US20110279974A1 - Display device and electronic apparatus - Google Patents

Display device and electronic apparatus Download PDF

Info

Publication number
US20110279974A1
US20110279974A1 US13/040,721 US201113040721A US2011279974A1 US 20110279974 A1 US20110279974 A1 US 20110279974A1 US 201113040721 A US201113040721 A US 201113040721A US 2011279974 A1 US2011279974 A1 US 2011279974A1
Authority
US
United States
Prior art keywords
housing
cooling fan
chamber
circuit board
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/040,721
Other languages
English (en)
Inventor
Nobuto Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUJIWARA, NOBUTO
Publication of US20110279974A1 publication Critical patent/US20110279974A1/en
Priority to US13/770,990 priority Critical patent/US9098234B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/64—Constructional details of receivers, e.g. cabinets or dust covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components

Definitions

  • Embodiments described herein relate generally to a display device and an electronic apparatus including a cooling fan.
  • Some display devices and electronic apparatuses include cooling fans.
  • FIG. 1 is an exemplary perspective view illustrating an electronic apparatus according to a first embodiment
  • FIG. 2 is an exemplary plan view illustrating a lower wall of the electronic apparatus shown in FIG. 1 ;
  • FIG. 3 is an exemplary perspective view illustrating the lower wall and a circumferential wall of the electronic apparatus shown in FIG. 1 ;
  • FIG. 4 is an exemplary plan view illustrating the inside of the electronic apparatus shown in FIG. 1 ;
  • FIG. 5 is an exemplary perspective view illustrating the inside of the electronic apparatus shown in FIG. 1 ;
  • FIG. 6 is an exemplary plan view illustrating the inside of the electronic apparatus shown in FIG. 1 with some sealing members removed;
  • FIG. 7 is an exemplary plan view illustrating a wiring pattern of a circuit board shown in FIG. 6 ;
  • FIG. 8 is an exemplary plan view illustrating the inside of the electronic apparatus shown in FIG. 1 ;
  • FIG. 9 is an exemplary cross-sectional view illustrating the electronic apparatus taken along the line F 9 -F 9 of FIG. 8 ;
  • FIG. 10 is an exemplary cross-sectional view illustrating the electronic apparatus taken along the line F 10 -F 10 of FIG. 8 ;
  • FIG. 11 is an exemplary cross-sectional view illustrating the electronic apparatus taken along the line F 11 -F 11 of FIG. 8 ;
  • FIG. 12 is an exemplary cross-sectional view schematically illustrating the inside of the electronic apparatus shown in FIG. 8 ;
  • FIG. 13 is an exemplary cross-sectional view schematically illustrating the inside of the electronic apparatus taken along the line F 13 -F 13 of FIG. 12 ;
  • FIG. 14 is an exemplary cross-sectional view schematically illustrating a duct structure of the electronic apparatus shown in FIG. 8 ;
  • FIG. 15 is an exemplary cross-sectional view illustrating an electronic apparatus according to a second embodiment.
  • FIG. 16 is an exemplary perspective view illustrating a display device according to a third embodiment.
  • an electronic apparatus comprises a housing, a cooling fan in the housing comprising an intake and a discharge hole, and a wind shielding portion between the intake of the cooling fan and the discharge hole of the cooling fan.
  • the wind shielding portion partitions at least partially an inner space of the housing.
  • FIGS. 1 to 14 show an electronic apparatus 1 according to a first embodiment.
  • the electronic apparatus 1 is, for example, a notebook PC.
  • electronic apparatuses to which the embodiment can be applied are not limited thereto.
  • the embodiment can be widely applied to various kinds of electronic apparatuses including a display device, such as a television, a recording/reproducing apparatus, a PDA (Personal Digital Assistant), and a game machine.
  • a display device such as a television, a recording/reproducing apparatus, a PDA (Personal Digital Assistant), and a game machine.
  • PDA Personal Digital Assistant
  • the electronic apparatus 1 includes a main unit 2 , a display unit 3 , and a hinge 4 .
  • the main unit 2 is an electronic apparatus main body provided with a main board.
  • the main unit 2 includes a housing 5 .
  • the housing 5 has a flat box shape including an upper wall 6 , a lower wall 7 , and a circumferential wall 8 .
  • the lower wall 7 faces a desk surface when the electronic apparatus 1 is placed on a desk.
  • the lower wall 7 is substantially parallel to the desk surface.
  • the upper wall 6 is opposite to the lower wall 7 with a space therebetween and extends substantially in parallel (that is, substantially in a horizontal direction) to the lower wall 7 .
  • a keyboard 9 is attached to the upper wall 6 .
  • the circumferential wall 8 rises with respect to the lower wall 7 , and connects the edge portion of the lower wall 7 and the edge portion of the upper wall 6 .
  • the housing 5 includes a base 11 and a cover 12 .
  • the base 11 includes the lower wall 7 and a part of the circumferential wall 8 .
  • the cover 12 includes the upper wall 6 and a part of the circumferential wall 8 .
  • the cover 12 is combined with the base 11 to form the housing 5 .
  • the housing 5 includes a rear end portion 13 (first end portion) to which the display unit 3 is rotatably connected and a front end portion 14 (second end portion) disposed opposite to the rear end portion 13 .
  • the circumferential wall 8 includes a front wall 8 a, a rear wall 8 b, a left wall 8 c, and a right wall 8 d.
  • the front wall 8 a extends in the width direction (left-right direction) of the housing 5 at the front end portion 14 .
  • the rear wall 8 b extends in the width direction of the housing 5 at the rear end portion 13 .
  • the left wall 8 c and the right wall 8 d extend in the depth direction (front-rear direction) of the housing 5 and connect the end portions of the front wall 8 a and the end portions of the rear wall 8 b.
  • the display unit 3 is rotatably (openably) connected to the rear end portion 13 of the main unit 2 by the hinge 4 .
  • the display unit 3 can be pivoted between a closed position where the display unit 3 falls and covers the main unit 2 from the upper side and an opened position where the display unit 3 rises with respect to the main unit 2 .
  • the display unit 3 includes a display housing 15 and a display panel 16 in the display housing 15 .
  • a display screen 16 a of the display panel 16 can be exposed to the outside through an opening portion 15 a in the front wall of the display housing 15 .
  • the upper wall 6 includes a keyboard mounting portion 17 to which the keyboard 9 is attached and a palm rest 18 .
  • the palm rest 18 is in front of the keyboard mounting portion 17 in the depth direction, that is, between the keyboard mounting portion 17 and the front wall 8 a.
  • the keyboard mounting portion 17 is recessed from the palm rest 18 to the inside of the housing 5 . In this way, the height of the upper surface of the keyboard 9 attached to the keyboard mounting portion 17 is substantially equal to or slightly higher than that of the upper surface of the palm rest 18 .
  • a plurality of leg portions 19 is provided on the lower wall 7 of the housing 5 .
  • the leg portions 19 come into contact with the desk surface and the lower wall 7 of the housing 5 is supported at a position separated from the desk surface.
  • the housing 5 includes first inlets 21 , second inlets 22 , and third inlets 23 .
  • the first inlets 21 , the second inlets 22 , and the third inlets 23 are separated from one another and are provided so as to be concentrated in, for example, the front left portion of the housing 5 .
  • the first inlets 21 and the third inlets 23 are provided in the lower wall 7 .
  • the first inlets 21 are below a cooling fan 24 , which will be described below, so as to face the cooling fan 24 .
  • the third inlets 23 are not below the cooling fan 24 .
  • the third inlets 23 are located between the first inlets 21 and the front wall 8 a.
  • the second inlets 22 are provided in the left wall 8 c.
  • the second inlets 22 are, for example, opening portions for exposing various kinds of connectors 25 .
  • the second inlets 22 enable fresh air to flow into the housing 5 through the gap between the connector 25 and the housing 5 .
  • the housing 5 includes first outlets 26 and second outlets 27 .
  • the first outlets 26 are provided in the left wall 8 c at the rear end portion 13 of the housing 5 , and located, for example, in the side of the keyboard 9 and in the rear end portion 13 .
  • the first outlets 26 face a heat sink 28 , which will be described below, from the side thereof.
  • the second outlets 27 are provided in the lower wall 7 at the rear end portion 13 of the housing 5 and face the heat sink 28 from the lower side thereof.
  • an opening portion 30 through which a docking connector 29 is exposed to the outside, is provided in the lower wall 7 .
  • the housing 5 accommodates a circuit board 31 , an ODD 32 (Optical Disk Drive), a storage device 33 , the heat sink 28 , a heat pipe 34 , a heat radiating plate 35 , and the cooling fan 24 .
  • the circuit board 31 is, for example, a main board.
  • the circuit board 31 includes a first surface 31 a and a second surface 31 b opposite to the first surface 31 a.
  • the first surface 31 a is, for example, the lower surface.
  • the second surface 31 b is, for example, the upper surface.
  • the first surface 31 a may be the upper surface
  • the second surface 31 b may be the lower surface.
  • a CPU 41 Central Processing Unit
  • a PCH 42 Platinum Controller Hub
  • a power supply circuit component 43 a memory slot connector 44
