US20130153644A1 - Electronic component mounting apparatus and method - Google Patents

Electronic component mounting apparatus and method Download PDF

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Publication number
US20130153644A1
US20130153644A1 US13/691,976 US201213691976A US2013153644A1 US 20130153644 A1 US20130153644 A1 US 20130153644A1 US 201213691976 A US201213691976 A US 201213691976A US 2013153644 A1 US2013153644 A1 US 2013153644A1
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United States
Prior art keywords
substrate
bonding tool
electronic component
reference position
drive unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/691,976
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English (en)
Inventor
Koji Hojo
Makoto Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
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Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Assigned to SHINKAWA LTD. reassignment SHINKAWA LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HOJO, KOJI, TAKAHASHI, MAKOTO
Publication of US20130153644A1 publication Critical patent/US20130153644A1/en
Priority to US14/871,622 priority Critical patent/US9603262B2/en
Abandoned legal-status Critical Current

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Definitions

  • the present invention relates to a structure of an electronic component mounting apparatus for mounting an electronic component on a substrate or the like, and also to a method therefor.
  • thermal bonding There are many techniques used for mounting an electronic component with a solder bump formed on an electrode on a substrate through thermal bonding.
  • the electronic component is pressed against the substrate using a bonding tool and heated to melt the solder bump for solder bond onto an electrode of the substrate.
  • continuous pressing after melting the solder bump can squash and deform the melted solder.
  • the position of the thermal bonding tool is fixed before melting the solder bump.
  • the thermal bonding tool may be fixed, there is still deformation due to loading in a load cell for detecting a pressing force. Upon release of this residual deformation, the thermal bonding tool can move downward to squash and deform the melted solder bump.
  • gold-solder fusion bond has recently and frequently being used in which a gold bump is formed on an electrode of an electronic component, while a thin solder film is provided on the surface of a copper electrode of a substrate, and the gold bump and the solder are thermally fused and bonded.
  • the film formed on the surface of the substrate electrode has a small thickness of 10 to 30 ⁇ m.
  • loading on the electronic component and/or the gold bump before raising the thermal bonding tool can damage the electronic component, and/or the contact between the gold bump and the copper electrode can cause the gold bump to be deformed and come into contact with an adjacent gold bump, resulting in poor bonding quality.
  • the present invention is directed to an electronic component mounting apparatus for mounting an electronic component on a substrate by bonding an electrode of the electronic component and an electrode of the substrate with thermally fusible bond metal
  • the apparatus including: a bonding tool for thermally bonding the electronic component onto the substrate, the bonding tool to be driven in a direction getting close to and away from the substrate; a drive unit for driving the bonding tool in the direction getting close to and away from the substrate; a position detection unit for detecting the position of the bonding tool in the direction getting close to and away from the substrate; and a control unit for changing the position of the bonding tool in the direction getting close to and away from the substrate with the drive unit, in which the control unit includes bonding tool position holding means for holding the position of the bonding tool in the direction getting close to and away from the substrate based on the determination that the bond metal between the electrode of the electronic component and the electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a predetermined distance from a reference position while heating the electronic component.
  • the electronic component includes a bump formed on the electrode and the substrate includes a film of the bond metal formed on the electrode
  • the control unit further includes: contact detecting means for determining whether or not the bump and the film are in contact with each other based on a signal from the position detection unit; and reference position setting means for setting the position of the bonding tool with respect to the substrate as the reference position when the contact detecting means determines that the bump and the film are in contact with each other.
  • control unit further includes: second reference position setting means for setting the position of the bonding tool with respect to the substrate as a second reference position after the reference position setting means sets the reference position and when the distance of the bonding tool from the substrate in the direction getting close to and away from the substrate changes from increasing to decreasing; and second bonding tool position holding means for holding the position of the bonding tool in the direction getting close to and away from the substrate based on the determination that the bond metal between the electrode of the electronic component and the electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a second predetermined distance from the second reference position while heating the electronic component.
  • the present invention is also directed to an electronic component mounting method for mounting an electronic component on a substrate by bonding an electrode of the electronic component and an electrode of the substrate with thermally fusible bond metal, the method including: preparing an electronic component mounting apparatus including a bonding tool for thermally bonding the electronic component onto the substrate, the bonding tool to be driven in a direction getting close to and away from the substrate, a drive unit for driving the bonding tool in the direction getting close to and away from the substrate, and a position detection unit for detecting the position of the bonding tool in the direction getting close to and away from the substrate; and holding the position of the bonding tool in the direction getting close to and away from the substrate based on the determination that the bond metal between the electrode of the electronic component and the electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a predetermined distance from a reference position while heating the electronic component.
  • the electronic component includes a bump formed on the electrode and the substrate includes a film of the bond metal formed on the electrode, and the method further includes: determining whether or not the bump and the film are in contact with each other based on a signal from the position detection unit; and setting the position of the bonding tool with respect to the substrate as the reference position when it is determined in the step of determining that the bump and the film are in contact with each other.
  • the method further includes: setting the position of the bonding tool with respect to the substrate as a second reference position after the reference position is set in the step of setting and when the distance of the bonding tool from the substrate in the direction getting close to and away from the substrate changes from increasing to decreasing; and holding the position of the bonding tool in the direction getting close to and away from the substrate based on the determination that the bond metal between the electrode of the electronic component and the electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a second predetermined distance from the second reference position while heating the electronic component.
  • the present invention offers the advantage of improving the quality of bonding in an electronic component mounting apparatus for bonding an electronic component and a substrate with thermally fusible bond metal.
  • FIG. 1 is a system diagram showing the configuration of an electronic component mounting apparatus according to an exemplary embodiment of the present invention.
  • FIG. 2 is an illustrative view showing an electronic component and a substrate set in the electronic component mounting apparatus according to the exemplary embodiment of the present invention.
  • FIG. 3 is a schematic view showing a linear scale used in the electronic component mounting apparatus according to the exemplary embodiment of the present invention.
  • FIG. 4 is a flowchart showing an operation of the electronic component mounting apparatus according to the exemplary embodiment of the present invention.
  • FIG. 5 is an illustrative view showing the change in the position of a bonding tool, the pressing force, and the temperature of a solder layer during an operation of the electronic component mounting apparatus according to the exemplary embodiment of the present invention.
  • FIG. 6 is an illustrative view showing a process of gold-solder fusion bond between a gold bump and a solder film performed by the electronic component mounting apparatus according to the exemplary embodiment of the present invention.
  • an electronic component mounting apparatus 100 is configured to include a base 10 , a frame 11 extending upward from the base 10 , an upper flange 12 extending from an upper portion of the frame 11 , a guide 14 provided vertically on a side surface of the frame 11 , a slider 16 attached vertically slidably to the guide 14 , a rise-and-fall block 15 fixed to the slider 16 to be movable vertically with the slider 16 , a nut 17 fixed to the rise-and-fall block 15 , a feed screw 18 to be screwed into the nut 17 , a motor 13 fixed to the upper flange 12 and configured to turn the feed screw 18 , a voice coil motor 20 attached to a lower portion of the rise-and-fall block 15 , a rod 26 to be moved vertically by the voice coil motor 20 , a ceramic heater 27 attached at a leading end of the rod 26
  • the voice coil motor 20 is configured to include a casing 21 , a permanent magnet stator 22 fixed along the inner periphery of the casing 21 , and a movable coil 23 arranged inside the stator 22 .
  • the rod 26 is attached to the casing 21 via a plate spring 25 .
  • an L-shaped linear scale 61 with a finely-scaled vertical portion is fixed to the rod 26 .
  • a linear scale head 62 for reading a pattern on the linear scale 61 is attached to the outer surface of the casing 21 in a manner facing toward the linear scale 61 .
  • the linear scale 61 and the linear scale head 62 constitute a position detection unit for detecting the position of the bonding tool 28 in the height direction.
  • the coil 23 of the voice coil motor 20 is supplied with driving power from a power source 19 .
  • the bonding stage 41 incorporates a stage heater 48 for heating the substrate 42 sucked and fixed on the bonding stage 41 .
  • the control unit 50 is a computer incorporating a CPU 51 for signal processing and a memory 52 .
