US20170075226A1 - Imaging Device - Google Patents

Imaging Device Download PDF

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Publication number
US20170075226A1
US20170075226A1 US15/363,520 US201615363520A US2017075226A1 US 20170075226 A1 US20170075226 A1 US 20170075226A1 US 201615363520 A US201615363520 A US 201615363520A US 2017075226 A1 US2017075226 A1 US 2017075226A1
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Prior art keywords
chips
imaging device
elements
grin
pair
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Abandoned
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US15/363,520
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English (en)
Inventor
Michael Nagler
Nir RUBIN BEN HAIM
Ofer Aknin
Benzion Landa
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Landa Labs 2012 Ltd
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Landa Labs 2012 Ltd
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Publication date
Priority claimed from GBGB1509077.2A external-priority patent/GB201509077D0/en
Priority claimed from GBGB1509073.1A external-priority patent/GB201509073D0/en
Application filed by Landa Labs 2012 Ltd filed Critical Landa Labs 2012 Ltd
Assigned to LANDA LABS (2012) LTD. reassignment LANDA LABS (2012) LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AKNIN, OFER, LANDA, BENZION, NAGLER, MICHAEL, RUBIN BEN-HAIM, NIR
Publication of US20170075226A1 publication Critical patent/US20170075226A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • B41J2/451—Special optical means therefor, e.g. lenses, mirrors, focusing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/455—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using laser arrays, the laser array being smaller than the medium to be recorded
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70025—Production of exposure light, i.e. light sources by lasers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/04—Apparatus for electrographic processes using a charge pattern for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material
    • G03G15/04036—Details of illuminating systems, e.g. lamps, reflectors
    • G03G15/04045—Details of illuminating systems, e.g. lamps, reflectors for exposing image information provided otherwise than by directly projecting the original image onto the photoconductive recording material, e.g. digital copiers
    • G03G15/04072—Details of illuminating systems, e.g. lamps, reflectors for exposing image information provided otherwise than by directly projecting the original image onto the photoconductive recording material, e.g. digital copiers by laser
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/04—Apparatus for electrographic processes using a charge pattern for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material
    • G03G15/043—Apparatus for electrographic processes using a charge pattern for exposing, i.e. imagewise exposure by optically projecting the original image on a photoconductive recording material with means for controlling illumination or exposure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
    • G03G15/34—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the powder image is formed directly on the recording material, e.g. by using a liquid toner
    • G03G15/342—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the powder image is formed directly on the recording material, e.g. by using a liquid toner by forming a uniform powder layer and then removing the non-image areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Definitions

  • the present disclosure relates to an imaging device for projecting a plurality of individually controllable laser beams onto a surface that is movable relative to the imaging device.
  • U.S. Pat. No. 7,002,613 describes a digital printing system to which the imaging device of the present disclosure is applicable, by way of example.
  • an imaging device designated 84 that is believed to represent the closest prior art to the present disclosure.
  • the imaging device serves to project a plurality of individually controllable laser beams onto a surface, herein termed an imaging surface, to generate an energy image onto that surface.
  • the laser image can be used for a variety of purposes, just a few examples being to produce a two dimensional printed image on a substrate, as taught for instance in U.S. Pat. No. 7,002,613, in 3D printing and in etching of an image onto any surface.
  • the number of pixels to be imaged every second is very high, demanding parallelism in the imaging device.
  • the laser imaging device of the present disclosure is intended for applications that require energy beams of high power where the total power required can be of tens or hundreds of milliwatt (mW).
  • the energy beams can provide powers of up to 10 mW, 100 mW and even 250 mW or higher.
  • the imaging device is required to have a plurality of laser emitting elements for various pixels (picture elements) each laser capable of tracing a line of pixels in the image area of an imaging surface in relative motion.
  • a high resolution image for example one having 1200 dpi (dots per inch)
  • adjacent elements would interfere thermally with one another.
  • U.S. Pat. No. 7,002,613 avoids this problem by arranging such chips in two rows, in the manner shown in FIG. 8 of the latter patent.
  • the chips in each row are staggered relative to the chips in the other row of the pair so that each chip in one row scans the gap left unscanned by the two adjacent chips in the other row.
  • U.S. Pat. No. 7,002,613 recognizes the requirement for beam shaping of the laser beams emitted by the elements on the chips and proposes the use of micro-optical components (acting on only one or more laser beams of the VCSEL [Vertical Cavity Surface Emitting Laser] bar) and/or macro-optical components (acting on all laser beams of the VCSEL bar).
  • arrays of micro-optical components such as microlens arrays, are proposed where the spacing between the individual components corresponds to the spacing of two laser emitters or a multiple thereof.
  • an imaging device for projecting individually controllable laser beams onto an imaging surface that is movable relative thereto in a reference X-direction
  • the device including a plurality of semiconductor chips each of which comprises a plurality of individually controllable laser beam emitting elements arranged in a two dimensional main array of M rows and N columns (M ⁇ N), the elements in each row having a uniform spacing A r and the elements in each column having a uniform spacing a c , wherein the chips are mounted on a support in such a manner that when nominally placed, each pair of chips that are adjacent one another in a reference Y-direction, transverse to the X-direction, are offset from one another in the X-direction, and such that the center of laser beam emitting elements of the main M ⁇ N emitting elements arrays of both chips in the pair are uniformly spaced in the Y-direction by a nominal distance A r /M, i.e.
  • the imaging device further comprises a plurality of lens systems each serving to focus the laser beams of all the laser elements of a respective one of the chips onto the imaging surface without altering the separation between the laser beams, each lens system comprising at least one gradient index (GRIN) rod.
