US20040070952A1 - IC card and an adapter for the same - Google Patents

IC card and an adapter for the same Download PDF

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Publication number
US20040070952A1
US20040070952A1 US10/676,098 US67609803A US2004070952A1 US 20040070952 A1 US20040070952 A1 US 20040070952A1 US 67609803 A US67609803 A US 67609803A US 2004070952 A1 US2004070952 A1 US 2004070952A1
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US
United States
Prior art keywords
card
standard
adapter
terminals
mode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/676,098
Other languages
English (en)
Inventor
Akira Higuchi
Hirotaka Nishizawa
Junichiro Osako
Kenji Osawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Hitachi Solutions Technology Ltd
Original Assignee
Renesas Technology Corp
Hitachi ULSI Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp, Hitachi ULSI Systems Co Ltd filed Critical Renesas Technology Corp
Assigned to RENESAS TECHNOLOGY CORP., HITACHI ULSI SYSTEMS CO., LTD. reassignment RENESAS TECHNOLOGY CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIGUCHI, AKIRA, NISHIZAWA, HIROTAKA, OSAKO, JUNICHIRO, OSAWA, KENJI
Publication of US20040070952A1 publication Critical patent/US20040070952A1/en
Priority to US11/681,046 priority Critical patent/US20070150633A1/en
Priority to US12/261,993 priority patent/US7823793B2/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K17/00—Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups G06K1/00 - G06K15/00, e.g. automatic card files incorporating conveying and reading operations
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0719—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for application selection, e.g. an acceleration sensor or a set of radio buttons
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07733—Physical layout of the record carrier the record carrier containing at least one further contact interface not conform ISO-7816
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07741—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors

Definitions

  • the present invention relates to an IC card and a card adapter, and particularly to a technique of making a specific IC card usable as IC cards having different shapes, different number of terminals (external terminals), and different properties.
  • flash EEPROM Electrically Erasable Programmable Read Only Memory
  • Small memory cards have already been commercialized as storage mediums of small electronic appliances such as digital cameras and portable telephone units.
  • FIG. 46 is a table of some standards of small memory cards, listing the development companies, product names and external dimensions of memory cards.
  • Japanese Unexamined Patent Publication No.Hei7(1995)-141114 discloses a technique, in which a memory card 3 a is set in a card adapter 30 and the adapter 30 is put into the memory card slot 21 of an information handling appliance 22 so that serial data transmission is established between the memory card 3 a and the appliance 22 : (refer to the abstract and FIG. 10 of the patent publication).
  • Japanese Unexamined Patent Publication No.2001-307801 discloses a connector of memory card which has an inseparable upper and lower sections formed of resin constituting an SD card connector 10 to be coupled with an SD card 50 and a SIM card connector 20 to be coupled with a SIM card 60 :(refer to the abstract and FIG. 2 of the patent publication).
  • Another object of the present invention is to provide a card adapter which enables an IC card to become usable as an IC card of other standard.
  • the inventive IC card is an IC card of a first standard, and it includes: (a) a plurality of external terminals, (b) a detector which detects the voltage level of a certain external terminal among the external terminals, (c) a mode controller which is connected to the detector, and (d) a first-mode interface controller corresponding to the first standard and a second-mode interface controller corresponding to a second standard, with both interface controllers being connected to the mode controller, (e) the mode controller including means of selecting the first-mode interface controller or second-mode interface controller in accordance with the output signal of the detector.
  • the inventive card adapter has an interior space which matches with the profile of an IC card of a first standard and has a profile of an IC card of a second standard, and it includes: (a) a plurality of first external terminals, (b) a plurality of internal terminals which are disposed at positions to be in contact with a plurality of second external terminals of an IC card of the first standard when the IC card is set in the adapter interior space, (c) wiring lines which connect between the first external terminals and the internal terminals, and (d) a resistor which is connected between a first external terminal, with a supply voltage or ground voltage being applied thereto, among the first external terminals and an internal terminal.
  • FIG. 1 is a top view and a first side view of an IC card based on a first embodiment of this invention
  • FIG. 2 is a set of diagrams of the IC card of the first embodiment, showing a rear view, a second and third side views, and a cross-sectional view taken along the line A-A′ of the rear view;
  • FIG. 3 is a perspective top view of the IC card of the first embodiment
  • FIG. 4 is a perspective rear view of the IC card of the first embodiment
  • FIG. 5 is a cross-sectional diagram showing the principal portion of the IC card of the first embodiment
  • FIG. 6 is a perspective top view showing the spatial relation of the IC card and a card extender based on the first embodiment of this invention
  • FIG. 7 is a block diagram showing the function of the IC card of the first embodiment
  • FIG. 8 is a set of perspective top views showing the setting of the IC card (RS-MMC) of the first embodiment in an SD-type adapter;
  • FIG. 9 is a set of perspective top views showing the setting of the IC card (RS-MMC) of the first embodiment in another SD-type adapter;
  • FIG. 10 is a set of perspective top views showing the setting of the IC card (RS-MMC) of the first embodiment in still another SD-type adapter;
  • FIG. 11 is a perspective top view and perspective rear view of an SD card
  • FIG. 12 is a perspective rear view of an SD-type adapter based on the first embodiment of this invention.