  • an LCD connector 45 an LCD connector 45
  • an I/O connector 46 a first power coil 47
  • a second power coil 48 is provided on the first surface 31 a of the circuit board 31 .
  • the CPU 41 is an example of a first heating element and is a component generating the largest amount of heat among the components of the circuit board 31 .
  • the PCH 42 is an example of a heating element and is, for example, a component whose heat may be naturally radiated.
  • the power supply circuit component 43 is an example of the heating element and is a component generating a relatively large amount of heat among the components of the circuit board 31 .
  • a power supply circuit component 49 is provided on the second surface 31 b of the circuit board 31 .
  • the power supply circuit component 49 is an example of the heating element.
  • the heating elements on the circuit board 31 are not limited to the above-mentioned components.
  • a direction from the front end portion 14 to the rear end portion 13 of the housing 5 is defined as a first direction D 1 .
  • a direction that is substantially orthogonal to the first direction D 1 and is from the right wall 8 d to the left wall 8 c is defined as a second direction D 2 .
  • a discharge hole 24 c of the cooling fan 24 which will be described below, is opened in the first direction D 1 .
  • the circuit board 31 is below the keyboard mounting portion 17 . As shown in FIG. 4 , the circuit board 31 includes a first portion 31 c between the cooling fan 24 and the heat sink 28 and a second portion 31 d deviating from the space between the cooling fan 24 and the heat sink 28 .
  • the first portion 31 c faces the cooling fan 24 in the direction (first direction D 1 ) in which the discharge hole 24 c of the cooling fan 24 is opened. That is, the first portion 31 c is directly exposed to cooling air discharged from the cooling fan 24 . In addition, the first portion 31 c faces the heat sink 28 in the second direction D 2 . The second portion 31 d does not face the cooling fan 24 in the direction in which the discharge hole 24 c of the cooling fan 24 is opened.
  • the CPU 41 and the power supply circuit component 43 are mounted on the first portion 31 c of the circuit board 31 and located between the heat sink 28 and the cooling fan 24 .
  • the PCH 42 is mounted on the second portion 31 d of the circuit board 31 and deviates from the space between the heat sink 28 and the cooling fan 24 .
  • the heat sink 28 is an example of the heat radiating portion, and is, for example, a fin unit including a plurality of fins.
  • the heat sink 28 is provided in the rear end portion 13 of the housing 5 and faces the first outlet 26 of the housing 5 .
  • the heat sink 28 is below the keyboard mounting portion 17 .
  • the gaps between the fins face the first outlets 26 .
  • the heat pipe 34 is an example of a heat transfer member.
  • the heat pipe 34 extends from the CPU 41 to the heat sink 28 .
  • the heat pipe 34 thermally connects the CPU 41 to the heat sink 28 and transfers heat generated from the CPU 41 to the heat sink 28 .
  • the heat radiating plate 35 is, for example, a metal plate member.
  • the heat radiating plate 35 includes a first portion 35 a facing the CPU 41 and a second portion 35 b extended away from the CPU 41 .
  • the first portion 35 a is thermally connected to the CPU 41 .
  • There is a step between the second portion 35 b and the first portion 35 a and the second portion 35 b extends from the first portion 35 a to, for example, the rear side. That is, the second portion 35 b extends in the direction in which air is discharged from the cooling fan 24 .
  • the heat radiating plate 35 is not thermally connected to the power supply circuit component 43 .
  • the ODD 32 is accommodated in the right portion of the housing 5 opposite to the circuit board 31 .
  • An example of the storage device 33 is an HDD (Hard Disk Drive).
  • the storage device 33 is provided in the front end portion 14 of the housing 5 so as to be adjacent to the cooling fan 24 .
  • the storage device 33 includes a case 51 and a magnetic disk (not shown) in the case 51 .
  • a side surface 51 a (end surface) of the case 51 expands in a flat plate shape and faces the side of the cooling fan 24 .
  • the side surface 51 a of the case 51 forms a rising wall facing the cooling fan 24 from the side opposite to the left wall 8 c of the housing 5 .
  • the cooling fan 24 is away from the heat sink 28 .
  • the cooling fan 24 is provided in the left portion of the front end portion 14 of the housing 5 .
  • the cooling fan 24 is below the palm rest 18 . That is, the cooling fan 24 deviates from the lower side of the keyboard mounting portion 17 where the thickness of the housing 5 is relatively small, and is below the palm rest 18 where the thickness of the housing 5 is relatively large.
  • the cooling fan 24 is a centrifugal fan and includes a fan case 53 and an impeller 54 rotated in the fan case 53 .
  • the fan case 53 includes first intakes 24 a, second intakes 24 b, and a discharge hole 24 c.
  • the fan case 53 includes a lower surface 53 a facing the lower wall 7 , an upper surface 53 b opposite to the lower surface 53 a and facing the upper wall 6 , and a circumferential surface 53 c facing the circuit board 31 .
  • the first intakes 24 a are provided in the lower surface 53 a of the fan case 53 and face the first inlets 21 of the lower wall 7 .
  • the second intakes 24 b are provided in the upper surface 53 b of the fan case 53 and are opposite to the first intakes 24 a.
  • the second intakes 24 b face the palm rest 18 with a gap therebetween.
  • the discharge hole 24 c is opened in the first direction D 1 and faces the CPU 41 of the circuit board 31 .
  • the thickness of the discharge hole 24 c is greater than that of the circuit board 31 .
  • the circuit board 31 faces a substantially intermediate portion of the discharge hole 24 c in the thickness direction of the discharge hole 24 c.
  • the “circuit board facing the substantially intermediate portion” means that the circuit board 31 does not face the upper and lower ends of the discharge hole 24 c.
  • the circuit board 31 does not necessarily face the substantially intermediate portion of the discharge hole 24 c in the thickness direction.
  • the discharge hole 24 c may be opened so as to extend from the upper side to the lower side of the circuit board 31 .
  • the discharge hole 24 c includes a first portion 24 ca close to the first surface 31 a of the circuit board 31 and a second portion 24 cb close to the second surface 31 b of the circuit board 31 .
  • the cooling fan 24 draws air in the housing 5 through the first intakes 24 a and the second intakes 24 b and discharges the air from the discharge hole 24 c to the CPU 41 . In this case, the cooling fan 24 discharges air to the upper and lower sides of the circuit board 31 .
  • the thickness of the heat sink 28 is larger than that of the circuit board 31 .
  • the circuit board 31 faces a substantially intermediate portion of the heat sink 28 in the thickness direction of the heat sink 28 .
  • the “circuit board 31 facing the substantially intermediate portion” means that the circuit board 31 does not face the upper and lower ends of the heat sink 28 .
  • the circuit board 31 does not necessarily face the substantially intermediate portion of the heat sink 28 in the thickness direction.
  • the heat sink 28 is exposed to the upper and lower sides of the circuit board 31 .
  • the heat sink 28 includes a first portion 28 a close to the first surface 31 a of the circuit board 31 and a second portion 28 b close to the second surface 31 b of the circuit board 31 .
  • the first portion 28 a is exposed to air flowing along the first surface 31 a of the circuit board 31 .
  • the second portion 28 b is exposed to air flowing along the second surface 31 b of the circuit board 31 .
  • the end portion of the circuit board 31 facing the discharge hole 24 c of the cooling fan 24 includes a component non-mounting region 56 .
  • the non-mounting region 56 has a width of, for example, 5 mm and extends in the width direction of the discharge hole 24 c along the edge of the circuit board 31 .
  • the non-mounting region 56 is put on a rail of a mounting apparatus in a process of mounting components on the circuit board, such as a reflow process. No component is provided on the non-mounting region 56 and the non-mounting region 56 hardly hinders the flow of air discharged from the cooling fan 24 .
  • the electronic apparatus 1 includes a wind shielding portion 64 that partitions the inside of the housing 5 into a first chamber 61 (first region), a second chamber 62 (second region), and a third chamber 63 (third region).
  • the first chamber 61 is an air drawing chamber in which the cooling fan 24 draws fresh air.
  • the second chamber 62 is a duct in which components generating a relatively large amount of heat are mainly mounted and cooling air mainly flows from the cooling fan 24 to the heat sink 28 .
  • components with sufficient natural heat radiation capability are in the third chamber 63 .
  • the term “chamber” means a region (portion) in the housing, and is not necessarily completely isolated from other chambers (other regions).
  • the memory slot connector 44 , the LCD connector 45 , the first power coil 47 , the second power coil 48 , and some sealing members 71 , 72 , 73 , 74 , 75 , 76 , and 77 on the circuit board 31 form the wind shielding portion 64 .
  • Each of the sealing members 71 , 72 , 73 , 74 , 75 , 76 , and 77 is an example of an elastic member and is also an example of a non-conductive member.
  • Each of the sealing members 71 , 72 , 73 , 74 , 75 , 76 , and 77 is an insulating member, such as sponge, rubber, or an insulator.
  • FIG. 6 some sealing members 73 , 74 , and 75 are removed.
  • FIGS. 6 and 7 for convenience of description, the components forming the wind shielding portion 64 are hatched.
  • the first sealing member 71 and the second sealing member 72 are attached to the lower surface 53 a of the cooling fan 24 .
  • the first sealing member 71 extends in the width direction (second direction D 2 ) of the discharge hole 24 c along the discharge hole 24 c of the cooling fan 24 . That is, the first sealing member 71 is provided between the first intakes 24 a and the discharge hole 24 c and partitions the internal space of the housing 5 .
  • the second sealing member 72 extends in the first direction D 1 along the right end portion of the cooling fan 24 .
  • the second sealing member 72 is opposite to the left wall 8 c of the housing 5 with the first intakes 24 a of the cooling fan 24 interposed therebetween. That is, the first intakes 24 a of the cooling fan 24 are located between the second sealing member 72 and the left wall 8 c of the housing 5 .
  • the first sealing member 71 and the second sealing member 72 are provided between the lower surface 53 a of the cooling fan 24 and the inner surface of the lower wall 7 of the housing 5 .
  • the first sealing member 71 and the second sealing member 72 are compressed in the gap between the lower surface 53 a of the cooling fan 24 and the inner surface of the lower wall 7 of the housing 5 , thereby airtightly sealing the gap.
  • the first chamber 61 surrounded by the first sealing member 71 , the second sealing member 72 , the left wall 8 c of the housing 5 , and the front wall 8 a of the housing 5 is formed in the corner of the housing 5 .
  • the first sealing member 71 and the second sealing member 72 are provided on the surface of the cooling fan 24 and are not provided in a region deviating from the cooling fan 24 . That is, the first sealing member 71 and the second sealing member 72 do not completely partition the first chamber 61 in the housing 5 , but partially partition the first chamber 61 in the housing 5 .
  • the first sealing member 71 and the second sealing member 72 may extend to the region deviating from the cooling fan 24 and completely partition the first chamber 61 in the housing 5 .
  • the side surface 51 a of the case 51 of the storage device 33 supplementarily serves a part of the wall (i.e., side surface) of the first chamber 61 .
  • first sealing member 71 and another second sealing member 72 are on the upper surface 53 b of the cooling fan 24 , similarly to the lower surface 53 a. That is, the first sealing member 71 extends in the width direction of the discharge hole 24 c along the discharge hole 24 c of the cooling fan 24 .
  • the first sealing member 71 is provided between the second intakes 24 b and the discharge hole 24 c and partitions the inner space of the housing 5 .
  • the second sealing member 72 extends in the first direction D 1 along the right end portion of the cooling fan 24 .
  • the first sealing member 71 and the second sealing member 72 are provided between the upper surface 53 b of the cooling fan 24 and the inner surface (the inner surface of the palm rest 18 ) of the upper wall 6 of the housing 5 .
  • the first sealing member 71 and the second sealing member 72 are compressed in the gap between the upper surface 53 b of the cooling fan 24 and the inner surface of the upper wall 6 of the housing 5 , thereby airtightly sealing the gap.
  • the first inlets 21 , the second inlets 22 , and the third inlets 23 of the housing 5 , and the first intakes 24 a and the second intakes 24 b of the cooling fan 24 are exposed to the first chamber 61 .
  • the first chamber 61 communicates with the housing 5 through the first inlets 21 , the second inlets 22 , and the third inlets 23 such that fresh air can flow into the first chamber 61 . Therefore, the temperature of air in the first chamber 61 is lower than that in the other chambers.
  • the memory slot connector 44 to which a memory 81 is attached is mounted on the circuit board 31 .
  • the memory slot connector 44 is an example of a board component, an example of a long connector, and an example of a “component in the housing”.
  • the term “long connector” means that a length of a connector in its longitudinal direction is longer than one side of the chip of the CPU 41 (first heating element).
  • the “long connector” is not limited to the memory slot connector 44 , but may be, for example, a docking connector or a connector for a television tuner.
  • the longitudinal direction of the memory slot connector 44 is aligned with the discharge direction (first direction D 1 ) of the cooling fan 24 .
  • the memory 81 includes a memory board 81 b on which a plurality of memory chips 81 a is mounted.
  • the memory slot connector 44 is adjacent to the CPU 41 , with the memory 81 facing the opposite side of the CPU 41 .
  • the memory slot connector 44 includes a pair of holders 83 that holds the memory 81 spaced apart from the circuit board 31 and a terminal portion 84 attached to the circuit board 31 .
  • the terminal portion 84 includes a slot to which the memory 81 is electrically connected and a plurality of wires for connecting the memory 81 to the CPU 41 .
  • the terminal portion 84 closely adheres to the circuit board 31 and there is no gap between the terminal portion 84 and the circuit board 31 .
  • the memory slot connector 44 is a second stage connector of a so-called two-stage memory connecting portion. That is, another memory slot connector 44 a is mounted between the memory 81 attached to the memory slot connector 44 and the circuit board 31 . In other words, the terminal portion 84 of the memory slot connector 44 is relatively high.
  • the memory slot connector 44 is arranged such that the terminal portion 84 is closer to the CPU 41 than the holders 83 . A portion of the memory slot connector 44 faces the CPU 41 .
  • the memory slot connector 44 is arranged in substantially parallel to the CPU 41 .
  • the terminal portion 84 is electrically connected to the CPU 41 by a plurality of wiring patterns 85 .
  • the memory slot connector 44 extends from the side of the CPU 41 to the side of the power supply circuit component 43 .
  • the memory slot connector 44 faces a part of the heat sink 28 , the second power coil 48 , and the I/O connector 46 in the second direction D 2 .
  • the first power coil 47 and the LCD connector 45 are provided between the end portion of the memory slot connector 44 and the end portion of the heat sink 28 .
  • Each of the first power coil 47 and the LCD connector 45 is an example of the board component.
  • the first power coil 47 and the LCD connector 45 are arranged in the second direction D 2 .
  • the first power coil 47 and the LCD connector 45 face the discharge hole 24 c of the cooling fan 24 in the first direction D 1 . That is, air discharged from the discharge hole 24 c of the cooling fan 24 passes through the CPU 41 and the power supply circuit component 43 , collides with the first power coil 47 and the LCD connector 45 , and flows to the heat sink 28 .
  • the second power coil 48 is opposite to the memory slot connector 44 with the CPU 41 interposed therebetween.
  • the gap between the second power coil 48 and the memory slot connector 44 is substantially equal to the width of the discharge hole 24 c of the cooling fan 24 .
  • each of the memory slot connector 44 , the first power coil 47 , the LCD connector 45 , and the second power coil 48 arranged in this way form a wind guide path 91 with a duct structure through which cooling air flows from the cooling fan 24 to the heat sink 28 , in cooperation with the lower wall 7 and the left wall 8 c of the housing 5 . That is, each of the memory slot connector 44 , the first power coil 47 , the LCD connector 45 , and the second power coil 48 forms at least a part of the wall surface of the wind guide path 91 . In other words, each of the memory slot connector 44 , the first power coil 47 , the LCD connector 45 , and the second power coil 48 is configured to serve as a wall that guides cooling air from the cooling fan 24 to the heat sink 28 .
  • the wind guide path 91 includes a first flow path 91 a and a second flow path 91 b.
  • the first flow path 91 a is formed in a substantially L shape on the first surface 31 a of the circuit board 31 (that is, between the circuit board 31 and the lower wall 7 of the housing 5 ).
  • the second flow path 91 b is formed on the second surface 31 b of the circuit board 31 (that is, between the circuit board 31 and the upper wall 6 of the housing 5 ) in the same shape as that of the first flow path 91 a, that is, in a substantially L shape.
  • the memory slot connector 44 , the first power coil 47 , the LCD connector 45 , and the second power coil 48 form the first flow path 91 a.
  • the CPU 41 , the power supply circuit component 43 , the heat pipe 34 , and the heat radiating plate 35 are located in the wind guide path 91 . That is, the CPU 41 , the power supply circuit component 43 , the heat pipe 34 , and the heat radiating plate 35 are provided between the cooling fan 24 and the heat sink 28 .
  • the third sealing member 73 is provided between the terminal portion 84 of the memory slot connector 44 and the inner surface of the lower wall 7 of the housing 5 .
  • the third sealing member 73 is an example of the first sealing portion.
  • the third sealing member 73 extends in the first direction D 1 .
  • the third sealing member 73 has a length substantially equal to that of the terminal portion 84 of the memory slot connector 44 .
  • the third sealing member 73 is compressed in the gap between the memory slot connector 44 and the lower wall 7 of the housing 5 , thereby airtightly sealing the gap.
