CN109757082B - Liquid cooling plate with structural connecting piece and machining method thereof - Google Patents

Liquid cooling plate with structural connecting piece and machining method thereof Download PDF

Info

Publication number
CN109757082B
CN109757082B CN201910030992.5A CN201910030992A CN109757082B CN 109757082 B CN109757082 B CN 109757082B CN 201910030992 A CN201910030992 A CN 201910030992A CN 109757082 B CN109757082 B CN 109757082B
Authority
CN
China
Prior art keywords
local position
substrate
flow channel
liquid cooling
cooling plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910030992.5A
Other languages
Chinese (zh)
Other versions
CN109757082A (en
Inventor
黄晓峰
涂志龙
刘飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changzhou Hengchuang Thermal Management System Co.,Ltd.
Original Assignee
Changzhou Hengchuang Heat Management Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changzhou Hengchuang Heat Management Co ltd filed Critical Changzhou Hengchuang Heat Management Co ltd
Priority to CN201910030992.5A priority Critical patent/CN109757082B/en
Publication of CN109757082A publication Critical patent/CN109757082A/en
Application granted granted Critical
Publication of CN109757082B publication Critical patent/CN109757082B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention belongs to the technical field of radiators, and particularly relates to a liquid cooling plate with a structural connecting piece. Has the advantages that: according to the liquid cooling plate with the structural connecting piece, when the liquid cooling plate is assembled with other structural components through the bending part as the connecting piece or accessories are installed on the liquid cooling plate, the liquid cooling plate is positioned and supported through the bending part, and compared with the existing liquid cooling plate which is connected with an L-shaped support through welding, riveting or threads as the connecting piece, the bending part is of an integrated structure with the substrate as the connecting piece, so that the strength is better, the connecting mode is more stable and reliable, the assembling process is simple and convenient, and the assembling quality is high; when the liquid cooling board was as the box shell, this application portion of bending makes the waterproof dustproof effectual of box as the connected mode of connecting piece.

Description

Liquid cooling plate with structural connecting piece and machining method thereof
Technical Field
The invention belongs to the technical field of radiators, and particularly relates to a liquid cooling plate with a structural connecting piece and a processing method thereof.
Background
The liquid cooling plate is a plate type radiator with a liquid flow channel arranged inside, and heat is taken away from the surface of the liquid cooling plate through the circulating flow of cooling liquid in the liquid flow channel so as to cool the environment. With the rapid development of power electronic equipment and electric vehicle battery electric control technology, the requirements of battery packs and electronic equipment on heat dissipation and cooling are higher and higher, and the liquid cooling plate is widely applied to the power electronic and electric vehicle industries.
The manufacturing method of the liquid cooling plate mainly adopts the modes of friction stir welding after machining or die-casting forming, vacuum brazing after punch forming, buried pipe type water cooling plate and flat pipe welding, and the inflation type liquid cooling plate has become a new research hotspot in recent years due to the advantages of short development period, small mold investment and high production efficiency.
The existing inflation type and stamping welding type liquid cooling plate is light and thin in structure, high in production efficiency and low in structural strength. When the liquid cooling plate is assembled with other structural components or accessories are installed on the liquid cooling plate, the structural connecting piece is used for positioning and supporting, the connecting piece is required to be connected with the surface of the liquid cooling plate through welding, riveting or threads, for example, the surface of the liquid cooling plate is connected with an L-shaped bracket as the connecting piece through welding, riveting or threads, so that the processing complexity is increased, and the strength and reliability of the connecting structure are not high; when the liquid cooling plate is used as a shell of the box body, the connection modes can bring difficulty to the water and dust prevention of the box body.
Disclosure of Invention
In order to improve the structure assembly process of the liquid cooling plate in the prior art and improve the structure strength and the protective performance, the invention provides the liquid cooling plate with the structure connecting piece and the processing method thereof.
In order to solve the technical problem, the technical scheme adopted by the invention is that the liquid cooling plate with the structural connecting piece comprises two base plates, a liquid flow channel is arranged between the two base plates, a bending part is formed by bending the local position of at least one base plate, the local position avoids the liquid flow channel, and the bending part and the base plates are of an integrated structure.
Preferably, the local position is located in the middle of the substrate. When the liquid cooling plate is assembled with other structural components or accessories are installed on the liquid cooling plate, the liquid cooling plate is directly connected with the bending part at the middle part of the substrate, according to the actual assembly position requirement, the bending part can be arranged at any position at the middle part of the substrate, the use is more flexible, the practicability and the adaptability are high, the bending part and the substrate are of an integrated structure, the connection strength is high, and the connection mode is more stable and reliable.
Preferably, the local position is located on one of the substrates; or the two substrates are provided with the local positions, and the local positions of the two substrates are arranged in a staggered manner. The two substrates are arranged in a staggered manner at local positions, namely the local position of one substrate is complete at the local position corresponding to the other substrate, so that the waterproof and dustproof capacity of the liquid cooling plate is ensured.
Preferably, the localized position is located on at least one side edge of the substrate. The local position is located at the edge of the substrate, so that bending processing is facilitated, a bending part formed by bending can be matched with the liquid cooling box body, the assembly process is improved, and the structural strength of the liquid cooling plate is improved.
Preferably, the local position is located on one of the substrates; or the two substrates are provided with the local positions, and the local positions on the two substrates are respectively far away from the other substrate to be bent to form a bending part.
Preferably, the bent portion is bent to form a side lug, and the side lug is parallel to the substrate. The side ear can be as the bottom support of base plate, is convenient for install the liquid cooling plate on bearing structure, need not install the liquid cooling plate support in addition.
Further, the distance between the local position and the liquid flow channel is not less than X mm, the blasting pressure of the liquid flow channel is Y megapascal, and the following relation is satisfied by X and Y: x is more than or equal to 2.5+ 0.6Y. The higher the burst pressure is, the larger the X is, so as to ensure that the liquid cooling plate meets the requirement of the burst pressure.
Further, the local position is at a distance of 5-50mm from the flow channel.
A processing method for manufacturing the liquid cooling plate with the structural connecting piece comprises the following processing steps:
printing a rolling inhibitor: printing a rolling inhibitor pattern on one substrate, wherein the rolling inhibitor pattern comprises a liquid flow channel area corresponding to a liquid flow channel and a local position area corresponding to a local position, and the liquid flow channel area is not communicated with the local position area;