  • FIG. 13 is a principal plan view showing the SD-type adapter of the first embodiment, with an RS-MMC being set therein;
  • FIG. 14 is a plan view of the SD-type adapter of the first embodiment, showing the spatial relation of the external terminals of adapter, the external terminals of RS-MMC, and the wiring lines of the adapter for connecting between these terminals;
  • FIG. 15 is a set of perspective top views showing the setting of the IC card (RS-MMC) of the first embodiment in an MS-type adapter;
  • FIG. 16 is a set of perspective rear views showing the setting of the IC card (RS-MMC) of the first embodiment in the MS-type adapter;
  • FIG. 17 is a set of perspective rear views showing the setting of the IC card (RS-MMC) of the first embodiment in another MS-type adapter;
  • FIG. 18 is a set of perspective top views showing the setting of the IC card (RS-MMC) of the first embodiment in still another MS-type adapter;
  • FIG. 19 is a perspective top view and perspective rear view of an MS card
  • FIG. 20 is a principal plan view showing the MS-type adapter of the first embodiment, with an RS-MMC being set therein;
  • FIG. 21 is a plan view of the MS-type adapter of the first embodiment, showing the spatial relation of the external terminals of adapter, the external terminals of RS-MMC, and the wiring lines of the adapter for connecting between these terminals;
  • FIG. 22 is a perspective top view and perspective rear view showing the setting of the IC card (RS-MMC) of the first embodiment in an MSDuo-type adapter;
  • FIG. 23 is a perspective top view showing the setting of the IC card (RS-MMC) of the first embodiment in another MSDuo-type adapter;
  • FIG. 24 is a perspective top view showing the setting of the IC card (RS-MMC) of the first embodiment in still another MSDuo-type adapter;
  • FIG. 25 is a perspective top view and perspective rear view of an MSDuo card
  • FIG. 26 is a perspective top view showing the setting of the IC card (RS-MMC) of the first embodiment in a USB-type adapter;
  • FIG. 27 is a perspective top view showing the setting of the IC card (RS-MMC) of the first embodiment in another USB-type adapter;
  • FIG. 28 is a perspective top view showing the setting of the IC card (RS-MMC) of the first embodiment in still another USB-type adapter;
  • FIG. 29 is a plan view of an USB-type adapter based on the first embodiment of this invention, showing the spatial relation of the external terminals of adapter, the external terminals of RS-MMC, and the wiring lines in the case for connecting between these terminals;
  • FIG. 30 is a flowchart showing the mode switching operation of the controller of the IC card of the first embodiment
  • FIG. 31 is a plan view of the IC card of the first embodiment, showing the relation between the external terminals Cn and the signals when the USB-mode interface controller is selected;
  • FIG. 32 is a plan view of the IC card of the first embodiment, showing the relation between the external terminals Cn and the signals when the MS-mode interface controller is selected;
  • FIG. 33 is a plan view of the IC card of the first embodiment, showing the relation between the external terminals Cn and the signals when the MMC/SD-mode interface controller is selected;
  • FIG. 34 is a plan view of the IC card of the first embodiment, showing the relation between the external terminals Cn and the signals when the MMC/SD-mode interface controller is selected and the 4-bit mode is selected;
  • FIG. 35 is a plan view of the IC card of the first embodiment, showing the relation between the external terminals Cn and the signals when the MMC/SD-mode interface controller is selected and the 8-bit mode is selected;
  • FIG. 36 is a plan view of the IC card of the first embodiment, showing the relation between the external terminals Cn and the signals when the MMC/SD-mode interface controller is selected and the 1-bit mode is selected;
  • FIG. 37 is a plan view showing the insertion direction of the IC card (RS-MMC) based on a second embodiment of this invention, and a perspective view showing the shape of the internal terminals of the adapter;
  • RS-MMC IC card
  • FIG. 38 is a principal plan view showing an SD-type adapter of the second embodiment, with an RS-MMC being set therein;
  • FIG. 39 is a principal plan view showing an MS-type adapter of the second embodiment, with an RS-MMC being set therein;
  • FIG. 40 is a plan view showing the insertion direction of the IC card (RS-MMC) of the second embodiment, and a perspective view showing the shape of the internal terminals of the adapter;
  • FIG. 41 is a set of plan views showing the insertion direction of the IC card (RS-MMC) of the second embodiment, and a perspective view showing the shape of the internal terminals of the adapter;
  • FIG. 42 is a perspective view of an IC card (RS-MMC) based on a third embodiment of this invention and an assortment of adapters of various types;
  • RS-MMC IC card
  • FIG. 43 is a set of perspective views of an assortment of adapters of various types of the third embodiment.