  • the third sealing member 73 forms a part of the wall surface of the first flow path 91 a of the wind guide path 91 .
  • the housing 5 includes a boss 95 and a rib 96 , which are protrusions protruding from the inner surface of the lower wall 7 of the housing 5 toward the circuit board 31 .
  • the boss 95 and the rib 96 are positioned between the cooling fan 24 and the memory slot connector 44 and form a part of the wall surface of the wind guide path 91 .
  • the fourth sealing member 74 is provided between the first power coil 47 and the inner surface of the lower wall 7 of the housing 5 .
  • the fourth sealing member 74 extends from the end portion of the memory slot connector 44 to the end portion of the LCD connector 45 .
  • the fourth sealing member 74 is compressed in the gap between the first power coil 47 and the lower wall 7 of the housing 5 , thereby airtightly sealing the gap.
  • the fourth sealing member 74 may extend to, for example, the end portion of the heat sink 28 .
  • the fourth sealing member 74 may be provided between the LCD connector 45 and the inner surface of the lower wall 7 of the housing 5 .
  • the fifth sealing member 75 is provided between the second power coil 48 and the inner surface of the lower wall 7 of the housing 5 .
  • the fifth sealing member 75 extends from the end portion of the cooling fan 24 to the end portion of the heat sink 28 .
  • the fifth sealing member 75 is compressed in the gap between the second power coil 48 and the lower wall 7 of the housing 5 , thereby airtightly sealing the gap.
  • the fifth sealing member 75 may be only in a portion of the space between the cooling fan 24 and the heat sink 28 .
  • Each of the fourth sealing member 74 and the fifth sealing member 75 forms a part of the wall surface of the first flow path 91 a of the wind guide path 91 .
  • the sixth sealing member 76 is provided between the heat sink 28 and the inner surface of the lower wall 7 of the housing 5 .
  • the sixth sealing member 76 extends over the entire length of the heat sink 28 in the longitudinal direction (first direction D 1 ).
  • the sixth sealing member 76 is compressed in the gap between the heat sink 28 and the lower wall 7 of the housing 5 , thereby airtightly sealing the gap. In this way, cooling air reaching the heat sink 28 is exhausted to the outside through the gaps between the fins of the heat sink 28 without passing through the gap between the heat sink 28 and the inner surface of the housing 5 .
  • the sixth sealing member 76 is provided between the heat sink 28 and the inner surface of the upper wall 6 of the housing 5 .
  • the sixth sealing member 76 is compressed in the gap between the heat sink 28 and the upper wall 6 of the housing 5 , thereby airtightly sealing the gap.
  • the keyboard mounting portion 17 includes a relatively large opening portion through which the keyboard 9 is exposed to the housing 5 .
  • the sixth sealing member 76 also extends between the heat sink 28 and the lower surface of the keyboard 9 .
  • the sixth sealing member 76 is compressed in the gap between the heat sink 28 and the lower surface of the keyboard 9 , thereby airtightly sealing the gap.
  • the seventh sealing member 77 is provided between the second surface 31 b of the circuit board 31 and the inner surface of the upper wall 6 of the housing 5 .
  • the seventh sealing member 77 is an example of a second sealing portion.
  • the seventh sealing member 77 is compressed in the gap between the circuit board 31 and the inner surface of the upper wall 6 of the housing 5 , thereby airtightly sealing the gap.
  • a sealing member between the board component and the inner surface of the housing is also included in “the sealing member between the second surface of the circuit board and the inner surface of the housing”.
  • the seventh sealing member 77 also extends between the second surface 31 b of the circuit board 31 and the lower surface of the keyboard 9 .
  • the seventh sealing member 77 is compressed in the gap between the second surface 31 b of the circuit board 31 and the lower surface of the keyboard 9 , thereby airtightly sealing the gap.
  • the seventh sealing member 77 has substantially the same shape as an integrated body of the third sealing member 73 and the fourth sealing member 74 .
  • the shape of the seventh sealing member 77 is not limited thereto.
  • the seventh sealing member 77 , the upper wall 6 (or the keyboard 9 ) of the housing 5 and the left wall 8 c of the housing 5 form the second flow path 91 b of the wind guide path 91 through which cooling air flows from the cooling fan 24 to the heat sink 28 . That is, the seventh sealing member 77 forms a part of the wall (i.e., side surface) of the wind guide path 91 . As shown in FIG. 9 , the power supply circuit component 49 is located in the second flow path 91 b.
  • the gap between the second surface 31 b of the circuit board 31 and the upper wall 6 of the housing 5 is smaller than the gap between the first surface 31 a and the lower wall 7 of the housing 5 .
  • the second chamber 62 surrounded by the memory slot connector 44 , the third sealing member 73 , the first power coil 47 , the fourth sealing member 74 , the LCD connector 45 , the boss 95 , the rib 96 , the seventh sealing member 77 , and the left wall 8 c of the housing 5 is formed in the left end portion of the housing 5 .
  • Each of the components according to this embodiment does not completely partition the second chamber 62 in the housing 5 , but partially partitions the second chamber 62 in the housing 5 .
  • the second chamber 62 may be completely partitioned in the housing 5 .
  • the first outlets 26 , the second outlets 27 , the CPU 41 , the power supply circuit component 43 , the power supply circuit component 49 , the heat sink 28 , the heat pipe 34 , the heat radiating plate 35 , and the discharge hole 24 c of the cooling fan 24 of the housing 5 are exposed to the second chamber 62 .
  • the housing 5 includes the third chamber 63 at least partially partitioned from the first chamber 61 and the second chamber 62 .
  • the third chamber 63 is partitioned from the first chamber 61 and the second chamber 62 by the second sealing member 72 , the boss 95 , the rib 96 , the memory slot connector 44 , the third sealing member 73 , the first power coil 47 , the fourth sealing member 74 , the LCD connector 45 , and the seventh sealing member 77 .
  • the third chamber 63 communicates with the outside through vent holes 98 in the lower wall 7 of the housing 5 .
  • the PCH 42 , the memory 81 , the ODD 32 , and the storage device 33 are exposed to the third chamber 63 .
  • a heat radiating member is not attached to the PCH 42 or the memory 81 , and heat generated from the PCH 42 and the memory 81 is naturally radiated.
  • the first portion 31 c of the circuit board 31 is exposed to the second chamber 62 .
  • the second portion 31 d of the circuit board 31 is exposed to the third chamber 63 .
  • Each of the components according to this embodiment does not completely partition the third chamber 63 in the housing 5 , but partially partitions the third chamber 63 .
  • the third chamber 63 may be completely partitioned in the housing 5 .
  • FIGS. 12 to 14 schematically showing the structure of this embodiment.
  • the inside of the housing 5 is divided into the first chamber 61 and the second chamber 62 .
  • a structure (the first sealing member 71 and the second sealing member 72 ) that shields the flow of air is provided between the first chamber 61 and the second chamber 62 .
  • the first intakes 24 a and the second intakes 24 b of the cooling fan 24 are exposed to the first chamber 61 .
  • the discharge hole 24 c of the cooling fan 24 is exposed to the second chamber 62 . That is, a partial sealing region that closes up the air intakes 24 a and 24 b of the cooling fan 24 is formed in the corner of the housing 5 .
  • the cooling fan 24 draws air from the outside of the housing 5 to the first chamber 61 and discharges the air from the first chamber 61 to the second chamber 62 .
  • the air intakes 24 a, 24 b of the cooling fan 24 are not exposed to the second chamber 62 and the third chamber 63 . Therefore, the cooling fan 24 draws a small amount of air or hardly draws air in the second chamber 62 and the third chamber 63 heated by the CPU 41 or the PCH 42 , the power supply circuit component 43 , and the other heating elements.
  • the cooling fan 24 draws low-temperature air from the outside of the housing 5 through the first chamber 61 and discharges the low-temperature air to, for example, the CPU 41 in the second chamber 62 .
  • the air inlets are in the lower wall 7 and the circumferential wall 8 of the housing 5 .
  • the air inlets may be in at least one of the upper wall 6 , the lower wall 7 , and the circumferential wall 8 of the housing 5 .
  • the wind guide path 91 guiding cooling air from the cooling fan 24 to the heat sink 28 is formed in the housing 5 by the board components on the circuit board 31 .
  • the memory slot connector 44 , the first power coil 47 , the LCD connector 45 , and the second power coil 48 form both wall surfaces of the wind guide path 91 .
  • a space surrounded by the memory slot connector 44 , the first power coil 47 , the LCD connector 45 , the second power coil 48 , the circuit board 31 , and the lower wall 7 and the upper wall 6 (or the keyboard 9 ) of the housing 5 is the wind guide path 91 .
  • the airtightness of the wind guide path 91 is improved by the third to seventh sealing members 73 , 74 , 75 , 76 , and 77 .