  • GRIN gradient index
  • the emitted laser beams of the respective main arrays of the two chips of the pair would trace on the imaging surface a set of parallel lines that extend in the X-direction and that are nominally uniformly spaced in the Y-direction.
  • the lines traceable by emitting elements of the first chip would not interlace with the lines traceable by emitting elements of the second chip.
  • the chips it is convenient for the chips to be arranged in at least one pair of rows on the support, with corresponding laser emitting elements of all the chips in each of the two rows lying in line with one another in the Y-direction.
  • corresponding elements it is meant that the individual laser emitting elements of the M ⁇ N main array should occupy the same row and column positions within their respective chips. It is advantageous for corresponding elements in any group of three chips in the pair of rows that are adjacent one another in the X and Y-directions to lie at the apices of congruent equilateral triangles as described above. This arrangement simplifies the construction of the lens system to focus the laser beams onto the imaging surface.
  • the term “nominally”, should be construed to denote the desired spatial relationship when the chips or other relevant elements are disposed at their intended placing.
  • different aspects of the invention allow for displacements that diverge from that nominal position within such tolerance, and for compensating for such displacement.
  • the term “beam” should be considered as relating primarily to the center of the beam, unless otherwise indicated or clear from the context.
  • the uniform spacing A r and a c relate to the distance between the centers of the laser beam emitting elements.
  • the spacing between the centers of adjacent laser beams along the Y-direction, or equivalently adjacent lines in the set of traced lines will equal A r /M, namely the quotient of the spacing of the adjacent elements in each row divided by the number of rows.
  • the total number of lines traced by the two chips will equal 2 ⁇ M ⁇ N, namely twice the product of the number of rows and the number of columns in each chip, if the chips have equal numbers of rows and columns respectively.
  • imaging devices would require a relatively high number of chips, each having multiple laser beam emitting elements arranged in columns and rows. This creates challenges for the optic systems to be associated with such multitude of laser elements, in particular when precise and accurate transmission of the laser signal to the imaging surface is desired (e.g., to achieve quality print in printing systems).
  • the alignment of the chips within each pair(s) of rows in the present disclosure is such that corresponding elements in any group of three adjacent chips in the X and Y-directions nominally lie at the apices of congruent equilateral triangles.
  • the GRIN rods may more conveniently be arranged in at least one pair of rows in such a manner that cylindrical surfaces of the GRIN rods in each row of the pair contact one another and the cylindrical surface of each lens in each row additionally contacts the cylindrical surfaces of the two adjacent GRIN rods in the other row of the pair.
  • construction of the lens system is particularly simplified because simply stacking the rods in their most compact configuration will automatically ensure their correct alignment between the chips, thus a correct alignment of each GRIN rod with their respective chips.
  • the lens system may comprise a single GRIN rod associated with each chip, it may alternatively comprise a plurality of GRIN rods arranged in series with one another and forming a folded light path where the fold is in the space where a beam emitted by the laser elements is substantially individually collimated.
  • a reflecting member such as a prism or mirror which is optionally common to all the chips may serve to direct the laser beams from one GRIN rod element to the next in each series.
  • a suitable light path folding prism can be for example a right angle prism, the folding face of the prism being a reflecting surface.
  • Other types of reflecting members and folding angles can be used depending on the geometry of the system and the direction to be given to beams in the series.
  • magnification M o whose absolute value is greater than or equal to one (1), however magnification lower than one (1) is also explicitly considered. It was found to be even more advantageous if the magnification M o was substantially equal to +1, as that would ensure that the laser elements can be spaced adequately on the chip even for high resolution systems. Stated differently, the image of the array of laser elements on the imaging surface (i.e. an array of dots) would have the same size as the array on the chip, though it may be inverted with a magnification of ⁇ 1.
  • the position of the illuminated laser spot on the imaging surface will remain unchanged, as it only depends on the position of the laser emitting element on the laser array chip.
  • the former elements can be positioned with very high accuracy on every laser array chip using standard semiconductor manufacturing techniques.
  • optical magnifications of ⁇ 1 may require more precise positioning and alignment of the GRIN rod lenses.
  • the separation between the laser elements is desirably sufficiently great to minimize thermal interference between adjacent laser emitting elements.
  • the support for the chip arrays may be fluid cooled to help dissipate the heat that may be generated by the chips.
  • the support may be a rigid metallic or ceramic structure and it may be formed of, or coated with, an electrically insulating surface bearing film conductors to supply electrical signals and power to the chips.
  • the chips in some embodiments are vertical cavity surface emitting laser (VCSEL) chip arrays. Equivalently other types of laser sources may be utilized, and the term VCSEL should be construed as encompassing such laser sources.
  • VCSEL vertical cavity surface emitting laser
  • the intensity of the laser beam emitted by each element may be adjustable either continuously (in an analogue manner) or in discrete steps (digitally).
  • the chips may include D/A converters so as to receive digital control signals. In this way, the laser beam intensity may be controllably adjusted in a plurality of discrete steps, such as 2, 4, 8, 16, 32, . . . 4096 and the like.
  • the laser emitting elements are switched on and off as needed to provide the required image on the imaging surface, as continuous operation of all laser beams would result in a substantially uniformly irradiated surface.