  • FIG. 44 is a plan view of an MS-type adapter based on a fourth embodiment of this invention, showing the spatial relation of the external terminals of adapter, the external terminals of RS-MMC, and the wiring lines of the adapter for connecting between these terminals;
  • FIG. 45 is a flowchart showing the mode switching operation of the controller of the IC card of the fourth embodiment.
  • FIG. 46 is a table of examples of standard of small memory cards, listing the development companies, product names and external dimensions of memory cards.
  • FIG. 1 through FIG. 5 show the card structure, of which FIG. 1 shows a top view and a first side view of the IC card seen in the direction indicated by “a” in the top view, FIG. 2 shows a rear view, a second and third side views seen in the direction indicated by “b”, “c” and “d” and a cross-sectional view taken along the line A-A′ of the rear view, FIG. 3 shows a perspective top view of the IC card 1 , FIG. 4 shows a perspective rear view of the IC card, and FIG. 5 shows the cross section of the principal portion of the IC card.
  • FIG. 6 shows the spatial relation of the IC card 1 and a card extender.
  • the IC card and card adapter have external terminals on their rear side.
  • the IC card 1 has a generally rectangular profile of about 18 mm by 24 mm and has a thickness of about 1.4 mm.
  • One of four corners is cut away for indexing as indicated by 3, serving to prevent the IC card 1 from being put in the opposite direction into an electronic appliance such as a personal computer.
  • the remaining three corners are rounded with a relatively small curvature so that the cut 3 of one corner is distinctive.
  • the external terminals Cn having a generally rectangular profile extend in parallel to the short sides of the IC card 1 .
  • C 1 -C 7 are aligned along the long side edge
  • C 8 -C 13 are aligned in the inner area next to C 1 -C 7 .
  • Terminal C 8 is located in the outer area next to C 7
  • terminal C 9 is located in the outer area next to C 1 .
  • Terminal C 10 is located between C 1 and C 2
  • terminal C 11 is located between C 2 and C 3
  • terminal C 12 is located between C 5 and C 6
  • terminal C 13 is located between C 6 and C 7 .
  • Arranging the external terminals Cn in this layout pattern facilitates the formation of the internal terminals of the card adapter as will be explained later.
  • the number of external terminals of the IC card 1 which is not confined to 13 though, must be at least the maximum number of terminals among the IC card standards, as will be explained later, which the IC card 1 is intended to be compatible with.
  • Extender holders 5 are formed at both ends of the long side that does not include the cut 3 , and an extender coupling groove 7 is formed at the middle of this long side.
  • a card extender 9 is coupled to the IC card 1 by placed the extender corners 13 on the extender holders 5 of the IC card 1 and bringing the ridge 11 of the extender 9 into the groove 7 of the IC card 1 as shown in FIG. 6.
  • the IC card 1 is compatible not only with the half-size card slot, but also with the full-size card slot (about the double of half-size) of electronic appliances.
  • the IC card 1 incorporates IC chips, e.g., a memory chip and a controller chip.
  • the IC card 1 incorporates three IC chips, e.g., flash memory chips 15 which overlap and a controller chip 17 .
  • the IC chips 15 and 17 are coated with sealing resin 21 and further covered with a cap 23 .
  • IC chips may be glued on a lead frame and coated with sealing resin, or IC chips may be glued on a base board and simply covered with a cap.
  • FIG. 7 shows by block diagram the function of the IC card of this embodiment.
  • This IC card is of a first standard. Specifically, it is a multimedia card (MMC) standardized by the multimediacard association (MMCA).
  • MMC multimedia card
  • MMCA multimediacard association
  • This IC card is compatible with IC cards (SD memory cards) of a second standard, IC cards (memory sticks) of a third standard, and IC cards (USB-oriented memories) of a fourth standard.
  • the IC card (MMC) of this embodiment is usable as an SD memory card, as a memory stick, and as a USB-oriented memory.
  • the SD (source digital) memory card which is identical in profile and slightly thicker than MMC, is standardized by the SD card association to have the SD card standard.
  • the memory stick (MS) was developed by Sony Corp. to have the MS card standard.
  • USB is the abbreviation of universal serial bus, and it is the interface specifications for connecting easily a personal computer to its peripheral devices. Specifically, for example, mouse devices, keyboards, printers and modems are designed to have a common interface so that any of these devices can be connected to a personal computer through a common USB connector. A memory device having a USB connector can also be connected to a personal computer.