  • cooling air discharged from the cooling fan 24 flows to the heat sink 28 on the circuit board 31 . That is, cooling air discharged from the cooling fan 24 is reliably focused on, for example, the CPU 41 or the heat sink 28 without being widely spread in the housing 5 , thereby effectively cooling the CPU 41 or the heat sink 28 .
  • the following structure is considered: intakes in the lower surface of the cooling fan face inlets in the lower wall of the housing and intakes are provided in the upper surface of the cooling fan in the housing.
  • the intakes in the lower surface of the cooling fan can draw low-temperature fresh air
  • the intakes in the upper surface of the cooling fan draw warm air in the housing 5 . Therefore, air discharged from the cooling fan 24 does not have a relatively low temperature. Therefore, it is difficult to effectively cool, for example, the heat sink 28 exposed to the air.
  • the wind shielding portion 64 that at least partially partitions the inner space of the housing 5 is between the intakes 24 a and 24 b of the cooling fan 24 and the discharge hole 24 c of the cooling fan 24 . Therefore, the air, which has been discharged from the discharge hole 24 c and then heated by the CPU 41 or the heat sink 28 , is less likely to be drawn through the intakes 24 a and 24 b. As a result, it is possible to blow relatively low-temperature air to the CPU 41 or the heat sink 28 and thus improve heat radiation efficiency.
  • the first chamber 61 to which the inlets 21 , 22 , and 23 of the housing 5 and the intakes 24 a and 24 b of the cooling fan 24 are exposed is at least partially partitioned from the second chamber 62 to which the outlets 26 and 27 of the housing 5 , the CPU 41 , the heat sink 28 , the heat pipe 34 , and the discharge hole 24 c of the cooling fan 24 are exposed by the wind shielding portion 64 in the housing 5 . Therefore, air heated by the CPU 41 , the heat sink 28 , or the heat pipe 34 is less likely to flow back to the intakes 24 a and 24 b of the cooling fan 24 .
  • the first chamber 61 that draws ambient fresh air into the housing 5 is provided, and the first intakes 24 a in the upper surface 53 a of the cooling fan 24 and the second intakes 24 b in the lower surface 53 b of the cooling fan 24 are exposed to the first chamber 61 .
  • a heating element such as the CPU 41 , is in the second chamber 62 partitioned from the first chamber 61 .
  • the second intakes 24 b in the upper surface of the cooling fan 24 in addition to the first intakes 24 a in the lower surface 53 b of the cooling fan 24 , can draw low-temperature fresh air, not warm air in the housing 5 .
  • the cooling fan 24 incorporated into the housing 5 may draw almost 100% of fresh air from the outside and discharge (blows) almost 100% of fresh air into the housing 5 , regardless of the type of cooling fan.
  • the cooling fan 24 is a component with a relatively large height (thickness) among the components in the housing 5 .
  • the cooling fan 24 is below the palm rest 18 , it is possible to accommodate the cooling fan 24 below the palm rest 18 in which the thickness of the housing 5 is larger than that below the keyboard mounting portion 17 . Therefore, it is possible to reduce the thickness of the housing 5 .
  • the following structure is considered: intakes in the lower surface of the cooling fan face inlets in the lower wall of the housing and intakes are formed in the upper surface of the cooling fan in the housing.
  • intakes in the lower surface of the cooling fan draw warm air in the housing. Therefore, cooling efficiency may be reduced.
  • the first chamber 61 for drawing air is in the housing 5 and the first chamber 61 includes the second inlets 22 in addition to the first inlets 21 .
  • the first chamber 61 communicates with the outside through the second inlets 22 . Since the intakes 24 a and 24 b are formed in the cooling fan 24 in the first chamber 61 , it is possible to draw low-temperature fresh air from the first chamber 61 . Therefore, even when some of the inlets of the housing 5 are clogged, cooling efficiency is less likely to be reduced.
  • first inlets 21 are in the lower wall 7 of the housing 5 and the second inlets 22 are in the circumferential wall 8 of the housing 5 , two kinds of inlets 21 and 22 are less likely to be clogged at the same time and the first chamber 61 easily communicates with the outside.
  • a second heating element for example, the PCH 42
  • the third chamber 63 including the second heating element is at least partially partitioned from the first chamber 61 and the second chamber 62 by the wind shielding portion 64 in the housing 5
  • an electronic apparatus 1 according to a second embodiment will be described with reference to FIG. 15 .
  • components having the same or similar functions as those of the first embodiment are denoted by the same reference numerals and a description thereof will not be repeated.
  • structures other than the following structures are the same as those in the first embodiment.
  • an I/O connector 46 forms a part of the wall (i.e., side surface) of a wind guide path 91 .
  • the I/O connector 46 includes a shell 101 made of metal and a terminal portion (not shown) in the shell 101 .
  • a housing 5 is made of metal, for example.
  • the housing 5 may be made of a resin and may have a conductor layer on the inner surface thereof.
  • the conductor layer is formed by, for example, plating, a conductive coating layer, or the attachment of a metal foil.
  • a conductive member 102 is provided between the I/O connector 46 and the housing 5 .
  • the conductive member 102 is, for example, a gasket. However, the conductive member 102 may be a leaf spring instead of the gasket.
  • the conductive member 102 is provided between the I/O connector 46 and the housing 5 and electrically connects the I/O connector 46 to the housing 5 .
  • the conductive member 102 functions as a member for ESD (Electro-Static Discharge) or EMI (Electro Magnetic Interference).
  • the conductive member 102 forms a part of the wall (i.e., side surface) of the wind guide path 91 . That is, the conductive member 102 is configured to serve as a wall that guides cooling air from a cooling fan 24 to a heat sink 28 .
  • the connector on which the conductive member 102 is provided is not limited to the I/O connector 46 , but may be other kinds of connectors.
  • a heating component 103 is mounted on a second surface 31 b of a circuit board 31 .
  • the heating component 103 is an example of the second heating element and is, for example, a power coil, a capacitor, or an IC.
  • the heating component 103 is not limited thereto, and only needs to be a component with a temperature higher than the average temperature of the circuit board 31 .
  • the heating component 103 forms a part of the wall (i.e., side surface) of the wind guide path 91 . That is, the heating component 103 is configured to serve as a wall that guides cooling air from the cooling fan 24 to the heat sink 28 .
  • the housing 5 includes a rib 104 whose protrusion is adjusted according to the height of a component (in this embodiment, the heating component 103 ) forming a part of the wall (i.e., side surface) of the wind guide path 91 .
  • the rib 104 is an example of the wind shielding portion.
  • the rib 104 protrudes from the inner surface of the housing 5 toward the component forming a part of the wall (i.e., side surface) of the wind guide path 91 such that a gap of, for example, several millimeters exists between the rib 104 and the component.
  • the rib 104 forms a part of the wall (i.e., side surface) of the wind guide path 91 .
  • a display device 111 according to a third embodiment will be described with reference to FIG. 16 .
  • components having the same or similar functions as those of the first embodiment are denoted by the same reference numerals and a description thereof will not be repeated.
  • structures other than the following structures are the same as those in the first embodiment.
  • the display device 111 includes a housing 5 and a display panel 16 in the housing 5 .
  • An example of the display device 111 is a television.
  • the same structure as that in the first embodiment or the second embodiment is in the housing 5 .
  • the display device 111 having the above-mentioned structure, similarly to the first embodiment or the second embodiment, it is possible to mount components at high density.
  • the electronic apparatuses 1 and the display device 111 according to the first to third embodiments have been described above, but the embodiments are not limited thereto.
  • the embodiments are not limited to the above-described embodiments, but the components may be changed without departing from the scope and spirit of the invention.
  • the third chamber 63 is not necessarily partitioned in the housing 5 , but it is only necessary that the first chamber 61 be partitioned from the second chamber 62 .
  • the wind guide path 91 is not necessarily provided. That is, the sealing members 73 , 74 , 75 , 76 , and 77 may be omitted.
  • the members partitioning the first chamber 61 , the second chamber 62 , and the third chamber 63 may not be the sealing members, but may be a portion of the housing 5 (for example, a rib).
  • the first intake 24 a may not necessarily face the inlet 21 of the lower wall 7 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
US13/040,721 2010-05-11 2011-03-04 Display device and electronic apparatus Abandoned US20110279974A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/770,990 US9098234B2 (en) 2010-05-11 2013-02-19 Display device and electronic apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-109524 2010-05-11
JP2010109524A JP4892078B2 (ja) 2010-05-11 2010-05-11 電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/770,990 Continuation US9098234B2 (en) 2010-05-11 2013-02-19 Display device and electronic apparatus