  • the memory 52 stores a bonding program 53 for bonding control, control data 58 , a reference position setting program 54 , a bonding tool position holding program 55 , a second reference position setting program 56 , a second bonding tool position holding program 57 , and a contact detecting program 59 .
  • the motor 13 is connected to the control unit 50 and arranged such that the direction and angle of rotation are controlled with a command from the control unit 50 .
  • the power source 19 is also connected to the control unit 50 and arranged such that the current and voltage output to the coil 23 are altered with a command from the control unit 50 .
  • the ceramic heater 27 and the stage heater 48 are also connected to the control unit 50 and arranged such that the heating state is controlled with a command from the control unit 50 .
  • the electronic component 31 which is sucked upside down at the leading end of the bonding tool 28 , has multiple electrodes 32 provided on the surface thereof, and each gold bump 33 is formed on each of the electrodes 32 .
  • Each gold bump 33 has a disk-shaped base portion 34 on the side of the electrode 32 and a conical convex portion 35 protruding from the base portion 34 .
  • the substrate 42 which is sucked and fixed on the bonding stage 41 , has copper electrodes 43 formed on the surface thereof, and a solder film 44 is formed on each of the copper electrodes 43 .
  • the solder film 44 has a very small thickness of about 10 to 30 ⁇ m.
  • the electrode 32 , the gold bump 33 , and the copper electrode 43 of the substrate are arranged in a manner facing toward each other.
  • the linear scale 61 includes a linear scale main body 61 a on which a pattern 61 b with a very fine pitch L is provided.
  • the linear scale head 62 incorporates a light source for delivering light to the pattern 61 b on the linear scale 61 , a grating through which the light from the light source passes, a light-receiving device for detecting light reflected from the pattern 61 b on the linear scale 61 , and a signal processing unit for processing a signal input from the light-receiving device.
  • the linear scale 61 moves relatively to the linear scale head 62 in the longitudinal direction of the pattern 61 b, the interference fringe also moves and thereby the light-receiving device outputs a sine-wave signal with a period equal to or half the pitch L of the pattern 61 b.
  • the sine-wave signal is a biphasic sine wave with 90-degree mutually shifted phases.
  • the linear scale head 62 instructs the signal processing unit to output an amount of relative movement of the linear scale 61 to the linear scale head 62 based on the output difference of the biphasic sine wave.
  • the detection accuracy of the amount of movement is about 1 nm if the pitch L of the pattern 61 b is several micrometers, for example.
  • the control unit 50 starts a lowering operation of lowering the bonding tool from an initial height H 0 as shown in step S 101 of FIG. 4 and the time interval from t 1 to t 2 of FIG. 5 .
  • This lowering operation is performed by rotating the motor 13 shown in FIG.
  • the control unit 50 detects a lowered position based on the angle of rotation of the motor 13 and, as shown in step S 102 of FIG. 4 , determines whether or not the bonding tool is lowered to a predetermined height H 1 shown in FIG. 5 .
  • the bonding tool is lowered to the height H 1 , the gold bump 33 comes very close to the solder film 44 and the copper electrode 43 as shown in FIG. 6( a ), yet there is still a gap between the convex portion 35 of the gold bump 33 and the solder film 44 .
  • control unit 50 if determines that the bonding tool is lowered to the predetermined height H 1 , stops the motor 13 and therefore the lowering operation and then, as shown in step S 103 of FIG. 4 , starts a search operation of detecting a position where the leading end of the gold bump 33 shown in FIG. 2 comes into contact with the solder film 44 on the copper electrode 43 of the substrate 42 .
  • this search operation the bonding tool 28 is lowered slowly until the leading end of the convex portion 35 of the gold bump 33 comes into contact with the surface of the solder film 44 as shown in the time interval from t 2 to t 3 of FIG. 5 .
  • This operation is performed by, for example, changing the current through the coil 23 of the voice coil motor 20 as follows.