  • the IC card (MMC) 1 incorporates a flash memory 15 , an IC card chip 16 , and a controller IC 17 .
  • the controller IC 17 includes a flash memory controller 31 , a mode controller 33 , a voltage pull-down detector 35 , a USB-mode interface (I/F) controller 37 , a MS-mode I/F controller 39 , an MMC/SD-mode I/F controller 41 , an IC card chip I/F controller 43 , and a bus controller 45 .
  • the MMC/SD-mode I/F controller 41 has x1 bit mode 41 a , x4 bit mode 41 b , x8 bit mode 41 c , and SPI mode 41 d .
  • the flash memory 15 is connected to the flash memory controller 31 , and the IC card chip 16 is connected to the IC card chip I/F controller 43 .
  • the flash memory controller 31 is connected to the USB-mode I/F controller 37 , MS-mode I/F controller 39 , and MMC/SD-mode I/F controller 41 .
  • the mode controller 33 is connected to the USB-mode I/F controller 37 , MS-mode I/F controller 39 , and MMC/SD-mode I/F controller 41 , and it switches among the USB, MS and MMC/SD modes in accordance with the signal from the voltage pull-down detector 35 .
  • the voltage pull-down detector 35 is connected to the external terminals Cn via the bus controller 45 .
  • the mode controller 33 , USB-mode I/F controller 37 , MS-mode I/F controller 39 , and MMC/SD-mode I/F controller 41 are also connected to the external terminals Cn via the bus controller 45 .
  • C 6 and C 3 are ground voltage terminals and C 4 is a supply voltage terminal.
  • the IC card of this embodiment includes the USB-mode I/F controller 37 and MS-mode I/F controller 39 within the controller IC 17 , and therefore it can be used as MS and USB-oriented memories.
  • the IC card chip I/F controller 43 is connected to the MMC/SD-mode I/F controller 41 for example, and the controller 43 and IC card chip 16 are used to reinforce the security function of the card.
  • an SD-type card adapter (slot case) 50 is used.
  • FIG. 8 through FIG. 10 show perspectively the setting of an RS-MMC 1 in an SD-type adapter 50 . Shown by FIG. 8 is card insertion from the short side of adapter, shown by FIG. 9 is card entry from the top of adapter, and shown by FIG. 10 is card insertion from the long side of adapter.
  • the SD-type adapter 50 has an interior space SP large enough to accommodate the RS-MMC 1 as shown in FIGS. 8 - 10 , has virtually the same profile as an SD card with dimensions of about 24 mm by 32 mm and about 2.1 mm in thickness.
  • FIG. 11 shows the top and rear of an SD card.
  • FIG. 13 shows in plan the RS-MMC 1 and SD-type adapter 50 in their set state
  • the external terminals AC 1 , AC 2 , AC 3 , AC 4 , AC 5 , AC 6 , AC 7 , AC 8 and AC 9 of the SD-type adapter 50 are conductive to the external terminals C 1 , C 2 , C 3 , C 4 , C 5 , C 6 , C 7 , C 8 and C 9 of the RS-MMC 1 , respectively, for example.
  • the wiring lines 55 are formed inside the SD-type adapter 50 to run from the external terminals ACn to the positions (internal terminals) which are in contact with the external terminals Cn of the RS-MMC 1 when it is set in the adapter.
  • the wiring lines 55 are formed inside the SD-type adapter 50 preferably on one layer by avoiding the line crossing, or may be formed on multiple layers for dealing with the line crossing.
  • St 1 indicated by St 1 is a switch (slide switch).
  • the SD-type adapter 50 changes its profile depending on the position of this switch.
  • the host electronic appliance recognizes the change to enable or inhibit the data writing.
  • FIG. 15 through FIG. 18 show perspectively the setting of an RS-MMC 1 in an MS-type adapter 60 . Shown by FIGS. 15 and 16 is card insertion from the short side of adapter, shown by FIG. 17 is card insertion from the long side of adapter, and shown by FIG. 18 is card entry from the top of adapter.
  • the MS-type adapter 60 has an interior space SP large enough to accommodate the RS-MMC 1 as shown in FIGS. 15 - 18 , has virtually the same profile as an MS card with dimensions of about 21.5 mm by 50 mm and about 2.8 mm in thickness.
  • FIG. 19 shows the top and rear of an MS card.
  • FIG. 20 shows in plan the RS-MMC 1 and SD-type adapter 60 in their set state
  • the external terminals AC 1 , AC 2 , AC 3 , AC 4 , AC 5 , AC 6 , AC 7 , AC 8 and AC 9 of the MS-type adapter 60 are conductive to the external terminals C 3 and C 6 , C 2 , C 4 , C 7 , C 8 , C 1 , C 9 , C 5 and C 4 of the RS-MMC 1 , respectively, for example.
