CN205812612U - A kind of liquid cooling heat radiator and electronic equipment - Google Patents
A kind of liquid cooling heat radiator and electronic equipment Download PDFInfo
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- CN205812612U CN205812612U CN201620571614.XU CN201620571614U CN205812612U CN 205812612 U CN205812612 U CN 205812612U CN 201620571614 U CN201620571614 U CN 201620571614U CN 205812612 U CN205812612 U CN 205812612U
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- liquid cooling
- cooling heat
- heat radiator
- fluid course
- composite plate
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Abstract
This application discloses a kind of liquid cooling heat radiator, including by the hot-forming composite plate of at least two panels metallic plate, fluid course it is provided with in composite plate, adjacent two panels metallic plate fits and is printed with solder resist region between surface, fluid course by carrying out gases at high pressure inflation formation to solder resist region, and the circulation path shape being shaped as fluid course in solder resist region.The fluid course of the liquid cooling heat radiator in this utility model is by carrying out inflation formation to composite plate, therefore, need not thicker metallic plate, the composite plate bond strength that hot pressing is formed is high, the good airproof performance of fluid course, under conditions of meeting structural strength, the lower thickness of liquid cooling heat radiator can be made, and the liquid cooling heat radiator after thinning easily bends deformation, can deform according to the electronic device of difformity size, increase contacts area of dissipation with electronic device, meets the radiating requirements of various electronic device.Disclosed herein as well is the electronic equipment with above-mentioned liquid cooling heat radiator.
Description
Technical field
This utility model relates to electronic equipment dissipating heat technical field, particularly to a kind of liquid cooling heat radiator.Further relate to one
Comprise the electronic equipment of this liquid cooling heat radiator.
Background technology
It is inevitably generated heat during electronic device works, needing, radiator structure is set electronic equipment is dispelled the heat.
The radiator structure of existing electronic equipment is liquid cooling heat radiator, generally by machining, metallic plate is produced groove, or
Directly formed groove by die casting, then by modes such as welding, screwings, another block metallic plate is covered in setting
On fluted metallic plate, form the fluid course sealed.Another kind of manufacture method is directly to press metal tube to be embedded into metallic plate
Groove in, make liquid cooling heat radiator.
Above-mentioned existing liquid cooling heat radiator is plane tabular structure, owing to needs arrange fluid pipe, and therefore thickness direction
Upper oversize, and it is not easy bending, it is impossible to for small-size product, non-planar articles or the heat radiation of multiple non-co-planar device.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of liquid cooling heat radiator, it is possible to make the thickness of liquid cooling heat radiator
Spend thinning, easily bend deformation, to meet the radiating requirements of the electronic device of difformity size.
Another purpose of the present utility model is to provide a kind of electronic equipment comprising this liquid cooling heat radiator, it is possible to make liquid
The lower thickness of cold heat sink, easily bends deformation, to meet the heat radiation of the electronic device of difformity size in electronic equipment
Demand.
For reaching above-mentioned purpose, this utility model offer techniques below scheme:
A kind of liquid cooling heat radiator, including by the hot-forming composite plate of at least two panels metallic plate, is arranged in described composite plate
Having fluid course, metallic plate described in adjacent two panels fits and is printed with solder resist region between surface, and described fluid course passes through
Described solder resist region is carried out gases at high pressure inflation formation, and the stream being shaped as described fluid course in described solder resist region
Path shape.
Preferably, in above-mentioned liquid cooling heat radiator, described metallic plate is aluminium sheet.
Preferably, in above-mentioned liquid cooling heat radiator, the two ends of described fluid course are separately installed with water inlet tap and water outlet
Mouth.
Preferably, in above-mentioned liquid cooling heat radiator, the position avoiding fluid course of described composite plate offers heat radiation
Hole and/or installation via.
Preferably, in above-mentioned liquid cooling heat radiator, the thickness of described metallic plate is 1mm～4mm.
Preferably, in above-mentioned liquid cooling heat radiator, the inflation gap of described fluid course is 2mm～5mm.
