HK1057942A1 - Film-shaped adhesive application apparatus - Google Patents

Film-shaped adhesive application apparatus

Info

Publication number
HK1057942A1
HK1057942A1 HK04100693A HK04100693A HK1057942A1 HK 1057942 A1 HK1057942 A1 HK 1057942A1 HK 04100693 A HK04100693 A HK 04100693A HK 04100693 A HK04100693 A HK 04100693A HK 1057942 A1 HK1057942 A1 HK 1057942A1
Authority
HK
Hong Kong
Prior art keywords
film
adhesive application
application apparatus
shaped adhesive
shaped
Prior art date
Application number
HK04100693A
Other languages
English (en)
Inventor
Hiroyuki Kumakura
Yukio Yamada
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1057942A1 publication Critical patent/HK1057942A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/514—Modifying physical properties
    • B65H2301/5143—Warming
    • B65H2301/51432—Applying heat and pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
HK04100693A 2002-03-25 2004-02-02 Film-shaped adhesive application apparatus HK1057942A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002083288A JP2003276090A (ja) 2002-03-25 2002-03-25 フィルム状接着剤の貼付装置

Publications (1)

Publication Number Publication Date
HK1057942A1 true HK1057942A1 (en) 2004-04-23

Family

ID=28035784

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04100693A HK1057942A1 (en) 2002-03-25 2004-02-02 Film-shaped adhesive application apparatus

Country Status (6)

Country Link
US (2) US20030178147A1 (zh)
JP (1) JP2003276090A (zh)
KR (1) KR100530201B1 (zh)
CN (1) CN1311535C (zh)
HK (1) HK1057942A1 (zh)
TW (1) TWI270951B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4796901B2 (ja) * 2006-06-23 2011-10-19 芝浦メカトロニクス株式会社 テープ状部材の供給装置及び供給方法
JP5104034B2 (ja) * 2007-05-23 2012-12-19 日立化成工業株式会社 異方導電接続用フィルム及びリール体
FR2972135B1 (fr) * 2011-03-01 2013-10-04 Astea Machine de transfert a chaud et sous pression d'une couche de protection d'un substrat
CN202886784U (zh) * 2012-10-29 2013-04-17 深圳市华星光电技术有限公司 异向导电膜拉伸夹取装置及其夹取滚筒和夹取头
US20140150952A1 (en) 2012-12-04 2014-06-05 Apple Inc. Lamination Systems With Temperature-Controlled Lamination Rollers
JP6155467B2 (ja) * 2013-09-18 2017-07-05 パナソニックＩｐマネジメント株式会社 部品実装機
CN104960019B (zh) * 2015-06-03 2017-03-01 合肥鑫晟光电科技有限公司 异方向性导电胶膜切割校准系统和方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4930899A (zh) 1972-07-24 1974-03-19
JPS6435114U (zh) 1987-08-28 1989-03-03
JPS6435112U (zh) 1987-08-28 1989-03-03
US4786353A (en) * 1987-10-16 1988-11-22 Adolph Coors Company Laminating method and apparatus with extensible web width control
US4952441A (en) * 1988-02-09 1990-08-28 Union Camp Corporation Thermal insulation batt
US5411825A (en) * 1990-10-16 1995-05-02 Xerox Corporation Heat development process of migration imaging members
JPH07130349A (ja) * 1993-11-05 1995-05-19 Sony Corp 電池用セパレータの製造方法
JPH07287244A (ja) 1994-04-19 1995-10-31 Sanyo Electric Co Ltd 異方性導電膜供給装置
JPH10260422A (ja) 1997-03-21 1998-09-29 Matsushita Electric Ind Co Ltd 異方性導電材の貼付け装置および貼付け方法
JP2001281685A (ja) 2000-01-28 2001-10-10 Sharp Corp 液晶表示素子の製造方法および異方導電性フィルム貼付装置

Also Published As

Publication number Publication date
TWI270951B (en) 2007-01-11
US7459046B2 (en) 2008-12-02
JP2003276090A (ja) 2003-09-30
KR20040030192A (ko) 2004-04-09
CN1447409A (zh) 2003-10-08
CN1311535C (zh) 2007-04-18
KR100530201B1 (ko) 2005-11-22
TW200305237A (en) 2003-10-16
US20070102105A1 (en) 2007-05-10
US20030178147A1 (en) 2003-09-25

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190321