  • the MS-type adapter 60 has its terminals AC 1 and AC 10 connected to each other, and has its terminals AC 3 and AC 9 connected to each other.
  • the adapter has its terminals AC 3 and AC 10 connected through resistors R 1 and R 2 in serial connection, with the node N of the resistors being connected to the terminal AC 10 through a switch St 2 disposed on the rear surface of adapter and also conductive to the external terminal C 13 .
  • the switch St 2 is operated mechanically to connect or disconnect electrically between the resistor node and the terminal AC 10 .
  • Wiring lines are formed inside the MS-type adapter 60 to run from the external terminals ACn to the positions (internal terminals) which are in contact with the external terminals Cn of the RS-MMC 1 when it is set in the adapter.
  • the wiring lines inside the adapter may be formed on multiple layers to deal with the line crossing as mentioned previously.
  • the MS-type adapter has the application of various signal voltages on the external terminals ACn as indicated on the left-hand side of the terminals in FIG. 21.
  • the supply voltage (VCC) is fed to AC 3
  • the reference ground voltage (VSS) is fed to AC 10 .
  • Individual signals will be explained in detail in the following paragraph (5).
  • the MS-type adapter 60 has the switch St 2 connected between the node N of the resistors R 1 and R 2 and the terminal AC 10 , enabling the voltage of C 13 to change in response to the on/off state of the switch St 2 .
  • C 13 is pulled down completely when the switch St 2 is on (write inhibit mode), or it is pulled down half when the switch St 2 is off (write enable mode).
  • the write enable/inhibit mode can be switched in response to the degree of voltage pull-down on C 13 .
  • MSDuo memory stick Duo
  • FIGS. 22 through FIG. 24 show perspectively the setting of an RS-MMC 1 in an MSDuo-type adapter 70 . Shown by FIG. 22 is card insertion from the short side of adapter, shown by FIG. 23 is card insertion from the long side of adapter, and shown by FIG. 24 is card entry from the top of adapter.
  • the MSDuo-type adapter 70 has an interior space SP large enough to accommodate the RS-MMC 1 as shown in FIGS. 22 - 24 , has virtually the same profile as an MSDuo card with dimensions of about 20 mm by 31 mm and about 1.6 mm in thickness.
  • FIG. 25 shows the top and rear of an MSDuo card.
  • Resistors R 1 and R 2 are connected between the external terminal ACn of the MS-type adapter and the external terminal Cn of the RS-MMC, so that the mode is switched in response to the presence or absence of voltage pull-down on the external terminal and the write enable/inhibit is switched in response to the degree of voltage pull-down, as in the case of the MS-type adapter.
  • USB-type card adapter slot device with a USB terminal
  • FIG. 26 through FIG. 28 show perspectively the setting of an RS-MMC 1 in an USB-type adapter 80 .
  • Shown by FIG. 26 is card insertion from the short side of adapter, i.e., in the adapter plug-in direction
  • shown by FIG. 27 is card insertion from the long side of adapter, i.e., in the direction perpendicular to the adapter plug-in direction
  • shown by FIG. 28 is card entry from the top of adapter.
  • the USB-type adapter 80 has an interior space SP large enough to accommodate the RS-MMC 1 as shown in FIGS. 22 - 28 , and it consists of a case section 80 a and a USB terminal section 80 b.
  • the external terminals AC 1 , AC 2 , AC 3 and AC 4 of the USB terminal section are conductive to the external terminals C 4 , C 12 , C 11 , and C 3 and C 6 of the RS-MMC 1 , respectively, for example.
  • AC 4 and AC 10 are connected through a resistor R 3 .
  • Wiring lines are formed inside the case section to run from the external terminals ACn to the positions (internal terminals) which are in contact with the external terminals Cn of the RS-MMC when it is set in the adapter.
  • the wiring lines inside the adapter may be formed on multiple layers to deal with the line crossing as mentioned previously.
  • the card extender 9 which has been explained on FIG. 6 is used.
  • the extender 9 shown in FIG. 6 has neither wiring lines nor interior space.
  • the adapters explained in the foregoing paragraphs (1)-(4) have casings of resin which house wiring boards.
  • the wiring board is a glass-epoxy plate, with a copper layer being formed on the surface, and the copper layer is etched to form wiring lines.
  • the wiring lines are connected to the internal terminals which will be in contact with the external terminals of the RS-MMC when it is set in the adapter, and parts of the wiring lines form the adapter external terminals which are exposed to the outside through an opening of the casing.
  • FIG. 30 shows by flowchart the mode determining operation by the controller IC 17 shown in FIG. 7 and the function switching operation for the controller IC 17 in accordance with the determined mode.
  • the host appliance with the IC card (RS-MMC) 1 being placed in its card slot, is turned on, and it starts the card setup operation to feed the ground voltage (VSS or GND) to external terminals C 3 and C 6 of RS-MMC and the supply voltage (VCC) to terminal C 4 .
  • RS-MMC IC card
  • Step 1 The voltage pull-down detector 35 judges whether or not the external terminal C 10 is at pull-down. In response to pull-down on the terminal C 10 , which is the case where the USB-type adapter 80 explained on FIG. 29 is attached to the RS-MMC 1 , the controller 33 selects the USB mode.
  • the USB-mode I/F controller assigns the +Data and ⁇ Data terminals to external terminals C 11 and C 12 , respectively, of the RS-MMC as shown in FIG. 31.
  • +Data is the data signal
  • ⁇ Data is the inverted version of the signal.
  • Terminal C 3 and C 6 are of the ground voltage
  • terminal C 4 is the VBus terminal of the supply voltage, e.g., 5 V.
  • Step 2 If terminal C 10 is not at pull-down, the pull-down detector 35 judges whether or not terminal C 13 is at mid pull-down. In response to mid pull-down on terminal C 13 , i.e., having a mid pull-down voltage, which is the case where the MS-type adapter 60 or MSDuo-type adapter 70 explained on FIG. 21 is attached to the RS-MMC 1 , the controller 33 selects the MS mode. In the case of mid pull-down, the switch Stl is off, and then write-enable mode is set.
  • the MS-mode I/F controller assigns the INS, BS, SCLK, DIO, and RSV terminals to external terminals C 1 , C 2 , C 5 , C 7 , and C 8 and C 9 , respectively, of the RS-MMC as shown in FIG. 32.
  • INC is the memory stick attach/detach detection signal
  • BS is the serial protocol bus state signal
  • SCLK is the serial protocol clock signal
  • DIO is the serial protocol data signal.
  • Terminal RSV is for reservation.
  • Terminals C 3 and C 6 are of the ground voltage (VSS), and terminal C 4 is of the supply voltage (VCC), e.g.,3.3 V.
  • Step 3 If terminal C 13 is not at mid pull-down, the pull-down detector 35 judges whether or not pull-down is full pull-down. In response to pull-down on terminal C 13 , i.e., having a voltage further lower than the mid pull-down voltage, which is the case where the MS-type adapter 60 or MSDuo-type adapter 70 is attached to the RS-MMC 1 , the controller 33 selects the MS mode. In the case of full pull-down, the switch St 1 is on, and then write-inhibit mode is set.
  • the MS-mode I/F controller assigns the signal terminals to the external terminals Cn as explained on FIG. 32.
  • Step 4 If terminal C 13 is not at full pull-down, which is the case where the SD-type adapter 50 explained on FIGS. 13 and 14 or the card extender 9 explained on FIG. 6 is attached to the RS-MMC 1 or the RS-MMC 1 has no attachment, the controller 33 selects the MMC/SD mode.
  • the SPI mode, x4 bit mode (SD mode), x8 bit mode (fast MMC mode), or x1 bit mode (normal MMC mode) is selected as follows.
  • Step 4-1 During the reception of reset command on terminal C 2 , it is checked whether or not the chip select signal (CS) on terminal C 1 is asserted.
  • CS chip select signal
  • the MMC/SD-mode I/F controller 41 selects the SPI mode 41 d .
  • the command signal is transferred in one direction.
  • external terminals Cn and the signal terminals are related as shown in FIG. 33.
  • external terminals C 2 , C 5 and C 7 of RS-MMC are the DI, SCLK and DO signal terminals, respectively.
  • DI is the input data signal
  • DO is the output data signal.
  • Terminal C 1 is for the CS signal
  • C 3 and C 6 are for the VSS voltage
  • C 4 is for the VCC voltage.
  • Step 4-2 When the CMD (start command) signal of the SD mode (x4 bit mode) is put in to terminal C 2 , the controller 33 makes a response of readiness of SD mode starting and selects the SD mode (x4 bit mode) 41 b.
  • external terminals C 1 , C 5 , C 7 , C 8 , and C 9 of RS-MMC are the CD/DAT 3 , CLK, DAT 0 , DAT 1 , and DAT 2 signal terminals, respectively.
  • CD/DAT 3 is either the card detect (CD) signal indicating the setting of memory card in the host appliance, or the third data signal (DAT 3 ).
  • DAT 0 , DAT 1 , and DAT 2 are the 0-th data signal, first data signal, and second data signal, respectively.
  • Terminal C 2 is for the CMD signal
  • C 3 and C 6 are for the VSS voltage
  • C 4 is for the VCC voltage.
  • Step 4-3 When the CMD (start command) signal of the fast MMC mode (x8 bit mode) is put in to terminal C 2 , the controller 33 selects the fast MMC mode (x8 bit mode) 41 c.