  • FIG. 1 is a schematic diagram of a digital printing system utilizing an imaging device according to an embodiment of the present disclosure
  • FIG. 2 shows part of an imaging device comprising a set of VCSEL chips mounted on a support
  • FIG. 3 is a schematic representation of the laser emitting elements of two VCSEL chips and the lines that they can trace on a relatively moving imaging surface;
  • FIG. 4 is a schematic representation that demonstrates in one pair of rows the alignment between the VCSEL chips and the GRIN rods used as lenses to focus the emitted laser beams onto the imaging surface;
  • FIG. 5A shows prior art proposals for correction of chip misalignment
  • FIG. 5B shows the manner in which an embodiment of the invention compensates for chip misalignment
  • FIG. 6 shows the energy profiles produced by the laser elements at the ends of two adjacent arrays, to illustrate how a single line can be traced using two laterally positioned laser elements, there being shown for each array three elements of the main array and one of the additional elements;
  • FIG. 7A is a similar energy diagram to FIG. 6 to show how the energies of two adjacent laser elements of the main array can be combined on the imaging surface to produce an additional dot that does not fall on the center line of either of the laser elements;
  • FIG. 7B shows the dot pattern on the imaging surface produced by activating four laser elements of the main array in the manner shown in FIG. 7A ;
  • FIG. 8A shows how the dot pattern of FIG. 7B assists in anti-aliasing
  • FIG. 8B shows for comparison with FIG. 8A the jagged edge that normally occurs when printing an oblique line
  • FIG. 9 shows an alternative lens system to that shown in FIG. 1 that has a folded light path to permit more compact packaging in a printing system.
  • the imaging device will be described herein mainly by reference to its application in digital printing systems however its use is not limited to this application, and different aspects of the invention may be implemented to controllably project image forming light beams onto any surface with relative motion between the surface and the chips.
  • FIG. 1 shows a drum 10 having an outer surface 12 that serves as an imaging surface.
  • the drum rotates clockwise, as represented by an arrow, it passes beneath a coating station 14 where it acquires a monolayer coating of fine particles.
  • the imaging surface 12 passes beneath an imaging device 15 of the present disclosure where selected regions of the imaging surface 12 are exposed to laser radiation which renders the particle coating on the selected regions of the surface 12 tacky.
  • the imaging surface passes through an impression station 19 where a substrate 20 is compressed between the drum 10 and an impression cylinder 22 .
  • the pressure applied at the impression station causes the selected regions of the coating on the imaging surface 12 that have been rendered tacky by exposure to laser radiation by the imaging device 15 in the correspondingly termed imaging station to transfer from the imaging surface 12 to the substrate 20 .
  • tacky as used herein is intended to mean that the irradiated particle coating is not necessarily tacky to the touch but only that it is softened sufficiently to be able to adhere to the surface of a substrate when pressed against it in the impression station 19 .
  • the regions on the imaging surface 12 corresponding to the selected tacky areas transferred to the substrate 20 consequently become exposed, being depleted by the transfer of particles.
  • the imaging surface 12 can then complete its cycle by returning to the coating station 14 where a fresh monolayer particle coating is applied only to the exposed regions from which the previously applied particles were transferred to the substrate 20 in the impression station 19 .
  • a monolayer of particles facilitates the targeted delivery of radiation as emitted by the laser elements of an imaging device according to present teachings. This may ease the control of the imaging device and process, as the selectively irradiated particles reside on a single defined layer.
  • an imaging device targeting a monolayer can preferably focus the laser radiation to form upon transfer to a substrate a dot of approximately even thickness and/or relatively defined contour.
  • the coating station 14 may comprise a plurality of spray heads 1401 that are aligned with each other along the axis of the drum 10 and only one is therefore seen in the section of FIG. 1 .
  • the sprays 1402 of the spray heads are confined within a bell housing 1403 , of which the lower rim 1404 is shaped to conform closely to the imaging surface leaving only a narrow gap between the bell housing 1403 and the drum 10 .
  • the spray heads 1401 are connected to a common supply rail 1405 which supplies to the spray heads 1401 a pressurized fluid carrier (gaseous or liquid) having suspended within it the fine particles to be used in coating the imaging surface 12 .
  • a pressurized fluid carrier gaseous or liquid
  • the imaging device 15 in FIG. 1 is composed of a support 16 carrying an array of chips each having an arrangement of individually controlled laser sources capable of emitting laser beams.
  • the laser beam emitting elements can coherently emit light in a range of wavelengths from about 400 nm to about 12 ⁇ m, or up to about 10 ⁇ m, or up to about 8 ⁇ m, or up to about 3 ⁇ m, or up to about 1.4 ⁇ m.
  • Such ranges includes regions generally known as Near Infra Red (NIR, ⁇ 0.75-1.4 ⁇ m), Short-Wavelength Infra Red (SWIR, ⁇ 1.4-3 ⁇ m), Mid-Wavelength Infra Red (MWIR), also called Intermediate Infra Red (IIR, 3-8 ⁇ m), and Long-Wavelength Infra Red (LWIR, 8-15 ⁇ m), also known as Thermal Infra Red (TIR).
  • the laser beam emitting elements are NIR lasers.
  • the laser sources may by way of example, be of VCSEL (Vertical Cavity Surface Emitting Laser) type, however other types may be utilized.
  • semiconductor lasers commercially available as laser diodes are capable of emitting at wavelengths from 375 nm to 3,500 nm, covering most of NIR and SWIR regions of the spectrum.
  • Gas lasers can emit over various area of the spectrum, depending on the elected gas and some optical design.
  • Commercial carbon dioxide (CO 2 ) lasers for instance, can emit hundreds of watts in the thermal infrared region at 10.6 ⁇ m. While for brevity the term VCSEL is predominantly used herein, it should be construed as encompassing any such laser sources which may be better suited for certain embodiments.
  • Each chip has individually controllable laser beam emitting elements arranged in a two dimensional main array of M rows and N columns (M ⁇ N), the elements in each row having a uniform spacing A r and the elements in each column having a uniform spacing a c .
  • M ⁇ N two dimensional main array of M rows and N columns
  • a r uniform spacing
  • a c uniform spacing
  • at least one additional column may be provided.
  • the chips can be individually or collectively associated with an array of corresponding lenses 18 that focus the laser beams on the imaging surface 12 is also used.
  • FIGS. 2 to 4 provide more details of the chips 30 according to some embodiments of the invention and on the manner in which they can be mounted on the support and aligned with the lenses 18 .
  • FIG. 2 shows a support 16 on which are mounted a plurality of VCSEL chips 30 arranged in two rows in accurately predetermined positions relative to one another, as will be described in more detail by reference to FIGS. 3 and 4 .
  • the support 16 is a rigid, and in some embodiments at least partially hollow elongate body fitted with connectors 34 to allow a cooling fluid to flow through its internal cavity.
  • the body of the support may be made of an electrically insulating material, such as a suitable ceramic, or it may be made of a metal and at least its surface 36 on which the chips 30 are mounted may be coated with an electrical insulator. This enables a circuit board made of thin film conductors (partial and symbolic depiction of the conductors is schematically shown to the lower-right chip at FIG. 2 ) to be formed on the surface 36 .
  • the chips 30 are soldered to contact pads on this circuit board and a connector 32 projecting from the lower edge of the support 16 allows control and power signals to be applied to the chips 30 .
  • the laser emitting elements 40 of each chip 30 are individually addressable and are spaced apart sufficiently widely to minimize thermal interference with one another.
  • the individually controllable laser elements of a chip can emit laser beams having variable energy that is preferably digitally controllable in discrete steps, allowing the laser intensity to be set at discrete levels such as 2, 4, 8, 16. . . and the like, and in some embodiments individual laser beam sources may be controllably set to emit up to 4096 levels or more.
  • the lowermost level of energy is defined as 0, where the individual laser element is not activated, the uppermost level of energy can be defined as 1.
  • the distinct intermediate levels therebetween may be considered analogous in the field of printing to “grey levels”, each level providing for a gradually distinct intensity (e.g., shade when considering a colored output).
  • level 0 would result in lack of impression (e.g., leaving a substrate bare or white if originally so) and level 1 would result in transfer of a tacky film formed by a particle irradiated at maximum energy (e.g., forming a full black dot in the event the particles are so colored).
  • levels 1/16, 2/16, 3/16 and so on would correspond to increasingly stronger shades of grey, comprised between white (0) and black (1).
  • the energy levels are evenly spaced.
  • the individually controllable laser elements of a chip can emit laser beams having variable energy that can be modulated in a continuous analogue manner.
  • each dot resembles the plots shown in FIG. 6 , that is to say that it is symmetrical with tapering sides.
  • the exact profile is not important as the distribution may be Gaussian, sinusoidal or even an inverted V.
  • the peak intensity increases, the base widens and the area of intersection of the profile with a threshold at which the particle coating is rendered tacky also increases in diameter.
  • a consequence of this energy distribution is that points of the imaging surface that are not in alignment with the centerline of any one laser emitting element will receive energy from adjacent elements.
  • FIG. 3 shows schematically, and to a much enlarged scale, the relative positioning of two laser emitting element arrays 130 a and 130 b of chips 30 that are adjacent one another in the Y-direction but are located in different rows.
  • Each of the chips has a main array of M by N laser emitting elements 40 , as previously described, which are represented by circular dots.
  • M and N are equal, there being nine rows and nine columns.
  • the spacing between the elements in a row, designated A r , and the spacing between the elements in a column, designate a c are shown as being different from one another but they may be the same.
  • the array is shown as being slightly skewed so that the columns and rows are not perpendicular to one another.
  • the rows lie parallel to the Y-direction while the columns are at a slight angle to the X-direction.
  • lines such as the lines 44 , traced by the elements 40 on the imaging surface, if energized continuously, to be sufficiently close together to allow high resolution images to be printed.
  • FIG. 3 shows that the element at the end of each row traces a line that is a distance A r /M away from the line traced by the corresponding element of each adjacent row, the separation between these lines being the image resolution I r .
  • the elements lie in a square array where the columns are perpendicular to the rows.
  • the chips would need to be mounted askew on their support and compensation would need to be applied to the timing of the control signals used to energize the individual elements.
  • the positioning of the array 130 b is such that the line traced by its bottom left element 40 should ideally also be spaced from the line traced by the top right element of the array 130 a by a distance equal to A r /M. Therefore when all the elements 40 of both arrays 130 a and 130 b are energized, they will trace 2 ⁇ M ⁇ N lines that will all be evenly spaced apart by a distance A r /M between adjacent lines, without any gaps.
  • the array could include additional rows of laser emitting elements 40 , but it is alternatively possible to compensate for a defective element by increasing the intensity of the laser beams generated by the laser emitting elements that trace the two adjacent parallel lines.
  • each chip has at least one additional column that is arranged along the Y-direction on the side of the main array, the additional column containing at least one laser beam emitting element 42 .
  • These further elements 42 are represented in FIG. 3 by stars, to distinguish them from the main array elements 40 .
  • at least two such additional columns each of one element 42 are provided, at least one column disposed in Y-direction on each side of the main N by M array.
  • the additional laser elements of the additional columns on one or both sides of each main array can be respectively positioned at a distance of 1 ⁇ 2 or 1 ⁇ 3 the spacing between traced lines that can be imaged by the lenses onto the imaging surface.
  • additional elements could be placed in the gap between two arrays that nominally spans a distance of A r /M so that higher sensitivity is achieved in correcting the spacing errors between adjacent arrays.
  • any additional element 42 of an additional column can be positioned in the column at any desired distance from the edge element of the main array, the distance in the Y-direction depending on the total numbers of additional elements/additional columns each two sets of main arrays of a pair of chips to be aligned would bound.
  • each additional element can be spaced from the edge element of the main arrays or from one another in the Y-direction by a distance equal to A r /(n+1), namely the spacing of the adjacent elements in each row divided by one more than the number of additional elements in the gap.
  • the additional elements can either be aligned with a row of elements of their respective main arrays or positioned at any desired intermediate position above or below such rows.
  • the positioning of an additional element 42 with respect to adjacent elements of the main array shall minimize thermal interference.
  • the additional element or elements may be disposed at any position along the X-direction of the chip.
  • n elements 42 positioned in any of the additional columns on one or both sides of the main array can correct for alignment errors of up to about a 1/(n+1) of the nominal spacing between the edge elements of two adjacent chips. If, by way of example, the edge elements of the two chips are at a distance of 20 um (micrometers) in the Y-direction, and there is a single additional laser emitting element on adjacent sides of each array, such elements may correct a spacing error of up to about one third of the nominal spacing, in the exemplified case approximately 7 ⁇ m. Any positional deviation from the desired position on the chip (e.g., with respect to its edges) or nominal distance between elements not exceeding 10%, is considered within tolerances, however in most cases due to the high precision of the semiconductor manufacturing methods, such errors are unlikely.
  • these elements 42 when activated, trace two additional lines 46 between the two sets of evenly spaces parallel lines 44 a and 44 b traced by the elements 40 of the two arrays 130 a and 130 b, respectively.
  • the energies of these two elements can be combined on the imaging surface, as earlier described, to form a single line of which the position is controllable by appropriate setting of the energies emitted by each of the additional elements 42 .
  • FIG. 6 the energy profiles of the lines 44 a and 44 b are designated 94 a and 94 b , respectively and the energy profiles of the additional lines 46 are designated 96 a and 96 b.
  • neither of the profiles 96 a and 96 b has sufficient energy to render the coating particles tacky but at the centerline between the two arrays the cumulative energy, shown as a solid dark line 96 , is sufficient to soften the particles coating and to create a trace line filling the gap between the trace lines 44 a and 44 b of the two main arrays. While in FIG. 6 the energy profiles of the two additional elements are matched, it is possible by varying the relative intensity of the two beams emitted by the additional laser sources to position the centerline of the combined energy at a different distance from the traces of the main arrays.
  • FIG. 7A shows how the ability to create dots that do not fall on the centerlines of the energy profiles of the laser elements can be used to advantage to achieve anti-aliasing.
  • FIG. 7A shows the energy profiles of four adjacent elements of the main array. The first two profiles a and b are set at a desired level, say 8 (out of sixteen), corresponding to mid-grey. The energy profiles c and d, on the other hand are set to say 12 and 4, respectively.
  • the resulting dot pattern produced on the imaging surface is shown in FIG. 7B . This can be seen to comprise two regular sized dots A and B aligned with the line of symmetry of the profiles a and b in FIG. 7A , a larger sized dot C aligned with the centerline of energy profile c, and a smaller dot D that lies somewhere between the centerlines of the profiles c and d.
  • FIG. 8A The result of repeating such a dot pattern diagonally is shown in FIG. 8A .
  • FIG. 8B where no anti-aliasing steps have been taken, it will be seen that the small dots in between regular raster line yield oblique edges that have reduced jaggedness and produce an image that is comparable with one achievable by a printing system having a greater image resolution.
  • the interaction of energies from nearby laser elements can also be used to compensate for missing or inoperative elements in that the elements producing the two adjacent raster lines can be used to combined in the same manner as previously explained to fill in a gap between them.
  • FIG. 4 shows arrays of seven adjacent chips 130 each shown lined up with a respective lens 18 . Additional laser elements 42 , on each side of the main array of each chip, are also schematically illustrated in the figure.
  • Each lens 18 is constructed as a GRIN (Gradient-Index) rod, this being a known type of lens that is shaped as a cylinder having a radially graduated refractive index.
  • GRIN Gradient-Index
  • the respective centers of corresponding elements of any three bi-directionally adjacent chip arrays 130 lie nominally on the apices of an equilateral triangle, three such triangles designated 50 being shown in the drawing. It will be noted that all the triangles 50 are congruent.
  • the diameter of the GRIN rods is now selected to be equal to 2 ⁇ N ⁇ A r , which is the length of the sides of the equilateral triangles 50 , or the distance between corresponding laser emitting elements of adjacent VCSEL chips 30 in the same row, then when stacked in their most compact configurations, after aligning the lens array to the Y-direction over the chips, the lenses 18 will automatically align correctly with their respective chip.
  • the lens 18 has been schematically illustrated in FIG. 1 (side view) and FIG. 4 (cross section view) as being an individual GRIN rod, in alternative embodiments the laser beams of each chip can be transmitted by a series of lenses.
  • the single GRIN rod 18 is replaced by two mutually inclined GRIN rods 18 a and 18 b and the light from one is directed to the other by a reflecting member which in the example of FIG. 9 is embodied by a prism 87 of high refractive index glass, so that the light follows a folded path.
  • a reflecting member which in the example of FIG. 9 is embodied by a prism 87 of high refractive index glass, so that the light follows a folded path.
  • other reflecting members such as mirrors and the like may be utilized.
  • Such a configuration enables coating stations in a colour printing system to be arranged closer to one another in a more compact configuration.
  • the length of the GRIN rods is preferably selected such that light beams are individually collimated on leaving the rods 18 a and entering the rods 18 b as shown by the light rays drawn in FIG. 9 .
  • the radiation guided by GRIN rod 18 a may be captured by the corresponding GRIN rod 18 b which can collect the collimated light emerging from rod 18 a on the same light path and focus it at a distance WD r from the distal end of the second GRIN rod 18 b .
  • Laser elements that are away from the longitudinal axis of the GRIN rod 18 a will leave the distal end of the GRIN lens collimated but at an angle to the axis.
  • the invention take advantage of Snell's law by causing the beam exiting the first rod to travel through a material with a high refractive index, thus causing the angle the collimated beam makes with the optical axis to decrease and enabling a larger separation between the rods 18 a and 18 b before the collimated beams leaving the first rod miss the entrance to the second rod.
  • magnification should be considered substantially equal to its nominal value if within ⁇ 0.5% or even 1% or 2%.
  • each of the verbs, “comprise” “include” and “have”, and conjugates thereof, are used to indicate that the object or objects of the verb are not necessarily a complete listing of members, components, elements, steps or parts of the subject or subjects of the verb.
  • Positional or motional terms such as “upper”, “lower”, “right”, “left”, “bottom”, “below”, “lowered”, “low”, “top”, “above”, “elevated”, “high”, “vertical”, “horizontal”, “backward”, “forward”, “upstream” and “downstream”, as well as grammatical variations thereof, may be used herein for exemplary purposes only, to illustrate the relative positioning, placement or displacement of certain components, to indicate a first and a second component in present illustrations or to do both. Such terms do not necessarily indicate that, for example, a “bottom” component is below a “top” component, as such directions, components or both may be flipped, rotated, moved in space, placed in a diagonal orientation or position, placed horizontally or vertically, or similarly modified.
  • adjectives such as “substantially” and “about” that modify a condition or relationship characteristic of a feature or features of an embodiment of the present technology are to be understood to mean that the condition or characteristic is defined to within tolerances that are acceptable for operation of the embodiment for an application for which it is intended. For instance, each two adjacent elements of the group of elements under consideration (such as by way of example of a chip row, of a chip column, or of adjacent chip arrays, when applicable) are considered “substantially uniformly spaced” if the deviation of each pair of adjacent elements from a desired nominal distance does not exceed 10% of this predetermined spacing.
  • Pairs of adjacent elements deviating from the nominal distance by less than 5%, 4%, 3%, 2% or 1% are further considered “substantially uniformly spaced” or “having a substantially uniform spacing”.
  • a r 20 micrometers
  • the desired nominal spacing in the Y-direction between corresponding main array laser emitting elements in two adjacent chips equals A r ⁇ N
  • spacing deviations resulting from manufacturing tolerance of no more than 2 ⁇ m are considered to fall within the nominal spacing.
  • smaller or no deviations are desired.

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190075283A1 (en) * 2015-12-09 2019-03-07 Titan Medical Inc. Stereoscopic imaging sensor apparatus and method for fabricating pairs of image sensors used in stereoscopic imaging
US10591822B2 (en) 2015-05-27 2020-03-17 Landa Labs (2012) Ltd. Imaging device
US10751750B2 (en) 2015-05-27 2020-08-25 Actega Metal Print Gmbh Coating apparatus with donor surface, application device, and surplus extraction system
JP2020529940A (ja) * 2017-08-08 2020-10-15 ランダ ラブズ （２０１２） リミテッド 印刷システム及びその書込みモジュール
US10815360B2 (en) 2016-11-30 2020-10-27 Landa Labs (2012) Ltd. Thermal conduction transfer printing
US20220266392A1 (en) * 2021-02-25 2022-08-25 Ricoh Company, Ltd. Marking device, medium, container, and marking method
US11701684B2 (en) 2015-05-27 2023-07-18 Landa Labs (2012) Ltd. Method for coating a surface with a transferable layer of thermoplastic particles and related apparatus

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2574439B (en) 2018-06-06 2020-06-10 Landa Labs 2012 Ltd Thermal transfer printing system and method
JP7205266B2 (ja) * 2019-02-05 2023-01-17 コニカミノルタ株式会社 光書き込み装置および画像形成装置
GB2594052A (en) * 2020-04-07 2021-10-20 Landa Labs 2012 Ltd Apparatus for coating a surface with particles
JP2022096964A (ja) * 2020-12-18 2022-06-30 キヤノン株式会社 画像形成装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4435064A (en) * 1980-06-28 1984-03-06 Ricoh Co., Ltd. Optical exposure unit for electrophotographic printing device
US5568320A (en) * 1994-11-30 1996-10-22 Xerox Corporation Multiple row lens array alignable with multiple row image bar
US20020015033A1 (en) * 2000-07-28 2002-02-07 Kim Hak Su Driving circuit for organic elecctroluminescence device
US20090141114A1 (en) * 2007-11-30 2009-06-04 Seiko Epson Corporation Line Head and an Image Forming Apparatus Using the Line Head

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US61200A (en) * 1867-01-15 Improvement in filteeufg, evaporating, and gbanijlating saoohaeine liquids
BE567069A (ja) 1957-04-25
JPS5557801A (en) * 1978-10-25 1980-04-30 Ricoh Co Ltd Optical system using focusing type optical transmission body array
DE2851008A1 (de) 1978-11-24 1980-05-29 Bhs Bayerische Berg Vorrichtung zum dosieren des leimauftrages auf eine laufende bahn, insbesondere wellpappenbahn
JPS5726874A (en) * 1980-07-24 1982-02-13 Ricoh Co Ltd Electrophotographic type printer device
JPS60245589A (ja) 1984-05-22 1985-12-05 Takeshi Kojima 粒径が異る微小粒子のコ−テイング方法
JPS6168253A (ja) 1984-09-12 1986-04-08 Fuji Xerox Co Ltd インクジエツト記録装置
JPS6213635U (ja) * 1985-07-12 1987-01-27
JPS6299166A (ja) * 1985-10-26 1987-05-08 Ricoh Co Ltd 光書込みヘツド
US5084714A (en) * 1990-11-28 1992-01-28 Eastman Kodak Company Narrow led printheads and gradient index lens array for use therewith
US5973709A (en) * 1992-06-24 1999-10-26 Oki Electric Industry Co., Ltd. Printer and process for printing different size dots by setting drive energies based on adjacent data bit logic
US5751327A (en) * 1993-06-18 1998-05-12 Xeikon N.V. Printer including temperature controlled LED recording heads
US5450157A (en) * 1993-12-06 1995-09-12 Xerox Corporation Imaging system using a gradient index lens array with improved depth of focus
US6469728B1 (en) * 1995-12-18 2002-10-22 Xerox Corporation LED printbars with depth of focus enhancement
DE19707157B4 (de) 1997-02-22 2006-04-06 Weitmann & Konrad Gmbh & Co Kg Vorrichtung zum Bestäuben von bewegten flächigen Produkten
JPH11188921A (ja) 1997-12-25 1999-07-13 Brother Ind Ltd 露光装置
US6623816B1 (en) 1998-11-18 2003-09-23 Ricoh Company, Ltd. Recording method and apparatus with an intermediate transfer medium based on transfer-type recording mechanism
RU2169977C2 (ru) * 1999-08-16 2001-06-27 ЗАО "Энергомаштехника" Теплообменник для мощных полупроводниковых лазеров
US6569494B1 (en) 2000-05-09 2003-05-27 3M Innovative Properties Company Method and apparatus for making particle-embedded webs
GB0017789D0 (en) * 2000-07-21 2000-09-06 Xeikon Nv Electrophotographic image reproduction system
US6660326B2 (en) 2000-08-04 2003-12-09 Tomoegawa Paper Co. Ltd. Production method for monolayer powder film and production apparatus therefor
JP2002254696A (ja) 2001-03-02 2002-09-11 Dainippon Screen Mfg Co Ltd Ｌｅｄ露光ヘッド装置
EP1243428A1 (en) * 2001-03-20 2002-09-25 The Technology Partnership Public Limited Company Led print head for electrophotographic printer
JP3897292B2 (ja) 2002-06-27 2007-03-22 株式会社リコー 画像形成装置
JP4023258B2 (ja) 2002-08-30 2007-12-19 コニカミノルタホールディングス株式会社 インクジェット記録用紙の製造方法及び製造装置
US7002613B2 (en) * 2002-09-06 2006-02-21 Heidelberger Druckmaschinen Ag Method for printing an image on a printing substrate and device for inputting energy to a printing-ink carrier
US20050151828A1 (en) * 2004-01-14 2005-07-14 Xerox Corporation. Xerographic printing system with VCSEL-micro-optic laser printbar
JP4617731B2 (ja) 2004-06-16 2011-01-26 富士ゼロックス株式会社 画像形成装置
JP2006086192A (ja) * 2004-09-14 2006-03-30 Sumitomo Electric Ind Ltd 発光装置
US7061581B1 (en) * 2004-11-22 2006-06-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006186192A (ja) 2004-12-28 2006-07-13 Sanyo Electric Co Ltd 半導体装置及びその製造方法
JP2006276806A (ja) 2005-03-03 2006-10-12 Ricoh Co Ltd 静電潜像担持体、並びに、これを用いた画像形成方法、画像形成装置、及びプロセスカートリッジ
JP2006263537A (ja) 2005-03-23 2006-10-05 Konica Minolta Photo Imaging Inc 表面層のスプレー塗布方法、表面層塗布用のスプレー塗布装置、インクジェット記録用紙
KR20060130980A (ko) * 2005-06-14 2006-12-20 삼성전자주식회사 화상형성장치 및 광주사장치
JP4059518B2 (ja) 2006-01-31 2008-03-12 キヤノン株式会社 電子写真感光体の製造方法
JP2008074052A (ja) * 2006-09-25 2008-04-03 Seiko Epson Corp ラインヘッド及びラインヘッドを用いた画像形成装置
JP5144243B2 (ja) 2006-12-28 2013-02-13 富士フイルム株式会社 画像形成方法及び画像形成装置
JP2008173889A (ja) * 2007-01-19 2008-07-31 Seiko Epson Corp ラインヘッド及び該ラインヘッドを用いた画像形成装置
JP2008194897A (ja) 2007-02-09 2008-08-28 Casio Comput Co Ltd 発光装置及び印刷装置
US7995085B2 (en) 2007-07-04 2011-08-09 Seiko Epson Corporation Line head, and an image forming apparatus using the line head
JP5256792B2 (ja) * 2007-07-04 2013-08-07 セイコーエプソン株式会社 ラインヘッド及び該ラインヘッドを用いた画像形成装置