hot rolling and rolling: compounding the two substrates, and performing hot rolling pressing;
and thirdly, blow molding: blowing and molding the liquid flow channel through a blowing hole;
bending the local position: after the liquid flow channel is formed in an inflation mode, the substrate at the local position is punched and bent to form a bent part;
further comprising, a local position cutting step: cutting a seam for bending the local position area; when the local position area is positioned in the middle of the substrate, the local position cutting step is between the first step and the second step; and when the local position area is positioned at the edge of the substrate, the step of cutting the local position is between the step I and the step II, or between the step III and the step IV.
Preferably, the step (c) further comprises a cutting step after blow molding: and cutting off the machining allowance of the liquid cooling plate along the periphery of the liquid cooling plate.
Has the advantages that: according to the liquid cooling plate with the structural connecting piece and the processing method thereof, the liquid cooling plate is assembled with other structural components by taking the bending part as the connecting piece, or when an accessory is installed on the liquid cooling plate, the liquid cooling plate is positioned and supported by the bending part, and compared with the existing liquid cooling plate which is provided with an L-shaped support as the connecting piece by welding, riveting or threaded connection, the bending part is taken as the connecting piece and is integrated with the substrate, so that the strength is better, the connecting mode is more stable and reliable, the assembling process is simple and convenient, and the assembling quality is high; when the liquid cooling board was as the box shell, this application portion of bending makes the waterproof dustproof effectual of box as the connected mode of connecting piece.
Drawings
FIG. 1 is a schematic perspective view of the structure of example 1;
FIG. 2 is a schematic front view of embodiment 1;
FIG. 3 is a schematic cross-sectional view taken along the line A-A in FIG. 2;
FIG. 4 is an enlarged partial schematic view of C of FIG. 3;
FIG. 5 is a schematic view of a resist printing track on a substrate of example 1;
FIG. 6 is a schematic perspective view of the preferred embodiment 3;
FIG. 7 is a schematic perspective view of the preferred embodiment 4;
FIG. 8 is a schematic front view of embodiment 4;
FIG. 9 is a schematic cross-sectional view taken along line B-B of FIG. 8;
FIG. 10 is a schematic view of a blocker print track on a substrate of examples 3 and 4;
in fig. 5 and 10, the shaded portion is a printed blocker pattern; the dotted line is a liquid cooling plate cutting track;
in the figure: 1. the device comprises a base plate, 2, a liquid flow channel, 3, a local position, 4, a bent part, 5, a blowing hole, 6, a liquid flow channel area, 7, a local position area, 8, a process circuit area, 9, a water pipe connector, 10 and a side lug.
Detailed Description
Example 1
As shown in fig. 1-5, a liquid cooling plate with structural connection spare, includes two base plates 1, and base plate 1 can select to use aluminum plate, two be provided with fluid flow channel 2 between the base plate 1 one local position 3 of base plate 1 is bent and is formed the portion of bending 4, local position 3 is located the middle part of base plate 1, fluid flow channel 2 is avoided to local position 3, the portion of bending 4 and this base plate 1 structure as an organic whole. In order to facilitate the bending processing and improve the reliability of the structure of the bent part 4 after bending, the bent part 4 can be bent by 90 degrees, so that the bent part 4 is perpendicular to the substrate 1, when the liquid cooling plate is assembled with other structural components through the bent part 4 or accessories are installed on the liquid cooling plate through the bent part 4, the bent part 4 is perpendicular to the substrate 1, so that the connection strength can be ensured, and the assembly with other structural components or the installation accessories is facilitated.
In order to ensure that the liquid cooling plate meets the requirement of the explosion pressure, the distance between the local position 3 and the liquid flow channel 2 is not less than X mm, the explosion pressure of the liquid flow channel 2 is Y megapascal, and the X and the Y meet the following relation: x is more than or equal to 2.5+ 0.6Y. In particular, the local position 3 is at a distance of 5-50mm from the flow channel 2.
The liquid cooling plate comprises a liquid cooling plate which is provided with a cooling liquid circulating and flowing in the liquid flow channel 2 to realize a cooling function, and also comprises an evaporator of a compression refrigeration system, wherein the evaporator is provided with a liquid flow channel for a refrigerant to flow.
As shown in fig. 4 and 5, a method for manufacturing the above-mentioned liquid cooling plate with structural connection member includes the following steps:
firstly, carrying out a pretreatment step: the pretreatment step is to perform roughening, slitting and annealing treatment on the substrate 1, and then perform the following steps:
printing a rolling inhibitor: printing a rolling inhibitor pattern on one substrate 1, wherein the rolling inhibitor pattern comprises a process circuit area 8, a liquid flow channel area 6 corresponding to the liquid flow channel 2 and a local position area 7 corresponding to the local position 3, the substrate 1 is thinned and elongated in the hot rolling and rolling process, after the substrate 1 is hot rolled and rolled, the liquid flow channel area 6 corresponds to the liquid flow channel 2, the local position area 7 corresponds to the local position 3, the process circuit area 8 is communicated with the liquid flow channel area 6, and the liquid flow channel area 6 is not communicated with the local position area 7; rolling and compounding are technological processes of combining double-layer or multi-layer metal plates into one body by rolling. The rolling inhibitor referred to in this patent is a material for preventing the double-layer metal plate from being bonded by rolling, for example: a graphite emulsion; coating or printing the rolling inhibitor between the double-layer metal plates, so that when the double-layer metal plates are rolled and compounded, the areas coated or printed with the rolling inhibitor cannot be rolled and combined into a whole, and the double-layer metal plates in the areas still keep a mutually separated double-layer structure;
cutting local positions: cutting a seam for bending in the local position area 7 of one substrate 1;
hot rolling and rolling: after the local position area 7 is cut, compounding the two substrates 1, performing hot rolling and pressing, and sequentially annealing, leveling and blowing and expanding the hot rolled and pressed substrates 1 by using a blowing and expanding hole 5;
and thirdly, blow molding: the liquid flow channel 2 is subjected to inflation molding through an inflation hole 5 through a process circuit area 8;
cutting off: cutting off the machining allowance of the liquid cooling plate along the periphery of the liquid cooling plate, wherein as shown in fig. 5, a dotted line part is a cutting track, a process line area 8 where an inflation hole 5 is located is also cut off, and then welding and sealing the inflation process pipe exposed after the cutting off;
bending the local position: after the liquid flow channel 2 is formed in an inflation mode, the substrate 1 at the local position 3 is punched and bent to form a bent part 4;
fifthly, a water inlet hole and a water outlet hole are punched on the liquid cooling flow path 5, and water pipe joints 9 are respectively welded on the water inlet hole and the water outlet hole. In this embodiment, the step (c') may be after the step (c).
When the liquid cooling plate is assembled with other structural components through the bending part 4 serving as a connecting piece or accessories are installed on the liquid cooling plate, the liquid cooling plate is positioned and supported through the bending part 4, and compared with the existing method that an L-shaped support is connected through welding, riveting or threads to serve as the bending part 4, the bending part 4 serves as the connecting piece and is integrated with the substrate 1, the strength is better, the connecting mode is more stable and reliable, the assembling process is simple and convenient, and the assembling quality is high; when the liquid cooling board was as the box shell, this application portion of bending 4 made the waterproof dustproof effectual of box as the connected mode of connecting piece.
Example 2
In this embodiment, the difference from embodiment 1 is that the two substrates 1 each have the local position 3, and the local positions 3 of the two substrates 1 are arranged to be shifted from each other. Namely, the part of the other substrate 1 corresponding to the local position 3 of one substrate 1 is complete, so as to ensure the waterproof and dustproof capability of the liquid cooling plate.
Example 3
As shown in fig. 6 and 10, the present embodiment is different from the liquid cooling plate of embodiment 1 in that both side edges of one of the substrates 1 have the local positions 3, and the local positions 3 of the substrate 1 are bent into bent portions 4 away from the other substrate 1. The local position 3 is located at the edge of the substrate 1, so that bending processing is facilitated, a bending part 4 formed by bending can be matched with the liquid cooling box body, the assembly process is further improved, and the structural strength of the liquid cooling plate is improved.
The corresponding processing methods differ in that: the partial position cutting step is carried out
Between the third step and the fourth step, the cutting locus in the partial position cutting step coincides with the cutting locus in the cutting step, and as shown in fig. 10, the broken line part is the cutting locus. In addition, in this embodiment, the step of cutting the local position may be performed between the first step and the second step.
Example 4
As shown in fig. 7 to 10, in the present embodiment, the difference from embodiment 3 is that the two side edges of the two substrates 1 have the local positions 3, and the local positions 3 on the two substrates 1 are respectively bent away from the other substrate 1 to form bent portions 4, wherein the bent portion 4 of one substrate 1 is bent to form side lugs 10, and the side lugs 10 are parallel to the substrate 1. The side ears 10 can be used as a bottom support of the substrate 1, so that the liquid cooling plate can be conveniently installed on the supporting structure without additionally installing a liquid cooling plate support.
Example 5
On the basis of the above embodiments 1 to 4, in practical applications, the minimum distance X between the local position 3 and the flow channel 2 and the burst pressure Y of the flow channel 2 specifically adopt the parameters in the following table:
TABLE 1 test examples under different parameters
Figure RE-GDA0001978170790000091
As can be seen from the above example, when the minimum distance X and the burst pressure Y satisfy the following relationship: x is more than or equal to 2.5+0.6Y, and X is controlled within 5-50 mm; the liquid cooling plate prepared by the method can meet the use pressure requirements under different working conditions, the required thickness and length can be obtained after hot rolling, the rolling ratio is close to an appropriate value of 2.5, the bonding rate is excellent, and the parameters are controlled in practical production application, so that unified processing is facilitated, batch products obtained by processing are more durable, and the heat dissipation performance is more reliable.