Publications (1)

Publication Number Publication Date
US20110279974A1 true US20110279974A1 (en) 2011-11-17

Family

ID=44911611

Family Applications (2)

Application Number Title Priority Date Filing Date
US13/040,721 Abandoned US20110279974A1 (en) 2010-05-11 2011-03-04 Display device and electronic apparatus
US13/770,990 Active 2031-10-25 US9098234B2 (en) 2010-05-11 2013-02-19 Display device and electronic apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
US13/770,990 Active 2031-10-25 US9098234B2 (en) 2010-05-11 2013-02-19 Display device and electronic apparatus

Country Status (2)

Country Link
US (2) US20110279974A1 (ja)
JP (1) JP4892078B2 (ja)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110279977A1 (en) * 2010-05-11 2011-11-17 Kabushiki Kaisha Toshiba Display device and electronic apparatus
US20130027873A1 (en) * 2011-07-26 2013-01-31 Compal Electronics, Inc. Electronic device
US20140009888A1 (en) * 2011-12-28 2014-01-09 Mark MacDonald Electronic device having a passive heat exchange device
US20140078669A1 (en) * 2010-06-18 2014-03-20 Kabushiki Kaisha Toshiba Display Apparatus and Electronic Apparatus
US20140092542A1 (en) * 2012-09-28 2014-04-03 Yoshifumi Nishi Electronic device having passive cooling
US20140092544A1 (en) * 2012-09-28 2014-04-03 Yoshifumi Nishi Electronic device having passive cooling
US20140268600A1 (en) * 2013-03-15 2014-09-18 Honeywell International Inc. Housing for an electronic device internal walls
US20140347816A1 (en) * 2013-05-24 2014-11-27 Funai Electric Co., Ltd. Display Device
US20160157383A1 (en) * 2014-11-27 2016-06-02 Inventec (Pudong) Technology Corporation Signal input device
US20170242462A1 (en) * 2016-02-24 2017-08-24 Kabushiki Kaisha Toshiba Electronic apparatus
CN107257609A (zh) * 2017-06-02 2017-10-17 合肥市惠科精密模具有限公司 一种Micro LED水冷散热显示屏
CN107357395A (zh) * 2017-09-01 2017-11-17 联想(北京)有限公司 一种笔记本电脑
US20190373765A1 (en) * 2018-05-30 2019-12-05 Canon Kabushiki Kaisha Cooling unit that discharges heat from heat source and electronic apparatus equipped with the cooling unit
US10591960B2 (en) * 2016-12-26 2020-03-17 Panasonic Intellectual Property Management Co., Ltd. Electronic device
CN114041099A (zh) * 2019-07-01 2022-02-11 玳能本股份有限公司 电子设备
US20220253113A1 (en) * 2021-02-10 2022-08-11 Dell Products L.P. Cooling system for an information handling system
CN115245060A (zh) * 2020-03-27 2022-10-25 索尼互动娱乐股份有限公司 电子设备

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102668546A (zh) * 2009-12-03 2012-09-12 松下电器产业株式会社 电子设备的散热单元及使用该散热单元的电子设备
CN104281236A (zh) * 2013-07-03 2015-01-14 南京化工职业技术学院 笔记本电脑散热架
KR102568676B1 (ko) * 2016-12-14 2023-08-22 삼성전자주식회사 방음 구조를 구비한 전자 장치
JP2018113402A (ja) * 2017-01-13 2018-07-19 富士通株式会社 電子装置
JP7250086B1 (ja) 2021-09-14 2023-03-31 レノボ・シンガポール・プライベート・リミテッド 電子機器
CN114206090B (zh) * 2021-11-30 2024-04-16 四川天邑康和通信股份有限公司 一种能够有效解决pon/全光网关发热和屏蔽信号互绕的方法

Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030072134A1 (en) * 2000-09-21 2003-04-17 Kabushiki Kaisha Tohsiba Electronic apparatus including a cooling unit for cooling a heat generating component
US20040070942A1 (en) * 2002-08-30 2004-04-15 Kabushiki Kaisha Toshiba Electronic apparatus
US20050007738A1 (en) * 2000-03-31 2005-01-13 Fujitsu Limited Radiator mechanism and electronic apparatus having same
US20060133048A1 (en) * 2003-05-07 2006-06-22 Fujitsu Limited Cooling device, substrate, and electronic equipment
US20060164808A1 (en) * 2005-01-21 2006-07-27 Nvidia Corporation Cooling system for computer hardware
US20060232934A1 (en) * 2005-04-15 2006-10-19 Kabushiki Kaisha Toshiba Electronic apparatus
US20070091561A1 (en) * 2005-10-25 2007-04-26 Shuttle Inc. Heat dissipating system of multi-media computer
US20070236879A1 (en) * 2004-05-07 2007-10-11 Sony Corporation Cooling air intake structure and desk top computer
US20070242438A1 (en) * 2004-03-31 2007-10-18 Belits Computer Systems, Inc. Low-Profile Thermosyphon-Based Cooling System for Computers and Other Electronic Devices
US20080112130A1 (en) * 2006-10-30 2008-05-15 Fusanobu Nakamura Housing temperature suppressing structure in electronic device and portable computer
US20080180910A1 (en) * 2007-01-30 2008-07-31 Kabushiki Kaisha Toshiba Portable Electronic Apparatus
US20080237845A1 (en) * 2007-03-28 2008-10-02 Jesse Jaejin Kim Systems and methods for removing heat from flip-chip die
US20080253083A1 (en) * 2007-04-11 2008-10-16 Kabushiki Kaisha Toshiba Electronic apparatus
US20080298011A1 (en) * 2007-05-31 2008-12-04 Kabushiki Kaisha Toshiba Electronic apparatus and cooling unit
US20090001560A1 (en) * 2005-12-05 2009-01-01 Zoran Stefanoski Embedded Heat Pipe In A Hybrid Cooling System
US20090046426A1 (en) * 2004-09-30 2009-02-19 Kabushiki Kaisha Toshiba Cooling Device for Cooling A Heat-Generating Component, and Electronic Apparatus Having the Cooling Device
US20090129020A1 (en) * 2007-11-19 2009-05-21 Kabushiki Kaisha Toshiba Electronic apparatus
US20090154104A1 (en) * 2007-12-14 2009-06-18 Yoshihiro Kondo Cooling Device and Electronic Apparatus Using the Same
US20090168331A1 (en) * 2006-05-19 2009-07-02 Kabushiki Kaisha Toshiba Electronic apparatus
US7675752B2 (en) * 2008-01-31 2010-03-09 Kabushiki Kaisha Toshiba Electronic apparatus
US7755896B2 (en) * 2006-09-21 2010-07-13 Sony Computer Entertainment Inc. Information processing device

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3663706B2 (ja) * 1995-01-27 2005-06-22 株式会社日立製作所 パーソナルコンピュータ
JP2000223876A (ja) * 1999-01-29 2000-08-11 Toshiba Corp 電子機器
JP3512735B2 (ja) * 2000-11-30 2004-03-31 株式会社東芝 情報処理装置
JP3530151B2 (ja) * 2001-06-08 2004-05-24 株式会社東芝 発熱体を内蔵する電子機器およびこの電子機器に用いる冷却装置
US6813149B2 (en) * 2001-06-29 2004-11-02 Intel Corporation High capacity air-cooling systems for electronic apparatus and associated methods
JP3690658B2 (ja) * 2001-07-13 2005-08-31 インターナショナル・ビジネス・マシーンズ・コーポレーション ヒートシンク、冷却部材、半導体基板冷却装置、コンピュータ、および放熱方法
JP2003108269A (ja) * 2001-09-28 2003-04-11 Nec Gumma Ltd 電子部品の冷却構造及び冷却方法
JP3757200B2 (ja) * 2002-09-25 2006-03-22 株式会社日立製作所 冷却機構を備えた電子機器
US7113402B2 (en) * 2004-10-01 2006-09-26 Lenovo (Singapore) Pte. Ltd. Systems, apparatus and method for reducing dust on components in a computer system
JP2006156786A (ja) * 2004-11-30 2006-06-15 Toshiba Corp 電子機器
JP2007011931A (ja) 2005-07-04 2007-01-18 Hitachi Ltd 記憶制御装置
JP2007047998A (ja) * 2005-08-09 2007-02-22 Sony Corp 電子部品冷却構造及び情報処理装置
US7286357B2 (en) * 2005-11-29 2007-10-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Computer system with cooling device for CPU
US7403393B2 (en) * 2005-12-28 2008-07-22 International Business Machines Corporation Apparatus and system for cooling heat producing components
US7539016B2 (en) * 2005-12-30 2009-05-26 Intel Corporation Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls
JP2007207944A (ja) * 2006-01-31 2007-08-16 Toshiba Corp 電子機器
JP2007286785A (ja) * 2006-04-14 2007-11-01 Fujitsu Ltd 電子機器および冷却部品
JP4240061B2 (ja) * 2006-05-29 2009-03-18 ソニー株式会社 ファンモータおよび電子機器
JP2008072062A (ja) * 2006-09-15 2008-03-27 Toshiba Corp 実装構造、およびこれを備えた電子機器
JP2008084019A (ja) * 2006-09-27 2008-04-10 Toshiba Corp 電子機器
JP4745206B2 (ja) * 2006-11-30 2011-08-10 株式会社東芝 電子機器
US7405937B1 (en) * 2007-02-16 2008-07-29 Inventec Corporation Heat sink module for dual heat sources
US20100128431A1 (en) * 2007-03-07 2010-05-27 Andre Sloth Eriksen Hybrid liquid-air cooled graphics display adapter
JP2008251687A (ja) * 2007-03-29 2008-10-16 Toshiba Corp プリント回路板、およびこれを備えた電子機器
JP4829192B2 (ja) 2007-09-07 2011-12-07 株式会社東芝 電子機器
CN101466241B (zh) * 2007-12-19 2012-01-25 鸿富锦精密工业（深圳）有限公司 散热装置
JP4372189B2 (ja) 2007-12-27 2009-11-25 株式会社東芝 情報処理装置及び不揮発性半導体メモリドライブ
US20090201639A1 (en) * 2008-02-12 2009-08-13 Inventec Corporation Chassis of portable electronic apparatus
JP4399013B2 (ja) * 2008-02-28 2010-01-13 株式会社東芝 電子機器、およびヒートパイプ
JP2010086071A (ja) * 2008-09-29 2010-04-15 Toshiba Corp 電子機器
JP2010224587A (ja) * 2009-03-19 2010-10-07 Toshiba Corp 電子機器
CN101852237B (zh) * 2009-04-01 2013-04-24 富准精密工业(深圳)有限公司 散热装置及其紧固件
JP5378863B2 (ja) * 2009-04-02 2013-12-25 株式会社ソニー・コンピュータエンタテインメント 電子機器