  • external terminals Cn and the signal terminals are related as shown in FIG. 35.
  • external terminals C 1 , C 5 , C 7 , and C 8 -C 13 of RS-MMC are the DAT 3 , CLK, DAT 0 , and DAT 1 -DAT 2 and DAT 4 -DAT 7 signal terminals, respectively.
  • Terminal DAT 0 is for the 0 th data signal
  • terminals DAT 1 -DAT 7 are for the first through seventh signals
  • terminal C 2 is for the CMD signal
  • C 3 and C 6 are for the VSS voltage
  • C 4 is for the VCC voltage.
  • Step 4-4 In the case of the absence of assertion of the CS signal and input of the CMD (start command) signal of SD mode (x4 bit mode) or CMD (start command) signal of fast MMC mode (x8 bit mode), the controller 33 selects the normal MMC mode (x1 bit mode) 41 a.
  • external terminals Cn and the signal terminals are related as shown in FIG. 36.
  • external terminals C 1 , C 5 , and C 7 of RS-MMC are the RSV/CS, CLK, and DAT signal terminals, respectively.
  • Terminal RSV/CS is for either a reserved signal (RSV) or CS signal.
  • Terminal C 2 is for the CMD signal, C 3 and C 6 are for the VSS and VCC voltages, respectively.
  • the IC card of this embodiment can be used as memories of various standards owing to the provision of the voltage pull-down detector 35 , mode controller 33 , USB-mode I/F controller 37 , MS-mode I/F controller 39 and I/F controllers for other memory standards.
  • each card adapter Owing to the incorporation of the controller IC 17 within the IC card, each card adapter does not need to have its own controller, enabling the cost-down of adapter.
  • each adapter with mode switching functions ( 35 , 33 , 37 , 39 , etc. ) for the adaption to other standards, the adapter needs to have an IC chip for those functions, resulting in a cost increase.
  • the provision of the voltage pull-down detector and mode controller within the IC card enables the card adapters to suffice to have easy formation of inexpensive parts such as wiring lines and resistors in rendering the IC card the compatibility with memories of other standards.
  • this embodiment deals with the IC card compatibility with three standards including the SD card, MS card and USB-oriented memory
  • the inventive IC card and card adapter can be made compatible with more than three standards based on the provision of I/F controllers for other standards.
  • voltage pull-down resistors are used in the USB-type adapter and MS-type adapter, resistors may be used in adapters of arbitrary types.
  • this embodiment uses a scheme of voltage pull-down, voltage pull-up may be used instead.
  • a voltage change caused by resistors can be used as signal generation.
  • An alternative detector may be used for detecting the conduction between adapter external terminals which are left unused for signals.
  • a second embodiment of this invention pertains to the RS-MMC card adapter attachment direction and the shape of internal terminals of the adapter.
  • FIG. 37 shows perspectively the internal terminals of a card adapter AD of the case where the RS-MMC 1 is put into the adapter AD from the short side of adapter as explained on FIG. 8 in the first embodiment.
  • the RS-MMC external terminals Cn come in contact with the internal terminals BCn formed on the interior wall of the adapter AD as shown in the figure.
  • the internal terminals BCn are spring-active terminals having a generally rectangular profile in plan and having their long side extending in the card insertion direction (along the long side of card and adapter).
  • the internal terminals BCn are formed to swell in the cross section taken along the long side of RS-MMC.
  • FIG. 38 and FIG. 39 show in plan the layout of the internal terminals BCn of this embodiment on the SD-type adapter, with the RS-MMC being set, shown in FIG. 13 and on the MS-type adapter, with the RS-MMC being set, shown in FIG. 20.
  • FIG. 40 shows perspectively the internal terminals of a card adapter AD of the case where the RS-MMC 1 is put into the adapter from the long side of adapter as explained on FIG. 10 in the first embodiment.
  • the internal terminals BCn of adapter have a generally rectangular profile in plan and have their long side extending in the card insertion direction (along the short side of card and adapter) as shown in the figure.
  • the internal terminals BCn are formed to swell in the cross section taken along the short side of RS-MMC.
  • FIG. 41 shows the adapter internal terminals and the manner of card setting of the case where the RS-MMC 1 is put into the adapter AD from the top of adapter as explained on FIG. 9 of the first embodiment.
  • the internal terminals BCn of adapter have a generally rectangular profile in plan and have their long side extending along the short side of RS-MMC as shown in the figure.
  • the internal terminals are formed to swell in the cross section taken along the short side of RS-MMC.
  • the adapter AD has the formation of a latch 91 and lock nails 93 , by which the RS-MMC 1 can be secured.
  • internal terminals may be laid out in correspondence to all 13 terminals of RS-MMC, or internal terminals which correspond to unused terminals of RS-MMC depending on the card mode may not be laid out.