  • the power source 19 applies a current to the coil 23 of the voice coil motor 20 based on the command value for position lowering. Accordingly, the coil 23 moves downward, so that the leading end 24 of the coil comes into contact with the upper end of the rod 26 . Since the rod 26 is attached to the casing 21 via the plate spring 25 , when an increased current flows through the coil 23 to result in that the leading end 24 of the coil 23 presses down the rod 26 and the plate spring 25 undergoes a deflection according to the pressing force, the rod 26 moves downward and thereby the leading end of the bonding tool 28 is lowered slowly.
  • the control unit 50 obtains the lowered position of the bonding tool 28 based on the change in the signal detected by the linear scale head 62 and feeds back the command value for position lowering to adjust the current output from the power source.
  • the control unit 50 can thus perform a search operation of gradually increasing the current through the coil 23 to lower the leading end of the bonding tool 28 slowly.
  • the control unit 50 uses contact detecting means to monitor if the leading end of the convex portion 35 of the gold bump 33 is in contact with the surface of the solder film 44 as shown in step S 104 of FIG. 4 .
  • the coil 23 stops moving downward and there starts to appear a difference between the lowered position detected by the linear scale head 62 and the command value for position lowering during the search operation.
  • the control unit 50 determines that the leading end of the convex portion 35 of the gold bump 33 comes into contact with the solder film 44 (contact detecting step). It is noted that since the vertical position of the linear scale 61 is adjusted such that the longitudinal center of the pattern 61 b comes directly in front of the linear scale head 62 when the leading end of the convex portion 35 of the gold bump 33 comes into contact with the solder film 44 , the linear scale head 62 can measure the amount of vertical movement centering on the point at which the leading end of the convex portion 35 of the gold bump 33 comes into contact with the solder film 44 .
  • the control unit 50 determines that the leading end of the convex portion 35 of the gold bump 33 comes into contact with the solder film 44 , determines that the bonding tool 28 reaches a reference height H 2 and sets the height H 2 detected by the linear scale head 62 as a reference height (reference position) of the bonding tool 28 as shown in step S 105 of FIG. 4 and the time t 3 of FIG. 5 (reference position setting step).
  • FIG. 6( b ) shows a state where the leading end of the convex portion 35 of the gold bump 33 comes into contact with the solder film 44 .
  • the control unit 50 After setting the reference height, the control unit 50 performs a constant loading operation in which the bonding tool 28 presses down the substrate 42 at a constant pressing force as shown in step S 106 of FIG. 4 .
  • an approximately constant current can flow through the coil 23 of the voice coil motor 20 , for example, so that the leading end 24 of the coil 23 presses down the rod 26 at a constant force.
  • a sensor for detecting a pressing force at which the bonding tool 28 presses down the substrate 42 can be provided and the current through the coil 23 can be controlled to change such that the pressing force detected by the sensor represents a constant value, as mentioned above.
  • the control unit 50 takes difference between the amount of vertical movement detected by the linear scale head 62 and the reference height H 2 to calculate the distance by which the bonding tool 28 comes close to the substrate 42 from the height H 2 (reference height) when the leading end of the convex portion 35 of the gold bump 33 comes into contact with the solder film 44 , that is, the distance of downward movement from the reference height H 2 as a sink D.
  • the control unit 50 then starts to monitor if the sink D exceeds a predetermined threshold value as shown in step S 108 of FIG. 4 .
  • the solder film 44 is heated by the stage heater 48 shown in FIG. 1 to have the same temperature T 0 as the substrate 42 .
  • the electronic component 31 is heated to a high temperature by the ceramic heater 27 disposed on the bonding tool 28 . Accordingly, when the leading end of the convex portion 35 of the gold bump 33 comes into contact with the solder film 44 at the time t 3 of FIG. 5 , heat starts to transfer from the leading end of the convex portion 35 of the gold bump 33 to the solder film 44 .
  • the temperature of the solder film 44 then starts to rise at the time t 4 of FIG. 5 .
  • the temperature of the copper electrode 43 also rises accordingly to result in that the copper electrode 43 and the solder film 44 undergo thermal expansion. Since the pressing force is constant during this time interval, the bonding tool 28 is raised gradually from the reference height H 2 when the leading end of the gold bump 33 comes into contact with the solder film 44 , and finally reaches a height H 3 at the time t 5 .
  • the bonding tool 28 is controlled to have a constant pressing force, which causes the convex portion 35 of the gold bump 33 to sink into the fused solder film 44 as shown in FIG. 6( c ). That is, the height of the bonding tool 28 changes from increasing to decreasing at the time t 5 and height H 3 shown in FIG. 5 . The lowered convex portion 35 is then surrounded by the fused solder 45 .
  • the height of the bonding tool 28 is made lower than the reference height H 2 , that is, the sink D, the amount of downward movement from the reference height H 2 , becomes positive.
  • the solder film 44 exists at a thickness of several micrometers between the leading end of the convex portion 35 of the gold bump 33 and the copper electrode 43 of the substrate 42 as shown in FIG. 6( c ).
  • the control unit 50 stops the constant loading control based on the determination that the solder film 44 is thermally fused and then starts a bonding tool position holding operation of holding the height H 4 of the bonding tool 28 at the time t 6 as shown in step S 109 of FIG. 4 .
  • the current through the coil 23 of the voice coil motor 20 can be changed by the difference between the amount of vertical movement detected by the linear scale head 62 , so that the bonding tool 28 is at the height H 4 and the reference height H 2 becomes equal to or smaller than a predetermined threshold value.
  • the solder film 44 has a thickness of 10 to 30 ⁇ m, measuring and controlling the vertical position of the bonding tool 28 using the linear scale head 62 in the order of about 1 nm allows the solder film 44 to exist stably at a thickness of several micrometers between the leading end of the convex portion 35 of the gold bump 33 and the copper electrode 43 of the substrate 42 as shown in FIG. 6( c ).
  • the control unit 50 starts a cooling operation, as shown in step S 110 of FIG. 4 , at the start of the bonding tool position holding operation.
  • the ceramic heater 27 heating the bonding tool 28 is turned off and cooled with supplied cooling air, for example, to cool the bonding tool 28 and the electronic component 31 sucked at the leading end thereof together with the ceramic heater 27 .
  • This causes the solder 45 to be cooled while the solder film 44 still exists stably at a thickness of several micrometers between the leading end of the convex portion 35 of the gold bump 33 and the copper electrode 43 of the substrate 42 as shown in FIG. 6( c ).
  • the solder 45 starts to be solidified to be bond metal 46 with the solder film 44 existing at a thickness of several micrometers between the leading end of the convex portion 35 of the gold bump 33 and the copper electrode of the substrate 42 as shown in FIG. 6( d ).
  • the control unit 50 determines that the cooling operation is completed as shown in step S 111 of FIG. 4 and releases the electronic component 31 sucked on the bonding tool 28 , and then raises the bonding tool 28 to the initial height H 0 by rotating the motor 13 and thereby turning the feed screw 18 as shown in step S 112 of FIG. 4 to complete the bonding of the electronic component 31 .
  • the bonding tool 28 can be held at a height after a small sink D due to solder fusion. This allows the solder to be solidified and the electronic component 31 to be mounted with the leading end of the convex portion 35 of the gold bump 33 existing within the thin solder film 44 without being in contact with the copper electrode 43 of the substrate 42 .
  • the exemplary embodiment above describes the case of setting the height when the leading end of the convex portion 35 of the gold bump 33 comes into contact with the solder film 44 as a reference height H 2 of the bonding tool 28
  • the height H 3 at the time t 5 of FIG. 5 that the height of the bonding tool 28 changes from increasing to decreasing after the leading end of the convex portion 35 of the gold bump 33 comes into contact with the solder film 44 can be set as a second reference height (second reference position setting step).

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
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KR20130005303A (ko) 2013-01-15
US9603262B2 (en) 2017-03-21
US20160029494A1 (en) 2016-01-28
TWI489571B (zh) 2015-06-21
JP4880055B2 (ja) 2012-02-22
JP2011254032A (ja) 2011-12-15
CN102918936A (zh) 2013-02-06
CN102918936B (zh) 2015-11-25
SG185817A1 (en) 2013-01-30
TW201205701A (en) 2012-02-01
KR101331548B1 (ko) 2013-11-20

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