JP2009056795A (ja) * 2007-08-07 2009-03-19 Seiko Epson Corp 画像形成装置及び画像形成方法、露光ヘッド
KR101110636B1 (ko) * 2007-09-04 2012-02-15 삼성전자주식회사 화상형성장치 및 그 제어방법
EP2036734B1 (en) * 2007-09-14 2010-12-29 Punch Graphix International N.V. Light emitting array for printing or copying
JP2009149051A (ja) * 2007-11-30 2009-07-09 Seiko Epson Corp ラインヘッドおよび該ラインヘッドを用いた画像形成装置
JP2009132039A (ja) * 2007-11-30 2009-06-18 Seiko Epson Corp 発光装置および電子機器
US7942547B2 (en) * 2007-12-07 2011-05-17 Seiko Epson Corporation Light emitting device and electronic apparatus
JP2009158477A (ja) * 2007-12-07 2009-07-16 Seiko Epson Corp 発光装置および電子機器
JP2010076388A (ja) * 2008-09-29 2010-04-08 Seiko Epson Corp 画像形成装置および画像形成方法
US8363082B2 (en) * 2009-08-11 2013-01-29 Conexant Systems, Inc. Systems and methods for alignment of laser printers
JP5866887B2 (ja) * 2011-01-27 2016-02-24 富士ゼロックス株式会社 発光素子ヘッドおよび画像形成装置
JP5880149B2 (ja) 2012-03-07 2016-03-08 セイコーエプソン株式会社 記録物の製造方法および記録物の製造装置
WO2013191535A1 (en) 2012-05-24 2013-12-27 Selmers Holding Bv Apparatus for powder coating of a surface, more in particular for powder coating of the surface of a steel pipe
US8840238B2 (en) 2012-08-30 2014-09-23 Xerox Corporation Systems and methods for ink-based digital printing using imaging member and image transfer member
US9174432B2 (en) 2012-12-17 2015-11-03 Xerox Corporation Wetting enhancement coating on intermediate transfer member (ITM) for aqueous inkjet intermediate transfer architecture
JP6310560B2 (ja) * 2013-12-17 2018-04-11 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． レーザ印刷システム
WO2016189512A1 (en) 2015-05-27 2016-12-01 Landa Labs (2012) Ltd Printing method and apparatus for coating selected regions of a substrate with a film
CA2986370C (en) 2015-05-27 2022-11-01 Landa Labs (2012) Ltd. Imaging device
GB201509080D0 (en) 2015-05-27 2015-07-08 Landa Labs 2012 Ltd Coating apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4435064A (en) * 1980-06-28 1984-03-06 Ricoh Co., Ltd. Optical exposure unit for electrophotographic printing device
US5568320A (en) * 1994-11-30 1996-10-22 Xerox Corporation Multiple row lens array alignable with multiple row image bar
US20020015033A1 (en) * 2000-07-28 2002-02-07 Kim Hak Su Driving circuit for organic elecctroluminescence device
US20090141114A1 (en) * 2007-11-30 2009-06-04 Seiko Epson Corporation Line Head and an Image Forming Apparatus Using the Line Head

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11679408B2 (en) 2015-05-27 2023-06-20 Actega Metal Print Gmbh Printing system and method
US10591822B2 (en) 2015-05-27 2020-03-17 Landa Labs (2012) Ltd. Imaging device
US10751750B2 (en) 2015-05-27 2020-08-25 Actega Metal Print Gmbh Coating apparatus with donor surface, application device, and surplus extraction system
US10906064B2 (en) 2015-05-27 2021-02-02 Actega Metal Print Gmbh Printing system and method
US10960432B2 (en) 2015-05-27 2021-03-30 Landa Labs (2012) Ltd. Apparatus for coating a surface with a transferable layer of thermoplastic particles, and related methods
US10981191B2 (en) 2015-05-27 2021-04-20 Actega Metal Print Gmbh Metal printed constructions
US11701684B2 (en) 2015-05-27 2023-07-18 Landa Labs (2012) Ltd. Method for coating a surface with a transferable layer of thermoplastic particles and related apparatus
US10805596B2 (en) * 2015-12-09 2020-10-13 Titan Medical Inc. Stereoscopic imaging sensor apparatus and method for fabricating pairs of image sensors used in stereoscopic imaging
US20190075283A1 (en) * 2015-12-09 2019-03-07 Titan Medical Inc. Stereoscopic imaging sensor apparatus and method for fabricating pairs of image sensors used in stereoscopic imaging
US10815360B2 (en) 2016-11-30 2020-10-27 Landa Labs (2012) Ltd. Thermal conduction transfer printing
US10913835B2 (en) 2016-11-30 2021-02-09 Landa Labs (2012) Ltd. Thermal transfer printing
US11104779B2 (en) 2016-11-30 2021-08-31 Landa Labs (2012) Ltd. Thermal transfer printing
JP2020529940A (ja) * 2017-08-08 2020-10-15 ランダ ラブズ （２０１２） リミテッド 印刷システム及びその書込みモジュール
JP2022188090A (ja) * 2017-08-08 2022-12-20 ランダ ラブズ （２０１２） リミテッド 印刷システム及びその書込みモジュール
US11865782B2 (en) 2017-08-08 2024-01-09 Landa Labs (2012) Ltd. Printing system and writing module thereof
US20220266392A1 (en) * 2021-02-25 2022-08-25 Ricoh Company, Ltd. Marking device, medium, container, and marking method
US11738408B2 (en) * 2021-02-25 2023-08-29 Ricoh Company, Ltd. Marking device, medium, container, and marking method

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JP2021092796A (ja) 2021-06-17
CN107667317A (zh) 2018-02-06
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RU2017138078A (ru) 2019-06-27
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IL255931B (en) 2021-10-31

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