  • the adapter AD of this embodiment can be any of the SD-type adapter, MS-type adapter, MSDuo-type adapter, and USB-type adapter.
  • a third embodiment of this invention pertains to kits for sale of the RS-MMC and its assortment of adapters which have been explained in the first embodiment.
  • FIG. 42 shows perspectively a kit of RS-MMC 1 and various card adapters.
  • This adapter kit includes the RS-MMC 1 , SD-type adapter 50 , MS-type adapter 60 , MSDuo-type adapter 70 and USB-type adapter 80 .
  • the adapter kit may include more than one (xN) RS-MMC, or may include the card extender 9 which has been explained on FIG. 6.
  • the sale kit of RS-MMC and adapters provides the RS-MMC users with the compatibility with various electronic appliances which deal with SD cards, MS cards and USB-oriented memories. It also facilitates the data transaction (writing and reading) among various electronic appliances.
  • FIG. 43 shows perspectively a kit various card adapters.
  • This adapter kit includes the SD-type adapter 50 , MS-type adapter 60 , MSDuo-type adapter 70 and USB-type adapter 80 .
  • the adapter kit may include the card extender 9 which has been explained on FIG. 6.
  • the sale kit of adapters provides the RS-MMC users with the compatibility with various electronic appliances. It also facilitates the data transaction (writing and reading) among various electronic appliances. It also fosters the prevalence of the RS-MMC 1 .
  • each card adapter may be provided with an IC chip for mode determination as shown in FIG. 44.
  • An IC chip CH is connected between external terminals AC 3 and AC 10 , for example, of the MS-type adapter.
  • the IC chip CH further has the connection to terminal AC 10 via a switch St 2 , and the connection to external terminal C 13 .
  • the switch St 2 is disposed on the rear side of the MS-type adapter 60 , and it is operated mechanically to connect or disconnect electrically between the IC chip CH and terminal AC 10 .
  • the switch St 2 enables the selection between, for example, the write-enable mode and the write-inhibit mode in the MS mode in accordance with the operation shown by flowchart in FIG. 45.
  • Step 2 When the switch St 2 is off, the IC chip CH issues a write-enable command and gives to external terminal C 13 .
  • the mode controller 33 of RS-MMC 1 shown in FIG. 7 selects the MS mode ( 39 ) and write enable mode.
  • Step 3 When the switch St 2 is on, the IC chip CH issues a write inhibit command and gives to external terminal C 13 .
  • the mode controller 33 of RS-MMC 1 shown in FIG. 7 selects the MS mode ( 39 ) and write-inhibit mode.
  • the RS-MMC 1 has its operational mode switched in response to the command from the IC chip CH on the adapter, instead of the provision of the voltage pull-down detector 35 shown in FIG. 7.
  • An alternative scheme of mode switching is providing a mode command generation means on the part of host electronic appliances.
  • the IC card and adapter of this embodiment render the higher generality for themselves by being not reliant on host electronic appliances.
  • the IC chip CH can be less costly by having only a mode command generating function.
  • the IC chip CH of adapter does not necessitate a large intricate circuit for the writing and reading of IC card, e.g., I/F controllers for individual modes, which is included in the controller of RS-MMC.
  • An IC chip CH of a sole mode command generating circuit is simple in arrangement and low in cost, and therefore adapters which mount this IC chip CH can be inexpensive.
  • this embodiment uses the IC chip CH on the MS-type adapter, it can be mounted on any type of adapter.
  • An IC card of a first standard includes therein a detector for detecting the voltage level of a certain external terminal among multiple external terminals and a mode controller connected to the detector.
  • the mode controller selects a first mode interface controller of the first standard or a second mode interface controller of a second standard in accordance with the output signal of the detector, whereby the IC card can be compatible with IC cards of the second standard.
  • An IC card of the first standard which is set in the adapter having a profile of an IC card of the second standard, can become compatible with IC cards of the second standard.
  • the adapter suffices to have wiring lines and resistors which are easy in formation and low in cost, and renders the IC card the compatibility with IC cards of other standard.

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CN101290663A (zh) 2008-10-22
AU2003271153A1 (en) 2004-05-04
CN1703717A (zh) 2005-11-30
AU2003271153A8 (en) 2004-05-04
CN100403334C (zh) 2008-07-16
WO2004034318A1 (ja) 2004-04-22
US20070150633A1 (en) 2007-06-28
JP2005284323A (ja) 2005-10-13
TW200410149A (en) 2004-06-16
JP4236440B2 (ja) 2009-03-11
KR20060066666A (ko) 2006-06-16
JPWO2004034318A1 (ja) 2006-02-09
US20090065593A1 (en) 2009-03-12
US7823793B2 (en) 2010-11-02

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