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050007738A1 (en) * 2000-03-31 2005-01-13 Fujitsu Limited Radiator mechanism and electronic apparatus having same
US20040057207A1 (en) * 2000-09-21 2004-03-25 Kabushiki Kaisha Toshiba Electronic apparatus including a cooling unit for cooling a heat generating component
US20040085734A1 (en) * 2000-09-21 2004-05-06 Kabushiki Kaisha Tohsiba Radiator for radiating heat of a heat generating component, a cooling unit including the radiator, and an electronic apparatus including the cooling unit
US20030072134A1 (en) * 2000-09-21 2003-04-17 Kabushiki Kaisha Tohsiba Electronic apparatus including a cooling unit for cooling a heat generating component
US20040070942A1 (en) * 2002-08-30 2004-04-15 Kabushiki Kaisha Toshiba Electronic apparatus
US20060133048A1 (en) * 2003-05-07 2006-06-22 Fujitsu Limited Cooling device, substrate, and electronic equipment
US20070242438A1 (en) * 2004-03-31 2007-10-18 Belits Computer Systems, Inc. Low-Profile Thermosyphon-Based Cooling System for Computers and Other Electronic Devices
US20070236879A1 (en) * 2004-05-07 2007-10-11 Sony Corporation Cooling air intake structure and desk top computer
US20090046426A1 (en) * 2004-09-30 2009-02-19 Kabushiki Kaisha Toshiba Cooling Device for Cooling A Heat-Generating Component, and Electronic Apparatus Having the Cooling Device
US20060164808A1 (en) * 2005-01-21 2006-07-27 Nvidia Corporation Cooling system for computer hardware
US7310227B2 (en) * 2005-04-15 2007-12-18 Kabushiki Kaisha Toshiba Electronic apparatus
US20060232934A1 (en) * 2005-04-15 2006-10-19 Kabushiki Kaisha Toshiba Electronic apparatus
US20070091561A1 (en) * 2005-10-25 2007-04-26 Shuttle Inc. Heat dissipating system of multi-media computer
US20090001560A1 (en) * 2005-12-05 2009-01-01 Zoran Stefanoski Embedded Heat Pipe In A Hybrid Cooling System
US20090168331A1 (en) * 2006-05-19 2009-07-02 Kabushiki Kaisha Toshiba Electronic apparatus
US7755896B2 (en) * 2006-09-21 2010-07-13 Sony Computer Entertainment Inc. Information processing device
US20080112130A1 (en) * 2006-10-30 2008-05-15 Fusanobu Nakamura Housing temperature suppressing structure in electronic device and portable computer
US20080180910A1 (en) * 2007-01-30 2008-07-31 Kabushiki Kaisha Toshiba Portable Electronic Apparatus
US20080237845A1 (en) * 2007-03-28 2008-10-02 Jesse Jaejin Kim Systems and methods for removing heat from flip-chip die
US20080253083A1 (en) * 2007-04-11 2008-10-16 Kabushiki Kaisha Toshiba Electronic apparatus
US20080298011A1 (en) * 2007-05-31 2008-12-04 Kabushiki Kaisha Toshiba Electronic apparatus and cooling unit
US20090129020A1 (en) * 2007-11-19 2009-05-21 Kabushiki Kaisha Toshiba Electronic apparatus
US20090154104A1 (en) * 2007-12-14 2009-06-18 Yoshihiro Kondo Cooling Device and Electronic Apparatus Using the Same
US7675752B2 (en) * 2008-01-31 2010-03-09 Kabushiki Kaisha Toshiba Electronic apparatus

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8422224B2 (en) * 2010-05-11 2013-04-16 Kabushiki Kaisha Toshiba Display device and electronic apparatus
US20110279977A1 (en) * 2010-05-11 2011-11-17 Kabushiki Kaisha Toshiba Display device and electronic apparatus
US20140078669A1 (en) * 2010-06-18 2014-03-20 Kabushiki Kaisha Toshiba Display Apparatus and Electronic Apparatus
US20130027873A1 (en) * 2011-07-26 2013-01-31 Compal Electronics, Inc. Electronic device
US9268377B2 (en) * 2011-12-28 2016-02-23 Intel Corporation Electronic device having a passive heat exchange device
US20140009888A1 (en) * 2011-12-28 2014-01-09 Mark MacDonald Electronic device having a passive heat exchange device
US20140092544A1 (en) * 2012-09-28 2014-04-03 Yoshifumi Nishi Electronic device having passive cooling
US8982555B2 (en) * 2012-09-28 2015-03-17 Intel Corporation Electronic device having passive cooling
US9134757B2 (en) * 2012-09-28 2015-09-15 Intel Corporation Electronic device having passive cooling
US20140092542A1 (en) * 2012-09-28 2014-04-03 Yoshifumi Nishi Electronic device having passive cooling
US20140268600A1 (en) * 2013-03-15 2014-09-18 Honeywell International Inc. Housing for an electronic device internal walls
US9803882B2 (en) * 2013-03-15 2017-10-31 Honeywell International Inc. Housing for an electronic device internal walls
US20140347816A1 (en) * 2013-05-24 2014-11-27 Funai Electric Co., Ltd. Display Device
USRE47914E1 (en) * 2013-05-24 2020-03-17 Funai Electric Co., Ltd. Display device
US9491893B2 (en) * 2013-05-24 2016-11-08 Funai Electric Co., Ltd. Display device
US9600043B2 (en) * 2014-11-27 2017-03-21 Inventec (Pudong) Technology Corporation Signal input device
US20160157383A1 (en) * 2014-11-27 2016-06-02 Inventec (Pudong) Technology Corporation Signal input device
US20170242462A1 (en) * 2016-02-24 2017-08-24 Kabushiki Kaisha Toshiba Electronic apparatus
US10591960B2 (en) * 2016-12-26 2020-03-17 Panasonic Intellectual Property Management Co., Ltd. Electronic device
CN107257609A (zh) * 2017-06-02 2017-10-17 合肥市惠科精密模具有限公司 一种Micro LED水冷散热显示屏
CN107357395A (zh) * 2017-09-01 2017-11-17 联想(北京)有限公司 一种笔记本电脑
US10939577B2 (en) * 2018-05-30 2021-03-02 Canon Kabushiki Kaisha Cooling unit that discharges heat from heat source and electronic apparatus equipped with the cooling unit
US20190373765A1 (en) * 2018-05-30 2019-12-05 Canon Kabushiki Kaisha Cooling unit that discharges heat from heat source and electronic apparatus equipped with the cooling unit
US11337333B2 (en) 2018-05-30 2022-05-17 Canon Kabushiki Kaisha Cooling unit that discharges heat from heat source and electronic apparatus equipped with the cooling unit
CN114041099A (zh) * 2019-07-01 2022-02-11 玳能本股份有限公司 电子设备
US11846994B2 (en) 2019-07-01 2023-12-19 Dynabook Inc. Electronic device
CN115245060A (zh) * 2020-03-27 2022-10-25 索尼互动娱乐股份有限公司 电子设备
US20230171915A1 (en) * 2020-03-27 2023-06-01 Sony Interactive Entertainment Inc. Electronic apparatus
US20220253113A1 (en) * 2021-02-10 2022-08-11 Dell Products L.P. Cooling system for an information handling system
US11429164B1 (en) * 2021-02-10 2022-08-30 Dell Products L.P. Cooling system for an information handling system

Also Published As

Publication number Publication date
JP2011238063A (ja) 2011-11-24
US9098234B2 (en) 2015-08-04
US20130163171A1 (en) 2013-06-27
JP4892078B2 (ja) 2012-03-07

Similar Documents

Publication Publication Date Title
US9098234B2 (en) Display device and electronic apparatus
US8422224B2 (en) Display device and electronic apparatus
JP4982590B2 (ja) 表示装置及び電子機器
US9277672B2 (en) Television, radiating member, and electronic apparatus
US7606027B2 (en) Electronic apparatus cooling structure
US8335082B2 (en) Heat dissipating apparatus
US8045327B2 (en) Electronic apparatus
US20080180910A1 (en) Portable Electronic Apparatus
TW201314425A (zh) 散熱裝置及使用該散熱裝置的電子裝置
JP7339075B2 (ja) 電気機器、電子制御装置
US10446192B2 (en) Electronic apparatus with air duct and fan
US20090201639A1 (en) Chassis of portable electronic apparatus
JP2013093487A (ja) 電子機器
US9122452B2 (en) Electronic device
JP2007172076A (ja) 放熱装置およびそれを用いた電子機器
US9516782B2 (en) Arrangement for cooling electronic components and/or assemblies
JP5066294B2 (ja) 電子機器
JP4922473B2 (ja) 電子機器
TWI816551B (zh) 伺服器
US20210112654A1 (en) Thermal management systems having signal transfer routing for use with electronic devices
US20080068794A1 (en) Dissipation module and electronic device having the same
CN115639895A (zh) 服务器
JP2004111655A (ja) 電子部品の冷却装置用ケース、およびこの冷却装置用ケースを用いた冷却装置
TW202414745A (zh) 電子裝置
JP2023094869A (ja) 情報処理装置

Legal Events

Date Code Title Description
AS Assignment

Owner name: KABUSHIKI KAISHA TOSHIBA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FUJIWARA, NOBUTO;REEL/FRAME:025905/0368

Effective date: 20101220

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION