US20030178147A1 - Film-shaped adhesive application apparatus - Google Patents

Film-shaped adhesive application apparatus Download PDF

Info

Publication number
US20030178147A1
US20030178147A1 US10/378,686 US37868603A US2003178147A1 US 20030178147 A1 US20030178147 A1 US 20030178147A1 US 37868603 A US37868603 A US 37868603A US 2003178147 A1 US2003178147 A1 US 2003178147A1
Authority
US
United States
Prior art keywords
film
shaped adhesive
supply reel
application apparatus
retainer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/378,686
Other languages
English (en)
Inventor
Hiroyuki Kumakura
Yukio Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Sony Corp
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Assigned to SONY CHEMICALS CORP. reassignment SONY CHEMICALS CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KUMAKURA, HIROYUKI, YAMADA, YUKIO
Publication of US20030178147A1 publication Critical patent/US20030178147A1/en
Assigned to SONY CORPORATION reassignment SONY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SONY CHEMICALS CORP.
Assigned to SONY CHEMICAL & INFORMATION DEVICE CORPORATION reassignment SONY CHEMICAL & INFORMATION DEVICE CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SONY CHEMICALS CORPORATION
Priority to US11/617,666 priority Critical patent/US7459046B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/514—Modifying physical properties
    • B65H2301/5143—Warming
    • B65H2301/51432—Applying heat and pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier

Definitions

  • the present invention relates to a film-shaped adhesive application apparatus for thermocompression-bonding a film-shaped adhesive to a substrate or other such adherend using a film-shaped adhesive supply reel on which the film-shaped adhesive is wound into a roll shape.
  • Anisotropic conductive films are widely used in LCD peripheral mounting, and have recently also been employed in COF (Chip on Film), COB (Chip on Board), and other such bare chip mounting.
  • an anisotropic conductive film 1 a typically comprises an anisotropic conductive adhesive layer 3 and a cover film 4 laminated as needed on top of a base film 2 , and employing this in bare chip mounting necessitates the use of an anisotropic conductive.
  • film supply reel 5 a in which the anisotropic conductive film 1 a is wound into a roll shape.
  • an application apparatus 10 is employed as an apparatus for temporarily tacking an anisotropic conductive film 1 a in a continuous manner to a substrate 30 using the anisotropic conductive film supply reel 5 a .
  • This apparatus 10 comprises a supply reel retainer 11 for mounting the anisotropic conductive film supply reel 5 a , a stage 12 for mounting the substrate 30 thereon, cover film winding means for separating a cover film 4 from the anisotropic conductive film 1 a drawn from the anisotropic conductive film supply reel 5 a and winding the cover film on a cover film winding reel 13 , film cutting means 14 for fully cutting or half-cutting to a prescribed length the anisotropic conductive film 1 a from which the cover film 4 has been separated, a thermocompression bonding roller 15 for thermocompression-bonding the fully cut or half-cut anisotropic conductive film 1 a to the substrate 30 and transferring and affixing the anisotropic conductive adhesive layer 3 to the substrate 30 .
  • the anisotropic conductive film 1 a is drawn from the anisotropic conductive film supply reel 5 a in the conventional application apparatus 10 , the anisotropic conductive film 1 a is sometimes wound tightly inside the anisotropic conductive film supply reel 5 a , the anisotropic conductive adhesive layer 3 is squeezed out from the side of the anisotropic conductive film 1 a as in FIG. 5, blocking occurs between the anisotropic conductive films 1 a during the tacking operation, making it impossible to smoothly draw the anisotropic conductive film 1 a and causing the application apparatus 10 to stop. Productivity suffers as a result.
  • an object of the present invention is to provide an application apparatus that prevents squeeze-out or blocking of an adhesive layer on a film-shaped adhesive supply reel on which an anisotropic conductive film or other such film-shaped adhesive is wound into a roll shape, and enables a film-shaped adhesive to be continuously applied.
  • the inventors have discovered that controlling the interior of a film-shaped adhesive supply reel at a prescribed temperature by thermally shielding the film-shaped adhesive supply reel from a thermocompression bonding roller or other such heat source or by cooling the film-shaped adhesive supply reel with a spot cooler or the like makes it possible to prevent squeeze-out or blocking of an adhesive layer on the film-shaped adhesive supply reel.
  • the present invention provides a film-shaped adhesive application apparatus comprising a supply reel retainer for mounting a film-shaped adhesive supply reel used to wind into a roll shape a film-shaped adhesive comprising a base film and an adhesive layer formed thereon, thermocompression bonding means for thermocompression-bonding the film-shaped adhesive drawn from the film-shaped adhesive supply reel onto an adherend, and a winding reel retainer for mounting a winding reel used to wind the base film of the thermocompression-bonded film-shaped adhesive; wherein the application apparatus further comprises temperature control means for controlling the film-shaped adhesive supply reel mounted on the supply reel retainer at a prescribed temperature.
  • FIG. 1 is a schematic depicting the film-shaped adhesive application apparatus of the present invention
  • FIGS. 2A and 2 b are a side view (a) and an expanded fragmentary view (b) of a reel of an anisotropic conductive film, respectively;
  • FIG. 3 is a diagram depicting the relation between the ambient temperature of the reel and the extent to which the adhesive layer is squeezed out;
  • FIG. 4 is a schematic depicting a conventional film-shaped adhesive application apparatus.
  • FIG. 5 is a side view of a film-shaped adhesive in which the anisotropic conductive adhesive layer is squeezed out due to roll tightening within the reel.
  • FIG. 1 is a schematic depicting the film-shaped adhesive application apparatus 10 A of an embodiment of the present invention.
  • This application apparatus 10 A comprises a supply reel retainer 11 for mounting a film-shaped adhesive supply reel 5 in which a film-shaped adhesive 1 is wound into a roll shape, a stage 12 for mounting a substrate 30 or other such adherend thereon, a cover film winding reel 13 for separating a cover film 4 from the film-shaped adhesive 1 drawn from the film-shaped adhesive supply reel 5 and winding the separated cover film 4 , film cutting means 14 for fully cutting or half-cutting to a prescribed length the film-shaped adhesive 1 after the cover film 4 has been separated, thermocompression bonding means 18 for thermocompression-bonding the film-shaped adhesive 1 to the adherend, and a winding reel retainer 17 for mounting the winding reel 16 used to wind the base film 2 of the thermocompression-bonded film-shaped adhesive 1 .
  • Examples of the film-shaped adhesive 1 include an anisotropic conductive adhesive film 1 a that comprises at least an anisotropic conductive adhesive film layer comprising a base film and an anisotropic conductive adhesive layer laminated on the base film and that may further comprises, if necessary, a cover film laminated on the anisotropic conductive adhesive layer, an insulating adhesive film that comprises a base film and an insulating adhesive layer laminated on the base film, an insulating adhesive film that further comprises a cover film laminated on the insulating adhesive layer as needed, and so on.
  • thermocompression bonding means 18 may be a thermocompression bonding roller 15 , thermocompression bonding head, or other component in which the thermocompression bonding surface can be controlled at 70-1 50° C. and the adherend can be heated and pressed while moved in the direction of the arrow.
  • a thermal shield plate 19 for thermally shielding the film-shaped adhesive supply reel 5 mounted on the supply reel retainer 11 from the thermocompression bonding means 18 is provided to the application apparatus 10 A so as to enclose the film-shaped adhesive supply reel 5 mounted on the supply reel retainer 11 .
  • Plastic material is preferably used as the structural material for the thermal shield plate 19 because of the low thermal conductivity thereof.
  • the thermal shield plate 19 acts as a temperature control means for controlling the film-shaped adhesive supply reel 5 mounted on the supply reel retainer 11 at a prescribed temperature.
  • the heat from the thermocompression bonding means 18 is prevented from spreading to the film-shaped adhesive supply reel 5 , and the film-shaped adhesive 1 is maintained at a temperature at which the adhesive layer constituting the film-shaped adhesive 1 in the film-shaped adhesive supply reel 5 assumes a hardness level sufficient to prevent the adhesive from being squeezed out even when the roll is tightened by the unwinding action of the film-shaped adhesive supply reel 5 .
  • the adhesive layer constituting the film-shaped adhesive 1 comprises a epoxy resin or other such thermosetting resin and the 70-150° C. thermocompression bonding operations of the thermocompression bonding means 18 are performed continuously at room temperature, structuring the thermal shield plate 19 from a polycarbonate allows the film-shaped adhesive 1 in the film-shaped adhesive supply reel 5 to be maintained at 30° C. or less.
  • a spot cooler or other such cooler for cooling the film-shaped adhesive supply reel 5 by blowing cold air on the film-shaped adhesive supply reel 5 mounted on the supply reel retainer 11 may be provided to the application apparatus of the present invention as a temperature control means in place of the previously described thermal shield plate 19 or together with the previously described thermal shield plate 19 .
  • the film-shaped adhesive supply reel 5 is actively cooled by the cooler, overcooling results in condensation on the surface of the film-shaped adhesive 1 and causes the film-shaped adhesives 1 to cling to each other, hindering the application apparatus in its ability to operate in a continuous manner. Therefore, the cooling action of the cooler is appropriately regulated so as not to cause such condensation.
  • the shaft on which the film-shaped adhesive supply reel 5 is mounted in the supply reel retainer 11 may serve as a cooling shaft, allowing the film-shaped adhesive supply reel 5 mounted on the supply reel retainer 11 to be cooled from the side of the winding core of the film-shaped adhesive supply reel 5 .
  • a specific structure of the cooling shaft may, for example, be such that the shaft on which the film-shaped adhesive supply reel 5 is mounted is cooled by cooling water, coolant gas, or the like. The temperature can thereby be controlled efficiently.
  • the application apparatus 10 A of the present invention can be embodied in a variety of ways according to the layer structure and the like of the film-shaped adhesive.
  • the cover film winding reel 13 or other such cover film winding means can be dispensed with in the case of film-shaped adhesives with no cover film.
  • An anisotropic conductive film supply reel (width 5 mm, 50-meter coil) (CP7131, Sony Chemicals Corp.), on which an anisotropic conductive film (cover film thickness 25 ⁇ m, adhesive layer thickness 25 ⁇ m, base film thickness 50 ⁇ m) was wound into a roll shape, was mounted such that the reel tension of the anisotropic conductive film was 100 g, and the anisotropic conductive adhesive layer thereof was continuously thermocompression-bonded to a glass substrate with a thermocompression bonding roll (100° C.) over the entire length of a 50-meter film.
  • the ambient temperature of the reel was controlled as shown in Table 1 by installing a spot cooler within a thermal shield plate composed of a polycarbonate material and regulating the airflow.
  • a thermal shield plate composed of a polycarbonate material
  • FIG. 3 depicts the relationship between the ambient temperature of the film-shaped adhesive supply reel and the extent to which the adhesive layer was squeezed out.
  • the film-shaped adhesive can be prevented from being blocked, or the adhesive layer can be prevented from being squeezed out due to roll tightening of the film-shaped adhesive supply reel on which the film-shaped adhesive is wound, and the film-shaped adhesive can therefore be continuously applied.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
US10/378,686 2002-03-25 2003-03-05 Film-shaped adhesive application apparatus Abandoned US20030178147A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/617,666 US7459046B2 (en) 2002-03-25 2006-12-28 Film-shaped adhesive application apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002083288A JP2003276090A (ja) 2002-03-25 2002-03-25 フィルム状接着剤の貼付装置
JP2002-083288 2002-03-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/617,666 Division US7459046B2 (en) 2002-03-25 2006-12-28 Film-shaped adhesive application apparatus