Preferably, in above-mentioned liquid cooling heat radiator, described fluid course is multiple described in inflation after described composite plate deforms
The solder resist region of plywood and formed.
Preferably, in above-mentioned liquid cooling heat radiator, described composite plate be shaped as slab construction, bending structure, waveform
Structure or curved-surface structure.
This utility model additionally provides a kind of electronic equipment, and including electronic device and radiator, described radiator is with described
Electronic device contact heat radiation, described radiator is the liquid cooling heat radiator as described in any of the above item.
Preferably, in above-mentioned electronic equipment, described liquid cooling heat radiator is bending structure, and described electronic device is multiple
And Different Plane with described liquid cooling heat radiator contacts heat radiation respectively.
Preferably, in above-mentioned electronic equipment, described liquid cooling heat radiator is waveform configuration, the ripple of described liquid cooling heat radiator
Shape face contacts heat radiation with the surface of multiple described electronic devices being arranged side by side.
Preferably, in above-mentioned electronic equipment, described liquid cooling heat radiator is curved-surface structure, and described liquid cooling heat radiator is coated with
In the curved surface of described electronic device.
Compared with prior art, the beneficial effects of the utility model are:
The liquid cooling heat radiator that this utility model provides includes composite plate, and composite plate is hot-forming by least two panels metallic plate,
Composite board internal is provided with fluid course, and fluid course is by the welding resistance printed between surface that fits adjacent two panels metallic plate
Agent region carries out gases at high pressure inflation formation, the circulation path shape being shaped as fluid course in solder resist region.Solder resist district
For preventing in metallic plate hot pressing, this region is inter-adhesive to be integrally forming in territory, in order to carry out height in this region of composite plate
Calm the anger body inflation, form fluid course.The fluid course of the liquid cooling heat radiator in this utility model is by blowing composite plate
Bulging becomes, and therefore, there is no need to thicker metallic plate, and the composite plate bond strength that hot pressing is formed is high, the good airproof performance of fluid course,
Under conditions of meeting structural strength, it is possible to make the lower thickness of liquid cooling heat radiator, and thinning after liquid cooling heat radiator easy
Bending deformation, it is possible to deform according to the electronic device of difformity size, increase contacts area of dissipation with electronic device,
Meet the radiating requirements of various electronic device.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, the accompanying drawing in describing below is only
It is embodiment of the present utility model, for those of ordinary skill in the art, on the premise of not paying creative work, also
Other accompanying drawing can be obtained according to the accompanying drawing provided.
The structural representation of a kind of liquid cooling heat radiator that Fig. 1 provides for this utility model embodiment；
Fig. 2 is the Section A-A schematic diagram in Fig. 1；
Fig. 3 is the enlarged diagram in B region in Fig. 2；
The structural representation of the second liquid cooling heat radiator that Fig. 4 provides for this utility model embodiment；
The structural representation of the third liquid cooling heat radiator that Fig. 5 provides for this utility model embodiment；
The structural representation of the 4th kind of liquid cooling heat radiator that Fig. 6 provides for this utility model embodiment.
In Fig. 1-Fig. 6,1 it is composite plate, 11 is metallic plate, 2 is fluid course, 3 is louvre, 4 is water inlet tap, 5 is
Faucet, 6 be electric capacity, 7 be battery, 8 for electronic device.
Detailed description of the invention
Core of the present utility model there is provided a kind of liquid cooling heat radiator, it is possible to makes its lower thickness, it is possible to according to difference
The electronic device of shape size carries out bending deformation, meets the radiating requirements of different electronic device.
This utility model additionally provides a kind of electronic equipment comprising this liquid cooling heat radiator, it is possible to make the thickness of liquid cooling heat radiator
Spend thinning, easily bend deformation, to meet the radiating requirements of the electronic device of difformity size in electronic equipment.
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under making creative work premise
The every other embodiment obtained, broadly falls into the scope of this utility model protection.
