TWM257474U - Heat-dissipating device - Google Patents

Description

M257474 Creation Instructions (1) [Technical Field to which the New Type belongs] This creation relates to an improvement of a heat sink, especially a heat sink that can be used in multiple types of central processing units (CPUs), and the heat sink can provide the best Of heat dissipation efficiency. [Previous technology] Press, with the rapid development of the computer industry, the central computer processing of crying = u) will generate more and more heat, and κ inch will be more (coming to effectively dissipate this dense heat in The environment outside the system is based on the dimension 2 CPU operating at the permitted temperature. The processor is often used on the surface of the processor to assist the CPU in the management of the government and effectively improve the execution and service life of the two CPUs. "The manufacturer of Meeki uses" U Ϊ Λ 1 "produced by Intel to be" I7 produced by "row or Ultra Micro UMD" ",

It ^ ^ ^ t Z Pentlum IV "CPU is fixed to the motherboard with a specific fixing frame, and" K7 "= the heat sink used by the theft is fixed to the motherboard frame, as for" K8 " There is a crying day in the center of the country, and there are Han and Han. But for the above "Penti ... V": f7 uses _ fixed frame. The fixing method between the radiator and the radiator ... head 1 ^ "°" central processing structure of the positioning element design combined; Do not = different sizes, but also relatively make the shape and type of the central processing of the radiator is currently promoted Modular components have different designs today and if, but they are mutually applicable. If there is a known solid method, the manufacturing cost of the product cannot be improved, and some defects can be improved. And therefore how to design

M257474 4. Creation instructions (2) Two types of heat sinks that can be used for multiple types of central processing units and can improve heat dissipation efficiency are still the topics that those who are engaged in this technology want to solve first. In view of the problems arising from the above-mentioned knowledge, the creator of this case has taken many years of experience in doing business as such and actively researched and improved in the spirit of excellence. This resulted in the creation of "heating device improvement" in this creation. [New content] The purpose of this creation is to provide an improvement of the heat dissipation device, which can make the heat dissipation device applicable to various types of central processing units, in order to reduce the manufacturing cost of the product and increase the market competitiveness. The other purpose of this creation is to provide an improvement of the heat dissipation device, which is designed to improve the rapid diffusion of the source of the entire heat dissipation device. The heat dissipation device is created by two heat sinks and a cover 罩 Μ θ Shi Di heat release The device is an aluminum extruded heat sink. The first scattered u ^ f ... block is provided with a plurality of aluminum extruded heat sinks at the middle of the heat dissipation block, and a -receiving recess is reserved for installation. ": A second radiator is located below the block; therefore, the" K 7 i set recess 1 1 processor can be installed with the lock of the first radiator-lock-L-"Pentium IV ”The“ p cover and side ”of the central processor can make the heat sink suitable for“ K7 ”,“ ”^ ―Ca IV '' or other central processors. The heat conduction block radiator has-a heat conduction block, two phases are filled with the next day 丨 ♦ \ Below the heat dissipation block of the political heat benefit, the heat conduction block ^ is located at the bottom of the heat conduction block, and a heat pipe with a working fluid is extended outward, so that Page 6 M257474 4. Creation instructions (3) The heat transfer tubes on both sides are _ v-shaped inclined angles, and a plurality of heat dissipation fins are arranged on the stack, and the top side of the cover is respectively arranged to fit the inclined installation. Since the heat dissipation fins of the second c are diffused outwardly, the heat source can be quickly dissipated as follows: [Embodiment] In the middle, k is the same as the entire heat dissipation efficiency. For the detailed description and technical content of this creation, with the cooperation, the lack of fighting, / send! _ The solid type wish Mingming…, and the drawings are provided for reference and explanation only, as a limiter. It is not used to improve the creation of this book. It is a kind of "improvement of heat dissipation device". Please refer to the first and the first: "No" is the first embodiment of this creation. The heat sink: two central parts, device 20, κ 7 central processing Device 2 〇 is installed in a connector 2 with 〇 on K 7 j connector 200 on the two corresponding sides are provided with a plurality of buckle blocks "^; this loose, device 10 is composed of two radiators j, 2 and cover 3, where jg a = heater 1 is an aluminum extruded radiator i, the first radiator i has an aluminum heat sink 11 and a plurality of aluminum is arranged above the heat sink 丨 丨For extrusion, a receiving groove 13 is reserved in the middle of the heat sinks 12 to install a buckle 4. In this embodiment, the buckle 4 used in conjunction with the K7 central processor 20 is used. ° ° η As shown in the first intention of continuing to participate in May, in this creation, a second heat sink 2 is provided below the heat sink 11. The second heat sink 2 has a copper heat conduction block 21. The heat conduction block 21 is Installed below the heat dissipation block 11 of the first heat sink 1, heat conducting tubes 22 with working fluid are respectively extended outward at two corresponding sides of the heat conduction block 21, The heat conductive tube 22 has both a V-shaped oblique angle,

M257474 4. Creation instructions (4) A plurality of heat dissipation fins 23 are stacked on the heat transfer tubes 22 respectively. The top plate 31 of the cover 3 has a fan-shaped arc shape to cooperate with the radiating fins 23 installed obliquely. The two corresponding side edges of the top plate 31 are respectively extended with side plates 32, and the side plates 32 are close to the top. A plurality of ventilation slots 33 are provided at each part, and the side plate 32 is provided with a notch 34 at the receiving groove 13 corresponding to the first radiator i to accommodate the buckle 4, and the top plate 31 of the cover 3 A cooling fan 5 can be installed in the middle, and the cooling fan 5 can blow the external wind into the heat dissipation device 10 or suck the heat source from the outside. ^ Please * as shown in the second and third figures, when you want to install the heat sink 10 on the central processing unit 20, first install the tool 7 used by the central processing unit 20 on the first heat sink i. The accommodating groove 13 is then covered with the cover 3 on the two heat sinks 1 and 2. Then, the heat sink 10 can be installed on the K7 processor 20, and the fastener 4 can be fastened to the connector 2. On the buckle block of 〇〇, = = The heat sink 10 is fixed above the K7 central processor 20 for heat dissipation. 7 When dissipating heat, part of the heat source will be conducted to the diffuser along the heat transfer tube 22: on the sheet 23, and part of the heat source will be conducted to Yi Yi Qiu Yiyi, ", ..., Yueyue ^ 12, if 刼 π ^ ^ The aluminum extruded fins of No.1 Zhengreyi1. The fan 5 draws the fins 23 to the outside, or blows cold air from the outside into the heat source fins 23 or fins 12 Above, C = 'To reduce the effect of heat dissipation as shown in Figures 4 and 5. Zhong San 埶 F 詈 1 0 # # i Μ + is the second embodiment of this creation, and its Jiazhengshu device 10 is used in Κ8 central processor 2 processor 20, has a fixed frame 2Q1, so that the center of the upper frame is fixed at the center of the frame 201 ', and the fixed frame and the processor 20 are placed at the fixed block 202'. 1 ^, the two corresponding outer sides are provided with a processing device 20 when a heat sink 10 is installed

M257474 Creative Instructions (5), that is, the K8 CPU 20 and the buckle 4 used in the first installation are installed in the receiving groove 13 with the first heat dissipation 1, and then the cover 3 is covered with two heat dissipation The heat sink 10 can be installed on the K8 central processor 20, and the fastener 4 'can be fastened to the fixed frame 201 and the buckle block 202, to heat dissipation. The device 10 fixes the jK8 central processing unit 20 above, for heat dissipation. Please refer to the sixth and seventh figures, which is the third embodiment of the present invention, in which the heat dissipation device 10 is used in the Pentiuuj IV central processing unit 20, and the Pentium IV central processor 20 is provided with a The fixing frame 2 ^ ,,, and the four corners of the fixing frame 201, are respectively provided with support and pillars 203 ,, and a support hole 203, is provided on the support pillar 203 '. When it comes to Pentium IV CPU 2

Taxi '... — Once the heat sink is installed, the fasteners used with the Pentium IV CPU 20 ”are first bolted by the bolt elements 41 and locked on the upper and lower plates of the cover 3, respectively. Set the fixing hole 321 and lock it in the screw hole 111 (shown in the figure) of the first heat sink 1 to fix the two fasteners 4 '' above the two side plates of the cover 3. Set the government heat I to 10 and install it on the pentium IV central processor 20, square, ^ and / two clips 4, which are respectively fastened to the support arm 201, and the support arm Π / Φ ^^ 204, , The heat sink 10 can be fixed above the Pentium IV CPU 20 ”for heat dissipation. After the structure description of f is placed, it can be known that“ in this creation, we can use this heat dissipation for 12 days, count ”to change the Fasteners 4, 4, and 4 '' are installed in No. 13 slot or locked in 3 cans, so that 2fr, °, for different types of CPUs 20, 20, , And the heat dissipation fins 23 on both sides of the second heat sink 2 diffuse outward

M257474

Fourth, the creation instructions (6) Setting ’can also make the heat source spread out quickly, instead of being concentrated in the middle, so as to improve the heat dissipation efficiency of the entire heat dissipation device 10. In summary, the "heat-reduction device improvement" of this creation can indeed achieve the stated effect through the structure disclosed above. And this creative application has not been seen in publications or used publicly before. It has already met the requirements for novelty and progress of new patents. However, the drawings and descriptions disclosed above are only examples of this creation, and are not intended to limit the examples of this creation. Anyone who is familiar with the art, based on the characteristics of this creation, and so on, etc. "Effective changes or modifications" should be covered by the scope of patent application in the following case.

M257474 Schematic description " — [Schematic description] Brother " ^ 图 4 糸 水 ^ 凌 丨 丨 你 +!,.

The five pictures are the appearance of the second embodiment of this creation used in the K8 CPU. The sixth figure is an exploded view of the third embodiment of the heat dissipation device of the present invention. The seventh figure is an external view of the third embodiment of the present invention used in the Pentiuin iv CPU. [Representative Symbol of Component] Heat sink 10 First heat sink 1 Heat sink block 11 Screw hole 丨 丨 丨 Heat sink 12 Receiving groove 13 Second heat sink 2 Heat transfer block 21 Heat pipe 22 Heat sink fin 23 Cover side panel ventilation slot hole Screw: Component cooling fan connector 323341, buckle block buckle hole 200202, 202,204 '' Top plate lock hole i Notch buckle Central processor fixed frame support 桎 3132134 4, 4, 4, 4, 20 > 20? ≫ 20 ,, 201,, 201, '2 03,'

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Claims (1)

M257474 1. An improved central processing unit for a heat sink, comprising: a first heat sink suitable for one of a variety of different types, having a plurality of aluminum extruded heat sinks, a heat sink, and a complex groove above the heat sink; In the middle of the exothermic piece, there is a accommodating concave diyizhengzheng heater 'set in Chuyi ^ The second heat sink has a work block ^ extending from the lower part of the heat-conducting block that carries a guide and a two-part device, and has a work flow ^ two opposite sides of the heat-conducting block. The angle of inclination is between the two sides; The two sides of the heat conduction tube are made into sheets; and, ",, and the officials are respectively stacked with a plurality of heat dissipation fins and two heat sinks. The heat dissipation device described in item 1 in the top plate of the cover is improved in arc shape to match A cover is installed in an inclined manner, and a cooling fan is installed at the first and middle positions of the cover. 2. If the top plate of the cover is a fan-shaped thermal fin in the scope of the patent application, evening 3. If the patent is applied for In the first scope of the scope of work, there are gaps in the receiving grooves of the plurality of ventilation slot holes near the top of the two corresponding sides of the top plate. The central groove of the receiving groove is installed in the K7 or K8. If the buckle is locked on both sides of the cover as described in the patent application, the heat dissipation device is improved. Side plate, side plate leaning and the side plate corresponds to the first heat dissipation The improvement of the heat dissipation device, which is mounted in a buckle, so that the upper heat sink assembly. The improved heat dissipation device of the item, which plate is mounted on the heat sink Page 12 M257474 V. Patent Application Range Above Pentium IV CPU 11111 Page 13