通該蒸發器11的液體入口115及該蒸氣出口116,如下為了方便敘述稱為汽液迴流管2,該汽液迴流管2設有一蒸氣段21與一液體段22,該蒸氣段21與該液體段22的一端分別連通該蒸氣出口116與該液體入口115及該蒸氣腔室113,該蒸氣段21的另一端向外一體延伸連接至該液體段22的另一端之間形成一冷凝段23,該冷凝段23外部設置有一冷凝元件3(如複數散熱鰭片),至少一波紋段16係設置在該蒸氣段21及液體段22中任一者或兩者,在此實施例的波紋段16表示兩個波紋段16各具有複數間隔(或連續)設置的波紋161係分別設置在該蒸氣段21與液體段22,該波紋段16之特徵(即波紋161之高度X、寬度Y、間距181可為相同或不相同者)與前述波紋段16相同故不再敘述。
In a feasible embodiment, referring to Fig. 3, supplemented by referring to Fig. 1C and 1D, it is mainly to change the
另外要說明的,前述該波紋段16的複數波紋161係為環形波紋其也波紋161呈閉合圓環狀圍繞該蒸氣管12及液體管14的管體。在其他一實施,該複數波紋161為螺旋形波紋,也就是波紋呈螺旋狀排布圍繞該蒸氣管12及液體管14的管體。
In addition, it should be noted that the plurality of
參閱各圖,當該可撓性散熱裝置1組裝在該電子裝置上時,使該蒸發器11貼設在該發熱元件42後,透過該蒸氣管12與液體管14其一的波紋段16可作任意角度或方向彎曲(如上、下、左、右彎折)變形調整,藉由該複數波紋161具有一較佳之伸縮彈性令其具有一伸縮長度可繞過該發熱元件42周圍較高的電子元件41,同時藉由該波紋段16還能吸收各自該蒸氣管12與液體管14這些管路產生的橋接力對該蒸發器11與冷凝器13的拉扯。
Referring to the figures, when the flexible
1:可撓性散熱裝置 1: Flexible cooling device
11:蒸發器 11: Evaporator
111:殼體 111: shell
12:蒸氣管 12: Steam pipe
15:平直段 15: straight section
13:冷凝器 13: Condenser
134:散熱鰭片 134: cooling fins
14:液體管 14: Liquid pipe
16:波紋段 16: corrugated section
161:波紋 161: Ripple
Claims (7)
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US20070227703A1 (en) * | 2006-03-31 | 2007-10-04 | Bhatti Mohinder S | Evaporatively cooled thermosiphon |
TWM556324U (en) * | 2016-06-17 | 2018-03-01 | 超眾科技股份有限公司 | Heat dissipation device |
TWI660151B (en) * | 2018-04-26 | 2019-05-21 | 泰碩電子股份有限公司 | Loop heat pipe partially filled with capillary material in the condensation section |
US20190186840A1 (en) * | 2017-12-13 | 2019-06-20 | Asia Vital Components Co.,Ltd. | Basic structural body for constructing heat dissipation device and heat dissipation device |
US20200370838A1 (en) * | 2019-05-21 | 2020-11-26 | Thermal Corp. | Heat pipe assembly and method |
TWM610096U (en) * | 2021-01-07 | 2021-04-01 | 大陸商深圳興奇宏科技有限公司 | Flexible heat dissipation device |
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- 2021-01-07 TW TW110100621A patent/TWI809346B/en active
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US20070227703A1 (en) * | 2006-03-31 | 2007-10-04 | Bhatti Mohinder S | Evaporatively cooled thermosiphon |
TWM556324U (en) * | 2016-06-17 | 2018-03-01 | 超眾科技股份有限公司 | Heat dissipation device |
US20190186840A1 (en) * | 2017-12-13 | 2019-06-20 | Asia Vital Components Co.,Ltd. | Basic structural body for constructing heat dissipation device and heat dissipation device |
TWI660151B (en) * | 2018-04-26 | 2019-05-21 | 泰碩電子股份有限公司 | Loop heat pipe partially filled with capillary material in the condensation section |
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