Claims (6)

1. A liquid-cooled panel with structural connection, characterized in that: the liquid flow bending device comprises two substrates (1), wherein a liquid flow channel (2) is arranged between the two substrates (1), a bending part (4) is formed by bending a local position (3) of at least one substrate (1), the liquid flow channel (2) is avoided by the local position (3), and the bending part (4) and the substrate (1) are of an integral structure;
the local position (3) is located in the middle of the substrate (1);
the local position (3) is located on one of the substrates (1);
or the two substrates (1) are provided with the local positions (3), and the local positions (3) of the two substrates (1) are arranged in a staggered manner;
the local position (3) is located at least one side edge of the substrate (1);
the local position (3) is located on one of the substrates (1);
or the two substrates (1) are provided with the local positions (3), and the local positions (3) on the two substrates (1) are respectively far away from the other substrate (1) and are bent to form bent parts (4).
2. The liquid cooled plate with structural connection of claim 1, wherein: the bending part (4) is bent to form a side lug (10), and the side lug (10) is parallel to the substrate (1).
3. The liquid cooled plate with structural connection of claim 1, wherein: the distance between the local position (3) and the liquid flow channel (2) is not less than X mm, the blasting pressure of the liquid flow channel (2) is Y megapascal, and the X and the Y satisfy the following relation: x is more than or equal to 2.5+ 0.6Y.
4. The liquid cooled plate with structural connection of claim 1, wherein: the distance between the local position (3) and the liquid flow channel (2) is 5-50 mm.
5. A method of manufacturing a liquid cooled plate with structural connection according to any of claims 1 to 4, comprising: the method comprises the following processing steps:
printing a rolling inhibitor: printing a blocker pattern on one of the substrates (1), the blocker pattern comprising a flow channel region (6) corresponding to the flow channel (2) and a local position region (7) corresponding to the local position (3), the flow channel region (6) not being in communication with the local position region (7);
hot rolling and rolling: compounding the two substrates (1) and performing hot rolling pressing;
and thirdly, blow molding: blowing and molding the liquid flow channel (2) through a blowing and expanding hole (5);
bending the local position: after the liquid flow channel (2) is formed in an inflation mode, the substrate (1) at the local position (3) is punched out and bent to form a bent part (4);
further comprising, a local position cutting step: cutting a seam for bending into the local position area (7); when the local position area (7) is positioned in the middle of the substrate (1), the local position cutting step is between the first step and the second step; when the local position area (7) is positioned at the edge of the substrate (1), the step of cutting the local position is between the step I and the step II, or between the step III and the step IV.
6. The processing method according to claim 5, characterized in that: the step III also comprises a cutting step after blow molding: and cutting off the machining allowance of the liquid cooling plate along the periphery of the liquid cooling plate.
CN201910030992.5A 2019-01-14 2019-01-14 Liquid cooling plate with structural connecting piece and machining method thereof Active CN109757082B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910030992.5A CN109757082B (en) 2019-01-14 2019-01-14 Liquid cooling plate with structural connecting piece and machining method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910030992.5A CN109757082B (en) 2019-01-14 2019-01-14 Liquid cooling plate with structural connecting piece and machining method thereof

Publications (2)

Publication Number Publication Date
CN109757082A CN109757082A (en) 2019-05-14
CN109757082B true CN109757082B (en) 2021-03-16

Family

ID=66405457

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910030992.5A Active CN109757082B (en) 2019-01-14 2019-01-14 Liquid cooling plate with structural connecting piece and machining method thereof

Country Status (1)

Country Link
CN (1) CN109757082B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112087913A (en) * 2019-06-14 2020-12-15 临沂大学 Aluminum profile substrate for cooling of refrigerant

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011125893A (en) * 2009-12-17 2011-06-30 Yokogawa Electric Corp Water-cooled cold plate
CN205812612U (en) * 2016-06-13 2016-12-14 深圳市英威腾电气股份有限公司 A kind of liquid cooling heat radiator and electronic equipment
CN206441785U (en) * 2016-12-26 2017-08-25 浙江吉利控股集团有限公司 A kind of battery tray radiator structure
CN107228584A (en) * 2017-07-13 2017-10-03 吴丹 A kind of ultra-thin three-dimensional water cooling plant and its processing method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107776117A (en) * 2016-08-31 2018-03-09 浙江嘉熙科技有限公司 Phase transformation suppresses plate and television set in heat sink, television set

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011125893A (en) * 2009-12-17 2011-06-30 Yokogawa Electric Corp Water-cooled cold plate
CN205812612U (en) * 2016-06-13 2016-12-14 深圳市英威腾电气股份有限公司 A kind of liquid cooling heat radiator and electronic equipment
CN206441785U (en) * 2016-12-26 2017-08-25 浙江吉利控股集团有限公司 A kind of battery tray radiator structure
CN107228584A (en) * 2017-07-13 2017-10-03 吴丹 A kind of ultra-thin three-dimensional water cooling plant and its processing method

Also Published As

Publication number Publication date
CN109757082A (en) 2019-05-14

Similar Documents

Publication Publication Date Title
CN109788712B (en) Side-edge separation type liquid cooling plate and processing method thereof
US11156409B2 (en) Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover
CN202977400U (en) Power semiconductor module cooling device
CN109757082B (en) Liquid cooling plate with structural connecting piece and machining method thereof
CN209882426U (en) Inflation formula liquid cooling board with structural connection spare
CN114941624A (en) Compressor backshell subassembly reaches scroll compressor including it
CN115443053A (en) Liquid-cooled heat sink and liquid-cooled electronic apparatus
CN209861418U (en) Side separation type inflation type liquid cooling plate
US20040118144A1 (en) Hermetic inverter/converter chamber with multiple pressure and cooling zones
EP3923689A1 (en) Cooling device and method of manufacturing the same
CN210156515U (en) Battery liquid cooling plate
CA2096983C (en) Radiator assembly for substrate
CN210120760U (en) Electrical apparatus box and air conditioner
CN217462553U (en) Compressor backshell subassembly reaches scroll compressor including it
CN110671750A (en) Air conditioner and phase change heat dissipation control box thereof
CN215266532U (en) Liquid-cooled battery box for new energy automobile
CN100364143C (en) Battery connector
CN210660593U (en) Compressor that possesses high-efficient heat-sinking capability
CN101232792A (en) Heat radiating device, heat radiating base and manufacturing method thereof
CN217470430U (en) Clamp for automatic surface mounting and reflow soldering of double-sided printed board assembly
CN219437228U (en) Multilayer high-conductivity aluminum-based circuit board
CN219797121U (en) Heat dissipation type multilayer copper substrate
CN218975770U (en) Temperature equalizing plate and radar antenna system
CN216566145U (en) Electromagnetic shielding structure of communication equipment
CN220914345U (en) Liquid cooling plate and battery pack

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20210208

Address after: Room 580, 18 Xinya Road, Changzhou City, Jiangsu Province 213164

Applicant after: CHANGZHOU HENGCHUANG HEAT MANAGEMENT Co.,Ltd.

Address before: 213000 Jiandong village, Lijia Town, Wujin District, Changzhou City, Jiangsu Province

Applicant before: CHANGZHOU CHANGFA REFRIGERATION TECHNOLOGY Co.,Ltd.

GR01 Patent grant
GR01 Patent grant
CP02 Change in the address of a patent holder
CP02 Change in the address of a patent holder

Address after: Room 580, 18 Xinya Road, Wujin national high tech Industrial Development Zone, Changzhou City, Jiangsu Province 213164

Patentee after: CHANGZHOU HENGCHUANG HEAT MANAGEMENT Co.,Ltd.

Address before: Room 580, 18 Xinya Road, Changzhou City, Jiangsu Province 213164

Patentee before: CHANGZHOU HENGCHUANG HEAT MANAGEMENT Co.,Ltd.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 213176 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province

Patentee after: Changzhou Hengchuang Thermal Management System Co.,Ltd.

Country or region after: China

Address before: Room 580, 18 Xinya Road, Wujin national high tech Industrial Development Zone, Changzhou City, Jiangsu Province 213164

Patentee before: CHANGZHOU HENGCHUANG HEAT MANAGEMENT Co.,Ltd.

Country or region before: China