Publications (1)

Publication Number Publication Date
US20030178147A1 true US20030178147A1 (en) 2003-09-25

Family

ID=28035784

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/378,686 Abandoned US20030178147A1 (en) 2002-03-25 2003-03-05 Film-shaped adhesive application apparatus
US11/617,666 Expired - Fee Related US7459046B2 (en) 2002-03-25 2006-12-28 Film-shaped adhesive application apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
US11/617,666 Expired - Fee Related US7459046B2 (en) 2002-03-25 2006-12-28 Film-shaped adhesive application apparatus

Country Status (6)

Country Link
US (2) US20030178147A1 (zh)
JP (1) JP2003276090A (zh)
KR (1) KR100530201B1 (zh)
CN (1) CN1311535C (zh)
HK (1) HK1057942A1 (zh)
TW (1) TWI270951B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140053971A1 (en) * 2011-03-01 2014-02-27 Hologram Industries Machine for transferring a protective layer for a substrate at high temperature and under pressure, and associated method
US20160358323A1 (en) * 2015-06-03 2016-12-08 Boe Technology Group Co., Ltd. Anisotropic Conductive Film Cutting Calibration System and Method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4796901B2 (ja) * 2006-06-23 2011-10-19 芝浦メカトロニクス株式会社 テープ状部材の供給装置及び供給方法
JP5104034B2 (ja) * 2007-05-23 2012-12-19 日立化成工業株式会社 異方導電接続用フィルム及びリール体
CN202886784U (zh) * 2012-10-29 2013-04-17 深圳市华星光电技术有限公司 异向导电膜拉伸夹取装置及其夹取滚筒和夹取头
US20140150952A1 (en) 2012-12-04 2014-06-05 Apple Inc. Lamination Systems With Temperature-Controlled Lamination Rollers
JP6155467B2 (ja) * 2013-09-18 2017-07-05 パナソニックＩｐマネジメント株式会社 部品実装機

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786353A (en) * 1987-10-16 1988-11-22 Adolph Coors Company Laminating method and apparatus with extensible web width control
US4952441A (en) * 1988-02-09 1990-08-28 Union Camp Corporation Thermal insulation batt
US5411825A (en) * 1990-10-16 1995-05-02 Xerox Corporation Heat development process of migration imaging members

