CN206100771U - Heat dissipation temperature -uniforming plate - Google Patents
Heat dissipation temperature -uniforming plate Download PDFInfo
- Publication number
- CN206100771U CN206100771U CN201621115599.4U CN201621115599U CN206100771U CN 206100771 U CN206100771 U CN 206100771U CN 201621115599 U CN201621115599 U CN 201621115599U CN 206100771 U CN206100771 U CN 206100771U
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- lower cover
- dusty spray
- plate
- spray plate
- powder
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Abstract
The utility model discloses a heat dissipation temperature -uniforming plate, including upper cover, lower cover, notes liquid mouth, the upper cover becomes integrative with the lower cover lock, it locates between upper cover and the lower cover to annotate the liquid mouth, the bonding of upper cover inner face has upper cover spray powder board, the bonding of lower cover inner face has lower cover spray powder board, the lower cover inner face has a lower cover cavity position, lower cover spray powder board has a cavity, the cavity is located in the lower cover cavity position, annotate the liquid mouth with the cavity intercommunication. The utility model discloses thereby can control powder porosity and powder thickness, improve the temperature -uniforming plate heat transfer efficiency, the improvement of heat transfer efficiency has directly increased radiator heat exchange efficiency, further improves the heat transfer performance of temperature -uniforming plate. The powder spraying structure has reduced powder sintering circuit simultaneously, has reduced the manufacturing cost and the defective rate of product, has improved production efficiency.
Description
Technical field
This utility model is related to a kind of heat sink, and specifically a kind of inside has the heat radiation sam plate of capillary porosity.
Background technology
With electronic component power more and more higher, the radiating of electronic component just seems more and more important.Temperature-uniforming plate is a kind of
Element with efficient heat transfer, when temperature-uniforming plate end thereof contacts electronic component is heated, from thermal source heat absorption, by amount of heat from thermal source area
Being delivered to radiating area can be such that heat does not pile up in heating position, but uniformly be dispersed in radiating fin group.
In existing samming plate technique, temperature-uniforming plate is usually to form a closed cavity by welding by upper and lower two boards,
Wherein upper and lower two boards need to be respectively welded silk screen or sintered powder to provide capillary structure, at present, because powder is in high temperature sintering
When can shrink, so porosity and powder sintered thickness are difficult to control after sintering.
Utility model content
This utility model purpose is to provide a kind of temperature-uniforming plate inner chamber body and has the powder spray structure radiating of capillary porosity equal
Warm plate.
Technical scheme：A kind of heat radiation sam plate, including upper lid, lower cover, liquid injection port, upper lid fastens integral, institute with lower cover
Liquid injection port is stated between upper lid and lower cover, the upper lid inner face is bonded with lid dusty spray plate, the lower cover inner face bonding
There is lower cover dusty spray plate, the lower cover inner face has a lower cover chamber position, and the lower cover dusty spray plate has a chamber, the chamber
Room in the lower cover chamber position, the liquid injection port and the chamber.
The upper lid dusty spray plate has some capillary porosities being interconnected with lower cover dusty spray plate.
The upper lid dusty spray plate is the upper lid dusty spray plate with some holes that some copper powders are constituted.
The lower cover dusty spray plate is the lower cover dusty spray plate with some holes that some copper powders are constituted.
Beneficial effect：This utility model as a result of above-mentioned technical proposal, such that it is able to control powder porosity and powder
Last thickness, improves temperature-uniforming plate heat transfer efficiency, and the raising of heat transfer efficiency directly increases radiator heat exchange efficiency, further improves equal
The heat transfer property of warm plate.Simultaneously powder spray structure reduces powder sintered operation, reduce the production cost of product with it is bad
Rate, improves production efficiency.
Description of the drawings
Fig. 1 is this utility model front view.
Fig. 2 is this utility model rearview.
Fig. 3 is this utility model lower cover front view.
Fig. 4 is this utility model lower cover right view.
Fig. 5 is this utility model lower cover dusty spray plate front view.
Fig. 6 is this utility model lower cover dusty spray plate right view.
Fig. 7 is lid front view on this utility model.
Fig. 8 is lid right view on this utility model.
Fig. 9 is lid dusty spray plate front view on this utility model.
Figure 10 is lid dusty spray plate right view on this utility model.
Figure 11 is this utility model radiating principle explanatory diagram.
Label is represented in figure：
1 liquid injection port, covers, lid dusty spray plate on 3,4 lower cover dusty spray plates, 5 lower covers, 6 chambers, 7 lower cover chambers on 2
Position, 8 capillary porosities, 9 solidifying cold liquid flowings, 10 heat absorptions, 11 heat releases.
Specific embodiment
See Fig. 1-11, a kind of heat radiation sam plate, including upper lid 2, lower cover 5, liquid injection port 1, upper lid 2 is buckled into one with lower cover 5
Body, the liquid injection port 1 is located between upper lid 2 and lower cover 5.The inner face of upper lid 2 is bonded with lid dusty spray plate 3, it is described under
The inner face of lid 5 is bonded with lower cover dusty spray plate 4, and the lower cover inner face has a lower cover chamber position 7, the lower cover dusty spray plate 4
There is a chamber 6, in lower cover chamber position 7, the liquid injection port 1 is connected the chamber 6 with the chamber 6.
The upper lid dusty spray plate 3 has some capillary porosities 8 being interconnected with lower cover dusty spray plate 4.
The upper lid dusty spray plate 3 is the upper lid dusty spray plate with some holes that some copper powders are constituted.
The lower cover dusty spray plate 4 is the lower cover dusty spray plate with some holes that some copper powders are constituted.
This utility model is viscous together with by powder spray technology, and to temperature-uniforming plate capillary structure is provided；Temperature-uniforming plate is upper and lower
Lid makes upper and lower covers dusty spray plate viscous together with by powder spray technology, and to temperature-uniforming plate capillary structure is provided；Temperature-uniforming plate by
Upper lid is welded into closed inner cavity chamber with lower cover.
There is liquid injection port 1 on temperature-uniforming plate top, seals liquid injection port after fluid injection.See Figure 11, liquid is within the chamber by dusty spray
Plate provides capillary force, and liquid is evenly distributed in within the chamber, solidifying cold liquid flowing 9 is made by capillary porosity 8, in heat absorption back cavity room
Steam flowing is formed, the purpose of uniformly transfer heat is reached.
Lower section arrow represents heat absorption 10 in Figure 11, and upper arrow represents heat release 11.
Above content is to combine specific preferred implementation further detailed description of the utility model, it is impossible to
Identification is of the present utility model to be embodied as being confined to these explanations.For the ordinary skill of this utility model art
For personnel, without departing from the concept of the premise utility, some simple deduction or replace can also be made, all should be regarded
To belong to protection domain of the present utility model.
Claims (4)
1. a kind of heat radiation sam plate, including upper lid（2）, lower cover（5）, liquid injection port（1）, upper lid（2）With lower cover（5）It is buckled into one
Body, the liquid injection port（1）Located at upper lid（2）With lower cover（5）Between, it is characterised in that：The upper lid（2）Inner face is bonded with lid
Dusty spray plate（3）, the lower cover（5）Inner face is bonded with lower cover dusty spray plate（4）, the lower cover inner face has a lower cover chamber
Position（7）, the lower cover dusty spray plate（4）There is a chamber（6）, the chamber（6）Located at lower cover chamber position（7）In, the note
Liquid mouth（1）With the chamber（6）Connection.
2. a kind of heat radiation sam plate according to claim 1, it is characterised in that：The upper lid dusty spray plate（3）With under
Lid dusty spray plate（4）With some capillary porosities being interconnected（8）.
3. a kind of heat radiation sam plate according to claim 1, it is characterised in that：The upper lid dusty spray plate（3）If for
The upper lid dusty spray plate with some holes that dry copper powder is constituted.
4. a kind of heat radiation sam plate according to claim 1, it is characterised in that：The lower cover dusty spray plate（4）If for
The lower cover dusty spray plate with some holes that dry copper powder is constituted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621115599.4U CN206100771U (en) | 2016-10-12 | 2016-10-12 | Heat dissipation temperature -uniforming plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621115599.4U CN206100771U (en) | 2016-10-12 | 2016-10-12 | Heat dissipation temperature -uniforming plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206100771U true CN206100771U (en) | 2017-04-12 |
Family
ID=60413883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621115599.4U Active CN206100771U (en) | 2016-10-12 | 2016-10-12 | Heat dissipation temperature -uniforming plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206100771U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110012639A (en) * | 2017-12-13 | 2019-07-12 | 奇鋐科技股份有限公司 | Radiator monomer and its radiator and its manufacturing method |
-
2016
- 2016-10-12 CN CN201621115599.4U patent/CN206100771U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110012639A (en) * | 2017-12-13 | 2019-07-12 | 奇鋐科技股份有限公司 | Radiator monomer and its radiator and its manufacturing method |
| US11466937B2 (en) | 2017-12-13 | 2022-10-11 | Asia Vital Components Co., Ltd. | Basic structural body for constructing heat dissipation device and heat dissipation device |
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| GR01 | Patent grant |