Refer to Fig. 1-Fig. 3, this utility model embodiment provides a kind of liquid cooling heat radiator, including composite plate 1, composite plate
1 is hot-forming by least two panels metallic plate 11, and composite plate 1 is internal forms fluid course 2 by gases at high pressure inflation, i.e. in two panels
Between the surface that adjacent metallic plate 11 is bonded to each other, the solder resist region being printed with solder resist is carried out gases at high pressure inflation, resistance
The circulation path shape being shaped as fluid course 2 in solder flux region, solder resist will not make adjacent two panels metallic plate because of hot pressing
The solder resist region of 11 combines, and therefore, it can make the metallic plate 11 in this region expand by gases at high pressure inflation and is formed
Fluid course 2.
Due to the direct inflation molding in composite plate 1 of fluid course 2, the therefore good seal performance of fluid course 2, and use
The mode of inflation forms fluid course 2 and need not the thickness of composite plate 1 relatively greatly, just can enter under conditions of meeting structural strength
Row inflation forms fluid course 2, it therefore reduces the thickness of liquid cooling heat radiator.After thickness reduces, liquid cooling heat radiator can be more
Easily carry out bending deformation, the electronic device 8 for difformity and size bends liquid cooling heat radiator, make liquid cooling heat radiator with
The heat radiation contact area of electronic device 8 increases, for non-coplanar multiple electronic devices 8, it is also possible to made by bending composite plate
Multiple electronic devices 8 all contact heat radiation with liquid cooling heat radiator, improve radiating effect, meet the heat radiation of different electronic device 8
Demand.
The manufacturing process of above-mentioned liquid cooling heat radiator is: illustrate as a example by composite plate 1 is made up of two panels metallic plate 11,
Wherein a side surface of piece of metal plate 11 uses solder resist to print fluid course 2 paths traversed, nugget by second afterwards
Belong to plate 11 and cover the side surface being printed with solder resist at first piece of metallic plate 11, two pieces of metallic plates 11 are carried out hot pressing formation
Composite plate 1, finally the aperture position in solder resist region is passed through gases at high pressure, and metallic plate 11 inflation in this region is formed liquid stream
Passage 2, obtains liquid cooling heat radiator.
In the present embodiment, metallic plate 11 is preferably aluminium sheet, and aluminium sheet has the advantage that fusing point is low, extensibility is good, is hot pressed into
Type and inflation are easy.It is, of course, also possible to use other to have the metallic plate of similar quality 11, such as copper coin etc..
As shown in Figure 1, Figure 2, shown in Fig. 4 and Fig. 5, external pipe is connected with fluid course 2 for convenience, the liquid in the present embodiment
Cold heat sink also includes water inlet tap 4 and the faucet 5 being separately positioned on the two ends of fluid course 2.In figure, the direction of arrow is liquid
Flow direction.
As depicted in figs. 1 and 2, in the present embodiment, liquid cooling heat radiator can also avoid fluid course 2 in composite plate 1
Position offer louvre 3 and/or via be installed, due to thinner thickness, therefore easily perforate in composite plate 1.Arrange scattered
Hot hole 3 can improve the radiating effect of liquid cooling heat radiator further, and louvre 3 can be flow-through cells or BAIYE fenestra.For
Some electronic device 8, it has bulge-structure or mounting structure, and liquid cooling heat radiator can not be fitted with it well, because of
This, can arrange installation via in composite plate 1, it is simple to bulge-structure and mounting structure are separately through, its remaining part of composite plate 1
Divide and electronic device 8 laminating heat radiation.
In the present embodiment, the quantity of metallic plate 11 is preferably two, and fluid course 2 is arranged between two metallic plates 11
Coating surface in.Certainly, according to using needs, composite plate 1 can also by three, the metallic plates 11 such as four hot-forming, often
It is provided with a fluid course 2 between two adjacent metallic plates 11.As long as being capable of inflation molding fluid course 2.
Owing to using inflation molding fluid course 2, therefore, on the premise of meeting liquid cooling heat radiator structural strength, metal
The thickness of plate 11 can be 1mm～4mm, selects suitable metallic plate 11 thickness according to the size of liquid cooling heat radiator, dissipates if liquid is cold
The size of hot device is little, then the thickness of metallic plate 11 can be less, for 1mm～2mm, if the size of liquid cooling heat radiator is big, then gold
The thickness belonging to plate 11 can suitably increase, for 3mm～4mm.Concrete condition is specifically arranged, it is not limited to cited by the present embodiment
Thickness range.
In the present embodiment, according to the size of liquid cooling heat radiator, the size in the inflation gap of fluid course 2, inflation are selected
Gap can be 2mm～5mm, if liquid cooling heat radiator size is little, then fluid course 2 selects less inflation gap, such as 2mm～
3mm, if liquid cooling heat radiator size is big, then fluid course 2 selects bigger inflation gap, such as 4mm～5mm.Concrete condition is concrete
Arrange, it is not limited to the size range cited by the present embodiment.
The integral thickness of the liquid cooling heat radiator in this utility model can be less than 10mm, with existing liquid cooling heat radiator phase
Ratio, thickness is greatly reduced, it is possible to relatively easily carry out bending deformation.
As Figure 1-Figure 5, liquid cooling heat radiator is platy structure, and the shapes and sizes with specific reference to electronic device 8 are arranged
The shape of liquid cooling heat radiator.I.e. composite plate 1 be shaped as slab construction, bending structure, waveform configuration or curved-surface structure etc..Flat board
Structure is applicable to the heat radiation of the electronic device 8 of plane；Bending structure is applicable to the heat radiation of non-coplanar multiple electronic devices 8, as
Shown in Fig. 2 and Fig. 6；Waveform configuration is applicable to the heat radiation of the electronic device 8 of multiple small size arrangement, such as the set of cells in Fig. 5, liquid
Cold heat sink inserts between two row's batteries, and each battery all can contact with liquid cooling heat radiator；Curved-surface structure is applicable to curved surface
The heat radiation of electronic device 8, such as the electric capacity in Fig. 4, bends to liquid cooling heat radiator circular arc and is coated on the circumferential surface of electric capacity.When
So, liquid cooling heat radiator can also is that other shape, it is not limited to the shape cited by the present embodiment.
In order to improve the structural strength of liquid cooling heat radiator, it is preferable that fluid course 2 is after composite plate 1 deforms, then to compound
The solder resist region of plate 1 carries out inflation, and the fluid course 2 of formation will not be by diastrophic power, it is not easy to bursts.Certainly,
For deforming little liquid cooling heat radiator, it is also possible to after inflation goes out fluid course 2, then be curved deformation.
On this basis, this utility model embodiment additionally provides a kind of electronic equipment, electronic equipment can be converter,
The power electronic equipment such as photovoltaic DC-to-AC converter, electric vehicle controller, electronic equipment include electronic device 8 and for electronic device
8 contact the radiators dispelled the heat, and radiator is the liquid cooling heat radiator described by all of the above embodiment.
As shown in Figure 6, in the present embodiment, liquid cooling heat radiator is bending structure, and bending structure is applicable to multiple flat board knot
The heat radiation of the electronic device 8 of structure, such as the electronic device such as circuit board, IGBT, electronic device 8 can be different from liquid cooling heat radiator respectively
Plane contact, the electronic device 8 installed to realize multiple non-co-planar dispels the heat.
As it is shown in figure 5, in the present embodiment, liquid cooling heat radiator is waveform configuration, and waveform configuration is applicable to multiple small size
The heat radiation of electronic device 8 of arrangement, such as set of cells etc., liquid cooling heat radiator inserts between two row's batteries, and each battery all can be with
Liquid cooling heat radiator contacts.
As shown in Figure 4, in the present embodiment, liquid cooling heat radiator is curved-surface structure, and curved-surface structure is applicable to the electronics of curved surface
The heat radiation of device 8, such as electric capacity etc., the radiator of curved surface is coated on the circumferential surface of electric capacity.
Certainly, liquid cooling heat radiator can also is that other shape, it is not limited to the shape cited by the present embodiment, concrete shape
Shape changes with the change of electronic device 8 shape that need to dispel the heat.
In this specification, each embodiment uses the mode gone forward one by one to describe, and what each embodiment stressed is and other
The difference of embodiment, between each embodiment, identical similar portion sees mutually.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses this practicality new
Type.Multiple amendment to these embodiments will be apparent from for those skilled in the art, is determined herein
The General Principle of justice can realize in the case of without departing from spirit or scope of the present utility model in other embodiments.Cause
This, this utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest scope consistent with features of novelty.
Claims (12)
1. a liquid cooling heat radiator, it is characterised in that include the composite plate (1) hot-forming by least two panels metallic plate (11),
Being provided with fluid course (2) in described composite plate (1), described in adjacent two panels, metallic plate (11) fits and is printed with resistance between surface
Solder flux region, described fluid course (2) by carrying out gases at high pressure inflation formation, and described solder resist to described solder resist region
The circulation path shape being shaped as described fluid course (2) in region.
Liquid cooling heat radiator the most according to claim 1, it is characterised in that described metallic plate (11) is aluminium sheet.
Liquid cooling heat radiator the most according to claim 1, it is characterised in that the two ends of described fluid course (2) are respectively mounted
There are water inlet tap (4) and faucet (5).
Liquid cooling heat radiator the most according to claim 1, it is characterised in that described composite plate (1) avoids described fluid course
(2) position offers louvre (3) and/or installs via.
Liquid cooling heat radiator the most according to claim 1, it is characterised in that the thickness of described metallic plate (11) be 1mm～
4mm。
Liquid cooling heat radiator the most according to claim 1, it is characterised in that the inflation gap of described fluid course (2) is 2mm
～5mm.
Liquid cooling heat radiator the most according to claim 1, it is characterised in that described fluid course (2) is in described composite plate (1)
The solder resist region of composite plate described in inflation (1) after deformation and formed.
Liquid cooling heat radiator the most according to claim 1, it is characterised in that described composite plate (1) be shaped as slab construction,
Bending structure, waveform configuration or curved-surface structure.
9. an electronic equipment, including electronic device (8) and radiator, described radiator contacts with described electronic device (8) and dissipates
Heat, it is characterised in that described radiator is the liquid cooling heat radiator as described in any one of claim 1 to 8.
Electronic equipment the most according to claim 9, it is characterised in that described liquid cooling heat radiator is bending structure, described electricity
Sub-device (8) is multiple and Different Plane with described liquid cooling heat radiator contacts heat radiation respectively.
11. electronic equipments according to claim 9, it is characterised in that described liquid cooling heat radiator is waveform configuration, described liquid
The wavy surface of cold heat sink contacts heat radiation with the surface of multiple described electronic devices (8) being arranged side by side.
12. electronic equipments according to claim 9, it is characterised in that described liquid cooling heat radiator is curved-surface structure, described liquid
Cold heat sink is coated in the curved surface of described electronic device (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620571614.XU CN205812612U (en) | 2016-06-13 | 2016-06-13 | A kind of liquid cooling heat radiator and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620571614.XU CN205812612U (en) | 2016-06-13 | 2016-06-13 | A kind of liquid cooling heat radiator and electronic equipment |
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| Publication Number | Publication Date |
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| CN205812612U true CN205812612U (en) | 2016-12-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620571614.XU Active CN205812612U (en) | 2016-06-13 | 2016-06-13 | A kind of liquid cooling heat radiator and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109757082A (en) * | 2019-01-14 | 2019-05-14 | 常州常发制冷科技有限公司 | Liquid cooling plate and its processing method with structural connection |
-
2016
- 2016-06-13 CN CN201620571614.XU patent/CN205812612U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109757082A (en) * | 2019-01-14 | 2019-05-14 | 常州常发制冷科技有限公司 | Liquid cooling plate and its processing method with structural connection |
| CN109757082B (en) * | 2019-01-14 | 2021-03-16 | 常州恒创热管理有限公司 | Liquid cooling plate with structural connecting piece and machining method thereof |
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