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4930899A (zh) 1972-07-24 1974-03-19
JPS6435112U (zh) 1987-08-28 1989-03-03
JPS6435114U (zh) 1987-08-28 1989-03-03
JPH07130349A (ja) * 1993-11-05 1995-05-19 Sony Corp 電池用セパレータの製造方法
JPH07287244A (ja) 1994-04-19 1995-10-31 Sanyo Electric Co Ltd 異方性導電膜供給装置
JPH10260422A (ja) 1997-03-21 1998-09-29 Matsushita Electric Ind Co Ltd 異方性導電材の貼付け装置および貼付け方法
JP2001281685A (ja) 2000-01-28 2001-10-10 Sharp Corp 液晶表示素子の製造方法および異方導電性フィルム貼付装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786353A (en) * 1987-10-16 1988-11-22 Adolph Coors Company Laminating method and apparatus with extensible web width control
US4952441A (en) * 1988-02-09 1990-08-28 Union Camp Corporation Thermal insulation batt
US5411825A (en) * 1990-10-16 1995-05-02 Xerox Corporation Heat development process of migration imaging members

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140053971A1 (en) * 2011-03-01 2014-02-27 Hologram Industries Machine for transferring a protective layer for a substrate at high temperature and under pressure, and associated method
US20160358323A1 (en) * 2015-06-03 2016-12-08 Boe Technology Group Co., Ltd. Anisotropic Conductive Film Cutting Calibration System and Method
US10163032B2 (en) * 2015-06-03 2018-12-25 Boe Technology Group Co., Ltd. Anisotropic conductive film cutting calibration system and method

Also Published As

Publication number Publication date
TW200305237A (en) 2003-10-16
US7459046B2 (en) 2008-12-02
JP2003276090A (ja) 2003-09-30
US20070102105A1 (en) 2007-05-10
TWI270951B (en) 2007-01-11
CN1311535C (zh) 2007-04-18
HK1057942A1 (en) 2004-04-23
KR100530201B1 (ko) 2005-11-22
KR20040030192A (ko) 2004-04-09
CN1447409A (zh) 2003-10-08

Similar Documents

Publication Publication Date Title
US7459046B2 (en) Film-shaped adhesive application apparatus
US8575746B2 (en) Chip on flexible printed circuit type semiconductor package
US8456861B2 (en) Display modules and methods of fixing flexible circuit boards therein
KR20060132551A (ko) 다중 광학 필름을 위한 접착 적층
JP6577915B2 (ja) 粘着テープの貼着装置
JP4825654B2 (ja) 粘着性テープの貼着装置及び貼着方法
JP2017090578A (ja) 額縁状の封し部を有する積層光学フィルムシート
JP4193858B2 (ja) フィルム状接着剤の貼付装置
JP5366403B2 (ja) 表示装置の製造方法及び表示装置の製造装置
JP2008085148A (ja) 接着剤フィルムの接着力発現方法および接着力発現装置
US8283774B2 (en) Chip on film type semiconductor package
US11569162B2 (en) Chip on film package with reinforcing sheet and manufacturing method of chip on film package with reinforcing sheet
KR100297369B1 (ko) 액정표시장치용테이프캐리어패키지
JPS6136960A (ja) リードフレームのテープ付け方法および装置
JP3617650B2 (ja) 接続部材貼付装置
KR20120103185A (ko) 전도성 금속 테이프 제조 장치 및 그 제조 방법
JP2001297549A (ja) 制振材連続供給体
JP4519288B2 (ja) 熱伝導性シート貼付装置及び熱伝導性粘着シート貼付方法
JPH06326240A (ja) フィルム貼り付け方法
KR20220049369A (ko) 히트싱크부재용 그라파이트증착 방열시트
JP2008251823A (ja) チップ型電子部品の外部電極形成方法
JPH06326238A (ja) フィルム貼り付け方法
JPH0423344A (ja) 半導体ウエハの保護粘着テープ剥離装置
KR100254257B1 (ko) 리드 프레임의 필름 부착 방법
KR100523275B1 (ko) 액정표시장치용 테이프 캐리어 패키지

Legal Events

Date Code Title Description
AS Assignment

Owner name: SONY CHEMICALS CORP., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KUMAKURA, HIROYUKI;YAMADA, YUKIO;REEL/FRAME:013855/0500

Effective date: 20030206

AS Assignment

Owner name: SONY CORPORATION, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SONY CHEMICALS CORP.;REEL/FRAME:016840/0619

Effective date: 20050906

AS Assignment

Owner name: SONY CHEMICAL & INFORMATION DEVICE CORPORATION,JAP

Free format text: CHANGE OF NAME;ASSIGNOR:SONY CHEMICALS CORPORATION;REEL/FRAME:018550/0258

Effective date: 20060701

Owner name: SONY CHEMICAL & INFORMATION DEVICE CORPORATION, JA

Free format text: CHANGE OF NAME;ASSIGNOR:SONY CHEMICALS CORPORATION;REEL/FRAME:018550/0258

Effective date: 20060701

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION